Embedded vapor-liquid two-phase cold plate heat dissipation device for intelligent computing server
Through the embedded two-phase cold plate heat dissipation device of vapor and liquid, combined with the internal and external circulation system, the problem of insufficient heat dissipation of high-density intelligent computing servers is solved, and efficient heat dissipation and cooling are achieved, ensuring server stability and reducing maintenance costs.
Patent Information
- Application Number
- CN202420951792.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-06
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-05-06
AI Technical Summary
Due to the limited cooling area of high-density intelligent computing servers, traditional air-cooled cooling modes cannot effectively reduce server temperature, resulting in reduced performance, reduced stability and increased maintenance costs.
The embedded two-phase cold plate heat dissipation device of vapor and liquid is combined with the inner fan and the outer circulation system. The gas and liquid two-phase cold plate and the chip are connected through thermally conductive silicone. The internal circulation system and the outer circulation system jointly realize the gas and liquid two-phase heat dissipation, and use refrigerant Channels and heat exchangers improve heat dissipation efficiency.
It significantly improves the cooling efficiency, avoids excessive operation of the heat dissipation device, ensures the stable operation of the server in a high-density environment and reduces maintenance costs.
Smart Images

Figure CN222213334U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of server heat dissipation, and in particular to an embedded vapor-liquid two-phase cold plate heat dissipation device for an intelligent computing server. Background Art
[0002] In data centers, with the rapid development of technologies such as cloud computing, big data, and artificial intelligence, the demand for high-density intelligent computing servers is increasing. High-density intelligent computing servers use a more compact design (mainly including high-power CPU or GPU chips, which generate a lot of heat when running), integrating more computing resources in a smaller physical space to improve performance density and energy efficiency. However, with the increase in server density, the traditional air cooling mode faces limitations. Traditional servers usually use fans and heat sinks to dissipate heat, but in high-density intelligent computing servers, due to the limited heat dissipation area, air cooling often cannot effectively reduce the temperature of the server, which not only leads to reduced server performance, reduced stability, and even failure, but also increases maintenance costs. Utility Model Content
[0003] The utility model provides an embedded vapor-liquid two-phase cold plate heat dissipation device for an intelligent computing server, which solves the problem that high-density intelligent computing servers lack effective heat dissipation and cooling equipment.
[0004] An embedded gas-liquid two-phase cold plate heat dissipation device for an intelligent computing server comprises: a gas-liquid two-phase cold plate, an internal fan, an internal circulation system connected to the gas-liquid two-phase cold plate, and an external circulation system arranged outside a casing of the server;
[0005] The gas-liquid two-phase cold plate is connected to the server chip through thermal conductive silicone, the internal fan is connected to the gas-liquid two-phase cold plate through bolts, and the air outlet of the internal fan is connected to the heat dissipation port on the server casing; the gas-liquid two-phase cold plate is also distributed with refrigerant channels;
[0006] The internal circulation system includes a heat exchanger, a refrigerant storage tank and a gas-liquid two-phase pump. The refrigerant storage tank is connected to the liquid inlet of the refrigerant channel through the internal circulation inlet pipe, and the liquid outlet of the refrigerant channel is connected to the internal circulation outlet pipe. The internal circulation outlet pipe is connected to the cold pipe side of the heat exchanger. The heat exchanger is connected to the refrigerant storage tank, and the gas-liquid two-phase pump is arranged on the internal circulation inlet pipe.
[0007] The external circulation system includes a refrigerant circulation pump, an external liquid storage tank, an external circulation inlet pipe and an external circulation return pipe. The external circulation inlet pipe and the external circulation return pipe are connected to one side of the heat pipe of the heat exchanger. The refrigerant circulation pump is arranged on the external circulation inlet pipe and is located at the front end of the external liquid storage tank. The external circulation return pipe is connected to an external cold source, and the external cold source is connected to the external liquid storage tank.
[0008] Furthermore, a controller is arranged outside the casing of the server, and the controller is connected to the display screen unit.
[0009] Furthermore, a temperature sensor is provided on the inner circulation outlet pipe, and the temperature sensor is communicatively connected with the controller.
[0010] Furthermore, a compressor and a one-way valve are arranged on the above-mentioned external circulation return pipe, the compressor and the one-way valve are arranged in series with the refrigerant circulation pump, the compressor and the one-way valve are arranged in parallel, and the compressor and the one-way valve are respectively communicated with the controller.
[0011] Furthermore, a compressor and a one-way valve are also provided on the above-mentioned internal circulation inlet pipe. The one-way valve is arranged in series with the gas-liquid two-phase pump, and the compressor and the one-way valve are arranged in parallel. The one-way valve and the gas-liquid two-phase pump are respectively communicated with the controller.
[0012] Furthermore, pressure gauges are respectively provided on the internal circulation inlet pipe and the internal circulation outlet pipe, and the pressure gauges are communicatively connected with the controller.
[0013] Furthermore, the external liquid storage tank and the refrigerant storage tank are respectively provided with liquid level gauges, and the liquid level gauges are communicatively connected with the controller.
[0014] Furthermore, the heat exchanger, refrigerant storage tank and gas-liquid two-phase pump are all arranged outside the casing of the server.
[0015] The utility model has the following beneficial effects: the heat dissipation device of the utility model combines the internal fan air cooling inside the server casing with the liquid cooling of the external circulation of the casing, and the gas-liquid two-phase heat dissipation and cooling method is used to cool the server, which can greatly improve the heat dissipation and cooling efficiency; at the same time, applicable cooling can be performed according to the heat dissipated when the server is working, which can ensure the cooling efficiency and avoid excessive operation of the heat dissipation and cooling device. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the connection structure of the components of the heat dissipation device of the utility model;
[0017] Figure 2 It is a schematic diagram of the arrangement structure of the gas-liquid two-phase cold plate and the chip in the utility model;
[0018] Figure 3 It is a refrigerant flow circuit diagram when the compressor is running in the embodiment of the utility model;
[0019] Figure 4 This is a circuit diagram of the refrigerant flow when the compressor is stopped in an embodiment of the present utility model.
[0020] In the figure: 1-gas-liquid two-phase cold plate; 2-thermal conductive silica gel; 3-chip; 4-internal fan; 5-bolt; 6-refrigerant channel; 7-heat dissipation port; 8-internal circulation inlet pipe; 9-internal circulation outlet pipe; 10-housing; 11-temperature sensor; 12-heat exchanger; 13-refrigerant storage tank; 14-gas-liquid two-phase pump; 15-controller; 16-display unit; 17-refrigerant circulation pump; 18-external liquid storage tank; 19-external cold source; 20-external circulation inlet pipe; 21-external circulation return pipe. DETAILED DESCRIPTION
[0021] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.
[0022] refer to Figure 1 and Figure 2 The utility model provides an embedded gas-liquid two-phase cold plate heat dissipation device for an intelligent computing server, comprising: a gas-liquid two-phase cold plate 1, an internal fan 4, an internal circulation system connected to the gas-liquid two-phase cold plate 1, and an external circulation system arranged outside a casing 10 of the server.
[0023] The surface of the server chip 3 is affixed with thermally conductive silicone 2, and the surface of the thermally conductive silicone 2 is in close contact with the gas-liquid two-phase cold plate 1. When the chip 3 is running, the high temperature generated is transferred to the gas-liquid two-phase cold plate 1 through the thermally conductive silicone 2. The gas-liquid two-phase cold plate 1 is connected to the internal fan 4 through bolts 5, and the air outlet of the internal fan 4 is connected to the heat dissipation port 7 on the server casing 10. The operation of the internal fan 4 takes away the heat on the gas-liquid two-phase cold plate 1 and discharges the heat to the outside of the server casing 10, thereby cooling the server chip 3.
[0024] Refrigerant channels 6 are also distributed on the gas-liquid two-phase cold plate 1, and the chip 3 is cooled down by circulating refrigerant fluid in the refrigerant channels 6; the refrigerant channels 6 are densely distributed in the gas-liquid two-phase cold plate 1 in a zigzag shape, and the refrigerant channels 6 are close to the surface of the gas-liquid two-phase cold plate 1, which is convenient for quickly taking away heat and improving heat dissipation efficiency.
[0025] Among them, the internal circulation system includes a heat exchanger 12, a refrigerant storage tank 13 and a gas-liquid two-phase pump 14. The refrigerant storage tank 13 is connected to the liquid inlet of the refrigerant channel 6 through the internal circulation inlet pipe 8, and the liquid outlet of the refrigerant channel 6 is connected to the internal circulation outlet pipe 9. The internal circulation outlet pipe 9 is connected to the cold pipe side of the heat exchanger 12. The heat exchanger 12 is connected to the refrigerant storage tank 13, and the internal circulation passage is formed by the internal circulation inlet pipe 8, the refrigerant channel 6, the internal circulation outlet pipe 9, the heat exchanger 12, and the refrigerant storage tank 13. The gas-liquid two-phase pump 14 is arranged on the internal circulation inlet pipe 8 and located at the front end of the refrigerant storage tank 13. In this embodiment, the front end is the direction of the refrigerant fluid moving forward.
[0026] The external circulation system includes a refrigerant circulation pump 17, an external liquid storage tank 18, an external circulation inlet pipe 20 and an external circulation return pipe 21. The external circulation inlet pipe 20 and the external circulation return pipe 21 are connected to one side of the heat pipe of the heat exchanger 12. The refrigerant circulation pump 17 is arranged on the external circulation inlet pipe 20 and is located at the front end of the external liquid storage tank 18. The external circulation return pipe 21 is connected to the external cold source 19, and the external cold source 19 is connected to the external liquid storage tank 18. A circulation loop is formed by the external liquid storage tank 18, the refrigerant circulation pump 17, the external circulation inlet pipe 20, the heat exchanger 12, the external circulation return pipe 21, and the external cold source 19. The external cold source 19 is used to absorb heat and cool the refrigerant fluid with heat in the external circulation return pipe 21. The form of the external cold source 19 can be selected from air cooling equipment or water cooling equipment, such as water-cooled energy-saving air conditioner.
[0027] The internal circulation system brings the heat of the chip 3 to the heat exchanger 12, and transfers the heat to the external circulation system through the heat exchanger 12. The external circulation system brings the heat to the outside, and the refrigerant fluid in the internal circulation system re-enters the refrigerant channel 6 for circulation.
[0028] Preferably, the heat exchanger 12 is an evaporative condenser.
[0029] In order to facilitate control and operation, a controller 15 is provided outside the housing 10 of the server, and the controller 15 is connected to a display unit 16, through which data viewing and command operation can be performed. Among them, the display unit 16 is a liquid crystal touch screen, which is connected to the controller 15 for communication. Of course, the controller 15 and the display unit 16 can also be installed in other parts or in a separate cabinet. The controller 15 can be a programmable PLC controller of model S7-200, which is used to receive signals and data from other components and issue commands.
[0030] A temperature sensor 11 is provided on the inner circulation outlet pipe 9. The temperature sensor 11 is communicatively connected with the controller 15. The probe of the temperature sensor 11 is attached to the outside of the inner circulation outlet pipe 9. The temperature sensor 11 can detect the temperature of the refrigerant fluid flowing out of the refrigerant channel 6, and then judge the temperature of the chip 3 when working, provide a reference for whether to speed up the flow rate of the refrigerant fluid, and provide a basis for controlling the dew point temperature of the refrigerant fluid; wherein, the temperature sensor 11 is an existing product, and its model can be selected by oneself.
[0031] As a preferred embodiment, refer to Figure 3 and Figure 4A compressor and a one-way valve are arranged on the outer circulation return pipe 21. The compressor and the one-way valve are arranged in series with the refrigerant circulation pump 17. The compressor and the one-way valve are arranged in parallel. The compressor and the one-way valve are respectively connected to the controller 15 for communication. When the outdoor temperature is low, the outer circulation adopts natural cooling to dissipate heat. During this process, the compressor is turned off and the one-way valve is opened. When the natural environment temperature cannot meet the heat dissipation requirements, the compressor is turned on and the one-way valve is closed. Regardless of whether the one-way valve is opened or the compressor is working, the refrigerant fluid is pressurized and pushed by the refrigerant circulation pump 17 during the flow process.
[0032] As another embodiment, a compressor and a one-way valve are also provided on the inner circulation inlet pipe 8, the one-way valve is arranged in series with the gas-liquid two-phase pump 14, the compressor and the one-way valve are arranged in parallel, and the one-way valve and the gas-liquid two-phase pump 14 are respectively communicated with the controller 15. It should be noted that the compressor and the one-way valve here and the compressor and the one-way valve in the outer circulation system are two independent sets of equipment, which do not affect each other.
[0033] Preferably, the one-way valve is a solenoid valve, which communicates with the controller 15 to achieve flow and blocking of the branch.
[0034] Pressure gauges are respectively provided on the inner circulation inlet pipe 8 and the inner circulation outlet pipe 9. The pressure gauges are electronic pressure gauges, which are communicatively connected with the controller 15. The probes of the electronic pressure gauges extend into the inner circulation inlet pipe 8 and the inner circulation outlet pipe 9 to detect the pressure of the refrigerant fluid in the pipes, thereby providing a reference for further pressurization of the refrigerant fluid.
[0035] The external liquid storage tank 18 and the refrigerant storage tank 13 are respectively provided with liquid level gauges, which are in communication connection with the controller 15. The liquid level in the external liquid storage tank 18 and the refrigerant storage tank 13 is measured by the liquid level gauge, so as to replenish the refrigerant liquid in time.
[0036] The heat exchanger 12, the refrigerant storage tank 13 and the gas-liquid two-phase pump 14 are all arranged outside the server casing 10 to prevent the heat dissipated by the heat exchanger 12 and the heat generated by the gas-liquid two-phase pump 14 during operation from being transferred into the server casing 10. This arrangement can improve the heat dissipation efficiency.
[0037] The refrigerant fluid may be vapor-liquid refrigerant or various types of environmentally friendly refrigerants, or liquid cold water may be used.
[0038] In addition, the specific models of the gas-liquid two-phase pump 14, the internal fan 4, the temperature sensor 11, and the refrigerant circulation pump 17 in this embodiment are not limited and need to be selected according to the adaptability of the server size and operating time.
[0039] The utility model adds an embedded gas-liquid two-phase cold plate cooling device between the original radiator and the base structure without changing the connection between the original radiator and the base structure and the heat dissipation method. The heat dissipation method is changed from the original radiator and fan heat exchange and cooling to the gas-liquid two-phase cold plate cooling device giving priority to heat exchange and cooling. When the gas-liquid two-phase cold plate cooling device cannot work normally, the original radiator and fan can still be used for cooling. The two cooling systems back up each other for heat dissipation, which can ensure the normal heat dissipation requirements of the intelligent computing server chip, reduce operating risks, and improve safety.
[0040] The above is only a preferred embodiment of the utility model, which does not represent all possible forms of the utility model, and the protection scope of the utility model is not limited to such special statements and embodiments. According to the technical inspirations disclosed by the utility model, various other modifications and improvements that do not deviate from the essence of the utility model are made, and these modifications and improvements are still within the protection scope of the utility model.
Claims
1. Embedded vapor-liquid two-phase cold plate cooling device for intelligent computing servers, It is characterized in that include: A gas-liquid two-phase cold plate (1), an internal fan (4), an internal circulation system connected to the gas-liquid two-phase cold plate (1), and an external circulation system arranged outside a casing (10) of a server; The gas-liquid two-phase cold plate (1) is connected to the chip (3) of the server via a heat-conducting silica gel (2); the internal fan (4) is connected to the gas-liquid two-phase cold plate (1) via a bolt (5); the air outlet of the internal fan (4) is connected to the heat dissipation port (7) on the server casing (10); a refrigerant channel (6) is also distributed on the gas-liquid two-phase cold plate (1); The internal circulation system comprises a heat exchanger (12), a refrigerant storage tank (13) and a gas-liquid two-phase pump (14); the refrigerant storage tank (13) is connected to the liquid inlet of the refrigerant channel (6) through the internal circulation inlet pipe (8); the liquid outlet of the refrigerant channel (6) is connected to the internal circulation outlet pipe (9); the internal circulation outlet pipe (9) is connected to the cold pipe side of the heat exchanger (12); the heat exchanger (12) is connected to the refrigerant storage tank (13); and the gas-liquid two-phase pump (14) is arranged on the internal circulation inlet pipe (8); The external circulation system comprises a refrigerant circulation pump (17), an external liquid storage tank (18), an external circulation inlet pipe (20) and an external circulation return pipe (21); the external circulation inlet pipe (20) and the external circulation return pipe (21) are connected to one side of the heat pipe of the heat exchanger (12); the refrigerant circulation pump (17) is arranged on the external circulation inlet pipe (20) and is located at the front end of the external liquid storage tank (18); the external circulation return pipe (21) is connected to an external cold source (19); and the external cold source (19) is in communication with the external liquid storage tank (18).
2. According to claim 1, the embedded vapor-liquid two-phase cold plate heat dissipation device for intelligent computing servers, Features: A controller (15) is arranged outside the casing (10) of the server, and the controller (15) is connected to a display screen unit (16).
3. The embedded vapor-liquid two-phase cold plate heat dissipation device for intelligent computing servers according to claim 2, Features: The inner circulation outlet pipe (9) is provided with a temperature sensor (11), and the temperature sensor (11) is communicatively connected with the controller (15).
4. The embedded vapor-liquid two-phase cold plate heat dissipation device for intelligent computing servers according to claim 2, Features: The external circulation return pipe (21) is provided with a compressor and a one-way valve. The compressor and the one-way valve are arranged in series with the refrigerant circulation pump (17). The compressor and the one-way valve are arranged in parallel. The compressor and the one-way valve are respectively connected to the controller (15) for communication.
5. The intelligent computing server embedded vapor-liquid two-phase cold plate heat dissipation device according to claim 4, Features: The inner circulation inlet pipe (8) is also provided with a compressor and a one-way valve. The one-way valve is arranged in series with the gas-liquid two-phase pump (14). The compressor and the one-way valve are arranged in parallel. The one-way valve and the gas-liquid two-phase pump (14) are respectively connected to the controller (15) for communication.
6. The intelligent computing server embedded vapor-liquid two-phase cold plate heat dissipation device according to claim 2, Features: The internal circulation inlet pipe (8) and the internal circulation outlet pipe (9) are respectively provided with pressure gauges, and the pressure gauges are communicatively connected with the controller (15).
7. The intelligent computing server embedded vapor-liquid two-phase cold plate heat dissipation device according to claim 2, Features: The external liquid storage tank (18) and the refrigerant storage tank (13) are respectively provided with liquid level gauges, and the liquid level gauges are communicatively connected with the controller (15).
8. The embedded vapor-liquid two-phase cold plate heat dissipation device for intelligent computing servers according to any one of claims 1 to 5, Features: The heat exchanger (12), the refrigerant storage tank (13) and the gas-liquid two-phase pump (14) are all arranged outside the casing (10) of the server.
Citation Information
Cited By
Cooling device and server
WO2026144909A1
