Display module and display screen

By using the main substrate and adapter board design in the LED display module, combined with TGV technology and redistribution layer, the problem of dark edges at the splicing and low yield of glass openings is solved, achieving lower manufacturing costs and better High display effect.

CN222190210UActive Publication Date: 2024-12-17SHENZHEN ARRAYED MATERIALS TECH CO LTD
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Patent Information

Application Number
CN202420937448.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-26
Publication Date
2024-12-17
Estimated Expiration
2034-04-26

AI Technical Summary

Technical Problem

The existing LED display screens have dark edges at the splicing due to the width of the binding terminals, which affects the display effect, and the production cost is high due to the low yield of glass openings.

Method used

The display module design is adopted including a glass substrate, a driving circuit, a PCB board and a conductive body. The glass substrate consists of a main substrate and an adapter board. The through hole is arranged on the adapter board. The conductive body passes through the through hole and connects the driving circuit and is bound. The terminals are located on the side of the glass substrate facing away from the LED chip, and the electrical connection quality and assembly efficiency are improved through TGV technology and redistribution layers.

Benefits of technology

The manufacturing cost of display modules and display screens is reduced, the display effect and electrical connection quality at the splicing are improved, the risk of glass warping is reduced, and assembly efficiency and reliability are improved.

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Abstract

The utility model discloses a display module and a display screen. The display module comprises a glass substrate, a driving circuit, a PCB (Printed Circuit Board) and a first conductor, the glass substrate comprises a main substrate and an adapter plate, the main substrate is connected to the adapter plate, the adapter plate is provided with a through hole, the driving circuit comprises a first driving circuit and a second driving circuit, the first driving circuit is arranged on the main substrate, the second driving circuit is arranged on the adapter plate, and the first driving circuit is electrically connected with the second driving circuit. The main substrate and the adapter plate are both connected with an LED chip and are electrically connected with the first driving circuit and the second driving circuit respectively, the PCB comprises a binding terminal, the PCB is located on the side, away from the LED chip, of the glass substrate, the first electric conductor penetrates through the through hole, one end of the first electric conductor is electrically connected to the second driving circuit, and the other end of the first electric conductor is electrically connected with the binding terminal. Therefore, in the processing process, even if the quality of the hole is low, only the adapter plate can be replaced without replacing the whole glass substrate, so that the manufacturing cost of the display module is reduced.
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Description

Technical Field

[0001] The utility model relates to the field of display technology, and in particular to a display module and a display screen. Background Art

[0002] LED display screens are usually formed by splicing multiple display modules together. The display modules include a glass substrate, an LED chip, and binding terminals. When the binding terminals and the LED chips are connected to the same side of the glass substrate, the binding terminals have a certain width, which will result in dark edges being formed at the joints after the display modules are spliced, affecting the display effect. For this reason, in some technologies, in order to make the display screen formed by splicing multiple display modules have no obvious dark edges, holes are opened in the glass substrate, and the binding terminals are set on the surface of the glass substrate opposite to the LED chip, so that the binding terminals do not need to occupy the light-emitting surface of the display module, thereby enhancing the display effect of the display screen. However, due to the low yield rate of the glass holes, the manufacturing cost of the display module is relatively high. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a display module that can have a lower manufacturing cost.

[0004] The utility model also provides a display screen including the above display module.

[0005] According to the first aspect of the present invention, the display module includes a glass substrate, a driving circuit, a PCB board and a first conductor.

[0006] The glass substrate includes a main substrate and an adapter board, the main substrate is connected to the adapter board, the adapter board has a through hole, and the through hole penetrates the adapter board along the thickness direction of the adapter board, the drive circuit includes a first drive circuit and a second drive circuit, the first drive circuit is arranged on the main substrate, the second drive circuit is arranged on the adapter board, the first drive circuit is electrically connected to the second drive circuit, the LED chip is connected to the same side of the main substrate and the adapter board, the LED chip connected to the main substrate is electrically connected to the first drive circuit, and the LED chip connected to the adapter board is electrically connected to the second drive circuit, the PCB board includes a binding terminal, the PCB board is located on the side of the glass substrate away from the LED chip, the first conductor is penetrated by the through hole, one end of the first conductor is electrically connected to the second drive circuit, and the other end is electrically connected to the binding terminal.

[0007] The display module according to the embodiment of the utility model has at least the following beneficial effects:

[0008] In this embodiment, the glass substrate includes a main substrate and an adapter plate, and the through hole is opened on the adapter plate. Therefore, during the processing, even if the opening quality is low, only the adapter plate can be replaced without replacing the entire glass substrate, thereby making the display module of this embodiment have a lower manufacturing cost.

[0009] According to some embodiments of the present invention, the diameter of the through hole is 10 μm to 100 μm, the adapter board has a plurality of the through holes, the display module includes a plurality of first conductors, and the plurality of first conductors and the adapter board constitute a TGV board.

[0010] According to some embodiments of the present invention, the area of ​​the adapter plate is smaller than the area of ​​the main substrate.

[0011] According to some embodiments of the present invention, a portion of the PCB board is connected to the main substrate, and another portion is connected to the adapter board.

[0012] According to some embodiments of the present invention, the display module further includes a supporting plate, and a surface of the main substrate facing away from the first driving circuit and a surface of the adapter plate facing away from the second driving circuit are both connected to the supporting plate.

[0013] According to some embodiments of the utility model, the PCB board is connected to the support board, and the display module also includes a second conductor, one end of the second conductor is connected to the first conductor, and the other end is connected to the binding terminal.

[0014] According to some embodiments of the present invention, the display module further includes a sealing layer, and the sealing layer covers the surface of the main substrate connected to the LED chip and the surface of the adapter board connected to the LED chip.

[0015] According to some embodiments of the present invention, the display module further includes a redistribution layer, a portion of which is disposed on the main substrate and connected to the first drive circuit, and another portion of which is disposed on the adapter board and connected to the second drive circuit.

[0016] The display screen according to the second embodiment of the utility model includes: a plurality of display modules described in the first embodiment.

[0017] The display screen according to the embodiment of the utility model has at least the following beneficial effects:

[0018] A display module according to the first aspect of the embodiment is adopted, in which a glass substrate includes a main substrate and a transfer plate, and a through hole is opened on the transfer plate. Therefore, during the processing, even if the quality of the opening is low, only the transfer plate can be replaced without replacing the entire glass substrate, thereby reducing the manufacturing cost of the display screen of this embodiment.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0021] Figure 1 It is a structural schematic diagram of a first display module of an embodiment of the first aspect of the utility model;

[0022] Figure 2 It is a structural schematic diagram of a second display module of an embodiment of the first aspect of the utility model;

[0023] Figure 3 It is a structural schematic diagram of a third display module of an embodiment of the first aspect of the utility model;

[0024] Figure 4 It is a structural schematic diagram of a fourth display module of an embodiment of the first aspect of the utility model;

[0025] Figure 5 This is a schematic diagram of the display screen structure of an embodiment of the second aspect of the utility model.

[0026] Reference numerals:

[0027] Glass substrate 100, main substrate 110, adapter plate 120, through hole 121;

[0028] A driving circuit 200, a first driving circuit 210, and a second driving circuit 220;

[0029] LED chip 300;

[0030] PCB board 400, binding terminal 410;

[0031] A first conductor 500 , a support plate 600 , a second conductor 700 , a redistribution layer 800 , and a sealing layer 900 . DETAILED DESCRIPTION

[0032] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0033] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0034] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0036] In the prior art, an LED display screen is usually formed by splicing a plurality of display modules together. The display module includes a glass substrate, an LED chip, and a binding terminal. When the binding terminal and the LED chip are connected to the same side of the glass substrate, since the binding terminal has a certain width, a dark edge will be formed at the splicing position after the display modules are spliced, thereby affecting the display effect. For this reason, in some technologies, in order to make the display screen formed by splicing a plurality of display modules have no obvious dark edge, a hole is opened in the glass substrate, and the binding terminal is set on the surface of the glass substrate opposite to the LED, so that the binding terminal does not need to occupy the light-emitting surface of the display module, thereby enhancing the display effect of the display screen. However, due to the low yield rate of the glass hole, the manufacturing cost of the display module is relatively high.

[0037] Based on the above problems, one embodiment of the present invention provides a display module. Figures 1 to 3 , Figure 1 Schematic diagram of the structure of the first display module of the first aspect of the utility model, Figure 2 Schematic diagram of the structure of the second display module of the first aspect of the utility model, Figure 3 This is a schematic structural diagram of a third display module of an embodiment of the first aspect of the utility model. The display module of this embodiment includes: a glass substrate 100, a driving circuit 200, a PCB board 400 and a first conductor 500.

[0038] Among them, the glass substrate 100 includes a main substrate 110 and an adapter board 120, the driving circuit 200 is used for signal amplification or attenuation, current / voltage matching and display control, etc. The driving circuit 200 includes a first driving circuit 210 and a second driving circuit 220, the first driving circuit 210 is arranged on the main substrate 110, and the second driving circuit 220 is arranged on the adapter board 120, the adapter board 120 has a through hole 121, the main substrate 110 is connected to the adapter board 120 by means of adhesive connection or mechanical connection, wherein the mechanical connection is interpreted as connecting the main substrate 110 and the adapter board 120 together through a connector (common connectors include fishbone parts, clamping parts, etc.), and the first driving circuit 210 is electrically connected to the second driving circuit 220 by means of a flexible circuit board, conductive glue or metal wire.

[0039] An LED chip 300 is connected to the same side of the main substrate 110 and the adapter board 120 as the light-emitting surface of the display module. The LED chip 300 connected to the main substrate is connected to the first drive circuit, and the LED chip 300 connected to the adapter board is connected to the second drive circuit, which is used to convert the input electrical signal into a driving capability to control the brightness and color of the LED chip 300.

[0040] The PCB board 400 includes a binding terminal 410. The PCB board 400 is located on a side of the substrate away from the LED chip 300. For example, the PCB board is connected to a side of the main substrate 110 away from the LED chip 300, or is connected to a side of the adapter board 120 away from the LED chip 300 (such as Figure 1 As shown), or a portion of the PCB board 400 is connected to the main substrate 110, and another portion is connected to the adapter board 120 (as shown Figure 2 As shown in FIG. 4 ), the PCB board 400 is not only used to set components, but also can improve the connection strength between the main substrate 110 and the adapter board 120. Alternatively, the PCB board 400 is connected to other structural members (such as the support plate 600 described below, such as Figure 3 As shown), the first conductor 500 is, for example, any conductive structure such as a wire, a metal wire or a conductive sheet. The first conductor 500 is passed through the through hole 121, one end of which is electrically connected to the second drive circuit 220, and the other end is electrically connected to the binding terminal 410, thereby ensuring that the current and signal can be accurately and efficiently transmitted to the drive circuit 200.

[0041] Specifically, it is understandable that there is a problem of yield rate when drilling holes on glass, and once the glass is damaged after drilling, it cannot be used. Therefore, if the glass substrate 100 is a whole plate, the whole glass substrate 100 needs to be replaced after the hole is damaged, but this is not necessary in the present embodiment. In the present embodiment, the glass substrate 100 includes a main substrate 110 and an adapter plate 120, and the through hole 121 is provided on the adapter plate 120. Therefore, during the processing, even if the quality of the hole is low, only the adapter plate 120 can be replaced without replacing the entire glass substrate 100, thereby reducing the manufacturing cost. Further, on this basis, in some embodiments, the area of ​​the adapter plate 120 is smaller than the area of ​​the main substrate 110, as long as the adapter plate 120 has a sufficient opening area, thereby minimizing the loss of raw materials during the processing, thereby saving manufacturing costs.

[0042] In addition, it is understandable that large-area glass may be more susceptible to external forces during processing, such as uneven heating or cooling, resulting in uneven temperature distribution, thereby increasing the risk of warping, and large-area glass may require longer heating and cooling times during processing, which may also increase the possibility of warping. In this embodiment, the glass substrate 100 is configured as two small substrates, which can effectively reduce the possibility of warping of the glass substrate 100.

[0043] Based on the above embodiment, the diameter of the through hole 121 is 10μm to 100μm, the adapter board has multiple through holes 121, the display module has multiple first conductors 500, and the multiple first conductors 500 and the adapter board 120 constitute a TGV board, that is, vertically penetrating tiny through holes are made on the glass plate through TGV technology (Through Glass Via), and conductive materials are filled in the through holes to form the through holes 121 on the adapter board 120 and the first conductors 500 penetrated in the through holes 121, so that the processing of the adapter board 120 is simpler and the processing cost is reduced. In addition, the TGV technology can realize high-precision production and metal filling of the through holes 121, ensuring the size and position accuracy of the through holes 121, so that the adapter board 120 has higher electrical connection quality, thereby improving the performance of the display module of this embodiment.

[0044] Reference Figure 3On the basis of the above embodiment, the display module further includes a redistribution layer 800, a part of the redistribution layer 800 (Redistribution Layer, RDL, is a metal layer added to an integrated circuit or microchip to redistribute electrical connections) is arranged on the main substrate 110 and connected to the first drive circuit 210, and the other part is arranged on the adapter board 120 and connected to the second drive circuit 220. The redistribution layer 800 not only ensures the stability and reliability of the connection, but also has significant advantages in layout optimization, electrical performance improvement and thermal management. In addition, the compactness of the connection of the redistribution layer 800 and the high-density interconnection characteristics can closely integrate multiple drive circuits 200 together, reduce the overall occupied space, and make the assembly process more efficient and compact.

[0045] Reference Figure 3 In some embodiments, the display module also includes a support plate 600. The surface of the main substrate 110 facing away from the first driving circuit 210 and the surface of the adapter plate 120 facing away from the second driving circuit 220 are both connected to the support plate 600. The support plate 600 can be, for example, a glass plate, a silicon plate or a metal plate. The main substrate 110 and the adapter plate 120 are both connected to the support plate 600, which not only improves the strength of the display module, but also improves the firmness of the connection between the main substrate 110 and the adapter plate 120, thereby improving the reliability of the display module.

[0046] Reference Figure 3 On the basis of the above embodiment, the PCB board 400 is connected to the support board 600, and the display module further includes a second conductor 700, which can be, for example, an FPC, a metal wire or a conductive sheet, etc. One end of the second conductor 700 is connected to the first conductor 500, and the other end is connected to the binding terminal 410. Specifically, the PCB board 400 is arranged on the support board 600, without occupying the space of the main substrate 110 or the adapter board 120, so that the support board 600 can be connected to the main substrate 110 and the adapter board 120 to a greater extent, thereby greatly improving the strength of the display module. In addition, the support plate 600 does not have any circuits or components, so it is simpler and more convenient to set up a connection structure on the support plate 600 for connecting to the PCB board 400. For example, the support plate 600 uses an easy-to-process plate body such as an aluminum plate or an epoxy resin plate, and threaded holes for connecting to the PCB board 400 can be directly processed on the support plate 600. During installation, the PCB board 400 can be connected to the support plate 600 by screws, which makes the installation of the PCB board 400 more convenient, thereby improving the assembly efficiency of the display module of this embodiment.

[0047] Reference Figure 4 , Figure 4This is a schematic diagram of the structure of the fourth display module of the first aspect of the utility model. In some embodiments, the display module also includes a sealing layer 900, which covers the surface of the main substrate 110 connected to the LED chip 300 and the surface of the adapter plate 120 connected to the LED chip 300. The sealing layer 900 is, for example, silicone, epoxy glue, and polyurethane glue. The sealing layer 900 can not only reduce the loss of photons at the interface, thereby improving the light extraction efficiency, but also prevent the LED chip 300 and the driving circuit 200 from being exposed to the air for a long time or mechanically damaged and failing, thereby improving the stability of the chip, and then extending the life of the display module of this embodiment. In addition, the sealing layer 900 can also enhance the connection strength between the main substrate 110 and the adapter plate 120, thereby improving the reliability of the display module of this embodiment.

[0048] Reference Figure 5 , Figure 5 This is a schematic diagram of the display screen structure of an embodiment of the second aspect of the utility model. The display screen of the embodiment of the second aspect of the utility model comprises: a plurality of display modules of the embodiment of the first aspect, wherein the glass substrate 100 in the display module comprises a main substrate 110 and an adapter plate 120, and a through hole 121 is provided on the adapter plate 120. Therefore, during the processing, even if the quality of the opening is low, only the adapter plate 120 can be replaced without replacing the entire glass substrate 100, thereby reducing the manufacturing cost of the display screen of this embodiment.

[0049] It should be noted that, since this embodiment adopts all the technical features of the display module of the first embodiment, this embodiment has all the beneficial effects brought by the first embodiment, which will not be repeated here.

[0050] The above is a detailed description of the embodiment of the utility model in conjunction with the accompanying drawings, but the utility model is not limited to the above-mentioned embodiment, and various changes can be made without departing from the purpose of the utility model within the scope of knowledge possessed by ordinary technicians in the relevant technical field. In addition, in the description of the utility model, the description of the reference terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A display module, characterized in that: include: A glass substrate, comprising a main substrate and an adapter plate, wherein the main substrate is connected to the adapter plate, and the adapter plate has a through hole, and the through hole penetrates the adapter plate along the thickness direction of the adapter plate; A driving circuit, comprising a first driving circuit and a second driving circuit, wherein the first driving circuit is arranged on the main substrate, the second driving circuit is arranged on the adapter board, and the first driving circuit is electrically connected to the second driving circuit; LED chips, the LED chips are connected to the same side of the main substrate and the adapter board, the LED chip connected to the main substrate is electrically connected to the first drive circuit, and the LED chip connected to the adapter board is electrically connected to the second drive circuit; A PCB board, including binding terminals, the PCB board is located on a side of the glass substrate away from the LED chip; The first conductor is disposed in the through hole, one end of which is electrically connected to the second driving circuit, and the other end of which is electrically connected to the binding terminal.

2. The display module according to claim 1, characterized in that: The diameter of the through hole is 10 μm to 100 μm, the adapter board has a plurality of the through holes, the display module includes a plurality of first conductors, and the plurality of first conductors and the adapter board constitute a TGV board.

3. The display module according to claim 1, characterized in that: The area of ​​the adapter plate is smaller than that of the main substrate.

4. The display module according to claim 1, characterized in that: A portion of the PCB board is connected to the main substrate, and another portion is connected to the adapter board.

5. The display module according to claim 1, characterized in that: The display module further includes a support plate, and a surface of the main substrate facing away from the first driving circuit and a surface of the adapter plate facing away from the second driving circuit are both connected to the support plate.

6. The display module according to claim 5, characterized in that: The PCB board is connected to the support board. The display module further includes a second conductor, one end of the second conductor is connected to the first conductor, and the other end of the second conductor is connected to the binding terminal.

7. The display module according to claim 1, characterized in that: The display module further includes a sealing layer, and the sealing layer covers the surface of the main substrate connected to the LED chip and the surface of the adapter board connected to the LED chip.

8. The display module according to claim 1, characterized in that: The display module further includes a redistribution layer, a portion of which is disposed on the main substrate and connected to the first driving circuit, and another portion of which is disposed on the adapter board and connected to the second driving circuit.

9. A display screen, characterized in that The invention comprises a plurality of display modules as claimed in any one of claims 1 to 8.