Smart card

Abstract

The utility model discloses a smart card. The intelligent card comprises a first hard substrate, the first hard substrate comprises a first surface and a second surface which are opposite to each other, and the first surface is provided with a first slot; the second hard base body is arranged on one side of the second surface of the first hard base body, and a second open groove is formed in the second surface or the surface of the side, facing the first hard base body, of the second hard base body; when the second open slot is arranged on the second surface, the first open slot and the second open slot are not overlapped along the thickness direction of the intelligent card; the information carrier part is arranged in the first open slot; and the antenna unit is arranged in the second open slot. According to the intelligent card provided by the embodiment of the invention, the first hard substrate and the second hard substrate are adopted, so that the material hardness and the structural strength are higher, the intelligent card is not easy to deform, and the use performance of the intelligent card is improved.

Description

Technical Field

[0001] The present application relates to the technical field of smart cards, and in particular to a smart card. Background Art

[0002] Smart cards usually refer to cards with chip modules embedded in them. Smart cards include standard cards, which have specific sizes and are made of plastic. Smart cards are used to identify individuals and store their information. Various smart cards, such as work permits, ID cards, various financial transaction cards, membership cards, etc., have been widely used in people's lives.

[0003] Due to the limitation of the structural materials of existing smart cards, the performance of existing smart cards cannot meet the demand. Utility Model Content

[0004] The embodiment of the present application provides a smart card. Since the smart card provided by the embodiment adopts a first hard substrate and a second hard substrate, the material hardness and structural strength are higher, and deformation is not easy to occur, thereby improving the performance of the smart card.

[0005] An embodiment of the present application provides a smart card, comprising: a first hard substrate, the first hard substrate comprising a first surface and a second surface relative to each other, the first surface being provided with a first groove; a second hard substrate, arranged on a side of the second surface of the first hard substrate, the second surface or a side surface of the second hard substrate facing the first hard substrate being provided with a second groove; when the second groove is arranged on the second surface, the first groove and the second groove do not overlap in the thickness direction of the smart card; an information carrier portion, arranged in the first groove; and an antenna unit, arranged in the second groove.

[0006] According to the embodiment provided in the present application, a chip is also included. The chip is electrically connected to the antenna unit and is at least partially disposed in the second slot.

[0007] According to the embodiment provided in the present application, the second hard substrate also includes a third slot running through the second hard substrate; the smart card also includes a chip module, the chip module is at least partially disposed in the third slot, and the chip module is electrically connected to the antenna unit.

[0008] According to an embodiment provided in the present application, a fourth groove is further provided on the second surface, and the fourth groove is connected to the third groove to accommodate part of the chip module.

[0009] According to the embodiment provided in the present application, the chip module includes a connected carrier tape, a chip, and a packaging adhesive arranged on the side of the chip away from the carrier tape; the carrier tape and the chip are at least partially arranged in the third groove, and the packaging adhesive is arranged in the fourth groove.

[0010] According to an embodiment provided by the present application, along the thickness direction of the smart card, the depth of the third slot is greater than the thickness of the carrier tape.

[0011] According to the embodiment provided in the present application, it also includes a glue layer, which is arranged between the first hard substrate and the second hard substrate to bond the first hard substrate and the second hard substrate.

[0012] According to an embodiment provided by the present application, the information carrier portion includes at least one of a magnetic stripe, an anti-counterfeiting mark, and a signature strip.

[0013] According to an embodiment provided by the present application, the first surface is provided with at least two first slots arranged at intervals, and at least two of the magnetic strip, the anti-counterfeiting mark, and the signature strip are respectively arranged in different first slots.

[0014] According to the embodiment provided in the present application, the orthographic projection pattern of the antenna unit on the first hard substrate matches the orthographic projection pattern of the second groove on the first hard substrate.

[0015] According to the embodiments provided in the present application, the antenna unit includes a first annular portion and a second annular portion connected to the outer peripheral side of the first annular portion, and the second annular portion is electrically connected to the chip module; or, the antenna unit includes a first annular portion and a second annular portion connected to the inner peripheral side of the first annular portion, and the second annular portion is electrically connected to the chip module.

[0016] According to an embodiment provided by the present application, the antenna unit includes a flexible antenna.

[0017] According to the embodiment provided in the present application, it also includes a pattern layer, which is arranged on the first surface and / or the surface of the second hard substrate facing away from the first hard substrate, and the pattern layer is formed by one of silk screen printing, electroplating, color firing, and photolithography.

[0018] According to the embodiment provided in the present application, an anti-fingerprint layer is further included, and the anti-fingerprint layer is arranged on one side of the first surface and / or on a side of the surface of the second hard substrate facing away from the first hard substrate.

[0019] According to an embodiment provided in the present application, the first hard substrate and the second hard substrate include a hard material, and the hard material is ceramic or stone.

[0020] According to the embodiment provided by the present application, the hard material is sapphire material. The smart card provided by the embodiment of the utility model includes a first hard substrate, a second hard substrate, an antenna unit and an information carrier part, by setting a first groove on the first surface of the first hard substrate, and setting a second groove on the second surface or the side surface of the second hard substrate facing the first hard substrate to accommodate the information carrier part and the antenna unit, when the second groove is set on the second surface, along the thickness direction of the smart card, the first groove and the second groove do not overlap, so as to avoid the first hard substrate from being broken in the weak area due to stress release when the first groove and the second groove are prepared, that is, to ensure that the thickness of the first hard substrate meets the requirements and improve its structural strength. The smart card provided by this embodiment adopts the first hard substrate and the second hard substrate, and the material hardness and structural strength are higher, and it is not easy to deform, thereby improving the performance of the smart card. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 This is a schematic diagram of the structure of a smart card according to an embodiment of the present application;

[0023] Figure 2 This is an embodiment of the present application Figure 1 Schematic diagram of the cross section at AA in the middle;

[0024] Figure 3 Another embodiment of the present application Figure 1 Schematic diagram of the cross section at AA in the middle;

[0025] Figure 4 is a top view of a first hard substrate according to an embodiment of the present application;

[0026] Figure 5 It is a schematic diagram of the structure of a chip module and an antenna unit according to an embodiment of the present application;

[0027] Figure 6 It is a structural diagram of a chip module and an antenna unit according to another embodiment of the present application.

[0028] Reference numerals:

[0029] 1. The first hard matrix;

[0030] 2. Second hard matrix;

[0031] 3. Chip module;

[0032] 4. Antenna unit;

[0033] 5. Information carrier part; 51. Magnetic stripe; 52. Signature stripe; 53. Anti-counterfeiting mark;

[0034] 6. Adhesive layer;

[0035] 7. Pattern layer;

[0036] H1, first annular portion; H2, second annular portion; F1, first surface; F2, second surface; K1, first slot; K2, second slot; K3, third slot; K4, fourth slot. DETAILED DESCRIPTION

[0037] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, many specific details are proposed in order to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present application by showing examples of the present application.

[0038] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The embodiments will be described in detail below in conjunction with the accompanying drawings.

[0039] Relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation; they do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion; so that a process, method, article or apparatus that includes a series of elements includes not only those elements; but also includes other elements not explicitly listed; or also includes elements inherent to such process, method, article or apparatus. In the absence of more limitations; the elements defined by the sentence "comprises..."; does not exclude the existence of other identical elements in the process, method, article or apparatus that includes the elements.

[0040] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" another layer or region.

[0041] In addition, the term "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone; A and B exist at the same time; B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0042] It should be understood that in the embodiment of the present application, "B corresponding to A" means that B is associated with A and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A; B can also be determined according to A and / or other information.

[0043] See also Figure 1 and Figure 3 , Figure 1 This is a schematic diagram of the structure of a smart card according to an embodiment of the present application; Figure 2 This is an embodiment of the present application Figure 1 Schematic diagram of the cross section at AA in the middle; Figure 3 Another embodiment of the present application Figure 1 Schematic diagram of the cross section at AA in the middle.

[0044] An embodiment of the present application provides a smart card, including: a first hard substrate 1, the first hard substrate 1 includes a first surface F1 and a second surface F2 opposite to each other, the first surface F1 is provided with a first groove K1, a second hard substrate 2 is provided on the side of the second surface F2 of the first hard substrate 1, and the second surface F2 or the side surface of the second hard substrate 2 facing the first hard substrate 1 is provided with a second groove K2; when the second groove K2 is provided on the second surface F2, the first groove K1 and the second groove K2 do not overlap along the thickness direction of the smart card; an information carrier portion 5 is provided in the first groove K1; and an antenna unit 4 is provided in the second groove K2.

[0045] The smart card provided by the embodiment of the utility model includes a first hard substrate 1, a second hard substrate 2, an antenna unit 4 and an information carrier part 5. A first groove K1 is set on the first surface F1 of the first hard substrate 1, and a second groove K2 is set on the second surface F2 or the side surface of the second hard substrate 2 facing the first hard substrate 1 to accommodate the information carrier part 5 and the antenna unit 4. When the second groove K2 is set on the second surface F2, the first groove K1 and the second groove K2 do not overlap along the thickness direction of the smart card to avoid the first hard substrate 1 from being broken in the weak area due to stress release when the first groove K1 and the second groove K2 are prepared, that is, to ensure that the thickness of the first hard substrate 1 meets the requirements and improve its structural strength. The smart card provided by this embodiment adopts the first hard substrate 1 and the second hard substrate 2, so the material hardness and structural strength are higher, it is not easy to deform, and the performance of the smart card is improved.

[0046] In this embodiment, the first slot K1 and the second slot K2 may be formed by milling, CNC engraving, laser etching, or the like.

[0047] Optionally, both the first hard substrate 1 and the second hard substrate 2 include hard materials, and the hard materials are ceramics or stone. That is, both the first hard substrate 1 and the second hard substrate 2 can be made of ceramics or stone to ensure the hardness and structural strength of the smart card.

[0048] Optionally, the hard material is sapphire material.

[0049] In some optional embodiments, when the smart card is a contactless card, the smart card further comprises a chip, which is electrically connected to the antenna unit 4 and at least partially disposed in the second slot K2.

[0050] The chip is powered by the antenna unit 4. The chip and the antenna unit 4 may be disposed in the second slot K2.

[0051] Optionally, the antenna unit 4 includes a coil.

[0052] Optionally, the antenna units 4 are arranged in a ring shape, specifically in a square or circular shape.

[0053] Optionally, the chip is close to the magnetic field of the card reader, requiring the induced current generated by the coil to be able to provide contactless communication. The larger the coil encirclement area, the greater the induced current generated by the coil.

[0054] When the smart card is a dual-interface card, the second hard substrate 2 further includes a third slot K3 penetrating the second hard substrate 2; the smart card further includes a chip module 3, which is at least partially disposed in the third slot K3, and the chip module 3 is electrically connected to the antenna unit 4.

[0055] The chip module 3 includes a chip and a carrier tape. The front side of the carrier tape has a contact pad for supplying power to the chip during contact payment. The back side of the carrier tape also includes contacts connected to the coil in the antenna unit 4. During contactless payment, the coil supplies power to the chip.

[0056] Optionally, the carrier tape includes a carrier and a strip. The strip and the chip are conductively connected through leads. The carrier is used to carry the strip and connect components that fix the chip. The strip is used for interface purposes and can adopt a copper-based structure. Nickel-gold elements are electroplated on the contact surface to ensure signal transmission effect while avoiding rust or damage.

[0057] Optionally, the carrier tape is provided with a chip carrying area and several functional areas which are isolated from each other, and these functional areas are, in sequence, an input / output functional area, a clock functional area, a power functional area, a grounding functional area, a reset functional area and a vacant functional area.

[0058] Optionally, the orthographic projection pattern of the antenna unit 4 on the first hard substrate 1 matches the orthographic projection pattern of the second slot K2 on the first hard substrate 1. Specifically, the shapes of the antenna unit 4 and the second slot K2 can be the same, so that the second slot K2 can just accommodate the antenna unit 4, and the size of the second slot K2 can be slightly larger than the size of the antenna unit 4, so as to facilitate the arrangement of the antenna unit 4.

[0059] Optionally, the antenna unit 4 includes a first annular portion H1 and a second annular portion H2 connected to the outer circumference of the first annular portion H1, and the second annular portion H2 is electrically connected to the chip module 3, such as Figure 4 and Figure 5 Or, the antenna unit 4 includes a first annular portion H1 and a second annular portion H2 connected to the inner circumference of the first annular portion H1, and the second annular portion H2 is electrically connected to the chip module 3, such as Figure 6 shown.

[0060] In this embodiment, the first annular portion H1 and the second annular portion H2 can both adopt a rectangular ring-like structure for easy preparation. At the same time, the size of the second annular portion H2 can be smaller than the first annular portion H1 to facilitate electrical connection between the second annular portion H2 and the chip module 3.

[0061] See also Figures 4 to 5 In some optional embodiments, the second surface F2 is further provided with a fourth groove K4 , and the fourth groove K4 is connected to the third groove K3 to accommodate part of the chip module 3 .

[0062] Considering that the chip module 3 needs to be connected to the antenna unit 4, a fourth slot K4 needs to be provided on the first hard substrate 1, so that the chip module 3 can at least partially extend to the first hard substrate 1, so as to be connected to the antenna unit 4 located in the second slot K2. The specific shape and size of the fourth slot K4 needs to be set according to the specific shape and size of the chip module 3, and can be slightly larger than the size of the chip module 3 for easy setting.

[0063] The chip module 3 provided in the embodiment of the present application can be set to a conventional shape such as a square, or can be set to a circular shape, a waist shape, an irregular shape, or any other special shape.

[0064] In some optional embodiments, the chip module 3 includes a connected carrier tape, a chip, and a packaging adhesive disposed on a side of the chip away from the carrier tape; the carrier tape and the chip are at least partially disposed in the third slot K3, and the packaging adhesive is disposed in the fourth slot K4.

[0065] In this embodiment, the carrier tape can be completely arranged in the third slot K3, so that the carrier tape is exposed and easy to use, and the chip is located on the side of the carrier tape facing the first hard substrate 1, which is convenient for arrangement and avoids chip damage. The chip can be protected by providing a packaging glue to play a role of a protective barrier, isolating moisture, and preventing problems such as thermal shock, corrosion, bending, vibration, and physical and chemical damage caused by fatigue.

[0066] In some optional embodiments, along the thickness direction of the smart card, the depth of the third slot K3 is greater than the thickness of the carrier tape.

[0067] It is understandable that, since the carrier tape is exposed, the depth of the third slot K3 needs to be limited to be greater than the thickness of the carrier tape, so that the upper surface of the carrier tape cannot protrude relative to the second hard substrate 2, thereby avoiding damage to the carrier tape.

[0068] Similarly, in order to effectively accommodate the antenna unit 4 and the information carrier portion 5, optionally, along the thickness direction of the smart card, the depth of the second slot K2 is greater than or equal to the thickness of the antenna unit 4. And / or, along the thickness direction of the smart card, the depth of the first slot K1 is greater than or equal to the thickness of the information carrier portion 5.

[0069] See also Figure 2 In some optional embodiments, the smart card further includes an adhesive layer 6 , which is disposed between the first hard substrate 1 and the second hard substrate 2 to bond the first hard substrate 1 and the second hard substrate 2 .

[0070] In this embodiment, the first hard substrate 1 and the second hard substrate 2 can be bonded and fixed by utilizing the viscosity of the adhesive layer 6. Optionally, the adhesive layer 6 can be made of adhesive materials such as a thermosetting adhesive layer 6.

[0071] Optionally, the information carrier portion 5 includes at least one of a magnetic stripe 51, an anti-counterfeiting mark 53, and a signature stripe 52. The specific selection is based on specific needs. The information carrier portions 5 with different functions such as the magnetic stripe 51, the anti-counterfeiting mark 53, and the signature stripe 52 can be respectively arranged in different first slots K1 to avoid mutual interference.

[0072] For example, the first surface F1 is provided with at least two first slots K1 spaced apart from each other, and at least two of the magnetic stripe 51, the anti-counterfeiting mark 53, and the signature stripe 52 are respectively provided in different first slots K1. Optionally, the first surface F1 is provided with three first slots K1, and the three first slots K1 are used to respectively provide the magnetic stripe 51, the anti-counterfeiting mark 53, and the signature stripe 52.

[0073] Considering that the antenna unit 4 is embedded in the first hard substrate 1, and the groove edge of the hard substrate is relatively sharp, which can easily cause damage to the antenna unit 4. To avoid the above problem, in some optional embodiments, the antenna unit 4 includes a flexible antenna or an enameled wire winding antenna.

[0074] The flexible antenna can use a PI (Polyimide) substrate, which has high toughness and temperature resistance, and the PI substrate can be made thin enough, which is more conducive to embedding in the first hard substrate 1. The special material of the flexible antenna makes it basically impossible for the lead to be worn off, reducing the possibility of breakage during the production process.

[0075] Ceramic material is a special material with high hardness and high temperature resistance. Therefore, the traditional card graphic printing method is not suitable for processing on the surface of ceramic cards. In some optional embodiments, the smart card also includes a pattern layer 7, and the pattern layer 7 is arranged on the first surface F1 and / or the surface of the second hard substrate 2 away from the first hard substrate 1. The pattern layer 7 is formed by one of silk screen printing, electroplating, color firing, and photolithography.

[0076] The photolithography may be laser etching, which is ablation on the surface of the ceramic card by high-energy laser.

[0077] Optionally, the smart card further includes an anti-fingerprint layer, which is disposed on one side of the first surface F1 and / or on a side of the surface of the second hard substrate 2 facing away from the first hard substrate 1 .

[0078] After the smart card graphics are processed, an anti-fingerprint layer can be sprayed on one side of the first surface F1 and / or the surface side of the second hard substrate 2 facing away from the first hard substrate 1. The anti-fingerprint layer can not only prevent fingerprint accumulation to a certain extent, but also protect the graphics on the surface of the smart card. The anti-fingerprint layer is generally a transparent coating and will not affect the texture and color of the existing pattern.

[0079] The smart card provided in the embodiment of the present application can be used to implement electronic transaction functions. A smart card is a type of card with a predetermined length, width, and thickness, and is also portable and convenient to use. A smart card can be a financial card, a credit card, a stored-value card, a bus card, an access card, or a membership card, but is not limited to the types of cards listed above.

[0080] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A smart card, characterized in that: include: A first hard substrate, the first hard substrate comprising a first surface and a second surface opposite to each other, the first surface being provided with a first groove; A second hard substrate is provided on one side of the second surface of the first hard substrate, and a second groove is provided on the second surface or on a side of the second hard substrate facing the first hard substrate; When the second slot is disposed on the second surface, the first slot and the second slot do not overlap in the thickness direction of the smart card; An information carrier portion, disposed in the first slot; The antenna unit is arranged in the second slot.

2. The smart card according to claim 1, characterized in that: A chip is also included. The chip is electrically connected to the antenna unit and is at least partially disposed in the second slot.

3. The smart card according to claim 1, characterized in that: The second hard substrate further includes a third slot penetrating through the second hard substrate; The smart card further comprises a chip module, wherein the chip module is at least partially disposed in the third slot, and the chip module is electrically connected to the antenna unit.

4. The smart card according to claim 3, characterized in that: The second surface is further provided with a fourth slot, and the fourth slot is communicated with the third slot to accommodate part of the chip module.

5. The smart card according to claim 4, characterized in that: The chip module comprises a connected carrier tape, a chip, and a packaging adhesive disposed on a side of the chip away from the carrier tape; The carrier tape and the chip are at least partially disposed in the third slot, and the packaging glue is disposed in the fourth slot.

6. The smart card according to claim 5, characterized in that: In the thickness direction of the smart card, the depth of the third slot is greater than the thickness of the carrier tape.

7. The smart card according to claim 1, characterized in that: It also includes an adhesive layer, which is arranged between the first hard substrate and the second hard substrate to bond the first hard substrate and the second hard substrate.

8. The smart card according to claim 1, characterized in that: The information carrier portion includes at least one of a magnetic stripe, an anti-counterfeiting mark, and a signature strip.

9. The smart card according to claim 8, characterized in that: The first surface is provided with at least two first slots spaced apart from each other, and at least two of the magnetic strip, the anti-counterfeiting mark and the signature strip are respectively provided in different first slots.

10. The smart card according to claim 1, characterized in that: The orthographic projection pattern of the antenna unit on the first hard substrate matches the orthographic projection pattern of the second groove on the first hard substrate.

11. The smart card according to claim 3, characterized in that: The antenna unit includes a first annular portion and a second annular portion connected to the outer circumference of the first annular portion, and the second annular portion is electrically connected to the chip module; or, The antenna unit includes a first annular portion and a second annular portion connected to an inner circumference of the first annular portion, and the second annular portion is electrically connected to the chip module.

12. The smart card according to claim 1, characterized in that: The antenna unit includes a flexible antenna.

13. The smart card according to claim 1, characterized in that: It also includes a pattern layer, which is arranged on the first surface and / or the surface of the second hard substrate facing away from the first hard substrate, and the pattern layer is formed by one of silk screen printing, electroplating, color firing and photolithography.

14. The smart card according to claim 1, characterized in that: It also includes an anti-fingerprint layer, which is arranged on one side of the first surface and / or a side of the surface of the second hard substrate facing away from the first hard substrate.

15. The smart card according to claim 1, characterized in that: The first hard substrate and the second hard substrate include hard materials, and the hard materials are ceramics or stone.

16. The smart card according to claim 15, characterized in that: The hard material is sapphire material.

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