SMT patch conveying device

Abstract

The utility model discloses an SMT (Surface Mount Technology) conveying device, which comprises a conveying mechanism and an adjusting and limiting mechanism, the conveying mechanism comprises a conveying belt, a plurality of penetrating through holes are formed in the conveying belt, and circular grooves corresponding to the solder balls on the bottom surface of the SMT patch are formed in the surface of the conveying belt; the adjusting and limiting mechanism comprises a negative pressure plate arranged below the upper supporting part of the conveying belt, and the negative pressure plate is used for providing negative pressure for a through hole in the upper supporting part of the conveying belt. The adjusting and limiting mechanism further comprises an adjustable guide plate arranged on one side of the conveying belt and an adjusting air cylinder arranged on the other side of the conveying belt. In the process that the conveying belt conveys the SMT patches, the negative pressure plate below the conveying belt enables the through holes in the upper supporting part of the conveying belt to have suction force on the SMT patches, it is ensured that the SMT patches cannot incline in the conveying process, limiting of the SMT patches is achieved, and then stable conveying is achieved; meanwhile, the SMT patches are pushed to the guide plate through the adjusting air cylinder, so that the directions of the SMT patches are adjusted, and orderly conveying of the SMT patches is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of SMT patch production, in particular to an SMT patch conveying device. Background Art

[0002] SMT patch refers to the abbreviation of a series of process flows based on PCB, PCB is a printed circuit board. SMT is surface mounting technology (surface mount technology), which is the most popular technology and process in the electronic assembly industry. The physical product of SMT patch is an electronic component of surface mounting technology, which is usually a small square or rectangular plastic-wrapped component with pins or solder balls at the bottom, which can be directly soldered on the surface of the printed circuit board.

[0003] The SMT patch process will transport the SMT patch during or after production. In the prior art, when transporting SMT patches, a conveyor belt is generally used. However, the simple conveyor belt conveying method can neither limit the position of the SMT patch nor adjust the position of the SMT patch during the conveying process, which is not conducive to the stable and orderly transportation of the SMT patch.

[0004] In view of this, it is necessary to improve the existing SMT patch conveying device to solve the technical problem that the existing conveying device can neither limit the SMT patch nor adjust the position of the SMT patch during the conveying process. Utility Model Content

[0005] The utility model aims to provide an SMT patch conveying device to solve the technical problem that the existing conveying device can neither limit the position of the SMT patch nor adjust the position of the SMT patch during the conveying process.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] An SMT patch conveying device, comprising:

[0008] A conveying mechanism, the conveying mechanism comprising a conveyor belt, the conveyor belt is provided with a plurality of through holes, and the surface of the conveyor belt is provided with circular grooves corresponding to the solder balls on the bottom surface of the SMT patch;

[0009] An adjusting and limiting mechanism, wherein the adjusting and limiting mechanism comprises a negative pressure plate disposed under the upper supporting portion of the conveyor belt, and the negative pressure plate is used to provide negative pressure to the through hole of the upper supporting portion of the conveyor belt;

[0010] The regulating and limiting mechanism also includes an adjustable guide plate arranged on one side of the conveyor belt and an regulating cylinder arranged on the other side of the conveyor belt.

[0011] Optionally, the conveying mechanism further includes an active synchronous shaft and a driven synchronous shaft, the active synchronous shaft and the driven synchronous shaft are arranged on a shaft support column, and the conveyor belt is connected between the active synchronous shaft and the driven synchronous shaft.

[0012] Optionally, a plurality of bosses are provided on the active synchronous shaft and the driven synchronous shaft.

[0013] Optionally, the negative pressure plate is provided with a plurality of air holes, and one side of the negative pressure plate is provided with an air port, and the air holes are connected to an external negative pressure machine through the air port;

[0014] The negative pressure plate includes an upper plate and a lower plate, the air hole is arranged on the upper plate, and the lower plate is provided with a first area groove, a second area groove and a third area groove, and the independent groove of each area is connected with the first area groove through a groove channel, and the upper plate and the lower plate are integrally formed to form an internal air channel connecting the air hole and the air port.

[0015] Optionally, the adjusting cylinder is mounted on the negative pressure plate via a cylinder mounting seat, and the telescopic rod of the adjusting cylinder is vertically pointed toward the guide plate.

[0016] Optionally, a cylinder pressure sensing switch is provided on the end surface of the telescopic rod close to the guide plate.

[0017] Optionally, an adjusting screw is provided on a side of the guide plate away from the adjusting cylinder, the adjusting screw is provided on the negative pressure plate through a screw mounting seat, and the guide plate is provided with a threaded hole corresponding to the adjusting screw.

[0018] Optionally, the adjustment and limiting mechanism also includes a plate supporting column.

[0019] Optionally, the side of the guide plate close to the regulating cylinder is a smooth surface.

[0020] Compared with the prior art, the utility model has the following beneficial effects: when conveying SMT patches, the SMT patches are placed on the conveyor belt, and the conveyor belt conveys the SMT patches. In the process of conveying the SMT patches by the conveyor belt, the negative pressure plate under the conveyor belt makes the through holes of the upper supporting part of the conveyor belt have suction force on the SMT patches, ensuring that the SMT patches will not tilt during the conveying process, so as to achieve the limit of the SMT patches, and then achieve stable conveying; at the same time, by adjusting the cylinder to push the SMT patches toward the guide plate, the orientation of the SMT patches is adjusted to achieve the orderly conveying of the SMT patches. In addition, the solder balls at the bottom of the SMT patches are sunk into the circular groove, which reduces the distance between the bottom surface of the SMT patches and the surface of the conveyor belt, and avoids the gap between the bottom surface of the SMT patches and the surface of the conveyor belt caused by the solder balls when adsorbing the SMT patches, thereby reducing the adsorption effect, that is, in the process of conveying the SMT patches, the bottom surface of the SMT patches can be attached to the surface of the conveyor belt, which improves the adsorption effect of the negative pressure plate on the SMT patches. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0023] Figure 1 It is a structural schematic diagram of the SMT patch conveying device of the utility model;

[0024] Figure 2 It is a partial structural schematic diagram of the surface of the conveyor belt of the utility model;

[0025] Figure 3 It is a structural schematic diagram of the conveying mechanism of the utility model;

[0026] Figure 4 It is a structural schematic diagram of the adjustment and limiting mechanism of the utility model;

[0027] Figure 5 This is a schematic diagram of the structure of the negative pressure plate of the utility model;

[0028] Figure 6 It is a structural schematic diagram of the regulating cylinder of the utility model installed on the cylinder mounting seat;

[0029] Figure 7 It is a structural schematic diagram of the adjustable guide plate of the utility model.

[0030] Illustrations: 10. Conveying mechanism; 11. Conveyor belt; 12. Through hole; 13. Active synchronous shaft; 14. Driven synchronous shaft; 15. Shaft support column; 16. Boss; 17. Circular groove; 20. Adjustment limit mechanism; 21. Negative pressure plate; 211. Air hole; 212. Air port; 213. Upper plate; 214. Lower plate; 215. First area groove; 216. Second area groove; 217. Third area groove; 218. Groove channel; 22. Guide plate; 23. Adjustment cylinder; 231. Telescopic rod; 24. Cylinder mounting seat; 25. Cylinder pressure sensing switch; 26. Adjustment screw; 27. Screw mounting seat; 28. Plate support column. DETAILED DESCRIPTION

[0031] In order to make the purpose, features and advantages of the invention of the utility model more obvious and easy to understand, the technical scheme in the embodiment of the utility model will be clearly and completely described below in combination with the drawings in the embodiment of the utility model. Obviously, the embodiment described below is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0033] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0034] The embodiment of the utility model provides an SMT patch conveying device, which can limit the position of the SMT patch and adjust the orientation of the SMT patch during the process of conveying the SMT patch on the conveyor belt, so that the SMT patch can be conveyed stably and orderly.

[0035] Reference Figures 1 to 5 The embodiment of the utility model provides an SMT patch conveying device, including a conveying mechanism 10 and an adjusting and limiting mechanism 20.

[0036] The conveying mechanism 10 includes a shaft support column 15, an active synchronous shaft 13, a driven synchronous shaft 14 and a conveyor belt 11. The active synchronous shaft 13 and the driven synchronous shaft 14 are arranged on the shaft support column 15. The output shaft of the external driving motor is connected to the active synchronous shaft 13. The conveyor belt 11 is connected between the active synchronous shaft 13 and the driven synchronous shaft 14. The conveyor belt 11 is provided with a plurality of through-type through holes 12. The surface of the conveyor belt 11 is provided with a circular groove 17 corresponding to the solder balls on the bottom surface of the SMT patch. The active synchronous shaft 13 and the driven synchronous shaft 14 are provided with a plurality of protrusions 16, and the protrusions 16 can be inserted into the through holes 12. When working, the external driving motor drives the rotation of the active synchronous shaft 13, and the protrusions 16 on the active synchronous shaft 13 are inserted into the through holes 12. As the active synchronous shaft 13 rotates, the protrusions 16 drive the rotation of the conveyor belt 11, and the conveyor belt 11 drives the rotation of the driven synchronous shaft 14. The SMT patch to be transported is placed on the conveyor belt 11 , and the conveyor belt 11 transports the SMT patch.

[0037] It should be noted that the SMT patch conveying device disclosed in the utility model is suitable for conveying SMT patches with solder balls arranged on the bottom.

[0038] The adjustment and limiting mechanism 20 includes a plate support column 28, a negative pressure plate 21, an adjustable guide plate 22 and a plurality of adjustment cylinders 23. The negative pressure plate 21 is arranged on the plate support column 28. The upper supporting part of the conveyor belt 11 is arranged on the negative pressure plate 21, and the lower surface of the upper supporting part of the conveyor belt 11 is in contact with the upper surface of the negative pressure plate 21. The negative pressure plate 21 is used to provide negative pressure to the through hole 12 of the upper supporting part of the conveyor belt 11, so as to generate suction force for the SMT patch placed on the conveyor belt 11. At the same time, the solder ball at the bottom of the SMT patch sinks into the circular groove 17, which reduces the distance between the bottom surface of the SMT patch and the surface of the conveyor belt 11, and avoids the reduction of the adsorption effect due to the gap between the bottom surface of the SMT patch and the surface of the conveyor belt 11 caused by the solder ball when the SMT patch is adsorbed.

[0039] The negative pressure plate 21 is provided with a plurality of air holes 211, and one side of the negative pressure plate 21 is provided with an air port 212, and the air holes 211 are connected to an external negative pressure machine through the air port 212. In particular, each of the through holes 12 will pass over the air holes 211 when the conveyor belt 11 rotates.

[0040] The negative pressure plate 21 includes an upper plate 213 and a lower plate 214, the air hole 211 is provided on the upper plate 213, the lower plate 214 is provided with a first region groove 215, a second region groove 216 and a third region groove 217, the independent grooves of each region are connected to the first region groove 215 through a groove channel 218, the upper plate 213 and the lower plate 214 are integrally formed to form an internal air channel connecting the air hole 211 and the air port 212. The first region groove 215 is located on one side of the lower plate 214, the third region groove 217 is located on the other side of the lower plate 214, and the second region groove 216 is located between the first region groove 215 and the second region groove 216.

[0041] Specifically, the first area groove 215 is two mutually symmetrical long strip grooves, and is located below a row of the air holes 211 on one side of the upper plate 213; the third area groove 217 is a pair of mutually symmetrical rectangular grooves, and is located below multiple rows of the air holes 211 on the other side of the upper plate 213; the second area groove 216 is a pair of mutually symmetrical rectangular grooves, and is located below the air holes 211 in the middle part of the upper plate 213. That is, after the upper plate 213 and the lower plate 214 are integrally formed, the internal air channel formed divides the air holes 211 into multiple areas, which effectively improves the adsorption force of the negative pressure plate 21 on the SMT patch.

[0042] Specifically, during the rotation of the conveyor belt 11 , of the two adjacent rows of through holes 12 along the conveying direction of the conveyor belt 11 , at least one row of through holes 12 is located above the air holes 211 .

[0043] The regulating cylinder 23 is disposed on one side of the negative pressure plate 21 and is located at the periphery of one side of the conveyor belt 11. The guide plate 22 is disposed on the other side of the negative pressure plate 21. The bottom surface of the guide plate 22 is located above the upper surface of the conveyor belt 11. The distance between the guide plate 22 and the regulating cylinder 23 can be adjusted by the guide plate 22.

[0044] An adjusting screw 26 is provided on one side of the guide plate 22 away from the adjusting cylinder 23. The adjusting screw 26 is provided on the negative pressure plate 21 through a screw mounting seat 27. The guide plate 22 is provided with a threaded hole corresponding to the adjusting screw 26. The distance between the guide plate 22 and the adjusting cylinder 23 is adjusted by rotating the adjusting screw 26, thereby adjusting the position of the SMT patch on the conveyor belt 11.

[0045] The adjusting cylinder 23 is mounted on the negative pressure plate 21 through a cylinder mounting seat 24, and the cylinder mounting seat 24 is mounted on the negative pressure plate 21 through a detachable connection. The main body of the adjusting cylinder 23 is fixed on the cylinder mounting seat 24, and the telescopic rod 231 of the adjusting cylinder 23 is vertically pointed to the guide plate 22, and a cylinder pressure sensing switch 25 is provided on the end surface of the telescopic rod 231 close to the guide plate 22. When adjusting the orientation of the SMT patch, the adjusting cylinder 23 is started, the telescopic rod 231 of the adjusting cylinder 23 is extended, and the SMT patch is pushed toward the guide plate 22. When the SMT patch touches the guide plate 22, the SMT patch generates resistance to the telescopic rod 231. The cylinder pressure sensing switch 25 senses the pressure, determines that the SMT patch has been pushed to the guide plate 22, triggers the cylinder pressure sensing switch 25 to close the adjustment cylinder 23, and the telescopic rod 231 retracts to adjust the position of the SMT patch.

[0046] The side surface of the guide plate 22 close to the regulating cylinder 23 is a smooth surface to ensure that the relative position of the SMT patch and the conveyor belt 11 is not changed during the transportation process after the SMT patch is pushed toward the guide plate 22.

[0047] The utility model provides an implementation method of an SMT patch conveying device as follows: when conveying SMT patches, the SMT patches are placed on a conveyor belt 11, and the conveyor belt 11 conveys the SMT patches. In the process of conveying the SMT patches by the conveyor belt 11, the negative pressure plate 21 below the conveyor belt 11 enables the through holes 12 of the upper supporting part of the conveyor belt 11 to have suction force on the SMT patches, ensuring that the SMT patches will not tilt during the conveying process, so as to limit the position of the SMT patches and further achieve stable conveying; at the same time, the SMT patches are pushed toward the guide plate 22 by adjusting the cylinder 23 to adjust the orientation of the SMT patches, so as to achieve orderly conveying of the SMT patches. In addition, the solder balls at the bottom of the SMT patch are sunken into the circular grooves 17, which reduces the distance between the bottom surface of the SMT patch and the surface of the conveyor belt 11, and avoids the reduction of the adsorption effect due to the gap between the bottom surface of the SMT patch and the surface of the conveyor belt 11 caused by the solder balls when the SMT patch is adsorbed. That is, during the transportation of the SMT patch, the bottom surface of the SMT patch can be attached to the surface of the conveyor belt 11, thereby improving the adsorption effect of the negative pressure plate 21 on the SMT patch.

[0048] As described above, the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A SMT patch conveying device, It is characterized in that include: A conveying mechanism (10), the conveying mechanism (10) comprising a conveying belt (11), the conveying belt (11) being provided with a plurality of through-type through holes (12), and the surface of the conveying belt (11) being provided with circular grooves (17) corresponding to the solder balls on the bottom surface of the SMT patch; an adjusting and limiting mechanism (20), the adjusting and limiting mechanism (20) comprising a negative pressure plate (21) arranged under the upper supporting portion of the conveyor belt (11), the negative pressure plate (21) being used to provide negative pressure to the through hole (12) of the upper supporting portion of the conveyor belt (11); The regulating and limiting mechanism (20) further comprises an adjustable guide plate (22) arranged on one side of the conveyor belt (11) and an regulating cylinder (23) arranged on the other side of the conveyor belt (11).

2. The SMT patch conveying device according to claim 1, It is characterized in that The conveying mechanism (10) further comprises an active synchronous shaft (13) and a driven synchronous shaft (14), wherein the active synchronous shaft (13) and the driven synchronous shaft (14) are arranged on a shaft support column (15), and the conveyor belt (11) is connected between the active synchronous shaft (13) and the driven synchronous shaft (14).

3. The SMT patch conveying device according to claim 2, It is characterized in that A plurality of protruding columns (16) are provided on the active synchronous shaft (13) and the driven synchronous shaft (14).

4. The SMT patch conveying device according to claim 1, It is characterized in that The negative pressure plate (21) is provided with a plurality of air holes (211), one side of the negative pressure plate (21) is provided with an air port (212), and the air holes (211) are connected to an external negative pressure machine via the air port (212); The negative pressure plate (21) comprises an upper plate (213) and a lower plate (214), the air hole (211) being arranged on the upper plate, the lower plate (214) being provided with a first area groove (215), a second area groove (216) and a third area groove (217), the independent grooves of each area being connected to the first area groove (215) via a groove channel (218), the upper plate (213) and the lower plate (214) being integrally formed to form an internal air channel connecting the air hole (211) and the air port (212).

5. The SMT patch conveying device according to claim 1, It is characterized in that The regulating cylinder (23) is mounted on the negative pressure plate (21) via a cylinder mounting seat (24), and the telescopic rod (231) of the regulating cylinder (23) is vertically directed toward the guide plate (22).

6. The SMT patch conveying device according to claim 5, It is characterized in that A cylinder pressure sensing switch (25) is provided on the end surface of the telescopic rod (231) close to the guide plate (22).

7. The SMT patch conveying device according to claim 1, It is characterized in that An adjusting screw (26) is provided on a side of the guide plate (22) away from the adjusting cylinder (23); the adjusting screw (26) is arranged on the negative pressure plate (21) via a screw mounting seat (27); and the guide plate (22) is provided with a threaded hole corresponding to the adjusting screw (26).

8. The SMT patch conveying device according to claim 1, It is characterized in that The adjustment and limiting mechanism (20) further comprises a plate supporting column (28).

9. The SMT patch conveying device according to claim 1, It is characterized in that The side surface of the guide plate (22) close to the regulating cylinder (23) is a smooth surface.

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