Silicon wafer separating device

Abstract

The utility model provides a silicon wafer separating device, which comprises a wafer carrying table used for carrying a silicon wafer group, and the silicon wafer group comprises a plurality of silicon wafers stacked along the vertical direction; the lifting assembly can drive the slide holder to ascend and descend; the limiting assembly is used for limiting the horizontal movement of the silicon wafer; the adsorption assembly comprises a suction cup, the suction cup is arranged above the wafer carrying table in a lifting mode, and the suction cup can adsorb the silicon wafer; and the separation assembly comprises a driving part and a brush, the brush is movably arranged at one end of the slide holder, and the driving part can drive the brush to be close to or far away from the silicon wafer group, so that the brush can be inserted between two adjacent silicon wafers or separated from the silicon wafers. According to the invention, silicon wafers which are adhered to each other can be separated, so that the effect of taking a single silicon wafer is realized.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor production technology, in particular to a silicon wafer separation device. Background Art

[0002] Silicon wafer is a thin, flat, round silicon matrix material, which is commonly used in the preparation of integrated circuit manufacturing and other semiconductor devices. It is one of the most common substrate materials in the semiconductor industry.

[0003] In the related art, for the convenience of operation, multiple silicon wafers are often placed in a stack before testing. However, due to the influence of the front-end process of the silicon wafer, the flatness of the silicon wafer is relatively high, which makes the stacked silicon wafers stick together more frequently. When taking the silicon wafer on the top of the stack, it is easy to take multiple silicon wafers at a time due to the sticking phenomenon, affecting the normal production of the equipment. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a silicon wafer separation device, which has the effect of separating silicon wafers that are adhered to each other and taking a single silicon wafer.

[0005] According to an embodiment of the utility model, a silicon wafer separation device includes: a wafer stage, the wafer stage is used to carry a silicon wafer group, the silicon wafer group includes multiple silicon wafers stacked vertically; a lifting component, the lifting component can drive the wafer stage to rise and fall; a limit component, the limit component is used to limit the horizontal movement of the silicon wafer; an adsorption component, the adsorption component includes a suction cup, the suction cup can be raised and lowered above the wafer stage, the suction cup can adsorb the silicon wafer; a separation component, the separation component includes a driving member and a brush, the brush is movably arranged at one end of the wafer stage, and the driving member can drive the brush to approach or move away from the silicon wafer group, so that the brush can be inserted between two adjacent silicon wafers or detached from the silicon wafer.

[0006] A silicon wafer separation device according to an embodiment of the utility model includes at least the following beneficial effects: when the suction cup needs to adsorb the silicon wafer, the wafer carrier is driven to rise by the lifting assembly, and the horizontal movement of the silicon wafer is limited by the limit assembly, so that the suction cup can adsorb the silicon wafer. Since the silicon wafers are prone to adhesion, the suction cup can easily pick up multiple silicon wafers at one time. At this time, the brush is driven by the driving member to approach the silicon wafer group, and then the brush is driven to be inserted between two adjacent silicon wafers, so that the gap between the two silicon wafers becomes larger, so that the silicon wafer located at the bottom falls back into the silicon wafer group under the restriction of the limit assembly, so that the suction cup can adsorb a single silicon wafer and pick up a single silicon wafer, thereby solving the problem of picking up multiple silicon wafers at one time due to adhesion.

[0007] According to some embodiments of the utility model, the silicon wafer separation device includes a base, the lifting assembly is arranged on the base, the lifting assembly includes a driving motor, a driving wheel, a driven wheel, a screw and a guide frame, the driving motor is arranged on the base, the driving wheel is fixedly sleeved on the output end of the driving motor, the screw is vertically arranged, the driven wheel is fixedly sleeved on the bottom of the screw, the driving wheel is meshed with the driven wheel, a screw hole is opened at the bottom of the guide frame, the screw is threadedly engaged with the screw hole, and the wafer carrier is carried on the top of the guide frame.

[0008] According to some embodiments of the utility model, a support frame is provided on the base, and the top of the support frame extends to the bottom of the wafer carrier. The limit assembly is carried on the top of the support frame. The limit assembly includes an elastic member and multiple limit rods. The multiple limit rods are distributed at intervals along the circumference of the silicon wafer, and the limit rods are vertically arranged. A plurality of waist-shaped holes are opened on the wafer carrier, and the multiple waist-shaped holes correspond to the multiple limit rods one by one. The waist-shaped holes are opened along the radial direction of the silicon wafer. The bottom end of the limit rod is set on the support frame, and the top end passes through the waist-shaped hole and extends vertically upward. The elastic member can simultaneously drive the multiple limit rods to approach or move away from the silicon wafer group along the length direction of the waist-shaped hole.

[0009] According to some embodiments of the utility model, the tensioner includes a clamping cylinder and a plurality of transmission rods, the clamping cylinder is arranged on the support frame, the plurality of transmission rods respectively correspond to the plurality of limiting rods, one end of the transmission rod is connected to the clamping cylinder, and the other end is connected to the limiting rod, and the clamping cylinder can drive the plurality of transmission rods to expand or contract.

[0010] According to some embodiments of the present invention, the adsorption assembly includes a lifting member, and the lifting member is used to drive the suction cup to rise and fall.

[0011] According to some embodiments of the utility model, the lifting member includes a first cylinder, the first cylinder is fixedly connected to the base through a connecting frame, and the top of the suction cup is connected to the first cylinder.

[0012] According to some embodiments of the utility model, the driving member includes a slide rail, a slider, a connecting plate and a second cylinder. The slide rail is arranged on the wafer stage along the length direction of the wafer stage. The slider slides with the slide rail. The connecting plate is vertically arranged on the slider. The brush is arranged on the connecting plate. The second cylinder can drive the slider to slide on the slide rail.

[0013] According to some embodiments of the present invention, the suction cup can be lowered to a position corresponding to the top end of the limiting rod, and the brush corresponds to the top end of the limiting rod.

[0014] According to some embodiments of the present invention, the partition assembly includes an air nozzle, which is arranged corresponding to the brush and connected to the connecting plate, and the air nozzle is used to spray air between two adjacent silicon wafers.

[0015] According to some embodiments of the present invention, the number of the partition components is two groups, and the two groups of the partition components correspond to the two ends of the wafer carrier respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0017] Figure 2 It is a structural schematic diagram of the lifting assembly in the embodiment of the present application;

[0018] Figure 3 is a schematic structural diagram of the bottom of the base in an embodiment of the present application;

[0019] Figure 4 It is a schematic diagram of the structure of the limit assembly in the embodiment of the present application;

[0020] Figure 5 It is a schematic diagram of the structure of the separation component in the embodiment of the present application;

[0021] Figure 6 It is a schematic diagram of the structure of the adsorption component in the embodiment of the present application.

[0022] Explanation of the reference numerals in the accompanying drawings: 100, base; 200, wafer carrier; 300, silicon wafer group; 310, silicon wafer; 410, driving motor; 420, driving wheel; 430, driven wheel; 440, screw rod; 450, guide frame; 500, support frame; 611, clamping cylinder; 612, transmission rod; 620, limiting rod; 630, waist-shaped hole; 700, adsorption assembly; 710, suction cup; 721, first cylinder; 811, slide rail; 812, slider; 813, connecting plate; 814, second cylinder; 820, brush; 830, air nozzle. DETAILED DESCRIPTION

[0023] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0024] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] In the description of the utility model, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0026] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0027] The following is combined with Figure 1-6 This application is described in further detail.

[0028] The present invention provides a silicon wafer separation device, referring to Figure 1 , including a base 100 and a wafer carrier 200 , the wafer carrier 200 is used to carry a silicon wafer group 300 , and the silicon wafer group 300 includes a plurality of stacked silicon wafers 310 .

[0029] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 3 The base 100 is provided with a lifting assembly for driving the wafer stage 200 to lift and lower. Specifically, the lifting assembly includes a driving motor 410, a driving wheel 420, a driven wheel 430, a screw rod 440 and a guide frame 450. The driving motor 410 is provided on the base 100, the driving wheel 420 is fixedly sleeved at the output end of the driving motor 410, the screw rod 440 is vertically provided, the driven wheel 430 is fixedly sleeved at the bottom of the screw rod 440, and the driving wheel 420 is meshed with the driven wheel 430. A screw hole is provided at the bottom of the guide frame 450, and the screw rod 440 is threadedly engaged with the screw hole. The carrier stage 200 is carried on the top of the guide frame 450, and the driving motor 410 drives the active wheel 420 to rotate, so that the active wheel 420 engages with the driven wheel 430 to drive the driven wheel 430 to rotate, and then drives the screw rod 440 to rotate. The screw rod 440 is threadedly engaged with the screw hole, so that the guide frame 450 can be driven to rise and fall, thereby driving the carrier stage 200 to rise and fall.

[0030] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 4 A support frame 500 is disposed on the base 100, and the top of the support frame 500 extends to the bottom of the wafer stage 200. A limit assembly is disposed on the top of the support frame 500, and the limit assembly is used to limit the horizontal movement of the silicon wafer 310.

[0031] It is understandable that in some embodiments of the present invention, reference Figure 4 and Figure 5 The limiting assembly includes a tension piece and a plurality of limiting rods 620, the plurality of limiting rods 620 are spaced apart along the circumference of the silicon wafer 310, the limiting rods 620 are arranged vertically, a plurality of waist-shaped holes 630 are provided on the wafer stage 200, the plurality of waist-shaped holes 630 correspond to the plurality of limiting rods 620 one by one, the waist-shaped holes 630 are provided along the radial direction of the silicon wafer 310, the bottom end of the limiting rod 620 is arranged on the support frame 500, the top end passes through the waist-shaped hole 630 and extends vertically upward, the tension piece can simultaneously drive the plurality of limiting rods 620 to approach along the length direction of the waist-shaped hole 630 or away from the silicon wafer group 300, so that when the silicon wafer group 300 is placed on the wafer carrier 200, the elastic member drives the plurality of limit rods 620 to approach the silicon wafer group 300 along the length direction of the waist-shaped hole 630 to limit the horizontal movement of the silicon wafer 310; when the silicon wafer group 300 needs to be raised or lowered, the wafer carrier 200 drives the silicon wafer group 300 to be raised or lowered, and at this time, the elastic member drives the plurality of limit rods 620 to approach the silicon wafer group 300 along the length direction of the waist-shaped hole 630 to reduce the situation in which the silicon wafer 310 is damaged by friction with the limit rods 620 during the lifting process. In some embodiments, refer to Figure 4 and Figure 5 There are three limit rods 620 , and the three limit rods 620 are distributed in a triangle relative to the silicon wafer 310 to limit the horizontal movement of the silicon wafer 310 .

[0032] It is understandable that in some embodiments of the present invention, reference Figure 4 and Figure 5 The tensioner includes a clamping cylinder 611 and a plurality of transmission rods 612. The clamping cylinder 611 is arranged on the support frame 500. The plurality of transmission rods 612 correspond to the plurality of limiting rods 620 one by one. One end of the transmission rod 612 is connected to the clamping cylinder 611, and the other end is connected to the limiting rod 620. When the plurality of limiting rods 620 need to move, the clamping cylinder 611 can drive the plurality of transmission rods 612 to expand or contract, so that the limiting rods 620 are away from or close to the silicon wafer group 300 along the length direction of the waist-shaped hole 630.

[0033] It is understandable that in some embodiments of the present invention, reference Figure 6The silicon wafer separation device further includes an adsorption assembly 700, which is used to adsorb the silicon wafer 310 on the top of the silicon wafer group 300, so as to achieve the effect of separating the silicon wafers 310 in the silicon wafer group 300. Specifically, the adsorption assembly 700 includes a suction cup 710 and a lifting member, and the lifting member is used to drive the suction cup 710 to rise and fall. The suction cup 710 is located above the wafer carrier 200, and the suction cup 710 can adsorb the silicon wafer 310.

[0034] It is understandable that in some embodiments of the present invention, reference Figure 6 The lifting component includes a first cylinder 721, which is fixedly connected to the base 100 through a connecting frame, and the top of the suction cup 710 is connected to the first cylinder 721. When the suction cup 710 needs to adsorb the silicon wafer 310, the wafer carrier 200 is driven to rise through the lifting component, thereby driving the silicon wafer group 300 to rise to the top of the limiting rod 620, and at the same time, the limiting rod 620 is driven by the clamping cylinder 611 to move away from the silicon wafer group 300 to avoid the movement of the silicon wafer group 300, thereby reducing the damage to the silicon wafer 310 caused by the friction between the limiting rod 620 and the silicon wafer 310; at this time, the suction cup 710 can be lowered to the top of the limiting rod 620 through the first cylinder 721, so as to adsorb the silicon wafer 310 on the top of the silicon wafer group 300, so that the first cylinder 721 drives the suction cup 710 to rise, and the silicon wafer 310 is taken.

[0035] It is understandable that in some embodiments of the present invention, reference Figure 4 and Figure 6 A separation component is also provided on the top of the support frame 500, and the separation component is used to separate two adjacent silicon wafers 310. Specifically, the separation component includes a driving member and a brush 820, and the brush 820 is movably provided at one end of the wafer stage 200. The driving member can drive the brush 820 to approach or move away from the silicon wafer group 300, so that the brush 820 can be inserted between two adjacent silicon wafers 310 or separated from the silicon wafer 310.

[0036] It is understandable that in some embodiments of the present invention, reference Figure 5 and Figure 6The driving member includes a slide rail 811, a slider 812, a connecting plate 813 and a second cylinder 814. The slide rail 811 is arranged on the stage 200 along the length direction of the stage 200. The slider 812 slides with the slide rail 811. The bottom end of the connecting plate 813 is fixedly connected to the end of the slider 812, and the top end extends vertically upward so that the connecting plate 813 is located at one end of the stage 200. The second cylinder 814 is arranged on the top of the support frame 500, and the second cylinder 814 is connected to the slider 812 so as to drive the slider 812 to slide relative to the slide rail 811. The brush 820 is arranged on the side of the connecting plate 813 close to the stage 200, and the brush 820 corresponds to the top end of the limiting rod 620. When the silicon wafer group 300 moves to the top of the limiting rod 620, the suction cup 710 absorbs the silicon wafer 310. At this time, since the silicon wafers 310 are prone to adhesion, the suction cup 710 can easily pick up multiple silicon wafers 310 at one time, so that the second cylinder 814 drives the slider 812 to slide relative to the slide rail 811, so as to drive the connecting plate 813 to approach the silicon wafer group 300, and then drive the brush 820 to be inserted between two adjacent silicon wafers 310, so that the gap between the two silicon wafers 310 becomes larger, so that the silicon wafer 310 located at the bottom falls back into the silicon wafer group 300 under the restriction of the limiting rod 620, so that the suction cup 710 can pick up a single silicon wafer 310.

[0037] It is understandable that in some embodiments of the present invention, reference Figure 5 and Figure 6 The separation component also includes an air nozzle 830, which is arranged corresponding to the brush 820 and connected to the connecting plate 813. The air nozzle 830 is used to spray air between two adjacent silicon wafers 310 to further assist the brush 820 to increase the gap between the two silicon wafers 310, thereby increasing the separation rate of the two silicon wafers 310, and further increasing the success rate and efficiency of the suction cup 710 in adsorbing a single silicon wafer 310.

[0038] It is understandable that in some embodiments of the present invention, reference Figure 5 and Figure 6 There are two groups of separation components, which correspond to the two ends of the wafer carrier 200 respectively. Two brushes 820 are inserted from both ends of the silicon wafer 310 to further speed up the separation rate of the two silicon wafers 310, thereby improving the efficiency of the suction cup 710 in adsorbing a single silicon wafer 310.

[0039] The implementation principle of the present application is as follows: when the suction cup 710 needs to adsorb the silicon wafer 310, the driving motor 410 drives the active wheel 420 to rotate, so that the active wheel 420 and the driven wheel 430 are meshed and matched to drive the driven wheel 430 to rotate, thereby driving the screw rod 440 to rotate, and the screw rod 440 cooperates with the thread of the screw hole to drive the guide frame 450 to rise and fall, thereby driving the wafer carrier 200 to rise and fall; the wafer carrier 200 drives the silicon wafer group 300 to rise to the top of the limit rod 620, and at the same time, the limit rod 620 moves in the direction away from the silicon wafer group 300 under the drive of the clamping claw cylinder 611, so as to avoid the movement of the silicon wafer group 300, thereby reducing the damage to the silicon wafer 310 caused by the friction between the limit rod 620 and the silicon wafer 310; at this time, the suction cup 710 can be lowered to the top of the limit rod 620 through the first cylinder 721. , thereby adsorbing the silicon wafer 310 on the top of the silicon wafer group 300. Since the silicon wafers 310 are prone to adhesion, the suction cup 710 can easily pick up multiple silicon wafers 310 at one time. The second cylinder 814 drives the slider 812 to slide relative to the slide rail 811 to drive the connecting plate 813 to approach the silicon wafer group 300, thereby driving the brush 820 to insert between two adjacent silicon wafers 310, and cooperating with the air jet of the air nozzle 830 to enlarge the gap between the two silicon wafers 310, so that the silicon wafer 310 located below falls back to the silicon wafer group 300 under the restriction of the limiting rod 620, so that the suction cup 710 can adsorb a single silicon wafer 310, so that the first cylinder 721 drives the suction cup 710 to rise, so as to pick up a single silicon wafer 310, thereby solving the problem of picking up multiple silicon wafers 310 at one time due to adhesion.

[0040] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A silicon wafer separation device, characterized in that: include: A wafer carrier (200), the wafer carrier (200) being used to carry a silicon wafer group (300), the silicon wafer group (300) comprising a plurality of silicon wafers (310) stacked vertically; A lifting component, the lifting component can drive the wafer carrier (200) to move up and down; A limiting component, the limiting component is used to limit the horizontal movement of the silicon wafer (310); An adsorption component (700), the adsorption component (700) comprising a suction cup (710), the suction cup (710) being arranged above the wafer carrier (200) in a liftable manner, and the suction cup (710) being capable of adsorbing the silicon wafer (310); A separation component, the separation component includes a driving member and a brush (820), the brush (820) is movably arranged at one end of the wafer carrier (200), and the driving member can drive the brush (820) to approach or move away from the silicon wafer group (300), so that the brush (820) can be inserted between two adjacent silicon wafers (310) or detached from the silicon wafer (310).

2. The silicon wafer separation device according to claim 1, characterized in that: The silicon wafer separation device comprises a base (100), the lifting component is arranged on the base (100), the lifting component comprises a driving motor (410), a driving wheel (420), a driven wheel (430), a screw rod (440) and a guide frame (450), the driving motor (410) is arranged on the base (100), the driving wheel (420) is fixedly sleeved on the output end of the driving motor (410), the screw rod (440) is arranged vertically, the driven wheel (430) is fixedly sleeved on the bottom of the screw rod (440), the driving wheel (420) is meshed with the driven wheel (430), a screw hole is opened at the bottom of the guide frame (450), the screw rod (440) is threadedly engaged with the screw hole, and the wafer carrier (200) is carried on the top of the guide frame (450).

3. The silicon wafer separation device according to claim 2, characterized in that: A support frame (500) is arranged on the base (100), the top of the support frame (500) extends to the bottom of the wafer carrier (200), the limit assembly is carried on the top of the support frame (500), the limit assembly includes an elastic member and a plurality of limit rods (620), the plurality of limit rods (620) are distributed at intervals along the circumference of the silicon wafer (310), the limit rods (620) are arranged vertically, and the wafer carrier (200) is provided with a plurality of waist-shaped holes (620). 30), the plurality of waist-shaped holes (630) respectively correspond to the plurality of limiting rods (620) one by one, the waist-shaped holes (630) are opened along the radial direction of the silicon wafer (310), the bottom end of the limiting rod (620) is arranged on the support frame (500), and the top end passes through the waist-shaped hole (630) and extends vertically upward, and the elastic member can simultaneously drive the plurality of limiting rods (620) to approach or move away from the silicon wafer group (300) along the length direction of the waist-shaped hole (630).

4. The silicon wafer separation device according to claim 3, characterized in that: The tensioner comprises a clamping cylinder (611) and a plurality of transmission rods (612); the clamping cylinder (611) is arranged on the support frame (500); the plurality of transmission rods (612) correspond one by one to the plurality of limit rods (620); one end of the transmission rod (612) is connected to the clamping cylinder (611), and the other end is connected to the limit rod (620); the clamping cylinder (611) can drive the plurality of transmission rods (612) to expand or contract.

5. The silicon wafer separation device according to claim 4, characterized in that: The adsorption assembly (700) comprises a lifting member, and the lifting member is used to drive the suction cup (710) to move up and down.

6. The silicon wafer separation device according to claim 5, characterized in that: The lifting member comprises a first cylinder (721), the first cylinder (721) is fixedly connected to the base (100) via a connecting frame, and the top of the suction cup (710) is connected to the first cylinder (721).

7. The silicon wafer separation device according to claim 1, characterized in that: The driving component includes a slide rail (811), a slider (812), a connecting plate (813) and a second cylinder (814); the slide rail (811) is arranged on the wafer carrier (200) along the length direction of the wafer carrier (200); the slider (812) and the slide rail (811) are slidably matched; the connecting plate (813) is vertically arranged on the slider (812); the brush (820) is arranged on the connecting plate (813); and the second cylinder (814) can drive the slider (812) to slide on the slide rail (811).

8. The silicon wafer separation device according to claim 6, characterized in that: The suction cup (710) can be lowered to a position corresponding to the top end of the limiting rod (620), and the brush (820) corresponds to the top end of the limiting rod (620).

9. The silicon wafer separation device according to claim 7, characterized in that: The separation component comprises an air nozzle (830), wherein the air nozzle (830) is arranged corresponding to the brush (820) and connected to the connecting plate (813), and the air nozzle (830) is used to spray air between two adjacent silicon wafers (310).

10. The silicon wafer separation device according to claim 9, characterized in that: The number of the partition components is two groups, and the two groups of partition components correspond to the two ends of the wafer carrier (200) respectively.

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