Wafer surface measuring device convenient to adjust

Abstract

The utility model discloses a wafer surface measuring device convenient to adjust, which comprises a measuring workbench, one side of the top of the measuring workbench is fixedly connected with a first vertical plate, the surface of the first vertical plate is provided with a C-shaped support, and two ends of the C-shaped support are respectively provided with a first measuring head and a second measuring head. The first measuring head is arranged over the second measuring head, a loading table is arranged at the top of the measuring workbench, and a detection through hole is formed in one end of the top of the loading table. Through the design of the C-shaped bracket, the first measuring head and the second measuring head can be respectively positioned above and below the detection through hole, so that the upper surface and the lower surface of the wafer can be detected at the same time when the wafer rotates, and the simultaneous detection mode of the two surfaces greatly reduces the measurement time and improves the detection efficiency; the two measuring heads work synchronously to ensure that the upper surface and the lower surface of the wafer can be fully covered and detected, so that the accuracy and the reliability of detection are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of measuring devices, in particular to a wafer surface measuring device which is easy to adjust. Background Art

[0002] In the semiconductor manufacturing industry, wafers are the basic materials for manufacturing integrated circuits. With the continuous advancement of semiconductor technology, the quality and performance requirements of wafers are getting higher and higher. As important parameters of wafer quality, wafer flatness and thickness have a direct impact on the subsequent manufacturing and performance of integrated circuits. Therefore, after wafer manufacturing, using high-precision measuring devices to measure the wafer surface and detect its flatness and thickness is of great significance for ensuring wafer quality and improving the manufacturing efficiency and performance of integrated circuits. In order to comprehensively and accurately evaluate the quality and performance of wafers, it is usually necessary to measure both the upper and lower sides of the wafer.

[0003] When some existing wafer measurement devices are in use, the measurement mechanism thereon can only measure one side of the wafer. This single measurement surface design limits the use range and test accuracy of the device.

[0004] For example, the announcement number CN210893015U discloses an easy-to-install wafer testing device. When the servo motor of this patent is in operation, the turntable is driven to rotate by adjusting the rotation of the gear, thereby driving the wafer body. When the lead screw rotates, the measuring head slides above the wafer body to perform a full-scale measurement of the thickness of the wafer body. The structure of the equipment is easy to install, and the transmission belt can continuously transmit the wafer body, thereby improving the working efficiency of the equipment.

[0005] The design of the measuring head of the wafer testing device of this patent only considers the measurement of the upper surface of the wafer body, and does not provide a mechanism for measuring the lower surface of the wafer body. The design of the measuring head is only suitable for measuring the upper surface of the wafer body and cannot directly test the lower surface of the wafer. During the wafer manufacturing and inspection process, both sides of the wafer may be key test points. Therefore, this single measurement surface design limits the scope of use and test accuracy of the device.

[0006] Therefore, it is necessary to invent a wafer surface measuring device that is easy to adjust to solve the above problems. Utility Model Content

[0007] The utility model aims to provide a wafer surface measuring device which is easy to adjust, so as to solve the problems in the above technology.

[0008] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer surface measuring device that is easy to adjust, comprising a measuring workbench, a No. 1 vertical plate is fixedly connected to one side of the top of the measuring workbench, a C-shaped bracket is installed on the surface of the No. 1 vertical plate, a No. 1 measuring head and a No. 2 measuring head are respectively installed at both ends of the C-shaped bracket, the No. 1 measuring head is arranged directly above the No. 2 measuring head, a loading platform is arranged on the top of the measuring workbench, a detection through hole is opened at one end of the top of the loading platform, the No. 1 measuring head is arranged above the detection through hole, and the No. 2 measuring head is arranged below the detection through hole, a gear ring is rotatably connected to the top edge of the detection through hole, a limited position fixing ring is installed on the top of the gear ring, a receiving groove is opened inside the loading platform, a No. 1 motor is installed inside the receiving groove, the top end of the output shaft of the No. 1 motor extends to the top of the loading platform and is fixedly connected with a transmission gear, and the transmission gear is meshed with the gear ring.

[0009] Through the design of the C-shaped bracket, the No. 1 measuring head and the No. 2 measuring head can be located above and below the detection hole respectively, thereby realizing simultaneous measurement of the upper and lower surfaces of the wafer; the meshing connection design of the gear ring and the transmission gear allows the wafer to be driven by the No. 1 motor to rotate above the detection hole, realizing all-round measurement.

[0010] Preferably, a second vertical plate and a third vertical plate are fixedly connected to the top of the measuring workbench, and the second vertical plate and the third vertical plate are respectively arranged on the front and rear sides of the loading platform, and a ball screw is rotatably connected between the second vertical plate and the third vertical plate.

[0011] By setting the second vertical plate and the third vertical plate on the measuring workbench and rotating the ball screw between them, a structural basis is provided for the subsequent forward and backward movement adjustment of the loading platform.

[0012] Preferably, the ball screw is arranged through the loading platform, and the ball screw is connected to the loading platform through threaded transmission.

[0013] The ball screw runs through the loading platform and is connected via a threaded transmission, so that the loading platform can be precisely moved and adjusted along the axial direction of the ball screw.

[0014] Preferably, a No. 2 motor is installed on the top of the measuring workbench, and the output shaft of the No. 2 motor is drivingly connected to one end of the ball screw.

[0015] The installation of the No. 1 motor and the transmission connection with the ball screw make the forward and backward movement of the loading platform electrically controlled through the control panel, making the operation more convenient.

[0016] Preferably, a control panel is installed on the surface of the No. 2 vertical plate, and the No. 1 measuring head, No. 2 measuring head, No. 1 motor and No. 2 motor are all electrically connected to the control panel.

[0017] The integrated design of the control panel brings together the control functions of the No. 1 measuring head, No. 2 measuring head, No. 1 motor and No. 2 motor, making it easier for users to manage and operate them in a unified manner.

[0018] Preferably, movable rollers are installed at the four corners of the bottom of the loading platform, a limiting slide groove is provided on the top of the measuring workbench, and the movable rollers are slidably connected to the inside of the limiting slide groove.

[0019] The moving rollers installed at the four corners of the bottom of the loading platform and the limiting slides opened on the measuring workbench ensure the stability and smoothness of the loading platform during movement.

[0020] Preferably, a positioning block is fixedly connected to the top of the position-limiting fixing ring, the number of the positioning blocks is set to four, and the four positioning blocks are evenly distributed in a ring array.

[0021] The four positioning blocks on the top of the limiting fixing ring are evenly distributed in a circular array, providing evenly distributed support points for the wafer and improving the stability of the fixation.

[0022] Preferably, a lever clamping cylinder is installed on the outer side of the limit fixing ring, the number of the lever clamping cylinders is set to four, the four lever clamping cylinders are evenly distributed in a circular array, and the four lever clamping cylinders are respectively staggered with the four positioning blocks.

[0023] The wafer can be quickly fixed and released by controlling the extension and contraction of the cylinder.

[0024] In the above technical solution, the technical effects and advantages provided by the utility model are:

[0025] 1. Through the design of the C-shaped bracket, the No. 1 measuring head and the No. 2 measuring head can be located above and below the detection through hole respectively, so that the upper and lower sides of the wafer can be detected at the same time when the wafer rotates. This double-sided simultaneous detection method greatly reduces the measurement time and improves the detection efficiency. The two measuring heads work synchronously to ensure that the upper and lower sides of the wafer can be fully covered and detected, thereby improving the accuracy and reliability of the detection;

[0026] 2. Through the combined design of the limit fixing ring, the positioning block and the lever clamping cylinder, the device can achieve stable and reliable fixation of the wafer. The four lever clamping cylinders and the four positioning blocks are staggered. The positioning blocks are used to quickly position and place the wafer carrier, and then the lever clamping cylinder is used to clamp the wafer carrier to ensure that the wafer does not shift or shake during the measurement process. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the overall structure of the utility model from a first perspective when it is not working;

[0028] Figure 2 It is a schematic diagram of the overall structure of the utility model from a second viewing angle when it is not working;

[0029] Figure 3 It is a schematic diagram of the overall structure of the utility model when it is working;

[0030] Figure 4 For this utility model Figure 3 A magnified view of the structure of part A;

[0031] Figure 5 It is a partial structural sectional view of the utility model.

[0032] Description of reference numerals:

[0033] 1. Measuring workbench; 2. Vertical plate No. 1; 3. C-shaped bracket; 4. Measuring head No. 1; 5. Measuring head No. 2; 6. Loading platform; 7. Gear ring; 8. Limit fixing ring; 9. Motor No. 1; 10. Transmission gear; 11. Vertical plate No. 2; 12. Vertical plate No. 3; 13. Ball screw; 14. Motor No. 2; 15. Control panel; 16. Moving roller; 17. Limit slide; 18. Positioning block; 19. Lever clamping cylinder. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0035] The utility model provides Figure 1-5 A wafer surface measuring device that is easy to adjust is shown, comprising a measuring workbench 1, a No. 1 vertical plate 2 is fixedly connected to one side of the top of the measuring workbench 1, a C-shaped bracket 3 is installed on the surface of the No. 1 vertical plate 2, a No. 1 measuring head 4 and a No. 2 measuring head 5 are respectively installed at both ends of the C-shaped bracket 3, the No. 1 measuring head 4 is arranged directly above the No. 2 measuring head 5, a loading platform 6 is arranged on the top of the measuring workbench 1, a detection through hole is opened at one end of the top of the loading platform 6, the No. 1 measuring head 4 is arranged above the detection through hole, the No. 2 measuring head 5 is arranged below the detection through hole, a gear ring 7 is rotatably connected to the top edge of the detection through hole, a limited position fixing ring 8 is installed on the top of the gear ring 7, a receiving groove is opened inside the loading platform 6, a No. 1 motor 9 is installed inside the receiving groove, the top end of the output shaft of the No. 1 motor 9 extends to the top of the loading platform 6 and is fixedly connected to a transmission gear 10, and the transmission gear 10 is meshed with the gear ring 7.

[0036] In one aspect of the present embodiment, a second vertical plate 11 and a third vertical plate 12 are fixedly connected to the top of the measuring workbench 1, and the second vertical plate 11 and the third vertical plate 12 are respectively arranged on the front and rear sides of the loading platform 6, and a ball screw 13 is rotatably connected between the second vertical plate 11 and the third vertical plate 12, and the ball screw 13 is arranged through the loading platform 6, and the ball screw 13 is connected to the loading platform 6 through a threaded transmission. A second motor 14 is installed on the top of the measuring workbench 1, and the output shaft of the second motor 14 is transmission-connected to one end of the ball screw 13, and a control panel 15 is installed on the surface of the second vertical plate 11, and a first measuring head 4, a second measuring head 5, and a first motor 1 are connected to each other. 9 and the second motor 14 are electrically connected to the control panel 15, moving rollers 16 are installed at the four corners of the bottom of the loading platform 6, a limiting slide groove 17 is opened on the top of the measuring workbench 1, and the moving roller 16 is slidably connected to the inside of the limiting slide groove 17, and a positioning block 18 is fixedly connected to the top of the limiting fixing ring 8. The number of the positioning blocks 18 is set to four, and the four positioning blocks 18 are evenly distributed in a circular array. A lever clamping cylinder 19 is installed on the outer side of the limiting fixing ring 8, and the number of the lever clamping cylinders 19 is set to four, and the four lever clamping cylinders 19 are evenly distributed in a circular array, and the four lever clamping cylinders 19 are staggered with the four positioning blocks 18 respectively.

[0037] Working principle of this utility model:

[0038] Refer to the instruction manual Figure 1-5 When using the utility model, firstly, the wafer to be measured is placed together with its carrier on the top of the limit fixing ring 8. The positioning block 18 can help the wafer carrier to be accurately positioned on the loading platform 6 to avoid the wafer from being offset and ensure that the wafer is located directly above the detection through hole. The wafer is fixed by a lever clamping cylinder 19. Four lever clamping cylinders 19 are respectively located at four positions around the wafer carrier. By controlling the extension and contraction of the cylinder, the wafer carrier is stably fixed on the limit fixing ring 8.

[0039] The first motor 9 is started through the control panel 15, and the first motor 9 drives the transmission gear 10 to rotate. The transmission gear 10 is meshed and connected with the gear ring 7. Therefore, when the transmission gear 10 rotates, the gear ring 7 and the limit fixing ring 8 fixed on the top of the gear ring 7 will be driven to rotate. Since the wafer is fixed on the limit fixing ring 8, the wafer will also rotate with the rotation of the gear ring 7;

[0040] When the wafer starts to rotate, the No. 1 measuring head 4 is located above the detection through hole to measure the upper surface of the wafer, and the No. 2 measuring head 5 is located below the detection through hole to measure the lower surface of the wafer. The No. 1 measuring head 4 and the No. 2 measuring head 5 simultaneously measure the upper and lower surfaces of the wafer, and the measurement data is transmitted to the control panel 15 through the measuring heads for processing and analysis. The control panel 15 will display the measurement results of the wafer, including detailed data of parameters such as flatness and thickness;

[0041] To measure different positions of the wafer, the No. 2 motor 14 can be started, and the No. 2 motor 14 drives the ball screw 13 to rotate. Since the ball screw 13 is connected to the loading platform 6 through a threaded transmission, when the ball screw 13 rotates, the loading platform 6 will move along the axial direction of the ball screw 13, which allows the wafer to move back and forth on the measuring workbench 1, thereby realizing the measurement of different positions of the wafer.

Claims

1. A wafer surface measuring device that is easy to adjust, comprising a measuring workbench (1), characterized in that: A No. 1 vertical plate (2) is fixedly connected to one side of the top of the measuring workbench (1); a C-shaped bracket (3) is installed on the surface of the No. 1 vertical plate (2); a No. 1 measuring head (4) and a No. 2 measuring head (5) are respectively installed at both ends of the C-shaped bracket (3); the No. 1 measuring head (4) is arranged directly above the No. 2 measuring head (5); a loading platform (6) is arranged on the top of the measuring workbench (1); a detection through hole is opened at one end of the top of the loading platform (6); the No. 1 measuring head (4) is arranged on the detection through hole. The second measuring head (5) is arranged above the detection through hole, the top edge of the detection through hole is rotatably connected with a gear ring (7), the top of the gear ring (7) is installed with a limit fixing ring (8), the loading platform (6) is provided with a receiving groove inside, the receiving groove is installed with a first motor (9), the top of the output shaft of the first motor (9) extends to the top of the loading platform (6) and is fixedly connected with a transmission gear (10), and the transmission gear (10) is meshed with the gear ring (7).

2. The wafer surface measuring device that is easy to adjust according to claim 1, characterized in that: A second vertical plate (11) and a third vertical plate (12) are fixedly connected to the top of the measuring workbench (1); the second vertical plate (11) and the third vertical plate (12) are respectively arranged on the front side and the rear side of the loading platform (6); a ball screw (13) is rotatably connected between the second vertical plate (11) and the third vertical plate (12).

3. The wafer surface measuring device that is easy to adjust according to claim 2, characterized in that: The ball screw (13) is arranged to penetrate the loading platform (6), and the ball screw (13) is connected to the loading platform (6) through threaded transmission.

4. The wafer surface measuring device that is easy to adjust according to claim 3 is characterized in that: A No. 2 motor (14) is installed on the top of the measuring workbench (1), and the output shaft of the No. 2 motor (14) is drivingly connected to one end of the ball screw (13).

5. The wafer surface measuring device that is easy to adjust according to claim 4, characterized in that: A control panel (15) is installed on the surface of the second vertical plate (11), and the first measuring head (4), the second measuring head (5), the first motor (9) and the second motor (14) are all electrically connected to the control panel (15).

6. The wafer surface measuring device that is easy to adjust according to claim 1, characterized in that: The four corners of the bottom of the loading platform (6) are all equipped with movable rollers (16), and a limiting slide groove (17) is provided on the top of the measuring workbench (1), and the movable roller (16) is slidably connected to the inside of the limiting slide groove (17).

7. The wafer surface measuring device that is easy to adjust according to claim 1, characterized in that: A positioning block (18) is fixedly connected to the top of the limiting fixing ring (8), the number of the positioning blocks (18) is set to four, and the four positioning blocks (18) are evenly distributed in a ring array.

8. The wafer surface measuring device that is easy to adjust according to claim 7, characterized in that: A lever clamping cylinder (19) is installed on the outer side of the limit fixing ring (8), the number of the lever clamping cylinders (19) is set to four, the four lever clamping cylinders (19) are evenly distributed in a ring array, and the four lever clamping cylinders (19) are respectively arranged alternately with the four positioning blocks (18).

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