Dilution refrigerator and quantum computer

Abstract

The utility model discloses a dilution refrigerator and a quantum computer, which comprises a plurality of cooling chambers with gradually reduced temperature, the plurality of cooling chambers are separated by a plurality of temperature zone partition plates, and at least one electronic device is arranged in each cooling chamber; the external device is arranged outside the cooling cavity and used for receiving signals of the electronic device and / or controlling operation of the electronic device; a plurality of signal lines, wherein each signal line is used for electrically connecting an external device and an electronic device; the heat conduction assemblies are installed on the temperature zone segmentation discs, and the other temperature zone segmentation discs except the temperature zone segmentation disc with the lowest temperature are each provided with at least one heat conduction assembly; any signal line makes contact with any heat conduction assembly on each temperature zone segmentation disc in the transmission path of the signal line so as to achieve conduction of heat on the signal line. By arranging the heat conduction assembly, the heat of the signal line penetrating through each temperature zone partition disc is conducted to the temperature zone partition disc, so that conduction of the heat on the signal line is achieved, and the heat problem is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of quantum computers, in particular to a dilution refrigerator and a quantum computer. Background Art

[0002] Quantum computers are physical devices that follow the laws of quantum mechanics to perform high-speed mathematical and logical operations, store and process quantum information. The main characteristics of quantum computers are fast operation speed, strong information processing capabilities, and a wide range of applications. Among the many quantum computing technology routes, the superconducting technology route has a very broad prospect, and quantum computers developed based on the superconducting technology route have attracted much attention in the industry.

[0003] The basic unit of superconducting quantum computing is the quantum chip, which needs to work in an ultra-low temperature environment, about 10mK to 20mK (Kelvins). Ultra-low temperature can effectively reduce the impact of environmental noise on the quantum chip. The ultra-low temperature environment is usually provided by a dilution refrigerator. Usually, electronic devices such as temperature sensors are arranged inside the dilution refrigerator. These electronic devices are connected to the external devices of the dilution refrigerator (such as a control cabinet) through their own signal lines. When the electronic devices are working, these signal lines will generate heat, which will affect the cooling effect inside the dilution refrigerator, and then affect the normal operation of the quantum chip.

[0004] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0005] The purpose of the utility model is to provide a dilution refrigerator and a quantum computer, which can efficiently transfer the heat of the signal line to the temperature zone partition plate, avoid or reduce the influence of the heat on the refrigeration effect inside the dilution refrigerator, and thus ensure the normal operation of the quantum chip.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] In a first aspect, the present application provides a dilution refrigerator, comprising: a plurality of cooling chambers with gradually decreasing temperatures, the plurality of cooling chambers being separated by a plurality of temperature zone partition plates, and at least one electronic device being arranged in each of the cooling chambers;

[0008] An external device, disposed outside the cooling chamber, for receiving a signal from the electronic device and / or controlling the operation of the electronic device;

[0009] A plurality of signal lines, each signal line being used to electrically connect the external device and one of the electronic devices;

[0010] A heat conduction component is installed on the temperature zone partition plate, and at least one heat conduction component is installed on each of the temperature zone partition plates except the temperature zone partition plate with the lowest temperature;

[0011] Wherein, any signal line contacts any of the heat-conducting components on each temperature zone dividing plate in its transmission path to achieve heat conduction on the signal line.

[0012] The dilution refrigerator as described above, further, is provided with a heat conduction component on any of the temperature zone dividing plates.

[0013] In the dilution refrigerator as described above, further, the heat conduction component comprises a heat conductor mounted on the temperature zone dividing plate, and the heat conductor is provided with at least one first through hole for the signal line to pass through.

[0014] The dilution refrigerator as described above, further, a first signal connector is provided in the first through hole;

[0015] Any of the signal lines is composed of a plurality of first line segments electrically connected through a first signal connector, and the first line segments are electrically connected to the first signal connector.

[0016] In the dilution refrigerator as described above, further, the first wire segment between the electronic device on the temperature zone partition plate with the lowest temperature and the heat conduction component on the adjacent temperature zone partition plate is a superconducting wire.

[0017] In the dilution refrigerator as described above, further, the heat-conducting component further comprises a heat-conducting cover arranged outside the first signal connector, and the heat-conducting cover is provided with a second through hole for the first line segment to pass through.

[0018] In the dilution refrigerator as described above, further, the heat conducting component further comprises a winding post, and the winding post is arranged on a side of the heat conducting body close to the heat conducting cover and is located inside the heat conducting cover.

[0019] In the dilution refrigerator as described above, further, the winding post is provided with a plurality of third through holes arranged obliquely along the height direction for the first wire segment to pass through.

[0020] As described above, the dilution refrigerator further comprises a heat conductive body and a heat conductive seat coaxially clamped on the outer wall of the heat conductive body, the outer wall of the heat conductive body is gap-matched with the first mounting hole on the temperature zone dividing plate, the heat conductive seat cover is arranged at the gap between the first mounting hole and the heat conductive body and is installed on the temperature zone dividing plate, and the first through hole is arranged on the heat conductive body.

[0021] A second aspect of the present application provides a quantum computer, comprising: the above-mentioned dilution refrigerator; and a quantum chip, wherein the quantum chip is installed in the dilution refrigerator.

[0022] The beneficial effects of the utility model are:

[0023] The dilution refrigerator of the present application, by providing a heat-conducting component, conducts the heat of the signal line passing through each temperature zone dividing disk to the temperature zone dividing disk, so as to realize the heat conduction on the signal line, solve the heat problem, avoid or reduce the influence of heat on the cooling effect inside the dilution refrigerator, and thus ensure the normal operation of the quantum chip.

[0024] The quantum computer provided by the utility model includes the above-mentioned dilution refrigerator, and thus has the same beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A structural schematic diagram of a dilution refrigerator provided by an embodiment of the utility model;

[0026] Figure 2 A schematic diagram of the structure of another dilution refrigerator provided by an embodiment of the utility model;

[0027] Figure 3 A schematic diagram of the structure of the first heat-conducting component in use provided by an embodiment of the utility model;

[0028] Figure 4 A structural schematic diagram of a second heat-conducting component in use provided by an embodiment of the utility model;

[0029] Figure 5 A schematic diagram of the structure of the third heat-conducting component in use provided by an embodiment of the utility model;

[0030] Figure 6 A schematic diagram of the structure of a heat-conducting seat provided in an embodiment of the utility model;

[0031] Figure 7 A schematic diagram of the structure of another heat-conducting seat provided in an embodiment of the utility model;

[0032] In the accompanying drawings: 10, temperature zone dividing plate; 20, electronic device; 30, external device; 40, heat-conducting component; 42, heat-conducting cover; 43, winding column; 44, first signal connector; 60, first thermal conductive adhesive layer; 41, heat conductor; 411, heat-conducting body; 412, heat-conducting seat; 4121, first clamping block; 4122, second clamping block; 4123, T-shaped gap. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be interpreted as limitations on the present application.

[0034] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0036] Figure 1 A structural schematic diagram of a dilution refrigerator provided by an embodiment of the utility model; Figure 1 As shown, this embodiment provides a dilution refrigerator, including: a plurality of cooling chambers with gradually decreasing temperatures, the plurality of cooling chambers are separated by a plurality of temperature zone partition plates 10, each of the cooling chambers being provided with at least one electronic device 20; an external device 30, arranged outside the cooling chamber, for receiving signals from the electronic device 20 and / or controlling the operation of the electronic device 20; a plurality of signal lines, each signal line being used to electrically connect the external device 30 and one of the electronic devices 20; a heat-conducting component 40, installed on the temperature zone partition plates 10, and at least one heat-conducting component 40 is provided on each of the temperature zone partition plates 10 except the temperature zone partition plate 10 with the lowest temperature; wherein any signal line contacts any of the heat-conducting components 40 on each of the temperature zone partition plates 10 in its transmission path to realize heat conduction on the signal line.

[0037] The dilution refrigerator of the present application conducts the heat of the signal line to the temperature zone partition plate 10 through the heat conduction component 40 to achieve heat conduction on the signal line, thereby solving the heat problem.

[0038] It should be noted that, in this embodiment, the room temperature plate located on the top of the dilution refrigerator housing and the cold plate located inside the dilution refrigerator housing are both referred to as temperature zone dividing plates 10 .

[0039] In this embodiment, the external device 30 includes but is not limited to a controller; the electronic device 20 includes but is not limited to a temperature sensor and a heater; specifically, the purpose of setting the temperature sensor is that: usually the temperature sensor is arranged on each temperature zone partition plate 10, and is used to monitor the temperature of the temperature zone partition plate 10. In order to ensure the accuracy of the monitoring result, multiple temperature sensors need to be arranged on the same temperature zone partition plate 10; the controller is electrically connected to the temperature sensor, and is used to receive the temperature signal monitored by the electronic device 20. In some implementations of this embodiment, the housing of the temperature sensor is detachably mounted on the temperature zone partition plate 10, and specifically, the housing of the temperature sensor is detachably mounted on the temperature zone partition plate 10 by screws. The purpose of setting the heater is that: usually an air gap type thermal switch is arranged in a dilution refrigerator, and a heater is usually provided on the air gap type thermal switch to control the opening and closing of the air gap type thermal switch, and the controller is electrically connected to the heater to control the operation of the heater.

[0040] In this embodiment, the material of the heat-conducting component 40 is not specifically limited, and any heat-conducting material is sufficient. Exemplarily, the heat-conducting component 40 is made of oxygen-free copper, which ensures the heat-conducting performance of the heat-conducting component 40 .

[0041] In this embodiment, the number of the heat conducting components 40 on any of the temperature zone partition plates 10 is not specifically limited, and one or more heat conducting components 40 may be provided. For example, Figure 1 As shown, in order to improve the integration of the circuit, any of the temperature zone partition plates 10 is provided with a heat conducting component 40. Figure 1 It can be seen that the number of signal lines passing through the heat conducting components 40 on the upper temperature zone partitioning plates 10 is greater, and the number of signal lines passing through the heat conducting components 40 on the uppermost temperature zone partitioning plate 10 is equal to the number of the electronic components.

[0042] In some implementations of this embodiment, the number of heat-conducting components 40 arranged on the upper temperature zone partition plate 10 may be greater than the number of heat-conducting components 40 on the lower temperature zone partition plate 10; for example, Figure 2 A schematic diagram of the structure of another dilution refrigerator provided by an embodiment of the utility model; Figure 2 As shown: two heat-conducting components 40 are arranged on the topmost temperature zone partition plate 10, and one is arranged on other layers. Furthermore, in order to facilitate wiring, when multiple heat-conducting components 40 are arranged on the temperature zone partition plate 10, the heat-conducting components 40 are arranged symmetrically about the axis of the temperature zone partition plate 10.

[0043] In the present embodiment, the structure of the heat-conducting component 40 is not specifically limited. It is sufficient to contact with the signal line and the temperature zone partition disk 10 at the same time to realize the heat conduction from the signal line to the temperature zone partition disk 10. Specifically, the heat-conducting component 40 includes a heat conductor 41 installed on the temperature zone partition disk 10, and the heat conductor 41 is provided with at least one first through hole for the signal line to pass through. In the present embodiment, the shape and arrangement of the first through hole are not specifically limited. For example, the first through hole can be cylindrical, and its axial direction is perpendicular to the temperature zone partition disk 10. In the present embodiment, the number of first through holes is not specifically limited. A plurality of first through holes can be provided, and only one signal line can pass through each first through hole, or a plurality of signal lines can pass through one first through hole. The following is combined with Figure 3 , Figure 4 and Figure 5 Three specific examples of the thermally conductive component 40 are given.

[0044] Figure 3 The schematic diagram of the structure of the first heat-conducting component 40 in use state provided by the embodiment of the utility model; Figure 3 As shown: a first through hole is provided in the heat conductor 41, and a signal line passes through the first through hole; in order to further improve the heat conduction effect of the signal line, a first heat conductive adhesive layer 60 is provided in the gap between the first through hole and the signal line.

[0045] Figure 4 A schematic diagram of the structure of the second heat-conducting component 40 in use according to the embodiment of the utility model; Figure 4 As shown: a first signal connector 44 is provided in the first through hole; any of the signal lines is composed of a plurality of first line segments electrically connected through the first signal connector 44, and the first line segments are electrically connected to the first signal connector 44. By providing the first signal connector 44 in the first through hole, the purpose of cross-temperature zone transfer and heat conduction of a signal line is achieved, and wiring is convenient.

[0046] In the present embodiment, the structure of the first signal connector 44 is not specifically limited. Exemplarily, the first signal connector 44 includes an insulating shell and a pin disposed in the insulating shell, and the first wire segment is welded to the pin; further, the insulating shells of any two first signal connectors 44 are plug-fitted or threadedly fitted and the pins therein are electrically contacted to achieve rapid installation of the two first signal connectors 44.

[0047] In this embodiment, the type of the first wire segment is not specifically limited. For example, the first wire segment is a phosphor copper wire. In other examples, the first wire segment between the electronic device 20 on the lowest temperature zone partition plate 10 and the heat-conducting component 40 on the adjacent temperature zone partition plate 10 is a superconducting wire. When a superconducting wire is used, the superconducting wire has no resistance at low temperatures, so the superconducting wire itself does not generate heat, thereby reducing the impact on the temperature of the dilution refrigerator temperature zone. In this embodiment, the type of the superconducting wire is not specifically limited. For example, the superconducting wire is a niobium titanium cable.

[0048] Continue as Figure 4 As shown: In some implementations of this embodiment, in order to further improve the heat conduction effect, the heat conductive component 40 also includes a heat conductive cover 42 that is covered on the outside of the first signal connector 44, and the heat conductive cover 42 is provided with a second through hole for the first line segment to pass through. In this embodiment, the heat conductive cover 42 can be installed on the heat conductor 41, specifically, by threaded fitting, by snap fitting, or by screw fixing. Furthermore, the gap between the heat conductive cover 42 and the first line segment inside it can be filled with a second heat conductive adhesive layer.

[0049] Figure 5 A schematic diagram of the structure of the third heat-conducting component in use according to the embodiment of the present utility model; Figure 5 As shown, in Figure 4 On the basis of, in order to further improve the heat conduction effect, the heat conduction component 40 also includes a winding post 43, and the winding post 43 is arranged on a side of the heat conductor 41 close to the heat conduction cover 42 and is located in the heat conduction cover 42. By providing the winding post 43, the contact area between the first line segment and the heat conduction component 40 is further increased, thereby improving the heat conduction effect.

[0050] In this embodiment, the structure of the winding post 43 is not specifically limited. For example, the winding post 43 is a columnar body. When used, the first line segment is wound around the outer wall of the columnar body. In other examples, continue as Figure 5 As shown: the winding post 43 is provided with a plurality of third through holes arranged obliquely along the height direction for the first line segment to pass through. This arrangement enables the first line segment to reliably contact the winding post 43 for heat conduction. At the same time, it also plays a limiting role, so that the first transmission line segment passes through the third through hole at the top to the second through hole of the heat conductive cover 42, thereby improving the integration. Of course, the third through hole here can also be provided in parallel along the radial direction of the winding post 43.

[0051] Continue as Figure 3 and Figure 4 and Figure 5As shown: In some implementations of this embodiment, the heat conductor 41 includes a heat conductor body 411 and a heat conductor seat 412 coaxially clamped on the outer wall of the heat conductor body 411, the outer wall of the heat conductor body 411 is gap-matched with the first mounting hole on the temperature zone partition plate 10, the heat conductor seat 412 is covered at the gap between the first mounting hole and the heat conductor body 411 and is installed on the temperature zone partition plate 10, and the first through hole is arranged on the heat conductor body 411. Through the above arrangement, the installation of the heat conductor 41 is facilitated while ensuring the heat conduction effect.

[0052] The structure of the heat-conducting seat 412 in this embodiment is not specifically limited. Two specific structures of the heat-conducting seat 412 are given below.

[0053] Figure 6 A schematic diagram of the structure of a heat-conducting seat 412 provided in an embodiment of the utility model; Figure 6 As shown: the heat-conducting seat 412 is a columnar body with a central through hole, and the central through hole is used to be sleeved on the outer wall of the heat-conducting body 411. Specifically, the side wall of the heat-conducting seat 412 is provided with a T-shaped gap 4123 connected to the central through hole, and the T-shaped gap 4123 is composed of a radial gap arranged radially and an axial gap arranged axially. The heat-conducting seat 412 on both sides of the axial gap is respectively provided with a through hole and a threaded hole, and the locking bolt passes through the through hole and is installed in the threaded hole. The locking bolt is tightened to reduce the inner diameter of the heat-conducting seat 412 to achieve clamping of the heat-conducting body 411. The heat-conducting seat 412 is also provided with a threaded hole for detachable connection with the temperature zone dividing plate 10. Exemplarily, the heat-conducting seat 412 and the temperature zone dividing plate 10 are detachably connected by screws.

[0054] Figure 7 A schematic diagram of the structure of another heat-conducting seat 412 provided in an embodiment of the utility model; Figure 7 As shown: the heat-conducting seat 412 is composed of a first clamping block 4121 and a second clamping block 4122, which are clamped together to form a central through hole for accommodating the heat-conducting body 411. Specifically, the first clamping block 4121 and the second clamping block 4122 are respectively provided with a through hole and a threaded hole, and a locking bolt passes through the through hole and is installed in the threaded hole so that the first clamping block 4121 and the second clamping block 4122 are clamped together to form a central through hole for accommodating the heat-conducting body 411. The locking bolt is tightened so that the first clamping block 4121 and the second clamping block 4122 clamp the heat-conducting body 411; the first clamping block 4121 and the second clamping block 4122 are both provided with threaded holes for detachably connecting with the temperature zone dividing plate 10 by screws.

[0055] Based on the same application concept, the embodiment of the present application also proposes a quantum computer, including the above-mentioned dilution refrigerator and a quantum chip, wherein the quantum chip is installed in the dilution refrigerator. The quantum computer of the present application includes the above-mentioned dilution refrigerator, and thus has the same beneficial effects as the above-mentioned dilution refrigerator, which will not be described in detail here.

[0056] In the description of this specification, the description with reference to the terms "some embodiments" or "examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0057] The above are only preferred embodiments of the present invention and do not limit the present invention in any way. Any technician in the relevant technical field, without departing from the scope of the technical solution of the present invention, may make any equivalent replacement or modification to the technical solution and technical content disclosed in the present invention, which shall be deemed as the content of the technical solution of the present invention and still fall within the protection scope of the present invention.

Claims

1. A dilution refrigerator, characterized in that: include: A plurality of cooling chambers with gradually decreasing temperatures, the plurality of cooling chambers being separated by a plurality of temperature zone partition plates, and at least one electronic device being arranged in each of the cooling chambers; An external device, disposed outside the cooling chamber, for receiving a signal from the electronic device and / or controlling the operation of the electronic device; A plurality of signal lines, each signal line being used to electrically connect the external device and one of the electronic devices; A heat conduction component is installed on the temperature zone partition plate, and at least one heat conduction component is installed on each of the temperature zone partition plates except the temperature zone partition plate with the lowest temperature; Wherein, any signal line contacts any of the heat-conducting components on each temperature zone dividing plate in its transmission path to achieve heat conduction on the signal line.

2. The dilution refrigerator according to claim 1, characterized in that A heat conduction component is provided on any of the temperature zone dividing plates.

3. The dilution refrigerator according to claim 1, characterized in that The heat-conducting assembly includes a heat conductor installed on the temperature zone dividing plate, and the heat conductor is provided with at least one first through hole for the signal line to pass through.

4. The dilution refrigerator according to claim 3, characterized in that A first signal connector is provided in the first through hole; Any of the signal lines is composed of a plurality of first line segments electrically connected through a first signal connector, and the first line segments are electrically connected to the first signal connector.

5. The dilution refrigerator according to claim 4, characterized in that The first line segment between the electronic device on the temperature zone dividing plate with the lowest temperature and the heat-conducting component on the adjacent temperature zone dividing plate is a superconducting wire.

6. The dilution refrigerator according to claim 4, characterized in that The heat-conducting component further comprises a heat-conducting cover arranged outside the first signal connector, and the heat-conducting cover is provided with a second through hole for the first line segment to pass through.

7. The dilution refrigerator according to claim 6, characterized in that The heat-conducting component further comprises a winding post, which is arranged on a side of the heat-conducting body close to the heat-conducting cover and is located inside the heat-conducting cover.

8. The dilution refrigerator according to claim 7, characterized in that The winding column is provided with a plurality of third through holes which are arranged obliquely along the height direction and are used for the first wire segment to pass through.

9. The dilution refrigerator according to claim 3, characterized in that The heat conductor includes a heat conductive body and a heat conductive seat coaxially clamped on the outer wall of the heat conductive body, the outer wall of the heat conductive body is gap-matched with the first mounting hole on the temperature zone dividing plate, the heat conductive seat cover is arranged in the gap between the first mounting hole and the heat conductive body and is installed on the temperature zone dividing plate, and the first through hole is arranged on the heat conductive body.

10. A quantum computer comprising: The dilution refrigerator according to claim 9; and a quantum chip, wherein the quantum chip is installed in the dilution refrigerator.

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