Multi-layer heat dissipation structure device of industrial personal computer power module

Abstract

The utility model relates to the technical field of heat dissipation structures, in particular to a multi-layer heat dissipation structure device of an industrial personal computer power module. According to the technical scheme, the heat dissipation assembly comprises multiple layers of heat dissipation fins, a fan, a temperature sensor, an electric push rod and a sliding plate, the fan is fixedly installed on the front side of the multiple layers of heat dissipation fins, the temperature sensor is electrically connected with the electric push rod, the end of the electric push rod is fixedly connected with the sliding plate, and the sliding plate is arranged in a shell and slides at a heat dissipation opening. According to the utility model, when the temperature of the power supply module is high, the fan rotates forwards to blow heat in the shell outwards; when the temperature of the power module is low, the multiple layers of heat dissipation fins dissipate heat and heat air, the fan rotates reversely to blow the hot air into the shell, the air cavity is filled with the hot air, the hot air is used for supplying heat to the power module, the heat dissipation direction is adjusted according to the environment temperature, and the power module can operate at the proper environment temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation structures, in particular to a multi-layer heat dissipation structure device of an industrial control computer power module. Background Art

[0002] Industrial computers are computers applied to industry. They are mainly used for industrial control and testing in industrial production. Industrial computers work in different occasions, and their components are different from general computers. For example, the harsh environment of industrial control often requires special components to form computers for industrial control. The power supply of industrial computers can provide stable voltage for industrial computers.

[0003] In the prior art, the power module of the industrial computer absorbs the heat of the power supply through the heat exchange plate, and uses the heat dissipation plate to exchange heat with the heat exchange plate to speed up the heat exchange speed, and uses a fan to blow air to the heat conduction plate and the power supply to reduce the temperature of the heat conduction plate and the power supply.

[0004] However, this heat dissipation method only considers the heat generated by the industrial computer power module during operation, and does not consider seasonal changes and temperature changes from high to low. If the industrial computer power module operates in a low temperature environment and the heat dissipation method of the power module is not changed, the operating stability of the power module will be affected. Utility Model Content

[0005] The utility model aims to solve the problem in the background technology that the heat dissipation of the power module is not adjusted when the seasons change, which affects the stability of the power module, and proposes a multi-layer heat dissipation structure device for the power module of an industrial control computer.

[0006] The technical solution of the utility model: a multi-layer heat dissipation structure device of an industrial computer power module comprises a shell, a power module is fixedly installed inside the shell, an extension frame is arranged at the front end of the shell, and a heat dissipation port is opened on one side of the shell close to the extension frame;

[0007] A heat dissipation component, comprising a multi-layer heat dissipation fin, a fan, a temperature sensor, an electric push rod and a slide plate, wherein the fan is fixedly installed on the front side of the multi-layer heat dissipation fin, the temperature sensor is electrically connected to the electric push rod, the end of the electric push rod is fixedly connected to the slide plate, and the slide plate slides inside the housing and at the heat dissipation port;

[0008] The back of the multi-layer heat dissipation fin is fixedly connected to the power module, the multi-layer heat dissipation fin is fixedly installed on the inner wall of the extension frame, and the temperature sensor is fixedly installed on the side of the power module.

[0009] Optionally, the skateboard is provided with a plurality of docking fence openings, which are equidistantly distributed along a straight line of the skateboard, and the docking fence openings and the heat dissipation openings adopt the same rectangular structure, and the positions of the docking fence openings and the heat dissipation openings are aligned.

[0010] Optionally, two slide plates are provided and symmetrically arranged on the inner wall of the shell, and the end of the electric push rod is fixedly connected to the extension frame.

[0011] Optionally, the slide plate adopts a transversely placed T-shaped structure, and a guide rod is slidably connected to a protruding position at the bottom of the slide plate, and both ends of the guide rod are fixedly connected to the shell.

[0012] Optionally, a heat exchange plate is fixedly mounted on the rear side of the multi-layer heat dissipation fins, and the heat exchange plate passes between the two slide plates and extends to the interior of the power module.

[0013] Optionally, there is an air cavity between the shell and the power module, the extension frame is connected to the air cavity through a heat dissipation port, and a cover plate covering the power module is fixedly installed on the top of the shell.

[0014] Optionally, a mounting frame is fixedly mounted on the inner wall of the extension frame and located directly in front of the multi-layer heat dissipation fins, and the mounting frame fixes the filter screen via a magnetic strip.

[0015] Compared with the prior art, the utility model has the following beneficial technical effects:

[0016] When the temperature of the power module is high, the fan rotates forward to blow the heat in the shell outward; when the temperature of the power module is low, the multi-layer heat dissipation fins dissipate heat and heat the air, and the fan reverses to blow the hot air into the interior of the shell, so that the air cavity is filled with hot air, and the hot air is used to heat the power module. The heat dissipation direction is adjusted according to the ambient temperature, so that the power module can operate in a suitable ambient temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the overall structure of an embodiment of the utility model is given;

[0018] Figure 2 A schematic diagram of the separation of the filter structure of an embodiment of the utility model is given;

[0019] Figure 3 A schematic cross-sectional view of a shell structure of an embodiment of the utility model is given;

[0020] Figure 4 A schematic diagram of the heat exchange plate structure of an embodiment of the utility model is given;

[0021] Figure 5 A schematic diagram of a multi-layer heat dissipation fin structure of an embodiment of the utility model is given.

[0022] Figure numerals: 1. Shell; 2. Power module; 3. Extension frame; 4. Heat dissipation assembly; 41. Multi-layer heat dissipation fins; 42. Fan; 43. Heat exchange plate; 44. Temperature sensor; 45. Electric push rod; 46. Slide plate; 47. Docking fence opening; 5. Cover plate; 6. Installation frame; 7. Filter; 8. Heat dissipation port. DETAILED DESCRIPTION

[0023] The technical solution of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all of the embodiments.

[0024] The components of the embodiments of the present invention generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention.

[0025] Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present utility model.

[0026] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] Example 1

[0029] This embodiment proposes a multi-layer heat dissipation structure device for an industrial computer power module, such as Figure 1 and 2As shown, it includes a shell 1, a power module 2 is fixedly installed inside the shell 1, an extension frame 3 is arranged at the front end of the shell 1, and a heat dissipation port 8 is opened on the side of the shell 1 close to the extension frame 3; a heat dissipation component 4 is arranged inside the extension frame 3, and a cover plate 5 covering the power module 2 is fixedly installed on the top of the shell 1.

[0030] The extension frame 3 is connected to the air cavity through the heat dissipation opening 8 , and the air inside the housing 1 and the outside air can flow through each other.

[0031] like Figure 2-4 As shown, the heat dissipation component 4 includes a multi-layer heat dissipation fin 41, a fan 42, a temperature sensor 44, an electric push rod 45 and a slide plate 46. The back of the multi-layer heat dissipation fin 41 is fixedly connected to the power module 2. A heat exchange plate 43 is fixedly installed on the rear side of the multi-layer heat dissipation fin 41. The heat exchange plate 43 extends to the interior of the power module 2. The temperature dissipated from the power module 2 is conducted to the multi-layer heat dissipation fin 41 through the heat exchange plate 43. The multi-layer heat dissipation fin 41 is fixedly installed on the inner wall of the extension frame 3. A fan 42 is fixedly installed on the front side of the multi-layer heat dissipation fin 41. The hot air inside the shell 1 is blown out through the forward rotation of the fan 42. At the same time, the wind blown by the fan 42 passes through the multi-layer heat dissipation fin 41 to accelerate the temperature dissipation of the multi-layer heat dissipation fin 41.

[0032] like Figure 3 As shown, two slide plates 46 are provided and symmetrically arranged on the inner wall of the housing 1, the end of the electric push rod 45 is fixedly connected to the extension frame 3, the multi-layer heat dissipation fins 41 are fixedly installed on the inner wall of the extension frame 3, and the temperature sensor 44 is fixedly installed on the side of the power module 2. The temperature of the power module 2 is detected by the temperature sensor 44.

[0033] The temperature sensor 44 is electrically connected to the electric push rod 45 through the controller. The end of the electric push rod 45 is fixedly connected to the slide plate 46. The slide plate 46 slides inside the shell 1 and is located at the heat dissipation port 8. A plurality of docking fence openings 47 are provided on the slide plate 46. The plurality of docking fence openings 47 are equidistantly distributed along the straight line of the slide plate 46. The docking fence openings 47 and the heat dissipation port 8 adopt the same rectangular structure, and the positions of the docking fence openings 47 and the heat dissipation port 8 are aligned.

[0034] When the temperature of the power module 2 is high, the temperature sensor 44 detects the temperature of the power module 2, and the temperature sensor 44 makes the electric push rod 45 fully extended through the controller, the two slide plates 46 move towards each other and contact, the docking fence opening 47 is aligned with the heat dissipation opening 8, and the fan 42 rotates forward to make the multi-layer heat dissipation fins 41 dissipate heat;

[0035] When the temperature of the power module 2 is low, the two slides 46 move toward each other and contact each other, the docking fence opening 47 is aligned with the heat dissipation port 8, and the fan 42 reverses to blow heat into the inside of the shell 1 to recover heat energy; when the temperature is too low, the temperature sensor 44 contracts the electric push rod 45 through the controller to separate the two slides 46, and the fan 42 stops rotating, and the docking fence opening 47 is staggered with the heat dissipation port 8. At this time, the air inside the shell 1 cannot circulate to the outside, and the shell 1 is closed for insulation.

[0036] like Figure 2 As shown, there is an air cavity between the shell 1 and the power module 2. When the temperature is high, the power module 2 can dissipate heat to the surroundings to increase the heat dissipation surface; when the temperature is low, the recovered hot air fills the air cavity, and the power module 2 is wrapped by the air cavity for alignment and heating.

[0037] The slide plate 46 adopts a transversely placed T-shaped structure, and a guide rod is slidably connected to the protruding position at the bottom of the slide plate 46, and both ends of the guide rod are fixedly connected to the housing 1. The guide rod guides and supports the slide plate 46 to prevent the slide plate 46 from tilting.

[0038] An installation frame 6 is fixedly installed on the inner wall of the extension frame 3 and located just in front of the multi-layer heat dissipation fins 41. The installation frame 6 is fixedly installed with a filter screen 7 through a magnetic strip. The filter screen 7 prevents dust from entering the interior of the housing 1.

[0039] In this embodiment, when the temperature of the power module 2 is high, the fan 42 rotates forward to blow the heat in the shell 1 outward; when the temperature of the power module 2 is low, the multi-layer heat dissipation fins 41 dissipate heat and heat the air, and the fan 42 reverses to blow the hot air into the interior of the shell 1, so that the air cavity is filled with hot air, and the hot air is used to heat the power module 2. The heat dissipation direction is adjusted according to the ambient temperature, so that the power module 2 can operate in a suitable ambient temperature.

[0040] The above-mentioned specific embodiments are only several optional embodiments of the present invention. Based on the technical solution of the present invention and the relevant inspiration of the above-mentioned embodiments, those skilled in the art can make various alternative improvements and combinations to the above-mentioned specific embodiments.

Claims

1. A multi-layer heat dissipation structure device for an industrial computer power module, comprising a housing (1), wherein a power module (2) is fixedly installed inside the housing (1), characterized in that: An extension frame (3) is provided at the front end of the shell (1), and a heat dissipation port (8) is provided on a side of the shell (1) close to the extension frame (3); A heat dissipation component (4), comprising a multi-layer heat dissipation fin (41), a fan (42), a temperature sensor (44), an electric push rod (45) and a slide plate (46), wherein the fan (42) is fixedly mounted on the front side of the multi-layer heat dissipation fin (41), the temperature sensor (44) is electrically connected to the electric push rod (45), the end of the electric push rod (45) is fixedly connected to the slide plate (46), and the slide plate (46) slides inside the housing (1) and at the heat dissipation port (8); The back of the multi-layer heat dissipation fin (41) is fixedly connected to the power module (2), the multi-layer heat dissipation fin (41) is fixedly mounted on the inner wall of the extension frame (3), and the temperature sensor (44) is fixedly mounted on the side of the power module (2).

2. The multi-layer heat dissipation structure device of the industrial computer power module according to claim 1, characterized in that: The slide plate (46) is provided with a plurality of docking fence openings (47), the plurality of docking fence openings (47) being equidistantly distributed along a straight line of the slide plate (46), the docking fence openings (47) and the heat dissipation openings (8) having the same rectangular structure, and the positions of the docking fence openings (47) and the heat dissipation openings (8) being aligned.

3. The multi-layer heat dissipation structure device of the industrial computer power module according to claim 1, characterized in that: Two slide plates (46) are provided and are symmetrically arranged on the inner wall of the housing (1); the end of the electric push rod (45) is fixedly connected to the extension frame (3).

4. The multi-layer heat dissipation structure device of the industrial computer power module according to claim 3, characterized in that: The slide plate (46) adopts a transversely placed T-shaped structure, and a guide rod is slidably connected to a protruding position at the bottom of the slide plate (46), and both ends of the guide rod are fixedly connected to the housing (1).

5. The multi-layer heat dissipation structure device of the industrial computer power module according to claim 4, characterized in that: A heat exchange plate (43) is fixedly mounted on the rear side of the multi-layer heat dissipation fins (41); the heat exchange plate (43) passes between the two slide plates (46) and extends into the interior of the power module (2).

6. The multi-layer heat dissipation structure device of the industrial computer power module according to claim 1, characterized in that: An air cavity exists between the shell (1) and the power module (2); the extension frame (3) is connected to the air cavity via a heat dissipation port (8); and a cover plate (5) covering the power module (2) is fixedly mounted on the top of the shell (1).

7. The multi-layer heat dissipation structure device of the industrial computer power module according to claim 1, characterized in that: An installation frame (6) is fixedly installed on the inner wall of the extension frame (3) and located directly in front of the multi-layer heat dissipation fins (41), and the installation frame (6) is fixedly installed with a filter screen (7) via a magnetic strip.

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