BGA chip welding quality detection device

Abstract

The utility model discloses a BGA (Ball Grid Array) chip welding quality detection device, which belongs to the technical field of chip welding quality detection and comprises a base, a board card, a lining disc and a plurality of guide upright posts, the lining disc is in vertical sliding guide fit with the guide stand columns; an impact block is arranged on the base; four strain gauge positioning silk screens are arranged on the board card, the four strain gauge positioning silk screens are located on the outer sides of the four corners of the BGA chip, and strain gauges are attached to the positions of the strain gauge positioning silk screens. The strain gauges are attached to the strain gauge positioning silk-screen positions at the four corners of the BGA chip, and the positions of the strain gauges are limited, so that the accuracy and reliability of detection are ensured; the lining disc loaded with the board card slides and guides the free falling body to fall from a high position under the action of gravity through the four guide stand columns, the falling lining disc is impacted and supported by the impact blocks, the welding quality of the BGA chip is detected by monitoring the stress values of the four strain gauges, the overall structure is simple, the occupied space is small, use is easy and convenient, and practicability is good.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip welding quality detection, in particular to a BGA chip welding quality detection device. Background Art

[0002] Ball Grid Array (BGA) packaging technology is a surface mounting technology used on integrated circuits. This technology is often used to permanently fix devices such as microprocessors. Compared with traditional pin-shaped mounting devices, BGA packaging devices have the following characteristics: 1. High yield rate. The use of BGA can reduce the failure rate of fine-pitch QFP solder joints from 200x10-6 to two orders of magnitude without making major changes to the process. 2. Simple equipment. The center distance of BGA solder joints is generally 1.27mm, and existing SMT process equipment can be used. 3. Large number of pins. Improved the ratio of device lead number and body size. 4. Small coplanar damage. Significantly improve the coplanar problem and reduce coplanar damage. 5. Firm pins. BGA pins are firm and do not have pin deformation problems like QFP. 6. Good electrical performance. BGA pins are very short, which shortens the signal path, reduces lead inductance and capacitance, and enhances electrical performance. 7. Good heat dissipation. The ball contact array is conducive to heat dissipation. 8. High packaging density. BGA is suitable for the packaging needs of MCM and is conducive to achieving high density and high performance of MCM.

[0003] Nowadays, BGA technology is more and more widely used in server board development. It is particularly important to detect the chip welding quality on the development board. It can find defects in board development and improve board quality.

[0004] However, traditional chip welding quality inspection equipment on boards is bulky, occupies a large space, is expensive, and is cumbersome to operate, which is not conducive to convenient inspection. Utility Model Content

[0005] In order to solve the problems that traditional chip welding quality detection equipment on a board is relatively bulky, occupies a large space, is expensive, has cumbersome operations, and is not conducive to detection convenience, the utility model provides a BGA chip welding quality detection device.

[0006] The utility model is realized by the following technical solutions:

[0007] A BGA chip welding quality inspection device comprises a base, a board for positioning and installing the BGA chip, a liner for positioning and installing the board, and a plurality of guide columns vertically positioned and installed on the base; the liner cooperates with the vertical sliding guides of the plurality of guide columns; the base is provided with a plurality of impact blocks capable of supporting the falling impact of the liner; the board is provided with four strain gauge positioning silk screens, the four strain gauge positioning silk screens are located on the outside of the four corners of the BGA chip, and strain gauges are attached to the positions of the strain gauge positioning silk screens.

[0008] A further improvement of the utility model is that the strain gauge positioning silk screen is located on the extension line of the diagonal of the BGA chip and has the same distance from the center of the BGA chip.

[0009] A further improvement of the utility model is that the strain gauge positioning silk screen is in a right-angle shape, and the inner side of the right angle is coated with a sol boss, and the upper surface of the sol boss is fitted and installed with the strain gauge.

[0010] A further improvement of the utility model is that a wire clamp capable of positioning and clamping the strain gauge cable is positioned and installed on the board.

[0011] A further improvement of the utility model is that the wire clamp is arranged on a side of the strain gauge away from the BGA chip.

[0012] A further improvement of the utility model is that a height scale capable of measuring the height of the liner disc is installed on the base.

[0013] A further improvement of the utility model is that an acceleration sensor is installed on the board.

[0014] A further improvement of the utility model is that the impact block is slidably sleeved on the bottom of the guide column.

[0015] A further improvement of the utility model is that a limiting clamp capable of limiting the position of the lining disc is engaged at the upper end of the guide column.

[0016] A further improvement of the utility model is that the base is provided with a column positioning countersunk hole capable of positioning and inserting the bottom of the guide column, and a column mounting bolt is passed upward from the bottom of the base and is screwed and installed with the bottom of the guide column.

[0017] It can be seen from the above technical solutions that the beneficial effects of the utility model are:

[0018] The strain gauges are installed by attaching them to the strain gauge positioning silk-screen positions at the four corners of the BGA chip (on the board) to limit the position of the strain gauges and ensure the accuracy and reliability of the detection. The backing plate loaded with the board falls from a high place under the action of gravity through four guide columns to slide and guide free fall. Several impact blocks support the falling backing plate (falling impact), and the stress values ​​of the four strain gauges are monitored. If the strain gauge exceeds the standard, and visual inspection shows obvious appearance damage, it will fail; if the strain gauge meets the standard, and visual inspection shows no obvious damage, and the function test shows abnormal function, it will fail; if the function is normal, it will go to the next step; red ink test, micro-cut the position larger than the BGA chip position by more than centimeters, plasma clean the BGA chip position, immerse it in red ink for hours, take it out and dry it to separate the BGA chip from the board, and observe the solder balls of the BGA chip under a microscope. If there is no staining, it will pass, and if there is staining, it will fail; the result of the unstained BGA chip meets the quality requirements and can be used normally, and the stained BGA chip does not meet the requirements, and the process is improved, and glue is dispensed around the BGA chip. The length and thickness of the glue are improved and verified according to the height characteristics of the BGA chip and the simulation data, until the appearance inspection, strain force, and function test are normal, and it is judged to be qualified. The BGA chip welding quality detection device has a simple structure, small space, simple and convenient use, and good practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solution of the utility model, the drawings required for use in the description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a structural schematic diagram of a specific implementation method of the utility model.

[0021] Figure 2 It is a schematic diagram of the top structure of a specific implementation method of the utility model.

[0022] Figure 3 for Figure 2 Schematic diagram of the partially enlarged structure of part A in the middle.

[0023] Figure 4 This is a schematic diagram of the installation of a guide column according to a specific implementation method of the utility model.

[0024] In the attached figure: 1. base, 2. guide column, 3. liner, 4. board, 5. fixing hole, 6. BGA chip, 7. strain gauge, 8. height scale, 9. impact block, 10. strain gauge positioning silk screen, 11. acceleration sensor, 12. handle, 13. limit clamp, 14. column positioning countersunk hole, 15. column mounting bolt, 16. washer. DETAILED DESCRIPTION

[0025] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the technical scheme of the utility model will be clearly and completely described below in combination with the drawings in the specific embodiment. Obviously, the embodiments described below are only part of the embodiments of the utility model, not all of them. Based on the embodiments in this patent, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this patent.

[0026] like Figure 1-2 As shown, the utility model discloses a BGA chip welding quality detection device, comprising a horizontally placed base 1, a board 4 for positioning and installing the BGA chip 6, a liner 3 for positioning and installing the board 4, and four (four corner positions) guide columns 2 vertically positioned and installed on the base 1; the BGA chip 6 is welded to a specific position of the board 4 through the BGA technology; the liner 3 is vertically slidably guided with a plurality of the guide columns 2; a plurality of impact blocks 9 capable of supporting the falling impact of the liner 3 are provided on the base 1; four strain gauge positioning screens 10 are provided on the board 4, and the four strain gauge positioning screens 10 are located on the outer sides of the four corners of the BGA chip 6, and strain gauges 7 are attached to the positions of the strain gauge positioning screens 10.

[0027] The strain gauge 7 is attached and installed at the positions of the strain gauge positioning silk screen 10 at the four corners of the BGA chip 6 (on the board 4), and the position of the strain gauge 7 is limited to ensure the accuracy and reliability of the detection; the liner 3 loaded with the board 4 falls from a high place under the action of gravity through the sliding guide of four guide columns 2, and a number of impact blocks 9 support the falling liner 3 (falling impact), and the stress values ​​of the four strain gauges 7 are monitored. If the strain gauge 7 exceeds the standard, and the visual inspection shows obvious appearance damage, it will fail; if the strain gauge meets the standard, and there is no obvious damage in the visual inspection, the function test is abnormal and it will fail; if the function is normal, it will go to the next step; red ink test, micro-cut the position larger than 10 cm around the BGA chip 6 position, plasma clean the BGA chip 6 position, put it in red ink for 10 hours, take it out and dry it to separate the BGA chip 6 from the board 4, and observe the solder balls of the BGA chip 6 under a microscope. If there is no staining, it will pass, and if there is staining, it will fail; the result of the unstained BGA chip 6 meets the quality requirements and can be used normally. If there is a stained BGA chip 6, it does not meet the requirements, and the process is improved. Glue is applied around the BGA chip 6, and the length and thickness of the glue are improved and verified according to the height characteristics of the BGA chip 6 and the simulation data, until the appearance inspection, strain force, and function test are normal, it is judged to be qualified. The BGA chip welding quality detection device has a simple structure, small space, simple and convenient use, and good practicality.

[0028] The liner 3 can simulate the installation condition of the real server board 4 to achieve the accuracy of the detection.

[0029] like Figure 3 As shown, the strain gauge positioning screen 10 is located on the extension line of the diagonal of the BGA chip 6 and is at the same distance from the center of the BGA chip 6. The accuracy of the stress value detected by the four strain gauges 7 is ensured, and the accuracy of the welding quality detection of the BGA chip 6 is ensured.

[0030] Furthermore, the strain gauge positioning screen 10 is in a right-angle shape, and the inner side of the right angle is coated with a sol boss, and the upper surface of the sol boss is fitted with the strain gauge 7. A wire clamp capable of positioning and clamping the strain gauge 7 cable is positioned and installed on the board 4. The wire clamp is arranged on the side of the strain gauge 7 away from the BGA chip 6. The upper surface of the sol boss is flat, ensuring the reliability of the adhesion of the strain gauge 7 and the accuracy of the detection; the strain gauge 7 cable is fixed by the outer wire clamp to avoid interference with the components on the board 4 (including the BGA chip 6), thereby achieving convenience of detection.

[0031] Among them, Figure 1-2As shown, the base 1 is provided with a height scale 8 capable of measuring the height of the liner plate 3. An acceleration sensor 11 is provided at the edge of the board 4. The height scale 8 can realize intuitive and accurate measurement of the falling distance of the liner plate 3, and the acceleration sensor 11 can realize direct reading of the acceleration value of the board 4 (falling acceleration value and impact acceleration value), thereby realizing accurate adjustment and detection of the impact intensity and achieving detection flexibility.

[0032] like Figure 4 As shown, the impact block 9 is slidably mounted on the bottom of the guide column 2 and supported on the upper side of the base 1. The impact block 9 is made of rubber and has a T-shaped structure as a whole. A groove for positioning and installing the impact block 9 is provided on the upper side of the base 1. The impact block 9 is accurately and reliably installed to ensure the reliability of the impact between the liner 3 and the impact block 9.

[0033] like Figure 2 As shown, in order to ensure the convenience of lifting and moving the lining plate 3, handles 12 are provided on both sides of the lining plate 3.

[0034] Among them, Figure 4 As shown, the upper end of the guide column 2 is clamped with a limit clamp 13 that can limit the lining plate 3. By adjusting the position of the limit clamp 13 on the guide column 2, the handle 12 is lifted on the lining plate 3 to abut against the limit clamp 13 to limit the position, so as to achieve the limitation of the initial position of the lining plate 3 and realize the convenience of operation.

[0035] In order to ensure sufficient impact force, a counterweight is installed on the lining disc 3.

[0036] Among them, Figure 4 As shown, the base 1 is provided with a column positioning countersunk hole 14 capable of positioning and inserting the bottom of the guide column 2, and a column mounting bolt 15 is passed upward from the bottom of the base 1 and is screwed and mounted with the bottom of the guide column 2, and a washer 16 is sleeved on the column mounting bolt 15, and a stepped hole communicating with the column positioning countersunk hole 14 is provided on the bottom wall of the base 1 to accommodate the washer 16 and the head of the column mounting bolt 15. The reliable positioning installation and convenient disassembly and assembly of the guide column 2 are achieved, so that it is easy to move and assemble, and the convenience of use is achieved.

[0037] The BGA chip welding quality detection device, by attaching and installing the strain gauge 7 at the position of the strain gauge positioning silk screen 10 at the four corners of the BGA chip 6 (on the board 4), limits the position of the strain gauge 7 to ensure the accuracy and reliability of the detection; the liner 3 loaded with the board 4 falls from a high place under the action of gravity through four guide columns 2 sliding guide free fall, a number of impact blocks 9 support the falling liner 3 (falling impact), and the stress values ​​of the four strain gauges 7 are monitored. If the strain gauge 7 exceeds the standard, and the visual inspection shows obvious appearance damage, it will fail; if the strain gauge meets the standard, and there is no obvious damage in the visual inspection, the function test is abnormal and it will fail; if the function is normal, it will go to the next step; red ink test, micro-cut the position larger than 10 cm around the BGA chip 6 position, plasma clean the BGA chip 6 position, put it in red ink for 10 hours, take it out and dry it to separate the BGA chip 6 from the board 4, and observe the solder balls of the BGA chip 6 under a microscope. If there is no staining, it will pass, and if there is staining, it will fail; the result of the unstained BGA chip 6 meets the quality requirements and can be used normally. If there is a stained BGA chip 6, it does not meet the requirements, and the process is improved. Glue is applied around the BGA chip 6, and the length and thickness of the glue are improved and verified according to the height characteristics of the BGA chip 6 and the simulation data, until the appearance inspection, strain force, and function test are normal, it is judged to be qualified. The BGA chip welding quality detection device has a simple structure, small space, simple and convenient use, and good practicality.

[0038] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referenced to each other.

[0039] The terms "upper", "lower", "outer side", "inner side", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish the relative relationship in position if they exist, and do not need to be qualitative. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0040] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A BGA chip welding quality detection device, characterized in that: The invention comprises a base (1), a board (4) for positioning and installing the BGA chip (6), a liner (3) for positioning and installing the board (4), and a plurality of guide columns (2) vertically positioned and installed on the base (1); the liner (3) and the plurality of guide columns (2) cooperate in vertical sliding guidance; the base (1) is provided with a plurality of impact blocks (9) capable of supporting the liner (3) when it falls; the board (4) is provided with four strain gauge positioning screens (10), the four strain gauge positioning screens (10) are located outside the four corners of the BGA chip (6), and strain gauges (7) are attached to the positions of the strain gauge positioning screens (10).

2. The BGA chip welding quality detection device according to claim 1, characterized in that: The strain gauge positioning silk screen (10) is located on the extension line of the diagonal of the BGA chip (6) and is at the same distance from the center of the BGA chip (6).

3. The BGA chip welding quality detection device according to claim 1, characterized in that: The strain gauge positioning screen (10) is in a right-angle shape, and the inner side of the right angle is coated with a sol boss, and the upper surface of the sol boss is fitted and installed with the strain gauge (7).

4. The BGA chip welding quality detection device according to claim 3, characterized in that: A wire clamp capable of positioning and clamping the cable of the strain gauge (7) is positioned and mounted on the board (4).

5. The BGA chip welding quality detection device according to claim 4, characterized in that: The wire clamp is arranged on a side of the strain gauge (7) away from the BGA chip (6).

6. The BGA chip welding quality detection device according to claim 1, characterized in that: A height scale (8) capable of measuring the height of the lining disc (3) is mounted on the base (1).

7. The BGA chip welding quality detection device according to claim 1, characterized in that: An acceleration sensor (11) is mounted on the board (4).

8. The BGA chip welding quality detection device according to claim 1, characterized in that: The impact block (9) is slidably mounted on the bottom of the guide column (2).

9. The BGA chip welding quality detection device according to claim 1, characterized in that: A limiting clamp (13) capable of limiting the position of the lining plate (3) is engaged at the upper end of the guide column (2).

10. The BGA chip welding quality detection device according to claim 1, characterized in that: The base (1) is provided with a column positioning countersunk hole (14) capable of positioning and inserting the bottom of the guide column (2), and a column mounting bolt (15) is passed upward through the bottom of the base (1) and is screwed and mounted to the bottom of the guide column (2).

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