Chip heat dissipation cover plate
By designing the sealing accommodation cavity, working fluid injection pipe and sealing groove in the chip heat dissipation cover, the problems of working fluid leakage and insufficient sealing during the transportation of the heat dissipation cover are solved, and higher heat dissipation performance is achieved and service life.
Patent Information
- Application Number
- CN202420547581.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-20
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-03-20
AI Technical Summary
The existing chip heat dissipation cover is prone to damage the heat dissipation work fluid injection port during transportation, resulting in leakage of the working fluid, affecting the heat dissipation performance, and the seal is weak during oxidation treatment, increasing the leakage risk during later use.
A chip heat dissipation cover plate is designed, including an upper cover body and a lower cover body. The top end of the lower cover body is recessed downwardly, and the sealing accommodating chamber is on the side of the lower cover body. The working fluid injection tube extends to the accommodating chamber. Inside, the sealing and thermal conductivity are enhanced by blocking grooves and thermal columns to prevent leakage of working fluid.
It effectively prevents working fluid leakage, improves the service life and stability of the chip heat dissipation cover, enhances thermal conductivity, avoids damage to the seal during transportation, and ensures performance and reliability for later use.
Smart Images
Figure CN222214168U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip heat dissipation, in particular to a chip heat dissipation cover plate. Background Art
[0002] With the rapid development of science and technology, chips are showing a trend of high integration, complexity and high frequency. However, the increasing heat generation of chips has become a key factor hindering the improvement of chip performance and reliability. In order to ensure the maximum performance and stability of the chip, an integrated heat sink is required to dissipate heat for the chip. However, most integrated heat sinks cannot be directly fixed on the BGA circuit board. Therefore, most manufacturers have adopted a method of setting a heat sink component above the chip and then installing the integrated heat sink on the heat sink component for heat dissipation.
[0003] like Figure 1 As shown, the existing chip heat dissipation components are generally heat dissipation cover plates with a accommodating cavity made of materials with good thermal conductivity such as INVAR alloy, aluminum or copper, and the heat dissipation medium is injected into the accommodating cavity through the injection port on the heat dissipation cover plate, and then the injection port is closed, so as to improve the heat conduction and heat dissipation efficiency of the heat dissipation cover plate to the chip.
[0004] The heat dissipation medium injection port of the heat dissipation cover plate described above is arranged in a notch on one side of the heat dissipation cover plate. The heat dissipation cover plate is easily damaged at its injection port during transportation, resulting in leakage of the heat dissipation medium, which affects the thermal conductivity and heat dissipation performance of the heat dissipation cover plate. At the same time, when the heat dissipation cover plate surface is oxidized and impurities are removed, a certain corrosion effect will be caused on the sealing part of the heat dissipation medium injection port, causing the sealing part to be extremely weak, resulting in the risk of heat dissipation medium leakage during the later use of the heat dissipation cover plate.
[0005] Therefore, there is an urgent need for a chip heat dissipation cover to solve the above problems. Utility Model Content
[0006] Based on the above, the purpose of the utility model is to provide a chip heat dissipation cover plate to solve the problem that the heat dissipation medium injection port is damaged during the transportation of the heat dissipation cover plate and there is a risk of heat dissipation medium leakage during the use of the heat dissipation cover plate, which affects the heat dissipation and thermal conductivity performance of the heat dissipation cover plate.
[0007] In order to solve the above technical problems, the utility model adopts the following technical solutions:
[0008] The utility model provides a chip heat dissipation cover plate, comprising an upper cover body, a lower cover body and a working medium accommodating cavity which is recessed downwardly from the top surface of the lower cover body, wherein the upper cover body is fixedly connected to the lower cover body, and further comprising:
[0009] A sealing accommodating chamber, wherein the sealing accommodating chamber is arranged on one side of the lower cover body;
[0010] A working fluid injection pipe, one end of which passes through one side of the lower cover body along the sealing accommodating cavity and extends into the working fluid accommodating cavity, and the other end of which forms an inclined first sealing portion toward the top surface of the lower cover body;
[0011] A sealing groove is arranged at the bottom of the lower cover body, and the top of the sealing groove extends toward the working medium accommodating chamber and abuts against the working medium injection pipe to form a second sealing portion.
[0012] As an optional technical solution for a chip heat dissipation cover plate, the upper end surface of the sealed accommodating cavity and the top end surface of the lower cover body are integrally formed, and the upper cover body and the lower cover body are fixed by circumferential welding.
[0013] As an optional technical solution for a chip heat dissipation cover plate, the end of the first sealing portion is horizontally arranged with the side surface of the lower cover body or is arranged in the sealing accommodating cavity.
[0014] As an optional technical solution for a chip heat dissipation cover plate, a plurality of heat-conducting columns are provided in the working medium accommodating cavity, and the plurality of heat-conducting columns are fixedly arranged in an array at the bottom of the working medium accommodating cavity, and the top of the heat-conducting column abuts against the bottom end surface of the upper cover body.
[0015] As an optional technical solution for a chip heat dissipation cover plate, a plurality of collars are provided in the working medium accommodating chamber. The collars are annular hollow structures and are sleeved on the middle of the heat conducting column. A plurality of evaporation capillaries are provided in the cross section of the collars.
[0016] As an optional technical solution for a chip heat dissipation cover plate, the chip heat dissipation cover plate also includes two heat conductive plates, and a plurality of plug holes are opened on the two heat conductive plates, the hole diameter of the plug holes is larger than the diameter of the heat conductive column, and the hole diameter of the plug holes is smaller than the diameter of the ring, one of the heat conductive plates is plugged with the heat conductive column through the plug holes and is arranged on the bottom end surface of the working medium accommodating cavity, and the other heat conductive plate is plugged with the heat conductive column through the plug holes and is arranged on the top of the ring and abuts against the bottom end surface of the upper cover body.
[0017] As an optional technical solution for a chip heat dissipation cover plate, two support columns are fixedly provided at the bottom of the working fluid accommodating chamber on one side close to the sealing accommodating chamber, and the two support columns are arranged at intervals on the left and right sides of the working fluid injection pipe. Two pieces of the heat conducting plates are sequentially passed through the top of the support columns to abut against the bottom of the upper cover body.
[0018] As an optional technical solution for a chip heat dissipation cover plate, the heat-conducting column, the collar, the plug hole and the support column are cylindrical, ellipsoidal or rectangular parallelepiped structures.
[0019] As an optional technical solution for a chip heat dissipation cover plate, the bottom of the lower cover body is recessed toward the upper cover body to form a chip accommodating cavity, and a coating portion for heat conduction is provided in the middle of the chip accommodating cavity.
[0020] The beneficial effects of the utility model are:
[0021] The utility model provides a chip heat dissipation cover plate, which comprises an upper cover body, a lower cover body and a working medium accommodating cavity. A sealed accommodating cavity is arranged on one side of the lower cover body, a working medium injection pipe is arranged on the inner side of the sealed accommodating cavity, one end of the working medium injection pipe extends into the working medium accommodating cavity, and the other end is arranged in the sealed accommodating cavity, so as to inject working medium into the working medium accommodating cavity; after the working medium is injected, one end of the working medium injection pipe in the sealed accommodating cavity is sealed to form a first sealing part, so as to effectively prevent leakage of the working medium.
[0022] The structure that the first sealing portion is inclined toward the top surface of the lower cover body and is horizontally arranged with the side surface of the lower cover body or arranged in the sealing accommodating cavity effectively avoids damage to the first sealing portion by the chip heat dissipation cover during transportation, thereby improving the life and stability of the chip in later use.
[0023] At the same time, a sealing groove is arranged at the bottom of the lower cover body, and the top of the sealing groove extends toward the working medium accommodating chamber and abuts against the working medium injection pipe to form a second sealing portion, which further increases the risk of working medium leakage.
[0024] Secondly, the upper end surface of the sealed accommodating chamber and the top end surface of the lower cover body are integrally formed to increase the fitting area between the upper cover body and the lower cover body, thereby solving the risk of fluid leakage due to the small fitting area between the upper cover body and the lower cover body at the upper end surface of the sealed accommodating chamber. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 It is a schematic diagram of the overall structure of the heat dissipation cover plate in the background technology;
[0026] Figure 2 A top view of the overall structure of the chip heat dissipation cover plate in the embodiment of the utility model;
[0027] Figure 3 This is a schematic diagram of the structure decomposition of the chip heat dissipation cover plate in the embodiment of the utility model;
[0028] Figure 4 for Figure 3 A is a partial enlarged schematic diagram;
[0029] Figure 5 for Figure 2 A partial enlarged schematic diagram of B in the middle;
[0030] Figure 6It is a schematic cross-sectional structure diagram of a collar in a chip heat dissipation cover plate according to an embodiment of the utility model.
[0031] In the figure:
[0032] 1. Upper cover; 10. Heat conducting plate; 101. Plug hole; 11. Ring; 110. Evaporation capillary hole;
[0033] 2. Lower cover; 20. Chip accommodating cavity; 21. Coating part; 22. Working fluid injection pipe; 221. Second sealing part; 222. First sealing part; 23. Heat conducting column; 24. Support column; 25. Sealing accommodating cavity; 26. Sealing groove. DETAILED DESCRIPTION
[0034] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.
[0035] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0036] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0037] In the description of this embodiment, terms such as "up", "down", "left", and "right" and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present utility model.
[0038] In the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more than two. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.
[0039] like Figures 2 to 5 As shown, the utility model provides a chip heat dissipation cover plate, which includes an upper cover body 1, a lower cover body 2 and a working medium accommodating cavity which is recessed downwardly at the top of the lower cover body 2, the upper cover body 1 is fixedly connected to the lower cover body 2, and also includes a sealing accommodating cavity 25, which is arranged on one side of the lower cover body 2;
[0040] A working fluid injection pipe 22, one end of which passes through one side of the lower cover body 2 along the sealing accommodating chamber 25 and extends into the working fluid accommodating chamber, and the other end of the working fluid injection pipe 22 forms an inclined first sealing portion 222 toward the top surface of the lower cover body 2;
[0041] The sealing groove 26 is arranged at the bottom of the lower cover body 2 , and the top of the sealing groove 26 extends toward the working medium accommodating chamber and abuts against the working medium injection pipe 22 to form a second sealing portion 221 .
[0042] The utility model provides a chip heat dissipation cover plate, by arranging a sealing accommodating cavity 25 on one side of a lower cover body 2, arranging a working fluid injection pipe 22 on the inner side of the sealing accommodating cavity 25, one end of the working fluid injection pipe 22 extends into the working fluid accommodating cavity, and the other end is arranged in the sealing accommodating cavity 25 to realize the injection of working fluid into the working fluid accommodating cavity; after the working fluid is injected, one end of the working fluid injection pipe 22 in the sealing accommodating cavity 25 is sealed to form a first sealing portion 222, so as to effectively prevent leakage of the working fluid.
[0043] Specifically, Figure 2 and Figure 4 As shown, resistance welding is performed at the front end of the first sealing portion 222 to strengthen the sealing between the upper end surface of the sealing accommodating chamber 25 and the upper cover body 1. The upper end surface of the sealing accommodating chamber 25 and the top end surface of the lower cover body 2 are integrally formed, and the upper cover body 1 and the lower cover body 2 are fixed by circumferential welding; on the one hand, the relative strength of the sealing accommodating chamber 25 can be strengthened, and on the other hand, the fitting area of the upper cover body 1 and the lower cover body 2 on the upper end surface of the sealing accommodating chamber 25 can be increased, so that the sealing between the upper cover body 1 and the lower cover body 2 is further improved. At the same time, the first sealing portion 222 is arranged in the sealing accommodating chamber 25, and the first sealing portion 222 is inclined toward the top end surface of the lower cover body 2, or the first sealing portion 222 and the side of the lower cover body 2 are horizontally arranged. The shielding of the first sealing portion 222 by the upper cover body 1 can avoid the risk of damage to the heat dissipation cover plate by external impact during transportation or handling.
[0044] like Figures 4 to 5As shown, in order to further prevent the working fluid from leaking from the first sealing portion 222, a sealing groove 26 is further provided at the bottom of the lower cover body 2, and the top of the sealing groove 26 extends toward the working fluid accommodating cavity and abuts against the working fluid injection pipe 22 to form a second sealing portion 221. When the chip heat dissipation cover plate is processed and manufactured, its surface is chemically treated, because it is treated by immersion method, it is possible that the first sealing portion 222 is inevitably corroded, resulting in the thickness of the first sealing portion 222 and its weakness, resulting in poor service life and stability of the chip heat dissipation cover plate. Therefore, the provision of the second sealing portion 221 can further prevent the working fluid from leaking from the first sealing portion 222, thereby increasing the service life and stability of the heat dissipation cover plate.
[0045] In this embodiment, if Figure 2 and Figure 4 As shown, a plurality of heat-conducting columns 23 are arranged in the working medium accommodating cavity, and the heat-conducting columns 23 are fixedly arranged in an array at the bottom of the working medium accommodating cavity, and the top of the heat-conducting columns 23 abuts against the bottom end surface of the upper cover body 1. By arranging the heat-conducting columns 23, the heat of the lower cover body 2 can be transferred to the working medium and the upper cover body 1, thereby improving the thermal conductivity and heat dissipation of the chip heat dissipation cover plate.
[0046] Further, such as Figure 2 and Figure 6 As shown, a plurality of collars 11 are further provided in the working fluid accommodating chamber. The collars 11 are hollow structures and are sleeved on the middle part of the heat-conducting column 23. A plurality of evaporation capillaries 110 are provided in the cross section of the collars 11. The collars 11 are used to accelerate the heat conduction speed of the heat-conducting column 23 and the lower cover 2. At the same time, the evaporation capillaries 110 in the collars 11 can make the working fluid in the working fluid accommodating chamber conduct heat quickly and evenly. The working fluid in the working fluid accommodating chamber is generally injected with 70% of the amount, and after the working fluid is injected, the working fluid accommodating chamber is vacuumed to reduce the melting point of the working fluid and increase the heat flow of the working fluid in the working fluid accommodating chamber, so that the upper cover 1 can quickly conduct the heat to the outside.
[0047] In order to improve the thermal conduction of the chip heat dissipation cover plate, two heat conducting plates 10 are further arranged in the working medium accommodating chamber. A plurality of plug holes 101 are opened on the two heat conducting plates 10. The aperture of the plug holes 101 is larger than the diameter of the heat conducting column 23 and smaller than the diameter of the sleeve 11. One of the heat conducting plates 10 is plugged with the heat conducting column 23 through the plug holes 101 and is arranged on the bottom end surface of the working medium accommodating chamber, and the other heat conducting plate 10 is plugged with the heat conducting column 23 through the plug holes 101 and is arranged on the top of the sleeve 11 and abuts against the bottom end surface of the upper cover body 1, so as to improve the thermal conduction of the chip heat dissipation cover plate.
[0048] Further, such as Figure 4As shown, two support columns 24 are fixedly arranged at the bottom of the working medium accommodating chamber near the sealing accommodating chamber 25, and the two support columns 24 are respectively arranged on the left and right sides of the working medium inlet pipe, and the top of the support column 24 is successively penetrated by two heat conducting plates 10 and abutted against the bottom of the upper cover body 1; in the process of sealing the working medium injection pipe 22 to form the first sealing part 222 and the second sealing part 221, the sealing equipment exerts a certain force between the upper cover body 1 and the lower cover body 2, and the setting of the support column 24 can effectively prevent the deformation of the upper cover body 1 and the lower cover.
[0049] The heat-conducting column 23, the collar 11, the plug hole 101 and the support column 24 described above are cylindrical, ellipsoidal or rectangular structures made of metal or other materials with good thermal conductivity, such as copper, aluminum and other metal materials, which can be selected according to needs.
[0050] In this embodiment, if Figure 3 As shown, the bottom of the lower cover body 2 is recessed toward the upper cover body 1 and is provided with a chip accommodating cavity 20 for installing chips and circuit boards; a coating portion 21 is provided in the middle of the chip accommodating cavity 20, and the chip body is in contact with the coating portion 21 for heat conduction through heat conductive material.
[0051] The chip heat dissipation cover plate provided by the utility model effectively avoids damage to the first sealing portion 222 of the chip heat dissipation cover plate during transportation by forming an inclined first sealing portion 222 toward the top surface of the lower cover body 2 and being horizontally arranged with the side surface of the lower cover body 2 or arranged in the sealing accommodating cavity 25, thereby improving the life and stability of the chip in later use.
[0052] At the same time, a sealing groove 26 is provided at the bottom of the lower cover body 2, and the top of the sealing groove 26 extends toward the working medium accommodating chamber and abuts against the working medium injection pipe 22 to form a second sealing portion 221, which further increases the risk of working medium leakage.
[0053] Secondly, the upper end surface of the sealing accommodating chamber 25 and the top end surface of the lower cover body 2 are integrally formed to increase the fitting area between the upper cover body 1 and the lower cover body 2, thereby solving the risk of fluid leakage due to the small fitting area between the upper cover body 1 and the lower cover body 2 at the upper end surface of the sealing accommodating chamber 25.
[0054] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.
Claims
1. A chip heat dissipation cover plate, comprising an upper cover body, a lower cover body and a working medium accommodating cavity with a top surface of the lower cover body being recessed downward, wherein the upper cover body is fixedly connected to the lower cover body, and characterized in that: Also includes: A sealing accommodating chamber, wherein the sealing accommodating chamber is arranged on one side of the lower cover body; A working fluid injection pipe, one end of which passes through one side of the lower cover body along the sealing accommodating cavity and extends into the working fluid accommodating cavity, and the other end of which forms an inclined first sealing portion toward the top surface of the lower cover body; A sealing groove is arranged at the bottom of the lower cover body, and the top of the sealing groove extends toward the working medium accommodating chamber and abuts against the working medium injection pipe to form a second sealing portion.
2. A chip heat dissipation cover plate according to claim 1, characterized in that: The upper end surface of the sealing accommodating cavity and the top end surface of the lower cover body are integrally formed, and the upper cover body and the lower cover body are fixed by circumferential welding.
3. The chip heat dissipation cover plate according to claim 1, characterized in that: The end of the first sealing portion is arranged horizontally with the side surface of the lower cover body or is arranged in the sealing accommodating cavity.
4. The chip heat dissipation cover plate according to claim 1, characterized in that: A plurality of heat-conducting columns are arranged in the working medium accommodating chamber, and the plurality of heat-conducting columns are fixedly arranged in an array at the bottom of the working medium accommodating chamber, and the tops of the heat-conducting columns are in contact with the bottom end surface of the upper cover body.
5. The chip heat dissipation cover plate according to claim 4, characterized in that: A plurality of sleeve rings are also arranged in the working medium accommodating chamber. The sleeve rings are annular hollow structures and are sleeved on the middle of the heat-conducting column. A plurality of evaporation capillary holes are arranged in the cross section of the sleeve rings.
6. The chip heat dissipation cover plate according to claim 5, characterized in that: The chip heat dissipation cover plate also includes two heat-conducting plates, and a plurality of plug-in holes are opened on the two heat-conducting plates. The diameter of the plug-in holes is larger than the diameter of the heat-conducting column, and the diameter of the plug-in holes is smaller than the diameter of the sleeve. One of the heat-conducting plates is plugged with the heat-conducting column through the plug-in holes and is arranged on the bottom end surface of the working medium accommodating cavity, and the other heat-conducting plate is plugged with the heat-conducting column through the plug-in holes and is arranged on the top of the sleeve and abuts against the bottom end surface of the upper cover body.
7. The chip heat dissipation cover plate according to claim 6, characterized in that: Two support columns are fixedly provided at the bottom of the working medium accommodating chamber near the sealing accommodating chamber. The two support columns are arranged at intervals on the left and right sides of the working medium injection pipe. Two heat conduction plates are sequentially passed through the top of the support columns to abut against the bottom of the upper cover body.
8. The chip heat dissipation cover plate according to claim 7, characterized in that: The heat-conducting column, the sleeve ring, the plug hole and the support column are cylindrical, ellipsoidal or rectangular parallelepiped structures.
9. The chip heat dissipation cover plate according to claim 8, characterized in that: The bottom of the lower cover body is recessed toward the upper cover body to form a chip accommodating cavity, and a coating portion for heat conduction is provided in the middle of the chip accommodating cavity.