Wafer positioning device

Abstract

The utility model provides a wafer positioning device. The wafer positioning device comprises a bearing platform, a circle center positioning assembly and a processing module, the bearing table is used for bearing a wafer; the number of the circle center positioning assemblies is at least three, at least one circle center positioning assembly comprises a positioning piece and a radial positioning groove, the radial positioning groove extends from the edge of the bearing table to the middle of the bearing table in the radial direction of the bearing table, and the positioning piece is arranged in the radial positioning groove and can move along the radial positioning groove; and the processing module is connected with the positioning piece, and is used for driving the positioning piece to move in the radial positioning groove, so that the positioning piece pushes the wafer to move, and the circle center of the wafer coincides with the preset position of the bearing table. According to the utility model, the wafer can be accurately positioned without depending on a calibrator, the structure is simple, the original bearing platform can be directly modified, the input cost is reduced, the operation is simple and convenient, and the engineering efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer positioning device. Background Art

[0002] In the semiconductor manufacturing process, it is very important to accurately place the wafer in the most ideal position in the process chamber, which can maximize and optimize the process efficiency of the wafer. For example, the wafer needs to be accurately positioned in the following processes: (1) The measuring machine is used to measure the characteristic dimensions and other parameters of the pattern in the semiconductor structure. During the measurement, the wafer needs to be accurately placed on the carrier to facilitate subsequent measurements. (2) During the wafer polishing process, the wafer needs to be moved from the preparation station to the grinding station for grinding. The wafer needs to be accurately fixed on the grinding table to facilitate subsequent grinding work. (3) The robot arm is set in the transfer processing chamber, which can enter and exit one or more process processing chambers connected to the transfer processing chamber. The accuracy of the center point and orientation of the wafer at the initial position will help the robot arm to correctly move the wafer to the process processing chamber and accurately place the wafer at the most ideal position in the process processing chamber.

[0003] The known solutions for determining the center point and orientation of the wafer at the initial position have the following problems: (1) Aligning the wafer notch to an index orientation by manual visual recognition; however, the error of this method is very large, and the wafer cannot be accurately rotated to a predetermined angle according to the needs of the subsequent processing procedures, which has an adverse effect on the yield and efficiency of wafer processing. (2) Using a calibrator to align the wafer notch and calculate the center point by edge-finding circle fitting; however, if the calibrator components are damaged or the edge of the wafer is not found, subsequent measurements cannot be performed, greatly delaying the progress of the experimental project; and the calibrator is generally complex in structure, high in investment cost, cumbersome in operation, and low in calibration efficiency.

[0004] Therefore, it is necessary to provide a new type of wafer positioning device to solve the above problems existing in the prior art. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer positioning device that can accurately position the wafer without relying on a calibrator, thereby reducing the investment in the pre-aligner workstation. The device is not only simple in structure and can directly modify the original carrier platform, thus reducing the investment cost, but also simple and convenient to operate, thereby improving engineering efficiency.

[0006] To achieve the above-mentioned purpose, the wafer positioning device of the utility model includes a carrier platform, a center positioning component and a processing module; the carrier platform is used to carry the wafer; the center positioning component is provided with at least 3 groups, at least one group of the center positioning components includes a positioning member and a radial positioning groove, and the radial positioning groove extends from the edge of the carrier platform to the middle of the carrier platform along the radial direction of the carrier platform, the positioning member is arranged in the radial positioning groove, and can move along the radial positioning groove; the processing module is connected to the positioning member, and the processing module is used to drive the positioning member to move in the radial positioning groove, so that the positioning member pushes the wafer to move and makes the center of the wafer coincide with the preset position of the carrier platform.

[0007] The beneficial effect of the wafer positioning device of the present invention is that because the radial positioning groove is arranged along the radial direction of the carrier, when the positioning member pushes the wafer, the wafer will move toward the center of the carrier, and at least three positioning members move in at least three radial positioning grooves respectively, that is, a three-point center positioning method is utilized, so that the center of the wafer can be accurately and quickly coincided with the preset position of the carrier, so that the wafer can be accurately positioned without relying on the calibrator, reducing the investment in the pre-aligner workstation. The device is not only simple in structure, and can directly modify the original carrier, reducing the investment cost, but also simple and convenient to operate, improving engineering efficiency, and has strong versatility. It is suitable for various carriers that need to position wafers in semiconductor processes.

[0008] Preferably, the radial positioning groove includes a center positioning portion and a wafer supporting portion that are connected, the wafer supporting portion is arranged close to the center of the carrier, and the radial distance between the junction of the center positioning portion and the wafer supporting portion and the center of the carrier is equal to the radius of the wafer, and the processing module is used to drive the positioning member to move to the wafer supporting portion so that the positioning member supports the wafer. Its beneficial effect is that before the wafer falls on the carrier and after positioning is completed, it can be moved to the wafer supporting portion to support the wafer through the positioning member, so that the positioning member can not only be used for positioning, but also realize the function of carrying and supporting the wafer.

[0009] Preferably, the center positioning assembly further comprises a barrier member, the barrier member is movably arranged at the joint, the support platform is provided with a receiving cavity for receiving the barrier member, the processing module is connected with the barrier member, and the processing module is used to drive the barrier member to be protruded into the radial positioning groove or received in the receiving cavity, so as to block or allow the positioning member to move to the wafer support portion. Its beneficial effect is that when positioning the center of the wafer, the processing module drives the barrier member to be protruded into the radial positioning groove, so that the positioning member stops when the center positioning portion moves to the joint, which is beneficial to improve the accuracy of wafer center positioning, and when the positioning member is required to support the wafer, the processing module drives the barrier member to be received in the receiving cavity, so that the positioning member can move to the wafer support portion to support the wafer.

[0010] Preferably, a plurality of baffles are movably arranged in each radial positioning groove, the baffles are arranged at intervals, and the radial distance between adjacent baffles is equal to the difference in radius of wafers of adjacent sizes. The beneficial effect is that the wafer positioning device is suitable for positioning wafers of different sizes, has strong versatility, meets various usage requirements, and has high wafer center positioning accuracy.

[0011] Preferably, the wafer positioning device further comprises a wafer notch positioning assembly, the wafer notch positioning assembly comprises a wafer notch identification module and a circumferential positioning groove, the circumferential positioning groove is arranged along the circumference of the carrier and is connected to the radial positioning groove, and the radial distance between the circumferential positioning groove and the center of the carrier is less than the radius of the wafer, the wafer notch identification module is connected to the processing module, the wafer notch identification module is used to identify the notch of the wafer and send identification information to the processing module, and the processing module is used to drive the positioning member to move along the circumferential positioning groove according to the identification information, so that the positioning member drives the supported wafer to rotate and directs the notch of the wafer to a predetermined direction. Its beneficial effect is that the wafer is rotated by using the wafer notch identification module and the circumferential positioning groove without edge search, avoiding the measurement failure due to failure to find the edge of the wafer, and by controlling the positioning member to move in the circumferential positioning groove, the positioning member realizes the function of driving the wafer to rotate, thereby realizing accurate positioning of the orientation of the wafer.

[0012] Preferably, the wafer positioning device also includes a wafer notch positioning component, the wafer notch positioning component includes a wafer notch identification module and a rotating adsorption disk, the rotating adsorption disk is movably arranged on the supporting platform, the wafer notch identification module and the rotating adsorption disk are both connected to the processing module, the wafer notch identification module is used to identify the notch of the wafer and send identification information to the processing module, the processing module is used to drive the rotating adsorption disk to rotate according to the identification information, so that the rotating adsorption disk drives the supported wafer to rotate and points the notch of the wafer to a predetermined direction. Its beneficial effect is that the wafer is rotated straight using the wafer notch identification module and the rotating adsorption disk without edge search, avoiding the failure to find the edge of the wafer and causing the measurement to fail normally, thereby achieving accurate positioning of the wafer's orientation.

[0013] Preferably, the wafer positioning device further comprises an air guide component, the air guide component comprises a connected air supply component and an air guide channel, the air guide channel is arranged on the support platform, and the air outlet end of the air guide channel is arranged on the top of the support platform, the air supply component is connected to the processing module, and the processing module is used to control the air supply component to spray air when moving the wafer or supporting the wafer, and / or control the air supply component to exhaust air to adsorb the wafer. Its beneficial effects are: the processing module controls the air supply component to spray air to support the wafer, so that the falling speed of the wafer is slower when placed on the support platform, which is beneficial to reduce damage to the wafer and the formation of particles; the processing module controls the air supply component to exhaust air to adsorb the wafer, which is beneficial to ensure that the wafer can be stably placed on the support platform without displacement, thereby helping to improve the positioning accuracy of the wafer.

[0014] Preferably, there are a plurality of gas outlets, and the plurality of gas outlets are evenly distributed in the middle of the carrier, and the gas outlet is at least one of a hole structure, an arc structure, and a slit segment. The beneficial effect is that the uniformity of the gas at the bottom of the wafer is ensured, so that the wafer can rise or fall more smoothly, and the suction force on the wafer is more uniform, which is conducive to improving the positioning accuracy of the wafer.

[0015] Preferably, the wafer positioning device further comprises a wafer detection module, the processing module is connected to the wafer detection module, the wafer detection module is used to detect whether a wafer is placed on the carrier and send wafer detection information to the processing module, and the processing module is used to send a driving instruction to the positioning member according to the wafer detection information to drive the positioning member to move in the radial positioning groove. Its beneficial effect is that it enables fully automatic positioning and improves the positioning speed of the wafer.

[0016] Preferably, the wafer detection module is embedded on the top of the carrier, and the upper surface of the wafer detection module is flush with the upper surface of the carrier, which has the beneficial effect of avoiding affecting the movement of the wafer on the carrier, and facilitating the accuracy of positioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of a wafer positioning device according to a first embodiment of the utility model;

[0018] Figure 2 for Figure 1 The schematic diagram of the frame structure of the wafer positioning device shown;

[0019] Figure 3 for Figure 1 A schematic top view of a carrier platform in a wafer positioning device is shown;

[0020] Figure 4 It is a top view schematic diagram of a carrier platform in a wafer positioning device according to a second embodiment of the utility model;

[0021] Figure 5 It is a top view schematic diagram of a carrier platform in a wafer positioning device according to a third embodiment of the utility model;

[0022] Figure 6 for Figure 5 The frame structure schematic diagram of the wafer positioning device is shown. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0024] In order to overcome the problems existing in the prior art, an embodiment of the utility model provides a wafer positioning device, which can accurately position the wafer without relying on a calibrator, reducing the investment in the pre-aligner workstation. The device is not only simple in structure and can directly modify the original carrier platform, thus reducing the investment cost, but also simple and convenient to operate, thereby improving engineering efficiency.

[0025] Figure 1 This is a schematic structural diagram of a wafer positioning device according to a first embodiment of the utility model; Figure 2 for Figure 1 The schematic diagram of the frame structure of the wafer positioning device shown; Figure 3 for Figure 1 A schematic top view of a carrier platform in a wafer positioning device is shown.

[0026] In some embodiments of the present invention, reference Figures 1 to 3 The wafer positioning device includes a carrier platform 1, a center positioning component 2 and a processing module 3; the carrier platform 1 is used to carry a wafer 4; the center positioning component 2 is provided with at least 3 groups, at least one group of the center positioning component 2 includes a positioning member 21 and a radial positioning groove 22, and the radial positioning groove 22 extends from the edge of the carrier platform 1 to the middle of the carrier platform 1 along the radial direction of the carrier platform 1, the positioning member 21 is arranged in the radial positioning groove 22, and can move along the radial positioning groove 22; the processing module 3 is connected to the positioning member 21, and the processing module 3 is used to drive the positioning member 21 to move in the radial positioning groove 22, so that the positioning member 21 pushes the wafer 4 to move and the center of the wafer 4 coincides with the preset position of the carrier platform 1.

[0027] Specifically, because the radial positioning groove 22 is arranged along the radial direction of the carrier 1, when the positioning member 21 pushes the wafer, the wafer 4 will move toward the center of the carrier 1, and at least three positioning members 21 move in at least three radial positioning grooves 22 respectively, that is, a three-point center positioning method is utilized, so that the center of the wafer 4 can be accurately and quickly coincided with the preset position of the carrier 1, so that the wafer 4 can be accurately positioned without relying on the calibrator, reducing the investment in the pre-aligner workstation. The device is not only simple in structure, but also can directly modify the original carrier, reducing the investment cost, and is simple and convenient to operate, thereby improving engineering efficiency, and has strong versatility, and is suitable for various carriers that need to position wafers in semiconductor processes.

[0028] In some embodiments of the present invention, the processing module 3 is electrically connected or communicatively connected to the positioning member 21 .

[0029] In some embodiments of the present invention, reference Figure 1 and Figure 3 The radial positioning grooves 22 are arranged on the supporting platform 1 at equal intervals along the circumference of the supporting platform 1, which is beneficial to improving the accuracy of positioning the center of the wafer 4.

[0030] In some specific embodiments of the present utility model, reference Figure 1 and Figure 3The center positioning assembly 2 is provided with three groups, that is, the positioning member and the radial positioning groove 22 are each provided with three, and the angle between adjacent radial positioning grooves 22 is 120 degrees.

[0031] Figure 4 It is a top view schematic diagram of a carrier platform in a wafer positioning device according to a second embodiment of the utility model.

[0032] In some embodiments of the present invention, reference Figure 4 The radial positioning groove 22 includes a circle center positioning portion 221 and a wafer supporting portion 222 that are connected. The wafer supporting portion 222 is arranged close to the circle center of the carrier 1, and the radial distance between the junction of the circle center positioning portion 221 and the wafer supporting portion 222 and the circle center of the carrier 1 is equal to the radius of the wafer 4. The processing module 3 is used to drive the positioning member 21 to move to the wafer supporting portion 222 so that the positioning member 21 supports the wafer 4. That is, the wafer 4 can be moved to the wafer supporting portion 222 by the positioning member 21 to support the wafer 4 before it falls on the carrier 1 and after it is positioned, so that the positioning member 21 can not only be used for positioning, but also realize the function of carrying and supporting the wafer 4.

[0033] In an embodiment of the present invention, the radial distance is the distance along the radius direction of the supporting platform.

[0034] In some embodiments of the present invention, reference Figure 4 The center positioning assembly 2 further includes a barrier 23, which is movably arranged at the joint. The carrier 1 is provided with a receiving cavity (not shown in the figure) for receiving the barrier 23. The processing module 3 is connected with the barrier 23. The processing module 3 is used to drive the barrier 23 to be convexly arranged in the radial positioning groove 22 or to be received in the receiving cavity (not shown in the figure) to block or allow the positioning member 21 to move to the wafer support portion 222. When the center positioning of the wafer 4 is performed, the processing module 3 drives the barrier 23 to be convexly arranged in the radial positioning groove so that the positioning member 21 stops when the center positioning portion 221 moves to the joint, which is conducive to improving the accuracy of the center positioning of the wafer 4. When the positioning member 21 is required to support the wafer 4, the processing module 3 drives the barrier 23 to be received in the receiving cavity (not shown in the figure) so that the positioning member 21 can move to the wafer support portion 222 to support the wafer 4.

[0035] Specifically, the radial distance between the outer wall of the barrier 23 facing the carrier platform 1 and the center of the carrier platform 1 is equal to the radius of the wafer 4 .

[0036] Specifically, the receiving cavity is communicated with the radial positioning groove, and the blocking member can reciprocate between the receiving cavity and the radial positioning groove under the drive of the processing module.

[0037] In some embodiments of the utility model, the barrier member includes a connected driving member and a barrier plate, the driving member is connected to the processing module, the receiving cavity is arranged directly below the junction of the center positioning portion and the wafer support portion, and the barrier plate is movably arranged in the receiving cavity. When the center of the wafer is positioned by using a positioning member, the barrier member is driven by the processing module to rise from the receiving cavity to the radial positioning groove to prevent the positioning member from moving to the wafer support portion. When the positioning member is required to support the wafer, the barrier member is driven by the processing module to be retracted from the radial positioning groove into the receiving cavity to connect the center positioning portion and the wafer support portion, thereby allowing the positioning member to move to the wafer support portion.

[0038] Figure 5 It is a top view schematic diagram of a carrier platform in a wafer positioning device according to a third embodiment of the utility model.

[0039] In some embodiments of the present invention, reference Figure 5 A plurality of baffles 23 are movably arranged in each radial positioning groove 22, and the baffles 23 are arranged at intervals, and the radial distance between adjacent baffles 23 is equal to the difference in radius of adjacent-sized wafers 4. This makes the wafer positioning device suitable for positioning wafers 4 of different sizes, has strong versatility, meets various use requirements, and has high wafer center positioning accuracy.

[0040] In some embodiments of the utility model, at least three of the radial positioning grooves are radially distributed with the center of the support platform as the center, that is, one end of at least three of the radial positioning grooves is connected at the center of the support platform, and the other end of at least three of the radial positioning grooves is located at the edge of the support platform.

[0041] In other embodiments of the present invention, reference Figure 5 The radial distance between one end of at least three of the radial positioning grooves 22 and the center of the supporting platform 1 is smaller than the radius of the wafer 4 of the minimum size to be positioned, and the other end of at least three of the radial positioning grooves 22 is located at the edge of the supporting platform 1.

[0042] In some specific embodiments of the present utility model, reference Figure 5, the wafer positioning device is suitable for locating the center of any one size of wafers among 6 inches, 8 inches and 12 inches. One end of the radial positioning groove 22 is located at the edge of the carrier 1, and the radial distance between the other end of the radial positioning groove 22 and the center of the carrier 1 is less than the radius of a 6-inch wafer. The barrier 23 includes the first barrier 231, the second barrier 232 and the third barrier 233, which are sequentially arranged from the edge of the carrier 1 to the middle of the carrier 1. The radial distance between the outer wall of the first barrier 231 facing the carrier 1 and the center of the carrier 1 is equal to the radius of a 12-inch wafer, so as to block or allow the positioning member 21 to move into the radial positioning groove 22 between the first barrier 231 and the second barrier 232, so that the positioning member 21 can locate the center of a 12-inch wafer or support a 12-inch wafer. The radial distance between the outer wall of the carrier platform 1 and the center of the carrier platform 1 of the second barrier 232 is equal to the radius of an 8-inch wafer, so as to block or allow the positioning member 21 to move into the radial positioning groove 22 between the second barrier 232 and the third barrier 233, so that the positioning member 21 can position the center of an 8-inch wafer or support an 8-inch wafer. The radial distance between the outer wall of the carrier platform 1 and the center of the carrier platform 1 of the third barrier 233 is equal to the radius of a 6-inch wafer, so as to block or allow the positioning member 21 to move into the radial positioning groove 22 between the third barrier 233 and the center of the carrier platform, so that the positioning member 21 can position the center of a 6-inch wafer or support a 6-inch wafer.

[0043] Figure 6 for Figure 5 The frame structure schematic diagram of the wafer positioning device is shown.

[0044] In some embodiments of the present invention, the wafer positioning device further includes a wafer notch positioning component. Figure 5 and Figure 6The wafer notch positioning assembly includes a wafer notch identification module 51 and a circumferential positioning groove 52. The circumferential positioning groove 52 is arranged along the circumference of the carrier 1 and is connected to the radial positioning groove 22. The radial distance between the circumferential positioning groove 52 and the center of the carrier 1 is less than the radius of the wafer 4. The wafer notch identification module 51 is connected to the processing module 3. The wafer notch identification module 51 is used to identify the notch of the wafer 4 and send identification information to the processing module 3. The processing module 3 is used to drive the positioning member 21 to move along the circumferential positioning groove 52 according to the identification information, so that the positioning member 21 drives the wafer 4 supported by it to rotate and the notch of the wafer 4 is oriented in a predetermined direction. The wafer notch recognition module 51 and the circumferential positioning groove 52 are used to rotate the wafer 4 without edge search, thereby avoiding the situation where the edge of the wafer 4 is not found and the measurement cannot be performed normally. In addition, by controlling the positioning member 21 to move in the circumferential positioning groove 52, the positioning member 21 can drive the wafer 4 to rotate, thereby achieving precise positioning of the wafer's orientation.

[0045] In some specific embodiments of the present utility model, reference Figure 5 The wafer positioning device is suitable for wafer notch positioning of any one of the sizes of 6 inches, 8 inches and 12 inches, that is, positioning the orientation of the wafer. The circumferential positioning groove 52 includes the first circumferential positioning groove 521, the second circumferential positioning groove 522 and the third circumferential positioning groove 523 which are sequentially arranged from the edge of the carrier 1 to the middle of the carrier 1. The first circumferential positioning groove 521 is arranged in the area between the first baffle 231 and the second baffle 232, the second circumferential positioning groove 522 is arranged in the area between the second baffle 232 and the third baffle 233, and the third circumferential positioning groove 523 is arranged in the area between the third baffle 233 and the center of the carrier 1. The processing module 3 drives the positioning member 21 to move in the third circumferential positioning groove 523, so that the positioning member 21 drives the 6-inch wafer supported by it to rotate and the notch of the 6-inch wafer faces the predetermined direction. The processing module 3 drives the positioning member 21 to move in the third circumferential positioning groove 523 and / or the second circumferential positioning groove 522, so that the positioning member 21 drives the 8-inch wafer supported by it to rotate and the notch of the 8-inch wafer faces the predetermined direction. The processing module 3 drives the positioning member 21 to move in at least one of the third circumferential positioning groove 523, the second circumferential positioning groove 522 and the second circumferential positioning groove 522, so that the positioning member 21 drives the 12-inch wafer supported by it to rotate and the notch of the 12-inch wafer faces the predetermined direction.

[0046] In some embodiments of the present invention, reference Figure 5The circumferential positioning groove 52 is an annular positioning groove, and the circumferential positioning groove 52 is connected to each of the radial positioning grooves 22 .

[0047] In some other embodiments of the present invention, the circumferential positioning groove includes a plurality of arc-shaped positioning grooves arranged along the circumference of the supporting platform, and adjacent arc-shaped positioning grooves are interconnected to form an annular structure.

[0048] In some other embodiments of the present invention, the circumferential positioning groove includes a plurality of arc-shaped positioning grooves arranged along the circumference of the support platform, and adjacent arc-shaped positioning grooves are arranged at intervals, that is, adjacent arc-shaped positioning grooves are not connected.

[0049] In some embodiments of the utility model, the wafer notch recognition module includes an optical path unit and an imaging unit, and the imaging unit is connected to the processing module. Specifically, the wafer notch recognition module is a camera, which realizes wide-field rapid imaging of the wafer on the wafer stage through the camera to identify the notch of the wafer, and the processing module uses the notch of the wafer as a feature mark to identify the angle difference (angle offset) between it and the absolute coordinates in the stage coordinate system, and then rotates the wafer by the angle offset to achieve rotation, thereby ensuring that the notch of the wafer faces the same direction.

[0050] In some embodiments of the present invention, reference Figures 1 to 4 The wafer positioning device also includes a wafer notch positioning component 5, which includes a wafer notch identification module 51 and a rotating adsorption disk 53. The rotating adsorption disk 53 is movably arranged on the carrier 1. The wafer notch identification module 51 and the rotating adsorption disk 53 are both connected to the processing module 3. The wafer notch identification module 51 is used to identify the notch of the wafer and send identification information to the processing module 3. The processing module 3 is used to drive the rotating adsorption disk 53 to rotate according to the identification information, so that the rotating adsorption disk 53 drives the supported wafer 4 to rotate and turn the notch of the wafer 4 to a predetermined direction. The wafer notch identification module 51 and the rotating adsorption disk 53 are used to rotate the wafer 4 without edge search, which avoids the measurement failure due to the failure to find the edge of the wafer 4, thereby realizing accurate positioning of the wafer orientation.

[0051] In some embodiments of the present invention, reference Figures 2 to 6The wafer positioning device further includes an air guide component 6, which includes a connected air supply component 61 and an air guide channel (not shown in the figure), the air guide channel (not shown in the figure) is arranged on the carrier 1, and the air outlet end 62 of the air guide channel (not shown in the figure) is arranged on the top of the carrier 1, the air supply component 61 is connected to the processing module 3, and the processing module 3 is used to control the air supply component 61 to spray when moving the wafer 4 or supporting the wafer 4, and / or control the air supply component 61 to evacuate to adsorb the wafer 4. The processing module 3 controls the air supply component 61 to spray to support the wafer 4, so that the wafer 4 falls more slowly when placed on the carrier 1, which is conducive to reducing damage to the wafer 4 and the formation of particles. Further, in some embodiments, when the positioning member 21 moves to push the wafer 4 to move and position, the processing module 3 controls the air supply member 61 to spray air so that an air gap is formed between the carrier 1 and the wafer 4, reducing the friction on the bottom of the wafer 4 during the movement, and avoiding damage to the wafer 4; at the same time, if there is a film layer at the bottom or edge of the wafer 4, an air gap is formed between the carrier 1 and the wafer 4, which can also avoid the film layer at the bottom or edge of the wafer 4 from falling off during the movement and causing pollution. The processing module 3 controls the air supply member 61 to evacuate air to adsorb the wafer, which is beneficial to ensure that the wafer 4 can be stably placed on the carrier 1 without displacement, thereby helping to improve the positioning accuracy of the wafer 4. And the position of the air outlet 62 is mainly set so as not to interfere with the center positioning component 2 for the center positioning of the wafer 4.

[0052] In some embodiments of the present invention, reference Figure 3 When the supporting platform 1 is provided with the rotating adsorption plate 53 and the radius of the rotating adsorption plate 53 is small, the gas outlet 62 is arranged at the top of the rotating adsorption plate and the top of the supporting platform 1 to ensure the uniformity of the gas at the bottom of the wafer 4, so that the wafer 4 can rise or fall more smoothly, and the suction force on the wafer 4 is more uniform, which is beneficial to improve the positioning accuracy of the wafer 4.

[0053] In some embodiments of the present invention, reference Figure 4 When the supporting platform 1 is provided with the rotating adsorption plate 53, and the radius of the rotating adsorption plate 53 is relatively large, the gas outlet 62 is arranged at the top of the rotating adsorption plate 53, so that it can not only ensure the uniformity of the gas at the bottom of the wafer 4, but also enable the wafer 4 to rise or fall more smoothly, and make the suction force on the wafer 4 more uniform, which is beneficial to improve the positioning accuracy of the wafer 4, but also prevent interference with the center positioning component 2 to perform the center positioning of the wafer 4.

[0054] In some embodiments of the present invention, reference Figures 3 to 5There are a plurality of gas outlets 62, and the gas outlets 62 are evenly distributed in the middle of the carrier 1, and the gas outlets 62 are at least one of a hole structure, an arc structure, and a slit segment. This ensures the uniformity of the gas at the bottom of the wafer 4, so that the wafer 4 can rise or fall more smoothly, and the suction force on the wafer 4 is more uniform, which is conducive to improving the positioning accuracy of the wafer 4.

[0055] In some embodiments of the present invention, reference Figure 3 , the air outlet end 62 is a hole structure.

[0056] In other embodiments of the present invention, reference Figure 4 and Figure 5 , the air outlet end 62 is an arc-shaped structure.

[0057] In some embodiments of the present invention, reference Figure 2 and Figure 6 The wafer positioning device also includes a wafer detection module 7, and the processing module 3 is connected to the wafer detection module 7. The wafer detection module 7 is used to detect whether a wafer 4 is placed on the carrier 1 and send wafer detection information to the processing module 3. The processing module 3 is used to send a driving instruction to the positioning member 21 according to the wafer detection information to drive the positioning member 21 to move in the radial positioning groove 22, so that positioning can be performed fully automatically, thereby improving the positioning speed of the wafer.

[0058] In some embodiments of the utility model, the wafer detection module is embedded on the top of the carrier, and the upper surface of the wafer detection module is flush with the upper surface of the carrier, so as to avoid affecting the movement of the wafer on the carrier, which is conducive to ensuring the accuracy of positioning.

[0059] In some embodiments of the present invention, the wafer detection module is at least one of a pressure-sensitive element, a pressure sensor and a distance-measuring sensor.

[0060] In some specific embodiments of the present invention, the wafer detection module is a pressure-sensitive element or a pressure sensor. When the wafer falls onto the supporting platform, the pressure-sensitive element or the pressure sensor contacts the wafer, and the pressure-sensitive element or the pressure sensor generates pressure information and sends it to the processing module.

[0061] In some other specific embodiments of the present invention, the wafer detection module is a distance measuring sensor. When the wafer falls onto the supporting platform, the distance measuring sensor contacts the wafer, and the distance measured by the distance measuring sensor is 0; when the distance measuring sensor contacts or does not contact the wafer, the distance measured by the distance measuring sensor is greater than 0.

[0062] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A wafer positioning device, characterized in that: include: A carrier table, used for carrying wafers; A circle center positioning assembly, provided with at least three groups, at least one group of the circle center positioning assembly comprises a positioning member and a radial positioning groove, and the radial positioning groove extends from the edge of the bearing platform to the middle of the bearing platform along the radial direction of the bearing platform, and the positioning member is arranged in the radial positioning groove and can move along the radial positioning groove; A processing module is connected to the positioning member, and the processing module is used to drive the positioning member to move in the radial positioning groove, so that the positioning member pushes the wafer to move and the center of the wafer coincides with the preset position of the carrier.

2. The wafer positioning device according to claim 1, characterized in that: The radial positioning groove includes a connected center positioning portion and a wafer supporting portion, the wafer supporting portion is arranged close to the center of the carrier, and the radial distance between the junction of the center positioning portion and the wafer supporting portion and the center of the carrier is equal to the radius of the wafer, and the processing module is used to drive the positioning member to move to the wafer supporting portion so that the positioning member supports the wafer.

3. The wafer positioning device according to claim 2, characterized in that: The center positioning assembly also includes a barrier member, which is movably arranged at the joint, and the supporting platform is provided with a receiving cavity for receiving the barrier member. The processing module is connected to the barrier member, and the processing module is used to drive the barrier member to protrude into the radial positioning groove or be received in the receiving cavity to block or allow the positioning member to move to the wafer support portion.

4. The wafer positioning device according to any one of claims 1 to 3, characterized in that: A plurality of baffles are movably arranged in each radial positioning groove, the baffles are arranged at intervals, and the radial distance between adjacent baffles is equal to the difference in radius of wafers of adjacent sizes.

5. The wafer positioning device according to claim 1, characterized in that: It also includes a wafer notch positioning component, which includes a wafer notch positioning component and a circumferential positioning groove. The circumferential positioning groove is arranged along the circumference of the carrier platform and is connected to the radial positioning groove, and the radial distance between the circumferential positioning groove and the center of the carrier platform is smaller than the radius of the wafer. The wafer notch recognition module is connected to the processing module. The wafer notch recognition module is used to identify the notch of the wafer and send identification information to the processing module. The processing module is used to drive the positioning member to move along the circumferential positioning groove according to the identification information, so that the positioning member drives the wafer supported by it to rotate and the notch of the wafer is oriented in a predetermined direction.

6. The wafer positioning device according to claim 1, characterized in that: It also includes a wafer notch positioning component, which includes a wafer notch positioning component and a rotating adsorption plate. The rotating adsorption plate is movably arranged on the supporting platform. The wafer notch recognition module and the rotating adsorption plate are both connected to the processing module. The wafer notch recognition module is used to identify the notch of the wafer and send identification information to the processing module. The processing module is used to drive the rotating adsorption plate to rotate according to the identification information, so that the rotating adsorption plate drives the wafer supported by it to rotate and the notch of the wafer is oriented to a predetermined direction.

7. The wafer positioning device according to any one of claims 1 to 3 or 5 to 6, characterized in that: It also includes an air guide component, which includes a connected air supply component and an air guide channel, the air guide channel is arranged on the support platform, and the air outlet end of the air guide channel is arranged on the top of the support platform, the air supply component is connected to the processing module, and the processing module is used to control the air supply component to spray when moving the wafer or supporting the wafer, and / or control the air supply component to evacuate air to adsorb the wafer.

8. The wafer positioning device according to claim 7, characterized in that: There are a plurality of the air outlet ends, and the plurality of the air outlet ends are evenly distributed in the middle of the supporting platform. The air outlet ends are at least one of a hole structure, an arc structure and a slit segment.

9. The wafer positioning device according to claim 1, characterized in that: It also includes a wafer detection module, the processing module is connected to the wafer detection module, the wafer detection module is used to detect whether a wafer is placed on the carrier and send wafer detection information to the processing module, and the processing module is used to send a driving instruction to the positioning member according to the wafer detection information to drive the positioning member to move in the radial positioning groove.

10. The wafer positioning device according to claim 9, characterized in that: The wafer detection module is embedded in the top of the carrier platform, and the upper surface of the wafer detection module is flush with the upper surface of the carrier platform.

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