Multi-channel IGBT module temperature measurement circuit based on bus technology

Abstract

The utility model provides a multi-channel IGBT module temperature measuring circuit based on a bus technology, and relates to the technical field of temperature measuring circuits. The measuring circuit comprises a control unit, a plurality of IGBT modules arranged in parallel and a plurality of temperature sensor chips, the temperature sensor chips are used for sensing the working temperature of the corresponding IGBT modules, and the temperature sensor chips use a single bus protocol; the control unit is used for reading the measured temperature of each temperature sensor chip in a bus communication mode; the temperature sensor chip is arranged on the air outlet side of the IGBT module in the air cooling direction. According to the measuring circuit, parallel IGBT multi-point temperature measurement is realized, and the real temperature of each module in parallel IGBT modules can be quickly reflected. The temperature measured by the temperature sensing chip is read in a bus mode, wiring is greatly simplified through the measurement method, and hardware complexity and cost are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature measurement circuits, in particular to a multi-channel IGBT module temperature measurement circuit based on bus technology. Background Art

[0002] As a power semiconductor device, IGBT plays a key role in energy conversion and control in power electronic devices (such as frequency converters and inverters). As power increases, the rated current increases. Whether it is limited by the insufficient current capacity of a single module, the cost advantage of parallel connection, or the system scalability and serialization requirements, more and more designs require the use of IGBT modules in parallel.

[0003] IGBT will generate power loss during operation, which is converted into heat energy, causing the device temperature to rise. Excessive temperature affects the service life. If the temperature is not controlled and exceeds the maximum allowable operating temperature of the IGBT junction temperature, it may damage the IGBT component. Controlling the operating temperature of the IGBT is crucial to extending its service life and ensuring the stability and reliability of the power electronic system.

[0004] Therefore, it is necessary to provide an IGBT module temperature measurement circuit. Utility Model Content

[0005] The purpose of the utility model is to provide a multi-channel IGBT module temperature measurement circuit based on bus technology to solve the problem of IGBT module temperature measurement in view of the above-mentioned deficiencies in the prior art.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0007] The utility model provides a multi-channel IGBT module temperature measurement circuit based on bus technology, the measurement circuit comprises a control unit, a plurality of IGBT modules arranged in parallel, and a plurality of temperature sensor chips arranged in one-to-one correspondence with the plurality of IGBT modules, each temperature sensor chip is used to sense the operating temperature of the corresponding IGBT module, the plurality of temperature sensor chips use a single bus protocol, and the bus communication realizes temperature reading through a control signal line;

[0008] The control unit is used to read the measured temperature of each temperature sensor chip through bus communication to monitor the operating temperature of the IGBT;

[0009] The plurality of temperature sensor chips are arranged on the air outlet side of the air cooling direction of the plurality of IGBT modules;

[0010] The distance between each temperature sensor chip and the corresponding IGBT module is a preset distance, and the preset distance ranges from greater than 5 mm to less than 20 mm.

[0011] Optionally, the control unit is a single chip microcomputer or a digital signal processor.

[0012] Optionally, in the measurement circuit, each temperature sensor chip has a unique code, which is used for the control unit to identify the IGBT module temperature corresponding to different chips on the bus.

[0013] Optionally, under a preset distance condition, the temperature difference between the sensed temperature of each temperature sensor chip and the actual temperature of the corresponding IGBT module is not higher than 30°C.

[0014] The beneficial effects of the utility model include:

[0015] The utility model provides a multi-channel IGBT module temperature measurement circuit based on bus technology, comprising a control unit, a plurality of IGBT modules arranged in parallel, and a plurality of temperature sensor chips arranged one by one corresponding to the plurality of IGBT modules, each temperature sensor chip is used to sense the working temperature of the corresponding IGBT module, the plurality of temperature sensor chips use a single bus protocol, and the bus communication realizes temperature reading through a control signal line; the control unit is used to read the measured temperature of each temperature sensor chip through the bus communication mode to monitor the working temperature of the IGBT; the plurality of temperature sensor chips are arranged on the air outlet side of the air cooling direction of the plurality of IGBT modules; the distance between each temperature sensor chip and the corresponding IGBT module is a preset distance, and the range of the preset distance is greater than 5mm and less than 20mm. The circuit realizes multi-point temperature measurement of parallel IGBTs, and can quickly respond to the real temperature of each module in the parallel IGBT modules. The temperature measured by the temperature sensor chip is read by the bus mode, because the temperature sensor chip has a unique code, and theoretically the number of temperature sensor chips hung on the bus and can be addressed is infinite. This bus communication method for measuring the temperature of the IGBT module greatly simplifies the wiring and reduces the hardware complexity and cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 The internal structure block diagram of a single bus digital high-precision temperature sensor chip provided by an embodiment of the utility model is shown;

[0018] Figure 2 A schematic diagram of a single bus circuit provided by an embodiment of the utility model is shown;

[0019] Figure 3 A schematic diagram of the layout of a multi-channel IGBT module temperature measurement circuit based on bus technology provided by an embodiment of the utility model is shown. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0023] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] IGBT will generate power loss during operation, which is converted into heat energy, causing the device temperature to rise. Excessive temperature affects the service life. If the temperature is not controlled and exceeds the maximum allowable operating temperature of the IGBT junction temperature, it may damage the IGBT component. Controlling the operating temperature of the IGBT is crucial to extending its service life and ensuring the stability and reliability of the power electronic system.

[0026] Therefore, it is necessary to provide an IGBT module temperature measurement circuit.

[0027] Figure 1 The internal structure block diagram of a single bus digital high-precision temperature sensor chip provided by an embodiment of the utility model is shown; Figure 2 A schematic diagram of a single bus circuit provided by an embodiment of the utility model is shown; Figure 3 A schematic diagram of the layout of a multi-channel IGBT module temperature measurement circuit based on bus technology provided by an embodiment of the utility model is shown.

[0028] The utility model provides a multi-channel IGBT module temperature measurement circuit based on bus technology. The measurement circuit comprises a control unit, a plurality of IGBT modules arranged in parallel, and a plurality of temperature sensor chips arranged in one-to-one correspondence with the plurality of IGBT modules. Each temperature sensor chip is used to sense the operating temperature of the corresponding IGBT module. The plurality of temperature sensor chips use a single bus protocol, and the bus communication realizes temperature reading through a control signal line.

[0029] This circuit uses a single bus (1-wire interface) digital high-precision temperature sensor chip as an IGBT temperature sampling chip. The chip uses a single bus protocol, and bus communication is implemented through a control signal line. In this bus system, the MCU or DSP identifies and addresses the devices on the bus through the bit encoding of each device. Because each device has a unique code, theoretically, the number of temperature sensor chips that can be hung on the bus and can be addressed is infinite. This bus communication method of measuring the temperature of the IGBT module greatly simplifies the wiring and reduces the hardware complexity and cost.

[0030] The control unit is used to read the measured temperature of each temperature sensor chip through bus communication to monitor the operating temperature of the IGBT.

[0031] The plurality of temperature sensor chips are arranged on an air outlet side in an air cooling direction of the plurality of IGBT modules.

[0032] The distance between each temperature sensor chip and the corresponding IGBT module is a preset distance, such as Figure 3 As shown in , the range of the preset distance is greater than 5 mm and less than 20 mm.

[0033] The internal structure diagram of the single bus digital high-precision temperature sensor chip is as follows Figure 1 As shown in the figure, DQ is a single bus digital interface. VCC and GND are the power supply for the chip. A single bus digital high-precision temperature sensor chip is used as the IGBT temperature sampling chip. The operating temperature of the IGBT module is measured by placing a temperature sensor near each IGBT module. The MCU or DSP reads the measured temperature of the chip through bus communication, monitors the operating temperature of the IGBT, and takes derating or alarm shutdown when necessary to avoid IGBT overheating.

[0034] The schematic diagram of the single bus circuit is as follows Figure 2 As shown, the single bus interface only requires one data pin for communication and power supply (it also supports independent power supply). The communication process uses strict timing control and encodes information through pulse width changes on the data line, including data transmission and handshake signals. The MCU or DSP is responsible for generating clock signals and controlling data read and write operations.

[0035] Each single bus digital high-precision temperature sensor chip device has a unique code to identify different chips on the bus. At the beginning of communication, the MCU or DSP broadcasts a reset pulse and then determines which chip to communicate with by querying the code.

[0036] Optionally, the control unit is a single chip microcomputer MCU or a digital signal processor DSP.

[0037] Optionally, in the measurement circuit, each temperature sensor chip has a unique code, which is used for the control unit to identify the IGBT module temperature corresponding to different chips on the bus.

[0038] like Figure 3 As shown, under the preset distance condition, the temperature difference between the sensed temperature of each temperature sensor chip and the actual temperature of the corresponding IGBT module is no more than 30°C.

[0039] In summary, this circuit realizes multi-point temperature measurement of parallel IGBTs and can quickly respond to the true temperature of each module in the parallel IGBT module. The temperature measured by the temperature sensor chip is read in bus mode. Because the temperature sensor chip has a unique code, the number of temperature sensor chips that can be hung on the bus and addressed is infinite in theory. This bus communication method of measuring the temperature of the IGBT module greatly simplifies the wiring and reduces the hardware complexity and cost.

[0040] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A multi-channel IGBT module temperature measurement circuit based on bus technology, characterized in that: The measurement circuit includes a control unit, a plurality of IGBT modules arranged in parallel, and a plurality of temperature sensor chips arranged in one-to-one correspondence with the plurality of IGBT modules, each temperature sensor chip is used to sense the operating temperature of the corresponding IGBT module, the plurality of temperature sensor chips use a single bus protocol, and the bus communication realizes temperature reading through a control signal line; The control unit is used to read the measured temperature of each temperature sensor chip through bus communication to monitor the operating temperature of the IGBT; The plurality of temperature sensor chips are arranged on the air outlet side of the air cooling direction of the plurality of IGBT modules; The distance between each temperature sensor chip and the corresponding IGBT module is a preset distance, and the preset distance ranges from greater than 5 mm to less than 20 mm.

2. The bus technology-based multi-channel IGBT module temperature measurement circuit according to claim 1 is characterized in that: The control unit is a single chip microcomputer or a digital signal processor.

3. The bus technology-based multi-channel IGBT module temperature measurement circuit according to claim 2 is characterized in that: In the measurement circuit, each temperature sensor chip has a unique code, which is used for the control unit to identify the IGBT module temperature corresponding to different chips on the bus.

4. The bus technology-based multi-channel IGBT module temperature measurement circuit according to claim 1, characterized in that: Under the preset distance condition, the temperature difference between the sensed temperature of each temperature sensor chip and the actual temperature of the corresponding IGBT module is no more than 30°C.

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