Inverter heat dissipation device and inverter welding machine

Abstract

The utility model provides an inverter heat radiation device and an inverter welding machine. The inverter heat radiation device comprises a metal heat radiation rack; the inverter comprises a circuit board and a plurality of IGBT (Insulated Gate Bipolar Translator) elements fixed on the circuit board, and each IGBT element is provided with a mounting part fixed with the metal heat dissipation frame and a plurality of pins connected with the circuit board; and the insulating partition plate is arranged between the pin and the metal heat dissipation frame and is suitable for separating the pin from the metal heat dissipation frame. According to the utility model, the insulating separator plates are arranged between the pins and the metal heat dissipation rack, so that the electrical gap and the creepage distance between the pins and the metal heat dissipation rack are increased, and the pins are prevented from being in lap joint with the metal heat dissipation rack after being deformed, thereby improving the safety performance and ensuring the normal use of equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of welding, in particular to an inverter heat dissipation device and an inverter welding machine. Background Art

[0002] The inverter welding machine is a device composed of a large number of electronic components, among which the IGBT components of the inverter will generate a lot of heat when working. Therefore, the common practice is to fix the IGBT components on a metal heat sink to achieve heat dissipation. The IGBT component has multiple pins that are welded and fixed to the circuit board. The inventor found in actual work that the creepage distance between the multiple pins of the IGBT component and the heat sink is small, which is easy to deform and bend during the assembly and transfer process, and is easy to overlap the heat sink to form a short circuit. In addition, the electrical gap between the multiple pins is also small, which is easy to cause a short circuit, affecting the service life of the equipment. Utility Model Content

[0003] To this end, the utility model provides an inverter heat dissipation device, including a metal heat dissipation frame, an inverter and an insulating partition, the inverter including a circuit board and a plurality of IGBT elements fixed on the circuit board, the IGBT elements having a mounting portion fixed to the metal heat dissipation frame and a plurality of pins connected to the circuit board; the insulating partition is arranged between the pins and the metal heat dissipation frame, and is suitable for separating the pins from the metal heat dissipation frame.

[0004] The insulating partition is arranged between the circuit board and the metal heat dissipation frame, and is suitable for separating the circuit board and the metal heat dissipation frame.

[0005] A side of the insulating partition facing the circuit board is provided with a partition located between the plurality of pins.

[0006] The metal heat dissipation frame is fixed on the mounting frame, and the mounting frame includes a top cover and a base arranged up and down, and a first partition and the insulating partition arranged at the front and back. The top cover, the base, the first partition and the insulating partition together form an installation cavity suitable for installing the metal heat dissipation frame, and windows located on the left and right sides of the installation cavity.

[0007] The metal heat dissipation frame further includes a plurality of second partitions spaced apart along its height direction, wherein the second partitions are suitable for dividing the installation cavity into a plurality of partitions.

[0008] The metal heat sink frame comprises a heat sink block fixed to the IGBT element, and a plurality of heat sink fins arranged on a side of the heat sink block away from the IGBT element and spaced apart along a height direction of the heat sink block.

[0009] It also includes a fan, which is arranged at one of the windows of the mounting frame.

[0010] The utility model also provides an inverter welding machine, comprising the inverter heat dissipation device as described above.

[0011] The technical solution of the utility model has the following advantages:

[0012] 1. The inverter heat dissipation device provided by the utility model not only increases the electrical clearance and creepage distance between the tube pins and the metal heat dissipation frame by arranging an insulating partition between the tube pins and the metal heat dissipation frame, but also prevents the tube pins from overlapping with the metal heat dissipation frame after deformation, thereby improving the safety performance and ensuring the normal use of the equipment.

[0013] 2. In the inverter heat dissipation device provided by the utility model, the insulating partition is arranged between the circuit board and the metal heat dissipation frame, which is suitable for separating the circuit board and the metal heat dissipation frame. The insulating partition increases the electrical clearance and creepage distance between the components on the circuit board and the metal heat dissipation frame, further improving the safety performance.

[0014] 3. In the inverter heat dissipation device provided by the utility model, a partition located between a plurality of pins is provided on one side of the insulating partition facing the circuit board, thereby increasing the electrical gap and creepage distance between two adjacent pins.

[0015] 4. The inverter heat dissipation device provided by the utility model comprises a metal heat dissipation frame including a heat dissipation block fixed to the IGBT element, and a plurality of heat dissipation fins arranged on a side of the heat dissipation block away from the IGBT element and spaced apart along the height direction of the heat dissipation block, so that heat is dissipated through the plurality of heat dissipation fins, and the heat dissipation efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A three-dimensional diagram of the inverter heat dissipation device of the utility model;

[0018] Figure 2 is a three-dimensional diagram of the inverter;

[0019] Figure 3 It is a schematic diagram of the assembly of IGBT components and metal heat sink;

[0020] Figure 4 It is a schematic diagram of the assembly of the metal heat sink and the mounting frame;

[0021] Figure 5 A perspective view of the mounting bracket.

[0022] Explanation of the reference numerals in the accompanying drawings: 1. metal heat sink; 2. inverter; 3. circuit board; 4. IGBT element; 5. mounting portion; 6. pin; 7. insulating partition; 8. partition; 9. mounting frame; 10. top cover; 11. first partition; 12. base; 13. mounting cavity; 14. second partition; 15. heat sink; 16. heat sink fin; 17. fan. DETAILED DESCRIPTION

[0023] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0027] Example 1

[0028] This embodiment provides an inverter heat dissipation device, including a mounting frame 9 , a metal heat dissipation frame 1 and an inverter 2 .

[0029] Metal heat sink 1, such as Figure 4As shown, it includes a heat sink 15 fixed to the IGBT element 4 , and a plurality of heat sink fins 16 arranged on a side of the heat sink 15 away from the IGBT element 4 and spaced apart along the height direction of the heat sink 15 .

[0030] Inverter 2, such as Figure 2 As shown, it includes a circuit board 3 and a plurality of IGBT elements 4 fixed on the circuit board 3 . The IGBT elements 4 have a mounting portion 5 fixed to the metal heat sink 1 and a plurality of pins 6 connected to the circuit board 3 .

[0031] like Figure 4 and Figure 5 As shown, the mounting frame 9 includes a top cover 10 and a base 12 arranged above and below, and a first partition 11 and the insulating partition 7 arranged at the front and rear. The top cover 10, the base 12, the first partition 11 and the insulating partition 7 enclose a mounting cavity 13 suitable for mounting the metal heat sink 1, and windows located on the left and right sides of the mounting cavity 13, and a fan 17 is arranged at one of the windows; Figure 1 As shown, the insulating partition 7 is provided between the pin 6 and the metal heat sink 1, and is suitable for separating the pin 6 from the metal heat sink 1. Further, the insulating partition 7 is provided between the circuit board 3 and the metal heat sink 1, and is suitable for separating the circuit board 3 from the metal heat sink 1. In this embodiment, Figure 3 and Figure 4 As shown, the insulating partition 7 is provided with a partition 8 located between the plurality of pins 6 on one side facing the circuit board 3. The metal heat sink 1 also includes a second partition 14 spaced apart along its height direction, and the second partition 14 is suitable for dividing the mounting cavity 13 into a plurality of partitions. It should be noted that the number of the second partitions 14 can be 1, 2, 3 or more, and those skilled in the art can flexibly select the number of the second partitions 14 according to actual needs.

[0032] The inverter heat dissipation device provided by the utility model not only increases the electrical clearance and creepage distance between the pins 6 and the metal heat dissipation frame 1 by arranging an insulating partition 7 between the pins 6 and the metal heat dissipation frame 1, but also prevents the pins 6 from overlapping with the metal heat dissipation frame 1 after deformation, thereby improving safety performance and ensuring normal use of the equipment.

[0033] Example 2

[0034] This embodiment also provides an inverter welding machine, including the inverter heat dissipation device as described in Example 1.

[0035] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. An inverter heat dissipation device, characterized in that: include: Metal heat sink (1); An inverter (2) comprises a circuit board (3) and a plurality of IGBT elements (4) fixed on the circuit board (3), wherein the IGBT elements (4) have a mounting portion (5) fixed to the metal heat sink (1) and a plurality of pins (6) connected to the circuit board (3); An insulating partition (7) is provided between the tube pin (6) and the metal heat dissipation frame (1) and is suitable for separating the tube pin (6) and the metal heat dissipation frame (1).

2. The inverter heat dissipation device according to claim 1, characterized in that: The insulating partition (7) is arranged between the circuit board (3) and the metal heat dissipation frame (1), and is suitable for separating the circuit board (3) and the metal heat dissipation frame (1).

3. The inverter heat dissipation device according to claim 1 or 2, characterized in that: A side of the insulating partition (7) facing the circuit board (3) is provided with a partition (8) located between the plurality of pins (6).

4. The inverter heat dissipation device according to claim 1, characterized in that: The metal heat sink (1) is fixed on a mounting frame (9), and the mounting frame (9) comprises a top cover (10) and a base (12) arranged above and below, and a first partition (11) and the insulating partition (7) arranged at the front and rear, the top cover (10), the base (12), the first partition (11) and the insulating partition (7) enclosing a mounting cavity (13) suitable for mounting the metal heat sink (1), and windows located on left and right sides of the mounting cavity (13).

5. The inverter heat dissipation device according to claim 4, characterized in that: The metal heat dissipation rack (1) further comprises a plurality of second partitions (14) arranged at intervals along its height direction, wherein the second partitions (14) are suitable for dividing the installation cavity (13) into a plurality of partitions.

6. The inverter heat dissipation device according to claim 1, characterized in that: The metal heat sink (1) comprises a heat sink block (15) fixed to the IGBT element (4), and a plurality of heat sink fins (16) arranged on a side of the heat sink block (15) away from the IGBT element (4) and spaced apart along a height direction of the heat sink block (15).

7. The inverter heat dissipation device according to claim 4, characterized in that: It also includes a fan (17), wherein the fan (17) is arranged at one of the window openings of the mounting frame (9).

8. An inverter welding machine, characterized in that: It comprises the inverter heat dissipation device as described in any one of claims 1 to 7.

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