Polishing machine grinding head pressure feedback and adjustment device

By adopting a combined structure of main cylinder, secondary cylinder, pressure regulator and pressure sensor in the polishing equipment, the uniform distribution and real-time adjustment of pressures on the grinding disc are achieved, and the uncertainty of pressure control of the edge of the grinding head in existing equipment is solved. Problem, improving polishing accuracy and product quality.

CN222200119UActive Publication Date: 2024-12-20SHANXI SEMICORE CRYSTAL CO LTD
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Patent Information

Application Number
CN202420128489.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-18
Publication Date
2024-12-20
Estimated Expiration
2034-01-18

AI Technical Summary

Technical Problem

There is uncertainty in the pressure control of the grinding head edge pressure, which leads to the inability to precisely control the pressure magnitude, affecting the polishing effect and product quality, and unable to meet the needs of complex process changes.

Method used

Adopting a structure including the main cylinder and the secondary cylinder, the pressure regulating valve and pressure sensor can achieve uniform distribution and real-time adjustment of pressure on the grinding disc. Combining universal joints and movable casters ensures uniform floating of the grinding disc during rotation, the motor drives the spindle to rotate. , realize high-precision pressure feedback and adjustment.

Benefits of technology

The pressure of the grinding disc is uniform, the polishing accuracy and reliability are improved, the number of reworks and resource waste is reduced, the production cost is reduced, and the controllability of product quality is enhanced.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model discloses a polishing machine grinding head pressure feedback and adjustment device, and relates to a polishing machine. Comprising millstones, a power system and a spindle, the power system is connected with the spindle; the millstone is connected to the bottom of the spindle; the device further comprises a main air cylinder and at least two auxiliary air cylinders. The main air cylinder is connected with the main shaft, the auxiliary air cylinders are evenly distributed above the grinding disc, the movable trundles are installed at the bottoms of the auxiliary air cylinders, and the movable trundles are tightly attached to the grinding disc below the movable trundles. The main air cylinder and each auxiliary air cylinder are respectively connected with a pressure regulating valve, and pressure sensors are arranged on one side, far away from the movable caster, of a central shaft in each auxiliary air cylinder and on the main shaft; by means of the device, materials below can obtain sufficient and even pressure, high accuracy is guaranteed, and the overall reliability is high.
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Description

Technical Field

[0001] The utility model relates to a polishing machine, in particular to a polishing machine grinding head pressure feedback and regulating device. Background Art

[0002] At present, the domestic silicon carbide industry is in a rapid development stage, with a huge output of wafers. Among them, wafer polishing, as an important part of the silicon carbide processing process, puts forward higher requirements on polishing equipment. Most of the existing polishing equipment on the market uses an upper motor to drive the grinding head to rotate, and the cylinder connected to the grinding head rises and falls to provide pressure, and cooperates with the rotation of the large plate below to generate friction to achieve the polishing effect. Among them, the precision control of downward pressure is particularly important. The existing polishing machine generates pressure by connecting the cylinder to the grinding head through the center axis. Such a structure can only ensure that the center of the grinding head can obtain the given pressure of the cylinder, which spreads from the center to the surrounding of the grinding head, and the pressure gradually decreases. The larger the area of ​​the grinding head, the more the pressure attenuates to the edge of the grinding head. Giving pressure in this way has the following disadvantages:

[0003] (1) The attenuation of pressure from the center to the edge is uncontrollable, and the pressure at the edge of the grinding head is uncertain;

[0004] (2) Before the new equipment is put into operation, the cylinder pressure is calibrated by an external auxiliary pressure measurement sensor. The actual pressure in the subsequent operation is calculated by proportional calculation, which has an error with the actual pressure and is not accurate enough;

[0005] (3) Due to many variables such as changing the polishing cloth or processing requirements, a single cylinder calibration value cannot meet the complex process change requirements, which brings higher requirements to the process settings of the process personnel and makes product quality difficult to control. Utility Model Content

[0006] The utility model overcomes the shortcomings of the prior art and provides a polishing machine grinding head pressure feedback and adjustment device.

[0007] In order to achieve the above purpose, the utility model is implemented through the following technical solutions.

[0008] A polishing machine grinding head pressure feedback and adjustment device, including a grinding disc, a power system, and a main shaft; the power system is connected to the main shaft, and the grinding disc is connected to the bottom of the main shaft; it also includes a main cylinder and no less than two auxiliary cylinders; the main cylinder is connected to the main shaft, the auxiliary cylinders are evenly distributed above the grinding disc, and movable casters are installed at the bottom of the auxiliary cylinders, and the movable casters are tightly fitted with the grinding disc below; the main cylinder and each auxiliary cylinder are respectively connected to a pressure regulating valve, and pressure sensors are installed on the side of the central axis inside the auxiliary cylinder away from the movable casters, as well as on the main shaft.

[0009] Furthermore, the grinding disc and the main shaft are connected via a universal joint.

[0010] Further, the main cylinder is connected to the top of the main shaft through a connecting shaft.

[0011] Furthermore, the auxiliary cylinders are arranged on a support plate directly above the grinding disc, the shape of the support plate is consistent with the grinding disc below, and the auxiliary cylinders are evenly distributed on the support plate.

[0012] Furthermore, the main shaft passes through the center of the support plate, the main shaft and the support plate are connected by bearing matching, the support plate is installed on a support column integrated with the connecting flange, and the support column is located outside the main shaft.

[0013] Furthermore, the grinding disc and the main shaft are connected via a universal joint.

[0014] Furthermore, the power system is a motor, which drives the main shaft to rotate through a synchronous belt.

[0015] Furthermore, the pressure regulating valve, the main cylinder and the motor are all installed above the support plate; the auxiliary cylinder and the grinding plate are located below the support plate.

[0016] Furthermore, a pressure sensor is connected to the top of the main shaft.

[0017] The beneficial effects of the utility model compared with the prior art are:

[0018] The utility model has a compact structure, reasonable layout, complete functions and strong integrity. Compared with the existing equipment on the market, it is more suitable for the production and processing of silicon carbide materials and has the following advantages:

[0019] 1. It can ensure that the pressure on the entire grinding disc is equal, so that the material to be processed below can obtain sufficient and uniform pressure;

[0020] 2. It can stably provide the different pressures required for each step of wafer polishing, ensure high accuracy, and provide timely feedback and adjustments to pressure changes, with high overall reliability;

[0021] 3. The reliability of the structure and the integrity of the functions make it easier to control product quality, indirectly reducing the complexity of the polishing process and creating more possibilities for the development of new processes;

[0022] 4. It can improve the processing yield, effectively reduce the number of rework, have a more accurate grasp of the degree of polishing cloth loss, reduce the waste of resources, and save production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the structure of the polishing machine grinding head pressure feedback and adjustment device of the utility model;

[0024] In the figure:

[0025] 1-motor; 2-main cylinder; 3-pressure regulating valve; 4-synchronous belt; 5-auxiliary cylinder; 6-support plate; 7-movable caster; 8-universal joint; 9-grinding disc; 10-pressure sensor; 11-support disc; 12-connecting flange; 13-spindle; 14-support column. DETAILED DESCRIPTION

[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail in combination with the embodiments and the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. The technical solution of the present invention is described in detail below in combination with the embodiments and the accompanying drawings, but the scope of protection is not limited thereto.

[0027] This embodiment provides a polishing machine grinding head pressure feedback and adjustment device, which is divided into two parts, the upper part is mainly the power system, and the lower part is mainly the execution system. The various mechanisms cooperate with each other and the overall layout is reasonable. Figure 1 As shown, the power system is a motor 1, which drives the main shaft 13 of the grinding disc 9 to rotate through a synchronous belt 4; the motor 1 provides the power required for the rotation of the grinding disc 9, the grinding disc 9 is connected to the bottom of the main shaft 13, and the grinding disc 9 and the main shaft 13 are connected through a universal joint 8, which can ensure that the grinding disc 9 is in a floating state when rotating, and ensure that the pressure distribution of each part of the grinding disc 9 is as uniform as possible.

[0028] It also includes a main cylinder 2 and a sub-cylinder 5; the main cylinder 2 is connected to the top of the main shaft 13 through a connecting shaft, and the main cylinder 2 can drive the lower execution system to rise and fall and provide the main pressure required for the grinding disc 9; the sub-cylinder 5 is used as a fine-tuning cylinder to adjust the pressure on the grinding disc 9; in this embodiment, four sub-cylinders 5 are taken as an example, and the sub-cylinders 5 are installed on the support plate 6 directly above the grinding disc 9. The shape of the support plate 6 is basically the same as that of the grinding disc 9 below. The sub-cylinders 5 are evenly distributed on the support plate 6, and the main shaft 13 passes through the center of the support plate 6. The two are connected by bearings to ensure that the support plate 6 does not affect the rotation of the main shaft 13. The support plate 6 is installed on a support column 14 located on the outside of the main shaft 13 which is integrated with the connecting flange 12.

[0029] A movable caster 7 is installed under the auxiliary cylinder 5, and the movable caster 7 fits tightly with the grinding disc 9 below; a pressure sensor 10 is installed on the side of the central axis inside the auxiliary cylinder 5 away from the movable caster 7; the main cylinder 2 and the four auxiliary cylinders 5 are respectively connected to a pressure regulating valve 3, and the pressure regulating valve 3 adjusts the required pressure of the main cylinder 2 and the auxiliary cylinder 5, and the number changes according to the actual number of auxiliary cylinders 5. A pressure sensor 10 is also installed on the top of the main shaft 13.

[0030] See also Figure 1, five pressure regulating valves 3 , the main cylinder 2 and the motor 1 are all installed above the support plate 11 ; the support plate 6 and the grinding disc 9 are located below the support plate 11 .

[0031] When the device is in standby mode, the main cylinder 2 is in the uppermost position. When the device is used to process the material to be polished, the main cylinder 2 descends to the position to be processed, the grinding disc 9 contacts the material, and the pressure regulating valve 3 controls the output process setting pressure. At this time, the actual pressure value and the setting value have a large error. At present, the existing equipment cannot measure the actual pressure value and thus ignores this error value. However, the device detects the actual pressure through the pressure sensor 10 installed at the end of the main shaft 13 connected to the main cylinder 2, and feeds it back to the computer, and the computer controls the output of the pressure regulating valve 3 to compensate for the error value. After the motor 1 is started, it drives the main shaft 13 and the grinding disc 9 to start the polishing operation. The universal joint 8 connection mechanism ensures that the grinding disc 9 is in a uniform floating state around to adapt to the complex processing conditions below. The auxiliary cylinder 5 installed on the support plate 6 serves as the fine-tuning cylinder of this device. The setting of the fine-tuning cylinder ensures that the pressure is adjusted in real time when the pressure of each part of the entire grinding disc 9 is uneven due to reasons such as the uneven processing surface below. When the polishing device is in operation, the movable caster 7 is in a real-time rolling state. The pressure sensor 10 located at the end of the shaft of the auxiliary cylinder 5 uses the reaction force of the movable caster 7 to detect the pressure values ​​of various parts of the grinding disc 9 in real time, and feeds back the pressure to the computer. The computer controls the output of the pressure regulating valve 3 connected to the auxiliary cylinder 5 and then controls the fine-tuning cylinder to ensure that the pressure of various parts of the grinding disc 9 is uniform. When the equipment process operation is completed, the motor 1 stops running, the main cylinder 2 drives the lower actuator to rise, and the task is completed. In addition, this device uses a high-precision pressure regulating valve, and the valve carries a pressure gauge, which can be used as a reference for the accuracy of the output pressure value or as a reference for the device pressure alarm when necessary, thereby realizing multi-angle monitoring of the actual value of the grinding disc pressure, forming a perfect systematic closed loop.

[0032] The above content is a further detailed description of the utility model in combination with a specific preferred implementation method. It cannot be determined that the specific implementation methods of the utility model are limited to this. For ordinary technicians in the technical field to which the utility model belongs, they can make several simple deductions or substitutions without departing from the utility model, which should be regarded as belonging to the utility model and the scope of patent protection determined by the submitted claims.

Claims

1. A polishing machine grinding head pressure feedback and adjustment device, comprising a grinding disc (9), a power system, and a main shaft (13); the power system is connected to the main shaft (13), and the grinding disc (9) is connected to the bottom of the main shaft (13); characterized in that: The invention also comprises a main cylinder (2) and at least two auxiliary cylinders (5); the main cylinder (2) is connected to a main shaft (13); the auxiliary cylinders (5) are evenly distributed above a grinding disc (9); movable casters (7) are installed at the bottom of the auxiliary cylinders (5); the movable casters (7) are tightly fitted with the grinding disc (9) below; the main cylinder (2) and each auxiliary cylinder (5) are respectively connected to a pressure regulating valve (3); a pressure sensor (10) is installed on the side of the central axis of the auxiliary cylinder (5) away from the movable casters (7) and on the main shaft (13).

2. A polishing machine grinding head pressure feedback and adjustment device according to claim 1, characterized in that: The grinding disc (9) and the main shaft (13) are connected via a universal joint (8).

3. A polishing machine grinding head pressure feedback and adjustment device according to claim 1, characterized in that: The main cylinder (2) is connected to the top of the main shaft (13) via a connecting shaft.

4. A polishing machine grinding head pressure feedback and adjustment device according to claim 1, characterized in that: The auxiliary cylinders (5) are arranged on a support plate (6) directly above the grinding disc (9); the shape of the support plate (6) is consistent with the grinding disc (9) below; and the auxiliary cylinders (5) are evenly distributed on the support plate (6).

5. A polishing machine grinding head pressure feedback and adjustment device according to claim 4, characterized in that: The main shaft (13) passes through the center of the support plate (6); the main shaft (13) and the support plate (6) are connected by means of a bearing; the support plate (6) is mounted on a support column (14) integrally connected to the connection flange (12); the support column (14) is located outside the main shaft (13).

6. A polishing machine grinding head pressure feedback and adjustment device according to claim 1, characterized in that: The grinding disc (9) and the main shaft (13) are connected via a universal joint (8).

7. A polishing machine grinding head pressure feedback and adjustment device according to claim 1, characterized in that: The power system is a motor (1), and the motor (1) drives the main shaft (13) to rotate via a synchronous belt (4).

8. A polishing machine grinding head pressure feedback and adjustment device according to claim 7, characterized in that: The pressure regulating valve (3), the main cylinder (2) and the motor (1) are all installed above the support plate (11); the auxiliary cylinder (5) and the grinding plate (9) are located below the support plate (11).

9. A polishing machine grinding head pressure feedback and adjustment device according to claim 1, characterized in that: The top of the main shaft (13) is connected with a pressure sensor (10).