High-definition decoder
By adopting a multi-layer thermal conductivity and airflow guidance structure in the high-definition decoder, the high-temperature problem of the circuit is solved, efficient heat dissipation treatment is achieved, and the normal operation of the components is ensured.
Patent Information
- Application Number
- CN202420523753.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-18
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-03-18
AI Technical Summary
The high-definition decoder has a high temperature due to the high load operation of the circuit, and the traditional micro-fan has low heat dissipation efficiency, which affects the operation of the component.
A structure including a bottom thermal conductor plate, an upper thermal conductor plate, a circuit board, a heat dissipation groove, a miniature heat discharge fan, a connecting groove tube, a guide frame, a partition, a telescopic rod and a heat discharge assembly were designed, and the structure was guided by multiple layers of thermal conduction and air flow. Achieve efficient heat dissipation and expand the space of the heat dissipation orifice plate to quickly discharge heat.
It effectively reduces the temperature of the circuit components, improves the heat dissipation efficiency, and avoids the problem of high temperature affecting the operation of the components.
Smart Images
Figure CN222169888U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of decoders, in particular to a high-definition decoder. Background Art
[0002] The existence of decoders is because audio and video data storage must first be compressed, otherwise the amount of data is too large, and compression requires certain encoding to store the highest quality audio and video data with the smallest capacity. Therefore, when the data needs to be played, it must first be decoded by a decoder.
[0003] Since there are many circuit module components on the PCB board in the HD decoder, if the circuit of the HD decoder runs at a high load, the temperature of the HD decoder will be high, thereby affecting the operation of the circuit components on the HD decoder. Traditionally, the HD decoder only dissipates heat through a micro fan. Such a structure makes the heat dissipation efficiency of the HD decoder low. Therefore, we propose a HD decoder. Utility Model Content
[0004] In view of the deficiencies in the prior art, the utility model provides a high-definition decoder to solve the problems mentioned in the above background.
[0005] The utility model provides the following technical solution: The utility model discloses a high-definition decoder, including a decoder shell, a bottom heat conduction plate is arranged on the inner bottom of the decoder shell, four corners above the bottom heat conduction plate are respectively arranged with supporting feet, an upper heat conduction plate is arranged on a plurality of the supporting feet, a circuit substrate is arranged above the upper heat conduction plate, a decoder element is electrically connected to the circuit substrate, heat dissipation grooves are respectively provided on the left and right sides of the decoder shell, a heat dissipation component is arranged on the bottom heat conduction plate, an annular groove is provided above the decoder shell, a heat dissipation hole plate is slidably connected in the annular groove, a decoder shell cover is arranged above the heat dissipation hole plate, and a heat exhaust component is arranged on the decoder shell cover.
[0006] Furthermore, the heat dissipation component includes a micro heat exhaust fan arranged on the inner side of the heat dissipation groove on the left side, a connecting groove pipe is arranged on the right side of the micro heat exhaust fan, a square groove is opened on the top of the connecting groove pipe, and a guide frame is arranged on the connecting groove pipe.
[0007] Furthermore, a plurality of partitions are evenly arranged above the guide frame, and the upper portions of the plurality of partitions are in contact with the bottom of the upper heat conducting plate.
[0008] Furthermore, the heat dissipation component includes support plates respectively arranged on the front and rear inner walls of the decoder housing, a telescopic rod is arranged on the front support plate, and an electric extension rod is arranged on the rear support plate, and the upper ends of the telescopic rod and the electric extension rod are connected to the decoder housing cover.
[0009] Furthermore, the heat dissipation slot is provided with a detachable dustproof hole plate.
[0010] Furthermore, a fireproof cushion layer is provided on the inner side wall of the decoder housing.
[0011] Compared with the prior art, the utility model has the following beneficial effects:
[0012] The utility model performs heat dissipation treatment on the decoder through the structural setting of the heat dissipation component and the coordinated use of the heat exhaust component, so as to avoid the high-load operation of the circuit of the high-definition decoder, which makes the temperature of the high-definition decoder high, thereby affecting the operation of the circuit elements on the high-definition decoder; the micro heat exhaust fan is guided by the connecting slot tube, and then the airflow is blown upward through the square slot, and the wind is guided by the guide frame; the spacer and the bottom heat conduction plate and the upper heat conduction plate on the guide frame form a channel, and the heat conduction area of the circuit substrate is increased, and the heat generated by the heat conduction at the bottom of the circuit substrate is blown for heat dissipation, so as to perform efficient heat dissipation treatment on the decoder elements; the telescopic rod is extended and extended by the electric extension rod, so that the heat dissipation hole plate is pushed in the ring groove, thereby expanding the space of the decoder, and the heat in the decoder shell is quickly discharged through the holes of the heat dissipation hole plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a three-dimensional structural diagram of the utility model;
[0014] Figure 2 It is a cross-sectional view of the utility model;
[0015] Figure 3 for Figure 2 The enlarged view of point A in the middle;
[0016] Figure 4 It is a schematic diagram of the structure of the decoder housing without circuit substrate and decoder components;
[0017] Figure 5 for Figure 4 Enlarged view of point B in the middle.
[0018] In the figure: 1. decoder housing; 2. bottom heat conduction plate; 3. support foot; 4. upper heat conduction plate; 5. circuit board; 6. decoder element; 7. heat dissipation groove; 8. ring groove; 9. heat dissipation hole plate; 10. decoder shell cover; 11. micro heat exhaust fan; 12. connecting groove pipe; 13. square groove; 14. guide frame; 15. partition; 16. support plate; 17. telescopic rod; 18. electric extension rod; 19. dustproof hole plate; 20. fireproof cushion layer. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] See also Figure 1-5 A high-definition decoder of the present embodiment includes a decoder housing 1, a display screen and a connection plug-in are arranged in front of the decoder housing 1, the decoder housing 1 and the decoder shell cover 10 are made of ABS plastic material, so that the high-definition decoder has fire resistance, a bottom heat conducting plate 2 is arranged at the inner bottom of the decoder housing 1, and the bottom heat conducting plate 2 and the upper heat conducting plate 4 are made of copper, so that the bottom heat conducting plate 2 and the upper heat conducting plate 4 have good thermal conductivity, so as to conduct heat to the decoder element 6 on the circuit substrate 5, and then to dissipate heat for the high-definition decoder, and legs 3 are respectively arranged at the upper four corners of the bottom heat conducting plate 2, and the longitudinal section of the legs 3 is L-shaped, and the upper heat conducting plates 4 are arranged on the plurality of legs 3, and the upper heat conducting plates 4 are arranged above the upper heat conducting plates 4. A circuit board 5 is provided, and a decoder element 6 is electrically connected to the circuit board 5. The decoder element 6 is used to decode the external electrical circuit. Heat dissipation grooves 7 are respectively provided on the left and right sides of the decoder housing 1. A heat dissipation component is provided on the bottom heat conducting plate 2 to efficiently dissipate heat for the decoder, thereby preventing the decoder element 6 from being in a high temperature state, thereby affecting the use of the decoder. An annular groove 8 is provided above the decoder housing 1, and a heat dissipation hole plate 9 is slidably connected in the annular groove 8. A decoder shell cover 10 is provided above the heat dissipation hole plate 9. A heat dissipation component is provided on the decoder shell cover 10, and the heat dissipation hole plate 9 is pushed in the annular groove 8 to expand the space of the decoder, and the heat in the decoder housing 1 is quickly discharged through the holes of the heat dissipation hole plate 9.
[0021] like Figure 4 , 5 As shown, the heat dissipation component includes a micro heat exhaust fan 11 arranged on the inner side of the left heat dissipation slot 7, a connecting slot tube 12 is arranged on the right side of the micro heat exhaust fan 11, a square slot 13 is opened above the connecting slot tube 12, and a guide frame 14 is arranged on the connecting slot tube 12. The micro heat exhaust fan 11 will be guided by the connecting slot tube 12, and then the airflow will be blown upward through the square slot 13, and the wind will be guided by the guide frame 14, and then the bottom of the circuit substrate 5 will be blown to dissipate heat, thereby efficiently dissipating the heat of the decoder element 6.
[0022] like Figure 4 , 5As shown, a plurality of partitions 15 are evenly arranged above the guide frame 14, and the upper parts of the plurality of partitions 15 are in contact with the bottom of the upper heat conducting plate 4 to guide the wind of the micro heat exhaust fan 11, thereby efficiently dissipating the heat of the bottom of the circuit substrate 5 mounted on the support leg 3, and the partition 13 and the bottom heat conducting plate 2 and the upper heat conducting plate 4 are made of copper, which conducts the heat generated by the decoder element 6, thereby preventing the decoder element 6 from being in a high temperature state.
[0023] like Figure 2 , 4 As shown, the heat dissipation component includes support plates 16 respectively arranged on the inner walls of the front and rear sides of the decoder housing 1, a telescopic rod 17 is arranged on the front support plate 16, and an electric extension rod 18 is arranged on the rear support plate 16. The telescopic rod 17 and the upper ends of the electric extension rod 18 are connected to the decoder housing cover 10. Through the extension and extension of the electric extension rod 18, the telescopic rod 17 is also extended and extended, so that the heat dissipation hole plate 9 is pushed in the annular groove 8, thereby expanding the space of the decoder, and the heat in the decoder housing 1 is quickly discharged through the holes of the heat dissipation hole plate 9.
[0024] like Figure 1 As shown, a detachable dustproof hole plate 19 is provided on the heat dissipation slot 7. The dustproof hole plate 19 is made of polyethylene. The dustproof hole plate 19 can be used to dissipate heat for the decoder on the one hand, and on the other hand, the decoder can be dissipated.
[0025] like Figure 2 , 4 As shown, a fireproof cushion layer 20 is arranged on the inner side wall of the decoder housing 1 . The material of the fireproof cushion layer 20 is made of glass fiber. The fireproof cushion layer 20 is arranged on the inner side wall of the decoder housing 1 to improve the fire resistance of the fireproof cushion layer 20 .
[0026] During the specific implementation of this embodiment, the decoder is heat-dissipated through the structural setting of the heat dissipation component and the use of the heat dissipation component, so as to avoid the high-load operation of the circuit of the high-definition decoder, which makes the temperature of the high-definition decoder high, thereby affecting the operation of the circuit elements on the high-definition decoder. The micro heat dissipation fan 11 will be guided by the connecting groove tube 12, and then the airflow will be blown upward through the square groove 13, and the wind will be guided by the guide frame 14. The spacers on the guide frame 14 and the bottom heat conduction plate 2 and the upper heat conduction plate 4 form a channel, and increase the heat conduction area of the circuit substrate 5, and the heat generated by the heat conduction at the bottom of the circuit substrate 5 is blown and dissipated, so that the decoder element 6 is efficiently heat-dissipated. By extending and releasing the electric extension rod 18, the telescopic rod 17 is also extended and released, so that the heat dissipation hole plate 9 is pushed in the annular groove 8, thereby expanding the space of the decoder, and the heat in the decoder housing 1 is quickly discharged through the holes of the heat dissipation hole plate 9.
[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A high-definition decoder, comprising a decoder housing (1), characterized in that: A bottom heat conducting plate (2) is arranged at the bottom inner side of the decoder housing (1), and legs (3) are arranged at the four corners above the bottom heat conducting plate (2), and an upper heat conducting plate (4) is arranged on the plurality of legs (3). A circuit substrate (5) is arranged above the upper heat conducting plate (4), and a decoder element (6) is electrically connected to the circuit substrate (5). Heat dissipation grooves (7) are respectively arranged on the left and right sides of the decoder housing (1), and a heat dissipation component is arranged on the bottom heat conducting plate (2). An annular groove (8) is arranged above the decoder housing (1), and a heat dissipation hole plate (9) is slidably connected in the annular groove (8). A decoder housing cover (10) is arranged above the heat dissipation hole plate (9), and a heat dissipation component is arranged on the decoder housing cover (10).
2. A high-definition decoder according to claim 1, characterized in that: The heat dissipation component comprises a micro heat dissipation fan (11) arranged on the inner side of the heat dissipation slot (7) on the left side, a connecting slot tube (12) is arranged on the right side of the micro heat dissipation fan (11), a square slot (13) is opened above the connecting slot tube (12), and a guide frame (14) is arranged on the connecting slot tube (12).
3. A high-definition decoder according to claim 2, characterized in that: A plurality of partitions (15) are evenly arranged above the guide frame (14), and the upper parts of the plurality of partitions (15) are in contact with the bottom of the upper heat conducting plate (4).
4. A high-definition decoder according to claim 1, characterized in that: The heat dissipation component comprises support plates (16) respectively arranged on the inner walls of the front and rear sides of the decoder housing (1); a telescopic rod (17) is arranged on the front support plate (16); an electric extension rod (18) is arranged on the rear support plate (16); the upper ends of the telescopic rod (17) and the electric extension rod (18) are connected to the decoder housing cover (10).
5. A high-definition decoder according to claim 1, characterized in that: The heat dissipation slot (7) is provided with a detachable dustproof hole plate (19).
6. A high-definition decoder according to claim 1, characterized in that: A fireproof cushion layer (20) is provided on the inner side wall of the decoder housing (1).