Automatic piece measuring and patching device for feeding of wet process slot type machine

Abstract

The utility model discloses an automatic piece measuring and patching device for feeding of a wet process trough type machine, and belongs to the field of solar cell manufacturing. The device comprises a flower basket conveying belt, a piece taking flower basket, a patching base and a feeding flower basket conveying belt, the flower basket conveying belt is arranged below the piece taking flower basket, and the feeding flower basket conveying belt is arranged below the piece taking flower basket; meanwhile, the wafer taking basket is positioned in the center of the basket conveying belt; the flower basket conveying belt is parallel to the patch base and the feeding flower basket conveying belt; a camera movement guide rail and a suction cup vertical movement guide rail are arranged above the patch base; a camera movement sliding block is arranged on the camera movement guide rail, a film taking camera module and a film repairing camera module are arranged at the two ends of the camera movement sliding block, and the camera movement sliding block can move up and down on the camera movement guide rail; the device can solve the problem that an existing machine cannot reduce fragments and carry liquid, the EL yield and appearance yield of solar cells are improved, and the value of a single finished product is improved.

Description

Technical Field

[0001] The invention relates to the technical field of wet etching slot machines for solar cell sheets, in particular to a device for automatically measuring and patching sheets when unloading materials from a slot machine in a wet process. Background Art

[0002] As solar power generation grows stronger and photovoltaic cells develop rapidly, the cost of raw silicon in the photovoltaic industry remains high. In response to such problems, various manufacturers have promoted the development of thin-sheet raw silicon and large-size raw silicon, resulting in many abnormalities in the subsequent wet process. It is now necessary to promote various companies to innovate their equipment. For wet trough equipment, a large amount of debris appears during the machine process, and the film sticks and liquids are present. There are many subsequent abnormal feedbacks, which need to be solved urgently.

[0003] It is now necessary to make targeted solutions to the above-mentioned phenomena in order to reduce abnormal situations, lower the downgrade rate and customer complaint risks. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a device for automatic wafer measurement and patching in a wet process slot machine, which improves the shortcomings of wafer sticking during the process and solves the problems of frequent production line degradation and abnormalities, thereby improving the EL yield and appearance yield of solar cells and the value of single finished wafers.

[0005] The present invention is achieved in that:

[0006] A device for automatic film measurement and patching of a wet process slot machine, characterized in that the device comprises: a flower basket transmission belt, a film taking flower basket, a patch base, and a feeding flower basket transmission belt, wherein the flower basket transmission belt is below the film taking flower basket, and the film taking flower basket is in the center of the flower basket transmission belt; the flower basket transmission belt, the patch base, and the feeding flower basket transmission belt are in a parallel state;

[0007] The patch base includes a camera motion guide rail and a suction cup vertical motion guide rail above; a camera motion slider is arranged on the camera motion guide rail, and the two ends of the camera motion slider are a film taking camera module and a patch camera module, and the camera motion slider can move up and down on the camera motion guide rail;

[0008] A patch suction cup movement slider is arranged on the suction cup vertical movement guide rail, and the end of the patch suction cup movement slider is sequentially connected to a patch suction cup fixing rod and a patch suction cup telescopic rod; a patch suction cup body is arranged above the patch suction cup telescopic rod, and an air extraction hole is arranged on the patch suction cup body.

[0009] The present invention includes a film-taking camera module arranged at the material discharging, responsible for checking whether the silicon wafers in the flower basket are missing, have liquid on them, or are in pieces; a patching camera module responsible for detecting the position of the silicon wafers in the film-taking flower basket; a suction cup device responsible for sucking out the missing wafers, the wafers with liquid on them, and the fragments; at the same time, taking out the silicon wafers from the film-taking flower basket and inserting them into the patching flower basket; a material guiding device, and an abnormal wafer recovery device; the film-taking camera device is used to check whether the silicon wafers in the entire material basket are abnormal; the patching camera module is responsible for determining the position of the silicon wafers in the film-taking flower basket; the suction cup device is used for moving the silicon wafers; the material guiding device is used for using the patching wafers, and the recovery device is used for recovering the silicon wafers. The present invention improves the shortcomings of missing wafers, wafers with liquid on them, and fragments being mistakenly transmitted during the wet process discharging, and solves the problem of abnormal wafers and missing wafers being mistakenly transmitted on the production line, leading to rework in the subsequent process, and the problem of a significant impact on the yield of the battery cells.

[0010] Furthermore, the lower end of the patch base is connected to a debris collection box; the debris collection box is a deformation-resistant plastic PVC structure. PVC material has the characteristics of non-flammability, high strength, resistance to climate change, and low price.

[0011] Furthermore, the patch suction cup body is a ceramic structure, which can be disassembled and replaced, and the ceramic structure does not contaminate the silicon wafer, thereby reducing the presence of suction cup marks.

[0012] Furthermore, the patch suction cup moving slider is a steel corrosion-resistant structure; the patch suction cup fixing rod is a steel corrosion-resistant structure. The steel structure is resistant to high temperature, corrosion, and deformation, and is a good guide rail material.

[0013] Furthermore, the film-taking camera module and the film-repairing camera module are provided with program devices for reading the flower basket silicon wafer information and transmitting the flower basket silicon wafer information.

[0014] Furthermore, the exhaust hole is also connected to the patch suction cup body; the exhaust hole is connected to the peripheral nitrogen, and the nitrogen does not pollute the silicon wafer and does not react with the silicon wafer.

[0015] Furthermore, a patch flower basket is arranged above the feeding flower basket transmission belt; silicon wafers are arranged inside the taking-out flower basket and the patch flower basket, the feeding flower basket transmission belt is below the patch flower basket, and the patch flower basket is in the center of the feeding flower basket transmission belt; the flower basket transmission belt, the patch base, and the feeding flower basket transmission belt are in a parallel state, the discharging flower basket transmission belt and the feeding flower basket transmission belt are in the same plane and in a vertical state, and the fragment placement box and the base are in a connected state;

[0016] The present invention also discloses a working method of a device for automatically measuring and patching a wet process slot machine, which is specifically:

[0017] When the patch basket reaches the unloading point, the robot grabs the patch basket and moves it to the feeding basket transmission belt. When it reaches the fixed point, the patch camera module detects whether there is sticky film or debris.

[0018] If there are sticky wafers or fragments, the patch suction cup body will suck out the fragments and sticky wafers, and then place the sticky wafers and fragments in the fragment collection box, then take out the silicon wafers to be patched from the wafer taking basket, insert them into the patch basket, and then send them to the process unloading through the feeding basket transmission belt;

[0019] If there is no sticking or fragmentation, the patch suction cup body does not perform any operation and is directly sent to the process unloading through the feeding basket transmission belt;

[0020] The entire process is able to remove all debris and execute patch commands simultaneously with fluid.

[0021] In the present invention, when the patch basket arrives at the unloading, the patch basket is grabbed by a robot and arrives at the feeding basket transmission belt. When it arrives at a fixed point, the patch camera module detects whether there is sticky film or debris: if there is sticky film or debris, the patch suction cup sucks out the debris and sticky film, and then places the sticky film and debris in a debris collection box, and then takes out the silicon wafer to be repaired from the wafer taking basket, inserts it into the patch basket, and then passes through the feeding basket transmission belt; if there is no sticky film or debris, the patch suction cup body does not perform any operation; after executing the program command, the patch basket is sent to the process unloading through the feeding basket transmission belt.

[0022] The beneficial effects of the present invention compared with the prior art are:

[0023] The present invention detects silicon wafers in the unloading basket by means of a camera, checks whether the state of the silicon wafers inside the basket is abnormal, executes program commands according to the abnormal situation, and makes the state of the silicon wafers inside the patching basket normal by taking out the wafers and patching them. This invention improves the disadvantage of chip debris sticking during unloading, solves the problems of frequent degradation and abnormalities in the production line, thereby improving the EL yield and appearance yield of solar cells and the value of single finished wafers.

[0024] The device of the present invention can be promoted and used in normal production. When in use, when the flower basket arrives at the unloading, the robot grabs the flower basket and arrives at the feeding flower basket transmission belt. When it arrives at the fixed point, the camera detects whether there are sticky chips and fragments. If sticky chips and fragments occur, the suction cup sucks out the fragments and sticky chips, and then the fragment box is placed in the fragment collection box, and then the silicon wafer to be patched is taken out from the patch flower basket and inserted into the feeding flower basket; if the flower basket test is normal, the patch device does not perform any operation. After the whole process, all fragments can be removed, and the patch command is executed simultaneously with liquid.

[0025] The device of the present invention can solve the problem that existing machines cannot reduce fragments and carry liquid, and can be widely used in texturing, one-time alkali polishing, and RCA machines, thereby improving the EL yield and appearance yield of solar cells and the value of single finished films. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of a device for automatically measuring and patching sheets for feeding a trough-type machine in a wet process according to the present invention;

[0027] Figure 2 This is a working flow chart of a device for automatically measuring and patching sheets for a slot machine for wet process according to the present invention;

[0028] Among them, 1-flower basket transmission belt, 2-film picking flower basket, 3-patch base, 4-camera motion guide rail, 5-camera motion slider, 5-1-film picking camera module, 5-2-patch camera module, 6-suction cup vertical motion guide rail, 7-patch suction cup motion slider, 8-patch suction cup fixing rod, 9-patch suction cup telescopic rod, 10-patch suction cup body, 11-exhaust hole, 12-silicon wafer, 13-patch flower basket, 14-discharging flower basket transmission belt, 15-feeding flower basket transmission belt, 16-fragment placement box. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] like Figure 1 As shown, the present invention includes a flower basket transmission belt 1, a film picking flower basket 2, a patch base 3, a camera motion guide rail 4, a camera motion slider 5, a film picking camera module 5-1, a patch camera module 5-2, a suction cup vertical motion guide rail 6, a patch suction cup motion slider 7, a patch suction cup fixing rod 8, a patch suction cup telescopic rod 9, a patch suction cup body 10, an exhaust hole 11, a silicon wafer 12, a patch flower basket 13, a discharging flower basket transmission belt 14, a feeding flower basket transmission belt 15, and a fragment placement box 16.

[0031] The flower basket transmission belt 1 is below the film-taking flower basket 2, and the film-taking flower basket 2 is located in the center of the flower basket transmission belt 1; the flower basket transmission belt 1, the patch base 3, and the feeding flower basket transmission belt 15 are in a parallel state.

[0032] The patch base 3 includes a camera motion rail 4 and a suction cup vertical motion rail 6 above; a camera motion slider 5 is arranged on the camera motion rail 4, and the two ends of the camera motion slider 5 are film-taking camera modules 5-1 and patch camera modules 5-2, and the camera motion slider 5 can move up and down on the camera motion rail 4; the lower end of the patch base 3 is connected to a debris collection box 16; the debris collection box 16 is a deformation-resistant plastic PVC structure. The film-taking camera module 5-1 and the patch camera module 5-2 are provided with program devices for reading and transmitting the flower basket silicon wafer information.

[0033] A patch suction cup moving slider 7 is arranged on the suction cup vertical moving guide rail 6, and the ends of the patch suction cup moving slider 7 are connected to a patch suction cup fixing rod 8 and a patch suction cup telescopic rod 9 in sequence; a patch suction cup main body 10 is arranged above the patch suction cup telescopic rod 9, and an exhaust hole 11 is arranged on the patch suction cup main body 10, and the exhaust hole 11 is also connected to the patch suction cup main body 10; the exhaust hole is connected to the peripheral nitrogen, and the nitrogen does not pollute the silicon wafer and does not react with the silicon wafer. The patch suction cup main body 10 is a ceramic structure and can be disassembled and replaced. The patch suction cup moving slider 7 is a steel corrosion-resistant structure; the patch suction cup fixing rod 8 is a steel corrosion-resistant structure.

[0034] A patch flower basket 13 is arranged above the feeding flower basket transmission belt 15; silicon wafers 12 are arranged in the film-taking flower basket 2 and the patch flower basket 13, the feeding flower basket transmission belt 15 is below the patch flower basket 13, and the patch flower basket 13 is in the center of the feeding flower basket transmission belt 15; the flower basket transmission belt 1 and the patch base 3 and the feeding flower basket transmission belt 15 are in a parallel state, the discharging flower basket transmission belt 14 and the feeding flower basket transmission belt 15 are in the same plane and are vertical, and the fragment placement box 16 and the base 3 are in a connected state.

[0035] The working principle of the above embodiment is:

[0036] When in use, a device for automatic wafer measurement and patching of wet process slot machine unloading can be promoted and used in normal production. When in use, when the flower basket arrives at the unloading, the robot grabs the flower basket and arrives at the feeding flower basket transmission belt. When it arrives at the fixed point, the camera detects whether there is sticky film or debris. If there is sticky film or debris, the suction cup sucks out the debris and sticky film, and then the debris box is placed in the debris collection box, and then the silicon wafer to be patched is taken out from the patch flower basket and inserted into the feeding flower basket; if the flower basket test is normal, the patch device does not perform any operation. After the whole process, all debris can be removed, and the patch command is executed with liquid. This design can solve the problem that the existing machine cannot reduce debris and liquid, and can be widely used in velvet making, one-time alkali polishing, and RCA machines, which improves the EL yield and appearance yield of solar cells and the value of single finished films.

[0037] Specific as Figure 2 As shown, Figure 2 The present invention is a work flow chart of a device for automatic film measurement and patching of a wet process slot machine; specifically:

[0038] When the patch basket 13 reaches the unloading point, the robot grabs the patch basket 13 and moves it to the feeding basket transmission belt 15. When it reaches the fixed point, the patch camera module 5-2 detects whether there is sticky film or debris.

[0039] If there are sticky wafers or fragments, the patch suction cup body 10 sucks out the fragments and sticky wafers, and then places the sticky wafers and fragments in the fragment collection box 16, and then takes out the silicon wafer to be patched from the wafer taking basket 2, inserts it into the patch basket 13, and then sends it to the process unloading through the feeding basket transmission belt 14;

[0040] If there is no sticking or fragmentation, the patch suction cup body 10 does not perform any operation and is directly sent to the process unloading through the feeding basket transmission belt 14;

[0041] The entire process is able to remove all debris and execute patch commands simultaneously with fluid.

[0042] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for automatic film measurement and patching of wet process slot machine feeding, characterized in that: The device comprises: a flower basket transmission belt (1), a flower basket for taking pieces (2), a patch base (3), and a feeding flower basket transmission belt (15); the flower basket transmission belt (1) is below the flower basket for taking pieces (2), and the flower basket for taking pieces (2) is located in the center of the flower basket transmission belt (1); the flower basket transmission belt (1), the patch base (3), and the feeding flower basket transmission belt (15) are in a parallel state; The patch base (3) comprises a camera motion guide rail (4) and a suction cup vertical motion guide rail (6) above; a camera motion slider (5) is arranged on the camera motion guide rail (4); two ends of the camera motion slider (5) are film-taking camera modules (5-1) and patch camera modules (5-2); the camera motion slider (5) can move up and down on the camera motion guide rail (4); A patch suction cup moving slider (7) is arranged on the suction cup vertical moving guide rail (6), and the end of the patch suction cup moving slider (7) is sequentially connected to a patch suction cup fixing rod (8) and a patch suction cup telescopic rod (9); a patch suction cup body (10) is arranged above the patch suction cup telescopic rod (9), and an air extraction hole (11) is arranged on the patch suction cup body (10).

2. The device for automatic film measurement and patching of a wet process slot machine according to claim 1, characterized in that: The lower end of the patch base (3) is connected to a debris placement box (16); the debris placement box (16) is a deformation-resistant plastic PVC structure.

3. The device for automatic film measurement and patching of a wet process slot machine according to claim 1, characterized in that: The patch suction cup body (10) is a ceramic structure and can be disassembled and replaced.

4. The device for automatic film measurement and patching for wet process slot machine feeding according to claim 1 is characterized in that: The patch suction cup moving slider (7) is a steel corrosion-resistant structure; the patch suction cup fixing rod (8) is a steel corrosion-resistant structure.

5. The device for automatic film measurement and patching for wet process slot machine feeding according to claim 1 is characterized in that: The film-taking camera module (5-1) and the film-repairing camera module (5-2) are provided with program devices for reading the flower basket silicon wafer information and transmitting the flower basket silicon wafer information.

6. The device for automatic film measurement and patching for wet process slot machine feeding according to claim 1, characterized in that: The suction hole (11) is also connected to the patch suction cup body (10); the suction hole is connected to the peripheral nitrogen, and the nitrogen does not pollute the silicon wafer and does not react with the silicon wafer.

7. The device for automatic film measurement and patching for wet process slot machine feeding according to claim 1 is characterized in that: A patch flower basket (13) is arranged above the feeding flower basket transmission belt (15); silicon wafers (12) are arranged inside the film-taking flower basket (2) and the patch flower basket (13); the feeding flower basket transmission belt (15) is below the patch flower basket (13); and the patch flower basket (13) is located in the center of the feeding flower basket transmission belt (15); the flower basket transmission belt (1) and the patch base (3) and the feeding flower basket transmission belt (15) are in a parallel state; the discharging flower basket transmission belt (14) and the feeding flower basket transmission belt (15) are in the same plane and in a vertical state; and the fragment placement box (16) and the base (3) are in a connected state.

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