Heat dissipation device

Abstract

The utility model belongs to the technical field of heat management, and relates to a heat dissipation device. The heat dissipation device comprises a porous heat pipe and a cooling mechanism, the porous heat pipe comprises a first pipe section, a second pipe section and a main body pipe section connected between the first pipe section and the second pipe section, the first pipe section is provided with a first external connection channel, the second pipe section is provided with a second external connection channel, and the first external connection channel is communicated with the second external connection channel. A plurality of mutually independent micro-channel holes are formed in the main body pipe section, and each micro-channel hole is communicated between the first external channel and the second external channel; a cooling channel is arranged on the cooling mechanism, the first pipe section and the second pipe section are respectively connected with the cooling mechanism, and the cooling channel is communicated between the first external channel and the second external channel; the porous heat pipe is used for being connected with a heating device. The heat dissipation device can meet the heat dissipation requirement of a high-power heating device.

Description

Technical Field

[0001] The utility model belongs to the technical field of thermal management, and in particular relates to a heat dissipation device. Background Art

[0002] In the fields of electric vehicles, industrial electronics, consumer electronics, computer rooms, data servers, etc., equipment or devices will generate a lot of heat when working. If this heat cannot be dissipated in time, the temperature of the equipment or the ambient temperature will continue to rise. High temperature will seriously affect the operating stability and life of the equipment. Therefore, various thermal managements are required to make the equipment work within a suitable temperature range. Thermal management includes heat transfer and heat dissipation. One of the heat transfer devices is a porous heat pipe with two or more internal microchannels. The number of these microchannels directly affects the thermal conductivity of the heat pipe. However, when the power of the equipment or device is large, the porous heat pipe with two or more internal microchannels will be difficult to meet its heat dissipation needs. Utility Model Content

[0003] The technical problem to be solved by the utility model is: to provide a heat dissipation device in view of the technical problem that the existing porous heat pipes with closed two ends are difficult to meet the heat dissipation requirements of high-power devices.

[0004] In order to solve the above technical problems, the embodiment of the utility model provides a heat dissipation device, including a porous heat pipe and a cooling mechanism, wherein the porous heat pipe includes a first pipe segment, a second pipe segment and a main pipe segment connected between the first pipe segment and the second pipe segment, the first pipe segment is provided with a first external channel, the second pipe segment is provided with a second external channel, and the main pipe segment is provided with a plurality of microchannel holes independent of each other, and each of the microchannel holes is respectively connected between the first external channel and the second external channel;

[0005] The cooling mechanism is provided with a cooling channel, the first pipe section and the second pipe section are respectively connected to the cooling mechanism, and the cooling channel is connected between the first external channel and the second external channel;

[0006] The porous heat pipe is used to be connected to a heating device.

[0007] According to the heat dissipation device of the embodiment of the utility model, the porous heat pipe is connected to the cooling mechanism through the first pipe segment and the second pipe segment, so that each microchannel hole of the porous heat pipe forms a circulation channel between the first pipe segment and the second pipe segment and the cooling channel of the cooling mechanism, thereby realizing heat dissipation of the heating device installed on the porous heat pipe. The heat dissipation device can meet the heat dissipation requirements of high-power heating devices by combining the porous heat pipe with the external cooling mechanism, and ensure the effective heat dissipation of the high-power heating devices.

[0008] Optionally, the first external channel includes a first connecting port and a first outlet connected to the first connecting port, the first connecting port is arranged on a side of the first pipe segment facing the main pipe segment and connected to each of the microchannel holes, the first outlet is arranged on a side of the first pipe segment facing away from the main pipe segment, and the first outlet is used to connect to the cooling channel.

[0009] Optionally, the second external channel includes a second connecting port and a second outlet connected to the second connecting port, the second connecting port is arranged on a side of the second pipe segment facing the main pipe segment and is connected to each of the microchannel holes, the second outlet is arranged on a side of the second pipe segment facing away from the main pipe segment, and the second outlet is used to connect to the cooling channel.

[0010] Optionally, a first step surface is formed at a position where the first pipe section connects with the main pipe section, and a second step surface is formed at a position where the main pipe section connects with the first pipe section, and the first step surface cooperates with and abuts against the second step surface.

[0011] Optionally, a third step surface is formed at a position where the second pipe segment is connected to the main pipe segment, a fourth step surface is formed at a position where the main pipe segment is connected to the second pipe segment, and the third step surface is mated and abutted against the fourth step surface.

[0012] Optionally, the cooling channel of the cooling mechanism is located above the porous heat pipe.

[0013] Optionally, the heat dissipation device further includes a first pipeline and a second pipeline, wherein the first pipeline is connected between the first pipe section and the cooling mechanism so that the first external channel is connected to the cooling channel;

[0014] The second pipeline is connected between the second pipe section and the cooling mechanism so that the second external channel is in communication with the cooling channel.

[0015] Optionally, on the cross section of the porous heat pipe, the cross sections of the plurality of microchannel holes are arranged in a two-dimensional array of multiple rows and columns.

[0016] Optionally, on the cross section of the porous heat pipe, the cross sections of the plurality of microchannel holes are arranged in a rectangular array, a circular array or a radial lattice.

[0017] Optionally, the cross-section of the porous heat pipe is rectangular or circular;

[0018] A tooth-like structure is arranged on the inner side wall of the microchannel hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1is a cross-sectional view of a heat dissipation device provided by an embodiment of the utility model;

[0020] Figure 2 yes Figure 1 Cross-section at AA in the middle;

[0021] Figure 3 yes Figure 2 The enlarged schematic diagram of point B in the middle;

[0022] Figure 4 This is a working principle diagram of a heat dissipation device provided in one embodiment of the utility model.

[0023] The reference numerals in the specification are as follows:

[0024] 1. porous heat pipe; 11. first pipe section; 111. first external channel; 1111. first communication port; 1112. first outlet; 112. first step surface; 12. second pipe section; 121. second external channel; 1211. second communication port; 1212. second outlet; 122. third step surface; 13. main pipe section; 131. microchannel hole; 132. second step surface; 133. fourth step surface;

[0025] 2. Cooling mechanism;

[0026] 3. The first pipeline;

[0027] 4. Second pipeline. DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and beneficial effects solved by the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0029] like Figures 1 to 4 As shown, the heat dissipation device provided by the embodiment of the utility model includes a porous heat pipe 1 and a cooling mechanism 2, the porous heat pipe 1 includes a first pipe segment 11, a second pipe segment 12 and a main pipe segment 13 connected between the first pipe segment 11 and the second pipe segment 12, the first pipe segment 11 is provided with a first external channel 111, the second pipe segment 12 is provided with a second external channel 121, the main pipe segment 13 is provided with a plurality of independent microchannel holes 131, and each of the microchannel holes 131 is respectively connected between the first external channel 111 and the second external channel 121.

[0030] The cooling mechanism 2 is provided with a cooling channel. The first pipe section 11 and the second pipe section 12 are respectively connected to the cooling mechanism 2 , and the cooling channel is connected between the first external channel 111 and the second external channel 121 .

[0031] The porous heat pipe 1 is used to be connected to a heating device.

[0032] The heat dissipation device provided by the embodiment of the utility model enables the porous heat pipe 1 to be externally connected to the cooling mechanism 2 through the first pipe segment 11 and the second pipe segment 12, so that each microchannel hole 131 of the porous heat pipe 1 forms a circulation channel between the first pipe segment 11 and the second pipe segment 12 and the cooling channel of the cooling mechanism 2, thereby realizing heat dissipation of the heating device installed on the porous heat pipe 1. The heat dissipation device can meet the heat dissipation requirements of high-power heating devices by combining the porous heat pipe 1 with the external cooling mechanism 2, and ensure effective heat dissipation of the high-power heating devices.

[0033] In one embodiment, if Figure 2 and Figure 3 As shown, the first external channel 111 includes a first connecting port 1111 and a first outlet 1112 connected to the first connecting port 1111, the first connecting port 1111 is arranged on a side of the first pipe segment 11 facing the main pipe segment 13 and is connected to each of the microchannel holes 131, the first outlet 1112 is arranged on a side of the first pipe segment 11 facing away from the main pipe segment 13, and the first outlet 1112 is used to communicate with the cooling channel.

[0034] By respectively arranging the first connecting port 1111 and the first outlet 1112 on the side of the first pipe segment 11 facing the main pipe segment 13 and the side facing away from the main pipe segment 13, and by making the first connecting port 1111 connected with each of the microchannel holes 131, and the first outlet 1112 connected with the cooling channel of the cooling mechanism 2, the connection between each of the microchannel holes 131 and the cooling channel of the cooling mechanism 2 is achieved from the first pipe segment 11.

[0035] In one embodiment, if Figure 2 As shown, the second external channel 121 includes a second connecting port 1211 and a second outlet 1212 connected to the second connecting port 1211, the second connecting port 1211 is arranged on the side of the second pipe segment 12 facing the main pipe segment 13 and is connected to each of the microchannel holes 131, and the second outlet 1212 is arranged on the side of the second pipe segment 12 facing away from the main pipe segment 13.

[0036] By respectively arranging the second connecting port 1211 and the second outlet 1212 on the side of the second pipe segment 12 facing the main pipe segment 13 and the side facing away from the main pipe segment 13, and by making the second connecting port 1211 connected with each of the microchannel holes 131, and the second outlet 1212 connected with the cooling channel of the cooling mechanism 2, the connection between each of the microchannel holes 131 and the cooling channel of the cooling mechanism 2 is achieved from the second pipe segment 12.

[0037] In one embodiment, if Figure 2 and Figure 3 As shown, a first step surface 112 is formed at a position where the first pipe segment 11 is connected to the main pipe segment 13, and a second step surface 132 is formed at a position where the main pipe segment 13 is connected to the first pipe segment 11. The first step surface 112 and a part of the second step surface 132 cooperate and abut against each other to achieve the connection between the first pipe segment 11 and the main pipe segment 13. At this time, a height difference can be formed between the first step surface 112 and the second step surface 132 to ensure the communication between the first communication port 1111 and each of the microchannel holes 131.

[0038] In one embodiment, if Figure 2 As shown, a third step surface 122 is formed at the position where the second pipe segment 12 is connected to the main pipe segment 13, and a fourth step surface 133 is formed at the position where the main pipe segment 13 is connected to the second pipe segment 12. The third step surface 122 and the fourth step surface 133 cooperate and abut against each other to achieve the connection between the second pipe segment 12 and the main pipe segment 13. At this time, a height difference can be formed between the third step surface 122 and the fourth step surface 133 to ensure the communication between the second communication port 1211 and each of the microchannel holes 131.

[0039] In one embodiment, if Figure 4 As shown, the cooling channel of the cooling mechanism 2 is located above the porous heat pipe 1 to ensure that the porous heat pipe 1 can fully absorb heat from the heating device.

[0040] In one embodiment, if Figure 4 As shown, the heat dissipation device further includes a first pipeline 3 and a second pipeline 4. The first pipeline 3 is connected between the first pipe section 11 and the cooling mechanism 2 so that the first external channel 111 is in communication with the cooling channel.

[0041] The second pipeline 4 is connected between the second pipe section 12 and the cooling mechanism 2 so that the second external channel 121 is in communication with the cooling channel.

[0042] In one embodiment, if Figure 1As shown, on the cross section of the porous heat pipe 1, the cross sections of the plurality of microchannel holes 131 are arranged in a two-dimensional array of multiple rows and columns.

[0043] The cross section of the porous heat pipe 1 refers to the cross section perpendicular to the extending direction of the microchannel holes 131 .

[0044] The two-dimensional array arrangement of multiple rows and columns means that the cross sections of the multiple microchannel holes 131 are not on the same straight line, but are arranged in a two-dimensional direction, and the two-dimensional array arrangement can be regular or irregular, that is, the multiple microchannel holes 131 are three-dimensionally arranged in the space where the porous heat pipe 1 is located.

[0045] In one embodiment, if Figure 1 As shown, on the cross section of the porous heat pipe 1, the cross sections of the multiple microchannel holes 131 are arranged in a rectangular array, that is, the multiple microchannel holes 131 are arranged in rows and columns perpendicular to each other, and the spacing between rows is equal, and the spacing between columns is equal.

[0046] In other embodiments not shown in the figures, on the cross section of the porous heat pipe, the cross sections of the plurality of microchannel holes may also be arranged in a ring array or a radial lattice.

[0047] In one embodiment, if Figure 1 As shown, the cross section of the porous heat pipe 1 is a flattened rectangle, and the side with a larger side length of the cross section serves as the surface in contact with the heating device. The porous heat pipe 1 with a rectangular cross section is suitable for heating devices with a relatively flat heating surface.

[0048] In other embodiments not shown in the figures, the cross-section of the porous heat pipe may also be circular, that is, the porous heat pipe is a cylindrical tubular structure.

[0049] In one embodiment, a tooth-like structure is provided on the inner side wall of the microchannel hole 131. The tooth-like structure can increase the contact area between the refrigerant and the microchannel hole 131 without increasing the aperture of the microchannel hole 131, thereby further improving the heat conduction efficiency.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation device, characterized in that: The invention comprises a porous heat pipe and a cooling mechanism, wherein the porous heat pipe comprises a first pipe section, a second pipe section and a main pipe section connected between the first pipe section and the second pipe section, the first pipe section is provided with a first external channel, the second pipe section is provided with a second external channel, and the main pipe section is provided with a plurality of mutually independent microchannel holes, each of which is connected between the first external channel and the second external channel; The cooling mechanism is provided with a cooling channel, the first pipe section and the second pipe section are respectively connected to the cooling mechanism, and the cooling channel is connected between the first external channel and the second external channel; The porous heat pipe is used to be connected to a heating device.

2. The heat dissipation device according to claim 1, characterized in that: The first external channel includes a first connecting port and a first outlet connected to the first connecting port, the first connecting port is arranged on a side of the first pipe segment facing the main pipe segment and connected to each of the microchannel holes, the first outlet is arranged on a side of the first pipe segment facing away from the main pipe segment, and the first outlet is used to connect to the cooling channel.

3. The heat dissipation device according to claim 1, characterized in that: The second external channel includes a second connecting port and a second outlet connected to the second connecting port, the second connecting port is arranged on a side of the second pipe segment facing the main pipe segment and connected to each of the microchannel holes, the second outlet is arranged on a side of the second pipe segment facing away from the main pipe segment, and the second outlet is used to connect to the cooling channel.

4. The heat dissipation device according to claim 1, characterized in that: A first step surface is formed at a position where the first pipe section connects with the main pipe section, and a second step surface is formed at a position where the main pipe section connects with the first pipe section. The first step surface cooperates with and abuts against the second step surface.

5. The heat dissipation device according to claim 1, characterized in that: A third step surface is formed at a position where the second pipe section connects with the main pipe section, a fourth step surface is formed at a position where the main pipe section connects with the second pipe section, and the third step surface cooperates with and abuts against the fourth step surface.

6. The heat dissipation device according to claim 1, characterized in that: The cooling channel of the cooling mechanism is located above the porous heat pipe.

7. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further includes a first pipeline and a second pipeline, wherein the first pipeline is connected between the first pipe section and the cooling mechanism so that the first external channel is connected to the cooling channel; The second pipeline is connected between the second pipe section and the cooling mechanism so that the second external channel is in communication with the cooling channel.

8. The heat dissipation device according to claim 1, characterized in that: On the cross section of the porous heat pipe, the cross sections of the plurality of microchannel holes are arranged in a two-dimensional array of multiple rows and columns.

9. The heat dissipation device according to claim 1, characterized in that: On the cross section of the porous heat pipe, the cross sections of the plurality of microchannel holes are arranged in a rectangular array, a circular array or a radial lattice.

10. The heat dissipation device according to claim 1, characterized in that: The cross section of the porous heat pipe is rectangular or circular; A tooth-like structure is arranged on the inner side wall of the microchannel hole.

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