Backlight module capable of avoiding function failure of FPC (Flexible Printed Circuit)
By setting the second PI layer and reinforcement layer at the connection between the binding area and the bending area of the FPC, the problem of the via area of the single-layer area of the backlight module FPC is easily broken near the pad position, and the strength of the area is enhanced. It avoids the potential for breakage and breakage, and improves the stability of the backlight module.
Patent Information
- Application Number
- CN202420282831.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-05
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-02-05
AI Technical Summary
The FPC of the backlight module is prone to breaking in the via area near the pad position of the single-layer area, resulting in functional failure.
The second PI layer and reinforcement layer are arranged at the connection between the binding area and the bending area of the FPC to cover part of the front line layer and the substrate layer to enhance the strength of the single-layer area and avoid breakage.
It effectively avoids the problem of easy breakage and damage of the backlit pad vias, and improves the softness and stability of the FPC.
Smart Images
Figure CN222189659U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of liquid crystal display, and more specifically to a backlight module for preventing FPC function failure. Background Art
[0002] The FPC of the backlight module is soldered to the pad of the main screen FPC through the pad, and then bent together with the main screen FPC to the iron frame of the backlight module for fixing. In order to improve the softness of the FPC of the backlight module, the FPC of the backlight module is generally made into a single-layer area in the area that needs to be bent. However, the via area near the pad position in the single-layer area is in a fragile state and is easily broken, posing a serious functional risk. Therefore, this design causes the problem that the via of the backlight pad is easily broken. Utility Model Content
[0003] The technical problem to be solved by the utility model is how to prevent the via hole area of the single-layer area close to the pad position from being easily broken.
[0004] The technical problem to be solved by the utility model is achieved through the following technical solutions:
[0005] In order to solve the above technical problems, the utility model provides a backlight module for avoiding FPC function failure, which includes a lower frame, a reflective sheet, a light guide plate and an optical film group which are sequentially stacked from bottom to top, the lower frame includes a bottom plate and a side wall extending upward from the edge of the bottom plate, an FPC is fixed on the side wall, the FPC includes a fixed area, a bending area and a binding area which are sequentially arranged from left to right, an LED lamp is fixed on the FPC located in the fixed area, the FPC includes a first PI layer, a back circuit layer and a substrate layer which are sequentially stacked from bottom to top, a front circuit layer is arranged above the substrate layer of the FPC located in the binding area, a second PI layer and a reinforcement layer arranged above the second PI layer are arranged on the FPC located at the connection between the binding area and the bending area, the second PI layer and the reinforcement layer cover part of the front circuit layer and part of the substrate layer located in the bending area, a window for avoiding air is arranged on the first PI layer located in the binding area, and a plurality of pad vias are arranged on the FPC located in the binding area.
[0006] As a preferred implementation of the backlight module for avoiding FPC function failure provided by the utility model, the reinforcement layer is white ink or white film.
[0007] As a preferred implementation of the backlight module for avoiding FPC function failure provided by the utility model, at least one elastic block is provided between the side of the light guide plate away from the light incident side and the side wall.
[0008] As a preferred implementation of the backlight module for avoiding FPC function failure provided by the utility model, at least one protrusion is provided on both sides of the elastic block.
[0009] As a preferred implementation of the backlight module for avoiding FPC function failure provided by the utility model, the elastic block is provided with a shock absorbing hole between adjacent protrusions.
[0010] As a preferred implementation of the backlight module for avoiding FPC function failure provided by the utility model, grooves are provided on the inner wall of the shock absorbing hole close to the side of the protrusion, and shock absorbing devices are provided between adjacent grooves.
[0011] As a preferred implementation of the backlight module for avoiding FPC function failure provided by the utility model, the shock absorbing device is a spring or two magnets with the same poles facing each other.
[0012] As a preferred embodiment of the backlight module for avoiding FPC function failure provided by the utility model, at least one glue column is provided on the upper surface of the light guide plate, the optical film group is provided with a positioning hole corresponding to the glue column, and the optical film group is sleeved on the glue column.
[0013] As a preferred implementation of the backlight module for avoiding FPC function failure provided by the utility model, an annular groove surrounding the glue column is provided on the upper surface of the light guide plate at the connection between the light guide plate and the glue column.
[0014] As a preferred implementation of the backlight module for avoiding FPC function failure provided by the utility model, the cross-sectional shape of the annular groove is square, arc or triangle.
[0015] The utility model has the following beneficial effects:
[0016] Since a second PI layer and a reinforcement layer above the second PI layer are provided on the FPC at the connection between the binding area and the bending area, the second PI layer and the reinforcement layer cover part of the front circuit layer and part of the substrate layer located in the bending area, so that the state of the via area close to the pad position in the single-layer area is strengthened, avoiding the hidden danger of breakage and fracture, and avoiding the problem of easy breakage of the backlight pad via. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0018] Figure 1 The utility model provides a structural schematic diagram of a backlight module for preventing FPC function failure.
[0019] Figure 2 for Figure 1 Schematic diagram of the structure of FPC.
[0020] Figure 3 This is a schematic diagram of the structure of Example 2.
[0021] Figure 4 for Figure 3 Schematic diagram of the improved structure.
[0022] Figure 5 This is a schematic diagram of the structure of Example 3.
[0023] Figure 6 for Figure 5 Schematic diagram of the structure of the elastic block.
[0024] Description of Figure Numbers:
[0025] Lower frame 1; reflector 2; light guide plate 3; optical film group 4; bottom plate 11; side wall 12; FPC 5; fixing area 501; bending area 502; binding area 503; LED lamp 6; first PI layer 51; back circuit layer 52; substrate layer 53; front circuit layer 54; second PI layer 55; reinforcement layer 56; airtight window 57;
[0026] Elastic block 7; convex block 71; shock absorbing hole 72; groove 73; shock absorbing device 74;
[0027] Glue column 31; annular groove 32. DETAILED DESCRIPTION
[0028] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0030] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0031] The utility model provides a backlight module for avoiding functional failure of an FPC, which comprises a lower frame, a reflective sheet, a light guide plate and an optical film group which are sequentially stacked from bottom to top, the lower frame comprises a bottom plate and a side wall extending upward from the edge of the bottom plate, an FPC is fixed on the side wall, the FPC comprises a fixed area, a bending area led outward and a binding area which are sequentially arranged from left to right, an LED lamp is fixed on the FPC located in the fixed area, the FPC comprises a first PI layer, a back circuit layer and a substrate layer which are sequentially stacked from bottom to top, a front circuit layer is arranged above the substrate layer of the FPC located in the binding area, a second PI layer and a reinforcement layer arranged above the second PI layer are arranged on the FPC located at the connection between the binding area and the bending area, the second PI layer and the reinforcement layer cover part of the front circuit layer and part of the substrate layer located in the bending area, a window for avoiding air is arranged on the first PI layer located in the binding area, and a plurality of pad vias are arranged on the FPC located in the binding area.
[0032] Since a second PI layer and a reinforcement layer above the second PI layer are provided on the FPC at the connection between the binding area and the bending area, the second PI layer and the reinforcement layer cover part of the front circuit layer and part of the substrate layer located in the bending area, so that the state of the via area close to the pad position in the single-layer area is strengthened, avoiding the hidden danger of breakage and fracture, and avoiding the problem of easy breakage of the backlight pad via.
[0033] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.
[0034] Example 1
[0035] See also Figure 1 and Figure 2 , a backlight module for preventing FPC function failure provided by the utility model, comprising a lower frame 1, a reflective sheet 2, a light guide plate 3 and an optical film group 4 which are sequentially stacked from bottom to top, the lower frame 1 comprising a bottom plate 11 and a side wall 12 extending upward from the edge of the bottom plate 11, an FPC 5 is fixed on the side wall 12, the FPC 5 comprises a fixed area 501, an outwardly extending bending area 502 and a binding area 503 which are sequentially arranged from left to right, an LED lamp 6 is fixed on the FPC 5 located in the fixed area 501, the FPC 5 comprises a first PI layer 51, A back circuit layer 52 and a substrate layer 53, a front circuit layer 54 is arranged above the substrate layer 53 of the FPC5 located in the binding area 503, a second PI layer 55 and a reinforcement layer 56 arranged above the second PI layer 55 are arranged on the FPC5 located at the connection between the binding area 503 and the bending area 502, the second PI layer 55 and the reinforcement layer 56 cover part of the front circuit layer 54 and part of the substrate layer 53 located in the bending area 502, a window 57 is arranged on the first PI layer 51 located in the binding area 503, and a plurality of pad vias are arranged on the FPC5 located in the binding area 503. Since the second PI layer 55 and the reinforcement layer 56 arranged above the second PI layer 55 are arranged on the FPC5 located at the connection between the binding area 503 and the bending area 502, the second PI layer 55 and the reinforcement layer 56 cover part of the front circuit layer 54 and part of the substrate layer 53 located in the bending area 502, so that the state of the via area in the single-layer area close to the pad position is strengthened, avoiding the hidden danger of breakage and fracture, and avoiding the problem of easy breakage of the backlight pad via.
[0036] Furthermore, the reinforcing layer 56 is white ink or white film. Its purpose is to reinforce the tin holes and wirings that are not involved in soldering here to prevent the tin holes and wirings from being broken. After being protected here, it will not be bent due to the bending of the backlight FPC5, thus avoiding the generation of stress.
[0037] Example 2
[0038] See also Figure 3 and Figure 4 As a further optimization scheme of Example 1, in this embodiment, at least one elastic block 7 is provided between the side of the light guide plate 3 away from the light incident side and the side wall 12. The elastic block 7 can make the light guide plate 3 firmly abut against the elastic block 7, buffer the impact force of the light guide plate 3 on the lower frame 1, avoid the collision between the light guide plate 3 and the lower frame 1 and cause noise, and also can improve the service life of the light guide plate 3.
[0039] Furthermore, at least one protrusion 71 is provided on both sides of the elastic block 7 , and the protrusion 71 directly abuts against the light guide plate 3 and the side wall 12 of the lower frame 1 , which can align the elastic block 7 with the light guide plate 3 and the side wall 12 , further improving the buffering performance of the elastic block 7 .
[0040] As the elastic block 7 is used for a longer time, the elasticity of the elastic block 7 will also weaken due to aging. In order to increase the ability of the elastic block 7 to buffer the impact force and increase the service life of the elastic block 7, the elastic block 7 is provided with a shock-absorbing hole 72 between adjacent protrusions 71. In this embodiment, the shock-absorbing hole 72 is a square hole. When the light guide plate 3 hits the elastic block 7, the elastic block 7 will be concave and deformed in the direction of the shock-absorbing hole 72 to absorb the impact force of the light guide plate 3, thereby further achieving the purpose of shock absorption and noise reduction. It should be noted that the shock-absorbing hole 72 can be a through hole or a blind hole, or an inner hole built into the elastic block 7, which is not limited here and falls within the scope of protection of the utility model. The present embodiment uses a through hole, which is easy to manufacture and has a low production cost. The shape of the shock-absorbing hole 72 can be a square hole or a round hole, which can be selected according to actual conditions and is not limited here.
[0041] In order to further increase the ability of the elastic block 7 to buffer the impact force, a groove 73 is provided on the inner wall of the shock-absorbing hole 72 close to the side of the protrusion 71. In this embodiment, there are only two protrusions 71, so there are only two grooves 73. It is possible to set multiple protrusions 71 and multiple grooves 73 according to actual conditions. A shock-absorbing device 74 is provided between adjacent grooves 73. The shock-absorbing device 74 can be used to further increase the ability of the elastic block 7 to buffer the impact force and absorb the impact force of the light guide plate 3, thereby further achieving the purpose of shock absorption and noise reduction.
[0042] Furthermore, the shock absorbing device 74 is any one of a spring or two magnets with the same poles facing each other. The elastic force of the spring or the repulsive force generated by the two magnets with the same poles facing each other is used to further increase the ability of the elastic block 7 to buffer the impact force. The spring and magnet are both standard commodities that can be purchased on the market, and no special customization is required. The procurement cost is low and can be replaced at any time, which is cost-effective.
[0043] Example 3
[0044] See also Figure 5 and Figure 6As a further optimization scheme of Example 1, in this embodiment, at least one glue column 31 is provided on the upper surface of the light guide plate 3, preferably four in this embodiment, which are evenly distributed at the four corners of the light guide plate 3, and the optical film group 4 is provided with positioning holes corresponding to the glue columns 31, and the optical film group 4 is sleeved on the glue columns 31. The positioning holes on the optical film group 4 can be positioned and fixed by the glue columns 31, and there is no need to use auxiliary fixtures for positioning, the assembly process is simple, the assembly accuracy is high, and the production cost of the backlight module can be reduced.
[0045] When the number of molds manufactured is large, the mold at the glue column 31 will be worn to a certain extent. The wear here will cause a fillet to be formed between the light guide plate 3 and the glue column 31 produced later. When the fillet exists, the optical film group 4 will interfere with the fillet, resulting in the inability to install the optical film group 4. Therefore, preferably, the upper surface of the light guide plate 3 is provided with a ring groove 32 surrounding the glue column 31 at the connection between the light guide plate 3 and the glue column 31. When the mold is worn, it will only be worn at the ring groove 32, so as to avoid the generation of fillets at the edge corners of the glue column 31 due to mold wear, which will interfere with other parts and affect the assembly accuracy, thereby improving the yield rate and assembly efficiency.
[0046] Furthermore, the cross-sectional shape of the annular groove 32 is square, arc or triangle, but not limited thereto. The square, arc and triangle structures are simple and easy to manufacture; and the assembly accuracy will not be affected after the mold is worn.
[0047] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0048] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.
Claims
1. A backlight module for preventing FPC function failure, characterized in that: It includes a lower frame, a reflective sheet, a light guide plate and an optical film group which are stacked in sequence from bottom to top, the lower frame includes a bottom plate and a side wall extending upward from the edge of the bottom plate, an FPC is fixed on the side wall, the FPC includes a fixed area, a bending area and a binding area which are arranged in sequence from left to right, an LED lamp is fixed on the FPC located in the fixed area, the FPC includes a first PI layer, a back circuit layer and a substrate layer which are stacked in sequence from bottom to top, a front circuit layer is arranged above the substrate layer of the FPC located in the binding area, a second PI layer and a reinforcement layer arranged above the second PI layer are arranged on the FPC located at the connection between the binding area and the bending area, the second PI layer and the reinforcement layer cover part of the front circuit layer and part of the substrate layer located in the bending area, a window for avoiding air is arranged on the first PI layer located in the binding area, and a plurality of pad vias are arranged on the FPC located in the binding area.
2. The backlight module for preventing FPC function failure according to claim 1, characterized in that: The reinforcing layer is white ink or white film.
3. The backlight module for preventing FPC function failure according to claim 1, characterized in that: At least one elastic block is disposed between the side of the light guide plate away from the light incident side and the side wall.
4. The backlight module for preventing FPC function failure according to claim 3, characterized in that: At least one protrusion is disposed on both sides of the elastic block.
5. The backlight module for preventing FPC function failure according to claim 4, characterized in that: The elastic block is provided with a shock absorbing hole between adjacent protrusions.
6. The backlight module for preventing FPC function failure according to claim 5, characterized in that: Grooves are arranged on the inner wall of the shock absorbing hole on one side close to the protrusion, and shock absorbing devices are arranged between adjacent grooves.
7. The backlight module for preventing FPC function failure according to claim 6, characterized in that: The shock absorbing device is a spring or two magnets with the same poles facing each other.
8. The backlight module for preventing FPC function failure according to claim 1, characterized in that: At least one glue column is disposed on the upper surface of the light guide plate, and a positioning hole corresponding to the glue column is opened in the optical film assembly, and the optical film assembly is sleeved on the glue column.
9. The backlight module for preventing FPC function failure according to claim 8, characterized in that: An annular groove surrounding the glue column is provided on the upper surface of the light guide plate at the connection between the light guide plate and the glue column.
10. The backlight module for preventing FPC function failure according to claim 9, characterized in that: The cross-sectional shape of the annular groove is square, arc or triangle.