MEMS chip and sensor
By setting nanofiber parts on the diaphragm and back plate of the MEMS chip, a vibration space is formed to prevent external foreign objects from entering, the problem of damaged performance of MEMS chip in harsh environments is solved, and its environmental applicability and working reliability are improved. .
Patent Information
- Application Number
- CN202420354803.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-26
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-02-26
AI Technical Summary
MEMS chips are susceptible to invasion of foreign matter such as oil and liquid in harsh environments, resulting in performance impact or failure, limiting the applicable scenarios of the sensor.
Nanofibers are provided on the diaphragm and the back plate of the MEMS chip to form the first and second vibration spaces, and nanofibers of adaptable shape are provided on the diaphragm and the shell to prevent the entry of external foreign matter.
It effectively prevents foreign objects from entering the MEMS chip, improves its environmental application ability and working performance, and is suitable for harsh environments such as oil pollution and liquid protection.
Smart Images
Figure CN222204806U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of sealing structures, and more specifically, to a MEMS chip and a sensor. Background Art
[0002] In the prior art, MEMS (Micro-Electro-Mechanical System) chips are widely used, especially in various sensors. However, due to the harsh operating environment of some sensors, foreign matter such as oil and liquid can easily invade the MEMS chip, causing the MEMS chip to be contaminated and its performance to be affected or fail, limiting the application scenarios of the sensor. Utility Model Content
[0003] One object of the utility model is to provide a new technical solution of a MEMS chip and a sensor to at least solve one of the problems of the background technology.
[0004] According to a first aspect of the utility model, a MEMS chip is provided, comprising:
[0005] Diaphragm, back plate, substrate and nanofiber parts;
[0006] The back plate and the diaphragm are fixed in sequence on the same side of the substrate, and a first vibration space is defined between the diaphragm and the back plate, and a second vibration space is defined on the side of the diaphragm facing the substrate, and the first vibration space is opposite to the second vibration space;
[0007] The nanofiber member is made of nanofibers, the diaphragm is covered with a first nanofiber member on a side facing the second vibration space, and the back plate is covered with a second nanofiber member on a side away from the first vibration space.
[0008] Optionally, a first through hole is arranged at the center of the diaphragm, a third nanofiber member is arranged in the first through hole, and a shape of the third nanofiber member matches a shape of the first through hole.
[0009] Optionally, the third nanofiber member has a thickness of 1 μm to 1.5 μm.
[0010] Optionally, a plurality of second through holes are arranged at intervals on the edge of the diaphragm, a fourth nanofiber member is arranged in each of the second through holes, and a shape of the fourth nanofiber member matches a shape of the corresponding second through hole.
[0011] Optionally, the fourth nanofiber member has a thickness of 1 μm to 1.5 μm.
[0012] Optionally, a pad area is provided on the back plate, and the second nanofiber member avoids the pad area.
[0013] Optionally, the thickness of the first nanofiber member and the second nanofiber member are both 0.1 μm to 3 μm.
[0014] Optionally, the nanofiber member is a natural polymer nanofiber member, a synthetic polymer nanofiber member, an organic polymer nanofiber member or an inorganic nanofiber member.
[0015] According to a second aspect of the present invention, a sensor is provided, comprising:
[0016] A PCB board, a housing and the MEMS chip described in the first aspect;
[0017] The housing and the MEMS chip are both arranged on the PCB board, the housing and the PCB board form a receiving space, the MEMS chip is located in the receiving space, and the diaphragm is close to the PCB board.
[0018] Optionally, the PCB board is provided with a third through hole connected to the second vibration space at a position corresponding to the diaphragm, a fifth nanofiber member is provided in the third through hole, and a shape of the fifth nanofiber member is adapted to a shape of the third through hole;
[0019] The shell is provided with a fourth through hole communicating with the accommodation space, a sixth nanofiber member is provided in the fourth through hole, and a shape of the sixth nanofiber member is matched with a shape of the fourth through hole.
[0020] One of the technical effects of the utility model is that the utility model arranges the first nanofiber component and the second nanofiber component on one side of the diaphragm and the back plate respectively, so that when the MEMS chip is working, external foreign matter can be effectively blocked by the nanofiber component, thereby avoiding foreign matter from entering the MEMS chip in harsh environments and affecting its working performance, thereby improving its environmental applicability.
[0021] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present utility model and, together with the description, are used to explain the principles of the present utility model.
[0023] Figure 1 It is a structural schematic diagram of a MEMS chip provided by the utility model, in which a second nanofiber member is arranged on a back plate.
[0024] Figure 2 It is a schematic diagram of the structure of a MEMS chip provided by the utility model in a bottom view with a first nanofiber member arranged on a diaphragm.
[0025] Figure 3 It is a schematic diagram of the structure of a MEMS chip provided by the utility model, in which a third nanofiber component and a fourth nanofiber component are arranged on a diaphragm, viewed from above.
[0026] Figure 4 It is a structural schematic diagram of a sensor provided by the utility model.
[0027] Figure 5 The utility model is a schematic diagram of an explosion structure of a sensor provided by the utility model.
[0028] Figure 6 The utility model is a schematic diagram of a sensor provided by the utility model when viewed from above.
[0029] Description of reference numerals:
[0030] 1. MEMS chip; 11. diaphragm; 111. first vibration space; 112. second vibration space; 12. back plate; 13. substrate; 14. first nanofiber component; 15. second nanofiber component; 16. third nanofiber component; 17. fourth nanofiber component; 18. pad area; 2. housing; 3. PCB board; 4. fifth nanofiber component; 5. sixth nanofiber component. DETAILED DESCRIPTION
[0031] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.
[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present invention, its application, or uses.
[0033] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.
[0034] In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.
[0035] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.
[0036] like Figures 1 to 6 As shown, according to the first aspect of the utility model, there is provided a MEMS chip 1, comprising: a diaphragm 11, a back plate 12, a substrate 13 and a nanofiber member; the back plate 12 and the diaphragm 11 are fixed in sequence on the same side of the substrate 13, and a first vibration space 111 is provided between the diaphragm 11 and the back plate 12, and a second vibration space 112 is provided on the side of the diaphragm 11 facing the substrate 13, and the first vibration space 111 is opposite to the second vibration space 112; the nanofiber member is made of nanofiber, and a first nanofiber member 14 is covered on the side of the diaphragm 11 facing the second vibration space 112, and a second nanofiber member 15 is covered on the side of the back plate 12 away from the first vibration space 111.
[0037] Specifically, in this embodiment, the back plate 12 and the diaphragm 11 of the MEMS chip 1 are stacked on the substrate 13 in sequence, so that a first vibration space 111 and a second vibration space 112 are formed on the upper and lower sides of the diaphragm 11, respectively. Figure 1 In practical applications, during the vibration of the diaphragm 11, its amplitude will be maintained within the first vibration space 111 and the second vibration space 112. The utility model covers the first nanofiber member 14 on the side of the diaphragm 11 facing the second vibration space 112 and covers the second nanofiber member 15 on the side of the back plate 12 away from the first vibration space 111, that is, the nanofiber member is covered on the outer side of the diaphragm 11 and the back plate 12 facing the MEMS chip 1, so as to prevent foreign matter from entering the inside of the MEMS chip 1.
[0038] Among them, the nanofiber component is made of nanofiber material. In the prior art, nanofiber is a linear material with a diameter of nanometer scale and a large length and a certain aspect ratio. In addition, the fiber modified by filling nanoparticles into ordinary fibers is also called nanofiber. The diameter of nanofiber is usually between 1nm and 1000nm. It has excellent air permeability, but has the functions of oil and water resistance, as well as filtering smoke oil / liquid but allowing air flow to pass smoothly. The first nanofiber component 14 and the second nanofiber component 15 made of nanofiber are respectively covered on the outside of the back plate 12 and the diaphragm 11, which can ensure that when the MEMS chip 1 is used in the sensor package, in the application scenarios of electronic cigarettes or other oil, liquid, etc., foreign objects are prevented from invading the sensor to contaminate the MEMS chip 1, resulting in performance failure, while protecting the performance of the MEMS chip 1 itself from being affected, and improving its environmental applicability.
[0039] Furthermore, in the above structure, the second nanofiber member 15 can be arranged on the top surface of the MEMS chip 1 (i.e., close to the back plate 12) by electrospinning or other methods. Its coverage area can be determined by the size and shape of the MEMS chip 1, and the coverage area is usually not less than the back plate 12 area, including but not limited to this range, refer to Figure 1 .
[0040] The first nanofiber member 14 is arranged in such a way that a layer of nanofiber film is made from the bottom surface of the diaphragm 11 (i.e., the back hole surface of the MEMS chip 1), so that the nanofibers are evenly covered on the bottom surface of the MEMS diaphragm 11. The nanofiber member 14 is made from the bottom surface of the MEMS chip 1, and the manufacturing process can also be selected from electrostatic spinning, etc. The coverage area is determined by the size and shape of the back hole of the MEMS chip 1, and the coverage area is roughly the same as the area of the diaphragm 11 of the MEMS chip 1, including but not limited to this range, refer to Figure 2 .
[0041] Optionally, the thickness of the first nanofiber member 14 and the second nanofiber member 15 are both 0.1 μm to 3 μm.
[0042] Specifically, in this embodiment, the covering thickness of the first nanofiber member 14 and the second nanofiber member 15 can generally be selected to be 0.1μm to 3μm. If the covering is too thick, it is easy to affect the vibration of the diaphragm 11 or the working performance of the back plate 12. If it is too thin, it is easy to cause poor blocking effect of the nanofiber member. In some special application environments, the thickness of the first nanofiber member 14 and the second nanofiber member 15 can also be selected outside the above range according to actual needs, and the present invention does not impose any restrictions on this.
[0043] Alternatively, if Figure 3 As shown, a first through hole is disposed at the center of the diaphragm 11 , a third nanofiber member 16 is disposed in the first through hole, and the shape of the third nanofiber member 16 matches the shape of the first through hole.
[0044] Specifically, in this embodiment, a first through hole is usually provided at the center of the diaphragm 11, and the first through hole serves as an air vent, so that the diaphragm 11 can balance the air pressure balance of the first vibration space 111 and the second vibration space 112 during the vibration process, thereby avoiding affecting the vibration transmission of the diaphragm 11. The third nanofiber member 16 is provided in the first through hole to further prevent foreign matter from entering the MEMS chip 1 through the first through hole, thereby ensuring the vibration performance of the diaphragm 11. The shape of the third nanofiber member 16 is adapted to the shape of the first through hole, which can be understood as the third nanofiber member 16 filling the first through hole to completely cover the first through hole.
[0045] Alternatively, if Figure 3As shown, a plurality of second through holes are arranged at intervals at the edge of the diaphragm 11 , and a fourth nanofiber member 17 is arranged in each of the second through holes, and the shape of the fourth nanofiber member 17 is adapted to the shape of the corresponding second through hole.
[0046] Specifically, a plurality of second through holes are usually arranged at the edge of the diaphragm 11, and the second through holes are usually used as the air release valve of the diaphragm 11, and can also help balance the air pressure of the vibration space on both sides of the diaphragm 11, so as to improve the vibration performance of the diaphragm 11. The number and shape of the second through holes can be designed according to actual needs, and the fourth nanofiber member 17 matches the shape of the second through holes, that is, the fourth nanofiber member 17 can be filled in the second through holes. Generally, the filling diameter of the fourth nanofiber member 17 can be selected between 3 μm and 20 μm, but is not limited to this range.
[0047] Optionally, the thickness of the third nanofiber member 16 and the thickness of the fourth nanofiber member 17 are 1 μm to 1.5 μm.
[0048] Specifically, the third nanofiber member 16 and the fourth nanofiber member 17 are both disposed on the diaphragm 11, so their thickness is generally determined by the thickness of the diaphragm 11. Setting the thickness of the third nanofiber member 16 and the fourth nanofiber member 17 between 1 μm and 1.5 μm can ensure the vibration performance of the diaphragm 11 and effectively block foreign matter such as oil, liquid, etc.
[0049] Alternatively, if Figure 1 As shown, a pad area 18 is provided on the back plate 12 , and the second nanofiber member 15 avoids the pad area 18 .
[0050] Specifically, in this embodiment, the pad area 18 provided on the back plate 12 is generally used to connect with other devices, such as an ASIC (Application Specific Integrated Circuit) chip. In order to ensure the reliability of the connection between the pad and other components, when the second nanofiber member 15 is covered on the back plate 12, the pad area 18 is avoided, so that the connection reliability of the MEMS chip 1 can be ensured.
[0051] Optionally, the nanofiber member is a natural polymer nanofiber member, a synthetic polymer nanofiber member, an organic polymer nanofiber member or an inorganic nanofiber member.
[0052] Specifically, in this embodiment, the nanofiber parts can be made of natural polymer nanofiber materials, or synthetic polymer nanofiber materials, organic polymer nanofiber materials or inorganic nanofiber materials to form corresponding nanofiber parts on the MEMS chip 1, which can be selected according to the actual application environment, further improving its environmental applicability and material selection cost.
[0053] According to the second aspect of the present invention, Figures 4 to 6 As shown, a sensor is provided, comprising: a PCB board 3, a shell 2 and the MEMS chip 1 described in the first aspect; the shell 2 and the MEMS chip 1 are both arranged on the PCB board 3, the shell 2 and the PCB board 3 form a accommodating space, the MEMS chip 1 is located in the accommodating space, and the diaphragm 11 is close to the PCB board 3.
[0054] Specifically, in this embodiment, the MEMS chip 1 provided in the first aspect is applied in the sensor. Since the MEMS chip 1 has a strong ability to prevent the entry of foreign matter such as oil and liquid, the environmental adaptability of the entire sensor is improved, and it can be used in environments with heavy oil pollution such as electronic cigarettes.
[0055] Alternatively, if Figures 4 to 6 As shown, the PCB board 3 is provided with a third through hole connected to the second vibration space 112 at a position corresponding to the diaphragm 11, and a fifth nanofiber member 4 is arranged in the third through hole, and the shape of the fifth nanofiber member 4 is adapted to the shape of the third through hole; the shell 2 is provided with a fourth through hole connected to the accommodating space, and a sixth nanofiber member 5 is arranged in the fourth through hole, and the shape of the sixth nanofiber member 5 is adapted to the shape of the fourth through hole.
[0056] Specifically, in this embodiment, the MEMS chip 1 provided in the first aspect is applied to the sensor, and the fifth nanofiber member 4 is arranged in the third through hole on the PCB board 3 of the sensor, so that when the sensor is applied in a harsh environment, the MEMS chip 1 can be provided with multiple protections through the nanofiber members, thereby improving the working reliability of the entire sensor. Among them, the third through hole is usually used as an acoustic hole.
[0057] In addition, in practical applications, in order to balance the air pressure inside and outside the sensor, a fourth through hole is usually provided on the housing 2 to ensure the working performance of the sensor. The sixth nanofiber member 5 is provided in the fourth through hole to prevent external foreign matter from entering the housing 2 through the fourth through hole, thereby affecting the working performance of the MEMS chip 1, and further improving the working reliability of the sensor.
[0058] The thickness of the fifth nanofiber member 4 and the sixth nanofiber member 5 can be designed according to the size of the third through hole and the thickness of the housing 2, and is usually set to 1 μm to 400 μm.
[0059] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.
[0060] Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.
Claims
1. A MEMS chip, characterized in that: include: Diaphragm, back plate, substrate and nanofiber parts; The back plate and the diaphragm are fixed in sequence on the same side of the substrate, and a first vibration space is defined between the diaphragm and the back plate, and a second vibration space is defined on the side of the diaphragm facing the substrate, and the first vibration space is opposite to the second vibration space; The nanofiber member is made of nanofibers, the diaphragm is covered with a first nanofiber member on a side facing the second vibration space, and the back plate is covered with a second nanofiber member on a side away from the first vibration space.
2. The MEMS chip according to claim 1, characterized in that: A first through hole is arranged at the center of the diaphragm, a third nanofiber member is arranged in the first through hole, and a shape of the third nanofiber member matches a shape of the first through hole.
3. The MEMS chip according to claim 2, characterized in that: The thickness of the third nanofiber member is 1 μm to 1.5 μm.
4. The MEMS chip according to claim 1, characterized in that: A plurality of second through holes are arranged at intervals on the edge of the diaphragm, a fourth nanofiber member is arranged in each of the second through holes, and the shape of the fourth nanofiber member matches the shape of the corresponding second through hole.
5. The MEMS chip according to claim 4, characterized in that: The fourth nanofiber member has a thickness of 1 μm to 1.5 μm.
6. The MEMS chip according to claim 1, characterized in that: A pad area is provided on the back plate, and the second nanofiber member avoids the pad area.
7. The MEMS chip according to claim 1, characterized in that: The thickness of the first nanofiber member and the second nanofiber member are both 0.1 μm to 3 μm.
8. The MEMS chip according to claim 1, characterized in that: The nanofiber piece is a natural polymer nanofiber piece, a synthetic polymer nanofiber piece, an organic polymer nanofiber piece or an inorganic nanofiber piece.
9. A sensor, characterized in that: include: A PCB board, a housing and a MEMS chip according to any one of claims 1 to 8; The housing and the MEMS chip are both arranged on the PCB board, the housing and the PCB board form a receiving space, the MEMS chip is located in the receiving space, and the diaphragm is close to the PCB board.
10. The sensor according to claim 9, characterized in that The PCB board is provided with a third through hole connected to the second vibration space at a position corresponding to the diaphragm, a fifth nanofiber member is provided in the third through hole, and a shape of the fifth nanofiber member is adapted to a shape of the third through hole; The shell is provided with a fourth through hole communicating with the accommodating space, a sixth nanofiber member is arranged in the fourth through hole, and a shape of the sixth nanofiber member is matched with a shape of the fourth through hole.