Card slot structure of single-chip microcomputer memory card
By designing a multi-layer structure in the memory card slot of the microcontroller, including the card slot shell, heat insulation box and thermal conductivity system, the problem of poor heat dissipation in the existing technology is solved, efficient heat dissipation and temperature monitoring are achieved, and the memory card is ensured. Stable use.
Patent Information
- Application Number
- CN202420900044.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-04-28
AI Technical Summary
The card slots of existing microcontroller memory cards lack fast heat dissipation and monitoring structure, which leads to the inability to dissipate heat in time, affecting the reading rate and usage effect.
Designed is a type including a slot housing, a heat insulation box, a contact pad plate, a heat conduction pad plate, a central block, a rotating central shaft rod, a torsion spring, a pressure plate, a partition plate, a heat conduction rod, a heat conduction pipe, and a heat transfer plate The structure of the temperature monitoring alarm is used to guide heat to the partition plate and the outer heat dissipation plate through the elastic force of the torsion spring and the pressing effect of the pressure plate, so as to achieve rapid heat dissipation, and to prevent excessive temperatures through the temperature monitoring alarm.
It improves the heat dissipation efficiency in the memory card slot, ensures the smooth operation of the memory card during use, and prevents excessive temperature damage through temperature monitoring.
Smart Images
Figure CN222213314U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of single-chip computers, in particular to a card slot structure of a single-chip computer memory card. Background Art
[0002] A single-chip microcomputer is an integrated circuit chip that uses ultra-large-scale integrated circuit technology to integrate a central processing unit CPU with data processing capabilities, random access memory RAM, read-only memory ROM, multiple I / O ports and interrupt systems, timer / counter and other functions (may also include display drive circuits, pulse width modulation circuits, analog multiplexers, A / D converters and other circuits) on a silicon chip to form a small and complete microcomputer system, which is widely used in the field of industrial control. At present, the existing single-chip microcomputer memory card slot has a single function. During the use of the memory card, it is impossible to understand the temperature of the memory card slot. During the use, heat is generated, and the heat cannot be dissipated in time in the slot. Excessive temperature will affect the reading rate and use of the memory card, and there is no targeted setting of rapid heat dissipation and monitoring structure. Utility Model Content
[0003] 1. Technical issues to be resolved
[0004] In view of the deficiencies in the prior art, the utility model provides a card slot structure for a single-chip microcomputer memory card, which solves the problems raised in the above-mentioned background technology.
[0005] (II) Technical solution
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a card slot structure of a single-chip microcomputer memory card, comprising a single-chip microcomputer body, a card slot shell fixedly installed on the top of the single-chip microcomputer body, a heat insulation box fixedly arranged inside the card slot shell, the bottom of the heat insulation box is fixedly welded to the top of the single-chip microcomputer body, a contact pad fixedly arranged on the top of the single-chip microcomputer body, the contact pad is located inside the heat insulation box, a heat conduction pad is fixedly arranged on the top of the contact pad, a center block is fixedly connected to the top edge of the heat insulation box, a rotating center axis rod passes through the middle of the center block, the surface of the rotating center axis rod is rotatably connected to the inner wall of the center block, both ends of the rotating center axis rod are rotatably connected to lifting blocks, the bottom of the lifting block is fixedly connected to the top edge of the heat insulation box, and the surface of the rotating center axis rod is fixedly sleeved with two A synchronous sleeve, the surface of the rotating central axis rod is sleeved with two torsion springs, the two ends of the torsion spring are respectively fixedly connected to the surface of the central block and the edge of the synchronous sleeve, the right sides of the two synchronous sleeves are fixedly connected with pressure plates, a middle pressure shoulder is arranged between the two pressure plates, the tops of the two pressure plates are penetrated by threaded bottom push rods, the surfaces of the threaded bottom push rods are threadedly connected to the inner walls of the pressure plates, the bottoms of the two threaded bottom push rods are rotatably connected to the top of the middle pressure shoulder, the right side of the middle pressure shoulder is fixedly connected with two pressing plates, a partition plate is fixedly arranged inside the heat insulation box, a heat conductive buried plate is fixedly arranged in the middle of the partition plate, a plurality of heat conductive rods are fixedly connected to the left side of the heat conductive buried plate, the left ends of the plurality of heat conductive rods are fixedly connected to the right edge of the contact pad, and a heat transfer plate is fixedly connected to the right side of the heat conductive buried plate.
[0007] Preferably, a heat-conducting tube is fixedly inserted into the right side of the card slot housing, and the bottom of the heat-conducting tube is fixedly connected to the top of the single-chip computer body.
[0008] Preferably, the right side of the heat transfer plate extends to the interior of the heat conduction tube, and the right end of the heat transfer plate is fixedly connected to an external heat dissipation plate.
[0009] Preferably, a temperature monitoring alarm is fixedly mounted on the inner wall of the heat insulation box, and the bottom of the temperature monitoring alarm is fixedly connected to the top of the single-chip computer body.
[0010] Preferably, the two synchronous sleeves are symmetrically distributed front and back about the middle part of the rotating central axis rod.
[0011] (III) Beneficial effects
[0012] The utility model provides a card slot structure for a single-chip microcomputer memory card, which has the following beneficial effects:
[0013] (1) The card slot structure of the single-chip computer memory card is provided with a card slot shell, and the coordinated use of a heat insulation box, a contact pad, a heat conductive pad transfer plate, a center block, a rotating center axis rod, a lifting block, a synchronous sleeve, a torsion spring, a pressure plate, a center pressure shoulder, a threaded bottom push rod, a pressing plate, a partition plate, a heat conductive buried plate, a heat conductive stick, a heat conductive pipe, a heat transfer plate, a temperature monitoring alarm and an external heat dissipation plate. Thus, the elastic force of the torsion spring is used to drive the pressing plate to press to the right side with the help of the pressure plate, so that the memory card is pressed into the card slot of the card slot shell. When the memory card is used, the heat generated by the memory card is promptly transferred to the heat conductive buried plate by the heat conductive pad transfer plate, and part of the heat is transferred to the right side space of the partition plate, and the heat is discharged to the outside through the heat transfer plate and the external heat dissipation plate. The temperature generated in the card slot is promptly discharged to the outside, thereby improving the heat dissipation efficiency in the memory card slot, so that the memory card can be used smoothly when in use. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a top view of the structure of the utility model;
[0015] Figure 2 The utility model structure Figure 1 A local internal enlarged schematic diagram of A;
[0016] Figure 3 The utility model structure Figure 2 An enlarged schematic diagram of point B;
[0017] Figure 4 The utility model structure Figure 2 Enlarged schematic diagram of point C.
[0018] In the figure: 1. MCU body; 2. Card slot shell; 3. Insulation box; 4. Contact pad; 5. Thermal pad transfer plate; 6. Center block; 7. Rotating center axis rod; 8. Lifting block; 9. Synchronous sleeve; 10. Torsion spring; 11. Pressure plate; 12. Center pressure shoulder; 13. Threaded push bottom rod; 14. Pressing plate; 15. Partition plate; 16. Thermal buried plate; 17. Thermal stick; 18. Thermal pipe; 19. Heat transfer plate; 20. Temperature monitoring alarm; 21. External heat sink. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] like Figure 1-4As shown, the utility model provides a technical solution: a card slot structure of a single-chip memory card, comprising a single-chip body 1, a card slot shell 2 is fixedly installed on the top of the single-chip body 1, a heat insulation box 3 is fixedly arranged inside the card slot shell 2, the bottom of the heat insulation box 3 is fixedly welded to the top of the single-chip body 1, a contact pad 4 is fixedly arranged on the top of the single-chip body 1, the contact pad 4 is located inside the heat insulation box 3, a heat conduction pad transfer plate 5 is fixedly arranged on the top of the contact pad 4, through the setting of the heat conduction pad transfer plate 5, the heat around the memory card is quickly transferred to the heat transfer plate 19 through the heat conduction pad transfer plate 5, so that the heat is quickly dissipated and transferred outward, a center block 6 is fixedly connected to the top edge of the heat insulation box 3, and a rotating central axis rod 7 runs through the middle of the center block 6 The surface of the rotating central axis rod 7 is rotatably connected to the inner wall of the center block 6. Through the setting of the center block 6, the effect of providing rotational support for the rotating central axis rod 7 is played. Both ends of the rotating central axis rod 7 are rotatably connected with lifting blocks 8. The bottom of the lifting block 8 is fixedly connected to the top edge of the heat insulation box 3. The surface of the rotating central axis rod 7 is fixedly sleeved with two synchronous sleeves 9. The two synchronous sleeves 9 are symmetrically distributed front and back in the middle of the rotating central axis rod 7. The surface of the rotating central axis rod 7 is sleeved with two torsion springs 10. The two ends of the torsion spring 10 are fixedly connected to the surface of the center block 6 and the edge of the synchronous sleeve 9 respectively. Through the setting of the torsion spring 10, the elastic force of the torsion spring 10 is used to continuously provide torsion to the rotating central axis rod 7, so that it passes through the pressure plate 11 and the middle pressure shoulder 12 provide a pressure effect on the pressing plate 14 to provide a positioning pressure force for the memory card. The right sides of the two synchronous sleeves 9 are fixedly connected with the pressure plates 11, and a middle pressure shoulder 12 is arranged between the two pressure plates 11. The tops of the two pressure plates 11 are penetrated by threaded bottom push rods 13, and the surfaces of the threaded bottom push rods 13 are threadedly connected to the inner walls of the pressure plates 11. The bottoms of the two threaded bottom push rods 13 are rotatably connected to the tops of the middle pressure shoulder 12. The right side of the middle pressure shoulder 12 is fixedly connected with two pressing plates 14. A partition plate 15 is fixedly arranged inside the heat insulation box 3. Through the arrangement of the partition plate 15, part of the heat generated around the memory card is quickly transferred to the right side space of the partition plate 15 by using the heat transfer plate 19, and finally gradually passes through the external heat dissipation plate 2 1 has the effect of dissipating heat to the outside, so as to improve the heat dissipation efficiency in the memory card slot. A heat-conducting buried plate 16 is fixedly arranged in the middle of the partition plate 15. A plurality of heat-conducting rods 17 are fixedly connected to the left side of the heat-conducting buried plate 16. The left ends of the plurality of heat-conducting rods 17 are fixedly connected to the right edge of the contact pad 4. A heat transfer plate 19 is fixedly connected to the right side of the heat-conducting buried plate 16. A heat-conducting pipe 18 is fixedly inserted into the right side of the card slot housing 2. The bottom of the heat-conducting pipe 18 is fixedly connected to the top of the single-chip computer body 1. The right side of the heat transfer plate 19 extends to the inside of the heat-conducting pipe 18. The right end of the heat transfer plate 19 is fixedly connected to an external heat dissipation plate 21. A temperature monitoring alarm 20 is fixedly installed on the inner wall of the heat insulation box 3. The bottom of the temperature monitoring alarm 20 is fixedly connected to the top of the single-chip computer body 1.By setting the temperature monitoring alarm 20, the temperature alarm function of the temperature monitoring alarm 20 is used to timely warn of the high temperature in the memory card slot, so as to prevent the memory card from being damaged by continued high-speed use due to excessive temperature.
[0021] When in use, first twist and press the pressing plate 14 to the left to make it rotate and swing around the rotating central axis rod 7, then place the memory card in the card slot of the heat insulation box 3, and then release the pressure force. The memory card is pressed and fixed in the card slot of the heat insulation box 3 by the elastic force of the torsion spring 10. The heat generated by the memory card during use is promptly transferred to the heat conductive buried plate 16 by the heat conductive pad transfer plate 5, and part of the heat is transferred to the right side space of the partition plate 15, and the heat is discharged to the outside through the heat transfer plate 19 and the external heat dissipation plate 21, and the temperature generated in the card slot is promptly discharged to the outside. , which improves the heat dissipation efficiency in the memory card slot, thereby allowing the memory card to be used smoothly. When it is necessary to adjust the height of the pressing plate 14 pressing downward according to usage requirements so that the memory card can be pressed and positioned with a more appropriate strength, the two threaded bottom pushing rods 13 on the top are synchronously rotated, and the threaded pushing principle of the threaded bottom pushing rods 13 and the pressing plate 11 is utilized to drive the middle pressure shoulder 12 to move vertically downward, that is, drive the two pressing plates 14 to move downward until they are moved to a suitable position. At the same time, the contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.
[0022] In summary, the card slot structure of the single-chip memory card, through the setting of the card slot shell 2, and the use of the heat insulation box 3, the contact pad 4, the heat conduction pad transfer plate 5, the center block 6, the rotating center axis rod 7, the lifting block 8, the synchronous sleeve 9, the torsion spring 10, the pressure plate 11, the middle pressure shoulder 12, the threaded push bottom rod 13, the pressing plate 14, the partition plate 15, the heat conduction buried plate 16, the heat conduction stick 17, the heat conduction pipe 18, the heat transfer plate 19, the temperature monitoring alarm 20 and the external heat sink 21, thereby playing a role through the elasticity of the torsion spring 10 The pressing plate 14 is pressed to the right by the pressure plate 11, and the memory card is pressed into the card slot of the card slot housing 2. When the memory card generates heat during use, the heat is promptly transferred to the heat-conducting buried plate 16 by the thermal pad transfer plate 5, and part of the heat is transferred to the right side space of the partition plate 15, and the heat is discharged outwardly through the heat transfer plate 19 and the external heat sink 21, and the temperature generated in the card slot is promptly discharged outwardly, thereby improving the heat dissipation efficiency in the memory card slot, so that the memory card can be used smoothly when in use.
[0023] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A card slot structure for a single-chip microcomputer memory card, comprising a single-chip microcomputer body (1), characterized in that: A card slot housing (2) is fixedly installed on the top of the single-chip computer body (1), a heat insulation box (3) is fixedly arranged inside the card slot housing (2), the bottom of the heat insulation box (3) is fixedly welded to the top of the single-chip computer body (1), a contact pad (4) is fixedly arranged on the top of the single-chip computer body (1), the contact pad (4) is located inside the heat insulation box (3), a heat conduction pad (5) is fixedly arranged on the top of the contact pad (4), and the top edge of the heat insulation box (3) is fixedly connected to A central block (6), wherein a rotating central axis rod (7) is passed through the middle of the central block (6), the surface of the rotating central axis rod (7) is rotatably connected to the inner wall of the central block (6), both ends of the rotating central axis rod (7) are rotatably connected to lifting blocks (8), the bottom of the lifting block (8) is fixedly connected to the top edge of the heat insulation box (3), the surface of the rotating central axis rod (7) is fixedly sleeved with two synchronous sleeves (9), the surface of the rotating central axis rod (7) is sleeved with two torsion springs (10), the torsion springs The two ends of (10) are respectively fixedly connected to the surface of the middle block (6) and the edge of the synchronous sleeve (9), the right sides of the two synchronous sleeves (9) are fixedly connected with a pressure plate (11), a middle pressure shoulder (12) is arranged between the two pressure plates (11), the tops of the two pressure plates (11) are penetrated by a threaded bottom push rod (13), the surface of the threaded bottom push rod (13) is threadedly connected to the inner wall of the pressure plate (11), and the bottoms of the two threaded bottom push rods (13) are screwed to the top of the middle pressure shoulder (12). The middle pressure shoulder (12) is dynamically connected, two pressing plates (14) are fixedly connected to the right side of the middle pressure shoulder (12), a partition plate (15) is fixedly arranged inside the heat insulation box (3), a heat conduction buried plate (16) is fixedly arranged in the middle of the partition plate (15), a plurality of heat conduction rods (17) are fixedly connected to the left side of the heat conduction buried plate (16), the left ends of the plurality of heat conduction rods (17) are fixedly connected to the right side edge of the contact pad (4), and a heat transfer plate (19) is fixedly connected to the right side of the heat conduction buried plate (16).
2. The card slot structure of a single-chip microcomputer memory card according to claim 1, characterized in that: A heat-conducting tube (18) is fixedly inserted into the right side of the slot housing (2), and the bottom of the heat-conducting tube (18) is fixedly connected to the top of the single-chip computer body (1).
3. The card slot structure of a single-chip microcomputer memory card according to claim 2, characterized in that: The right side of the heat transfer plate (19) extends to the interior of the heat conduction pipe (18), and the right end of the heat transfer plate (19) is fixedly connected to an external heat dissipation plate (21).
4. The card slot structure of a single-chip microcomputer memory card according to claim 1, characterized in that: A temperature monitoring alarm (20) is fixedly mounted on the inner wall of the heat-insulating box (3), and the bottom of the temperature monitoring alarm (20) is fixedly connected to the top of the single-chip computer body (1).
5. The card slot structure of a single-chip microcomputer memory card according to claim 1, characterized in that: The two synchronous sleeves (9) are respectively distributed frontally and rearwardly symmetrically at the middle of the rotating central axis rod (7).