Rack for electroplating gold-tin alloy on integrated circuit shell

Abstract

The utility model discloses an integrated circuit shell electrogilding tin alloy hanger, which comprises a U-shaped plate, the bottom of the U-shaped plate is fixedly connected with two symmetrically arranged bases, each base is provided with a limiting mechanism, a tin alloy plating solution frame is arranged below the U-shaped plate, the top of the U-shaped plate is fixedly connected with a motor, and the motor is connected with the base. The tail end of an output shaft of the motor is fixedly connected with a driving belt wheel, the top of the U-shaped plate is provided with a driven belt wheel, the outer wall of the driving belt wheel and the outer wall of the driven belt wheel are jointly sleeved with a synchronous belt, and the bottom of the driven belt wheel is coaxially and fixedly connected with a hollow column. According to the utility model, the motor can drive the integrated circuit shell to rotate, so that charges can be more uniformly distributed on the surface of a workpiece, the problem of non-uniform deposition caused by current concentration in a specific area is reduced, and an electroplated layer is uniform.

Description

Technical Field

[0001] The utility model relates to the technical field of hangers, in particular to a hanger for electroplating gold-tin alloy for an integrated circuit shell. Background Art

[0002] A hanger is required when electroplating the integrated circuit casing.

[0003] During electroplating, it is generally necessary to hang the integrated circuit housing on a hanger. During electroplating, the charge is unevenly distributed on the surface of the workpiece, causing the current to concentrate in a specific area, resulting in uneven deposition and uneven electroplating layer. To solve the above problem, the present application proposes a hanger for electroplating a gold-tin alloy on an integrated circuit housing. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a gold-tin alloy hanger for electroplating an integrated circuit shell. The integrated circuit shell can be driven to rotate by a motor, which can help distribute the charge more evenly on the surface of the workpiece, reduce the problem of uneven deposition caused by current concentration in a specific area, and make the electroplating layer uniform.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A gold-tin alloy hanger for electroplating an integrated circuit shell comprises a U-shaped plate, the bottom of the U-shaped plate is fixedly connected to two symmetrically arranged bases, each of the bases is provided with a limiting mechanism, a tin alloy plating liquid frame is provided below the U-shaped plate, the top of the U-shaped plate is fixedly connected to a motor, the end of the output shaft of the motor is fixedly connected to a driving pulley, the top of the U-shaped plate is provided with a driven pulley, the outer walls of the driving pulley and the driven pulley are jointly sleeved with a synchronous belt, the bottom of the driven pulley is coaxially fixedly connected to a hollow column, the hollow column passes through the U-shaped plate and is rotatably connected thereto, the bottom of the hollow column is penetrated by a sliding column slidably connected thereto, the bottom of the sliding column is fixedly connected to a rotating rod, the rotating rod is provided with a lifting mechanism, the outer wall of the rotating rod is fixedly connected to two fixed plates, the bottom of each of the fixed plates is fixedly connected to a plurality of hooks, and the inner wall of the U-shaped plate is fixedly connected to a control panel.

[0007] Preferably, the limiting mechanism includes four supporting legs fixedly connected to the bottom of the base, a movable wheel is installed at the bottom of each supporting leg, a threaded rod threadedly connected to the base is penetrated by the base, a handle is fixedly connected to the top of the threaded rod, and a positioning block is fixedly connected to the bottom of the threaded rod.

[0008] Preferably, the lifting mechanism comprises a lifting plate which is sleeved on the outer wall of the rotating rod and rotatably connected thereto, and two hydraulic rods are fixedly connected to the top of the lifting plate, and both of the two hydraulic rods are fixedly connected to the inner top of the U-shaped plate.

[0009] Preferably, the outer wall of the handle is provided with a protective cover, and the material of the protective cover is rubber.

[0010] Preferably, the bottom of the positioning block is provided with anti-slip grooves.

[0011] Preferably, the cross section of the sliding column is rectangular.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] The output shaft of the motor drives the driving pulley, synchronous belt, driven pulley, hollow column, sliding column, rotating rod, fixed plate, hook and multiple integrated circuit housings to rotate slowly, which can help distribute the charge more evenly on the surface of the workpiece, reduce the problem of uneven deposition caused by current concentration in a specific area, and make the electroplating layer uniform.

[0014] In summary, the motor can be used to drive the integrated circuit housing to rotate, which can help distribute the charge more evenly on the surface of the workpiece, reduce the problem of uneven deposition caused by current concentration in a specific area, and make the electroplating layer uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a first structural schematic diagram of a gold-tin alloy electroplating hanger for an integrated circuit housing proposed by the utility model;

[0016] Figure 2 This is a second structural schematic diagram of a gold-tin alloy electroplating hanger for an integrated circuit housing proposed by the utility model.

[0017] In the figure: 1 U-shaped plate, 2 base, 3 moving wheel, 4 threaded rod, 5 handle, 6 positioning block, 7 tin alloy plating liquid frame, 8 motor, 9 driving pulley, 10 synchronous belt, 11 driven pulley, 12 hollow column, 13 sliding column, 14 rotating rod, 15 lifting plate, 16 hydraulic rod, 17 fixed plate, 18 hook, 19 control panel. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0019] Reference Figure 1-Figure 2A gold-tin alloy hanger for electroplating an integrated circuit shell comprises a U-shaped plate 1. Two symmetrically arranged bases 2 are fixedly connected to the bottom of the U-shaped plate 1. A limiting mechanism is provided on each base 2. The limiting mechanism comprises four supporting legs fixedly connected to the bottom of the base 2. A moving wheel 3 is installed at the bottom of each supporting leg, so that the device can be moved to a destination. A threaded rod 4 threadedly connected to the base 2 is penetrated through the base 2. A handle 5 is fixedly connected to the top of the threaded rod 4. A protective cover is provided on the outer wall of the handle 5. The material of the protective cover is rubber to increase comfort. A positioning block 6 is fixedly connected to the bottom of the threaded rod 4. The bottom of the positioning block 6 is provided with anti-slip grooves. The friction can be increased by setting the anti-slip grooves to make the device stop steadily.

[0020] A tin alloy plating liquid frame 7 is provided below the U-shaped plate 1. The plating liquid in the tin alloy plating liquid frame 7 performs electroplating processing on the integrated circuit shell under the electroplating principle. A motor 8 is fixedly connected to the top of the U-shaped plate 1. A driving pulley 9 is fixedly connected to the end of the output shaft of the motor 8. A driven pulley 11 is provided on the top of the U-shaped plate 1. The outer walls of the driving pulley 9 and the driven pulley 11 are jointly sleeved with a synchronous belt 10. A hollow column 12 is coaxially fixedly connected to the bottom of the driven pulley 11. The hollow column 12 passes through the U-shaped plate 1 and is rotatably connected thereto. The bottom of the hollow column 12 passes through a groove 120 that is slidably connected thereto. The sliding column 13 has a rectangular cross-section. A rotating rod 14 is fixedly connected to the bottom of the sliding column 13. A lifting mechanism is provided on the rotating rod 14. The lifting mechanism includes a lifting plate 15 which is sleeved on the outer wall of the rotating rod 14 and rotatably connected thereto. Two hydraulic rods 16 are fixedly connected to the top of the lifting plate 15. Both hydraulic rods 16 are fixedly connected to the inner top of the U-shaped plate 1. The integrated circuit housing is lifted and lowered by the hydraulic rods 16. When the integrated circuit housing moves down for electroplating, the workpiece can be removed easily when the integrated circuit housing moves up to complete electroplating.

[0021] Two fixed plates 17 are fixedly connected to the outer wall of the rotating rod 14, and a plurality of hooks 18 are fixedly connected to the bottom of each fixed plate 17. A control panel 19 is fixedly connected to the inner wall of the U-shaped plate 1. The control panel 19 can control the opening and closing of the motor 8 and the extension and retraction of the hydraulic rod 16. The rotation of the integrated circuit housing can help distribute the charge more evenly on the surface of the workpiece, reduce the uneven deposition caused by the current concentrated in a specific area, and make the workpiece electroplated evenly.

[0022] In the utility model, the staff hangs the through-hole on the integrated circuit shell on the hook 18, starts the hydraulic rod 16 to drive the lifting plate 15, the rotating rod 14, the sliding column 13, the fixed plate 17 and the multiple hooks 18 to move downward until the integrated circuit shell is immersed in the tin alloy liquid in the tin alloy plating liquid frame 7, starts the motor 8, and drives the active pulley 9, the synchronous belt 10, the driven pulley 11, the hollow column 12, the sliding column 13, the rotating rod 14, the fixed plate 17, the hook 18 and the multiple integrated circuit shells to rotate slowly through the output shaft of the motor 8, and electroplating is performed on the multiple integrated circuit shells according to the electroplating principle (this technology is the prior art and will not be repeated here), and the electroplating layer of the multiple integrated circuit shells is evenly plated by rotating the multiple integrated circuit shells (rotation can help the charge to be more evenly distributed on the surface of the workpiece, reducing the uneven deposition caused by the current concentrated in a specific area), and the electroplating effect is good.

[0023] The utility model solves the problem in the prior art that, when electroplating, the electric charge is unevenly distributed on the surface of the workpiece, so that the current is concentrated in a specific area, resulting in uneven deposition and uneven electroplating layer by arranging the rotation of the integrated circuit housing.

Claims

1. A gold-tin alloy hanger for electroplating an integrated circuit housing, comprising a U-shaped plate (1), characterized in that: The bottom of the U-shaped plate (1) is fixedly connected to two symmetrically arranged bases (2), each of which is provided with a limiting mechanism, a tin alloy plating liquid frame (7) is provided below the U-shaped plate (1), a motor (8) is fixedly connected to the top of the U-shaped plate (1), a driving pulley (9) is fixedly connected to the end of the output shaft of the motor (8), a driven pulley (11) is provided on the top of the U-shaped plate (1), a synchronous belt (10) is sleeved on the outer walls of the driving pulley (9) and the driven pulley (11), and the bottom of the driven pulley (11) is coaxially fixed to the driven pulley (11). A hollow column (12) is fixedly connected, the hollow column (12) passes through the U-shaped plate (1) and is rotatably connected thereto, a sliding column (13) is passed through the bottom of the hollow column (12) and is slidably connected thereto, a rotating rod (14) is fixedly connected to the bottom of the sliding column (13), a lifting mechanism is provided on the rotating rod (14), two fixed plates (17) are fixedly connected to the outer wall of the rotating rod (14), a plurality of hooks (18) are fixedly connected to the bottom of each fixed plate (17), and a control panel (19) is fixedly connected to the inner wall of the U-shaped plate (1).

2. The gold-tin alloy electroplating hanger for integrated circuit housing according to claim 1, characterized in that: The limiting mechanism comprises four supporting legs fixedly connected to the bottom of the base (2), a moving wheel (3) is installed at the bottom of each supporting leg, a threaded rod (4) is passed through the base (2) and is threadedly connected to the base (2), a handle (5) is fixedly connected to the top of the threaded rod (4), and a positioning block (6) is fixedly connected to the bottom of the threaded rod (4).

3. The gold-tin alloy electroplating hanger for integrated circuit housing according to claim 1, characterized in that: The lifting mechanism comprises a lifting plate (15) which is sleeved on the outer wall of the rotating rod (14) and rotatably connected thereto, and two hydraulic rods (16) are fixedly connected to the top of the lifting plate (15), and the two hydraulic rods (16) are both fixedly connected to the inner top of the U-shaped plate (1).

4. The gold-tin alloy electroplating hanger for integrated circuit housing according to claim 2, characterized in that: The outer wall of the handle (5) is provided with a protective sleeve, and the material of the protective sleeve is rubber.

5. The gold-tin alloy electroplating hanger for integrated circuit housing according to claim 2, characterized in that: The bottom of the positioning block (6) is provided with anti-slip grooves.

6. The gold-tin alloy electroplating hanger for integrated circuit housing according to claim 1, characterized in that: The cross section of the sliding column (13) is arranged in a rectangular shape.

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