Liquid cooling heat dissipation assembly and chip packaging structure

Abstract

The utility model relates to the technical field of chip heat dissipation packaging structures, and discloses a liquid cooling heat dissipation assembly and a chip packaging structure, the liquid cooling heat dissipation assembly comprises an upper cover, the bottom surface of the upper cover is provided with a first accommodating cavity in an upward concave manner, is provided with a first supporting part in a downward convex manner, and is provided with a second clearance groove around the first supporting part; a heat dissipation piece is arranged on the upper end face of the base, and a first clearance groove and a second supporting part are arranged around the heat dissipation piece; the upper cover and the base are connected in a press fit mode to form a sealed first containing cavity, and the bottom face of the base is provided with a second containing cavity used for packaging a chip in an upward concave mode. The chip packaging structure comprises the liquid cooling heat dissipation assembly, a chip, a PCB and a bottom plate, wherein the chip, the PCB and the bottom plate are sequentially connected below the liquid cooling heat dissipation assembly in a laminated mode. According to the liquid cooling heat dissipation assembly, the chip is packaged through the base of the heat dissipation assembly, so that the interface between the heat dissipation device and the chip is reduced, the liquid cooling heat dissipation assembly is in direct contact with a heat source for heat dissipation, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation packaging structure, in particular to a liquid cooling heat dissipation component and a chip packaging structure. Background Art

[0002] As the integration and power of chips continue to increase, the heat generated during their operation also increases dramatically. If the heat cannot be dissipated in time, the temperature of the chip will rise, affecting its performance and stability. The chip heat dissipation process includes heat conduction and convection heat dissipation. The chip transfers the internal heat to the radiator through a thermal conductive medium (such as thermal conductive silicone, indium sheet, etc.), and then dissipates the heat through convection radiation.

[0003] However, water cooling has higher heat conduction and lower noise level, and has been widely used; most of the existing water cooling technologies are to install a water cooling radiator on the chip packaging cover to dissipate heat; this cooling method transfers the heat on the chip to the chip packaging cover through a thermal conductive medium, and then transfers the heat from the packaging cover to the water cooling radiator through a layer of thermal conductive medium. Therefore, the heat conduction efficiency is not high enough to meet the heat dissipation requirements of today's chips when running under high power loads.

[0004] Therefore, a liquid cooling heat dissipation component and a chip packaging structure are urgently needed to solve the above problems. Utility Model Content

[0005] Based on the above, the purpose of the present invention is to provide a liquid cooling heat dissipation component and a chip packaging structure to solve the problem that the existing water cooling heat dissipation technology has low thermal conductivity and cannot meet the heat dissipation problem when the chip is running under high power load.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] The liquid cooling heat dissipation assembly provided by the utility model comprises an upper cover, the bottom surface of the upper cover is recessed upward to form a first accommodating cavity, a downwardly protruding first supporting portion is provided around the first accommodating cavity, a second air avoidance groove is provided around the first supporting portion, and a first sealing groove is provided on the side of the first supporting portion close to the second air avoidance groove; a liquid inlet joint and a liquid outlet joint for cooling liquid circulation are provided at intervals on the top surface of the upper cover;

[0008] A base, wherein a heat sink is provided on the upper end surface of the base, a first air-avoiding groove is provided around the heat sink, a second supporting portion protruding upward is provided around the first air-avoiding groove, and a second sealing groove is provided on the side of the second supporting portion away from the first air-avoiding groove; a second accommodating cavity for packaging a chip is provided on the bottom surface of the base;

[0009] Among them, the upper cover is press-fitted with the base, and sealing members are provided in the first sealing groove and the second sealing groove. When the upper cover is press-fitted with the base, the first supporting portion is sealably inserted in the first air avoidance groove, and the second supporting portion is sealably inserted in the second air avoidance groove. The first accommodating cavity forms a sealed cavity, and the liquid inlet joint and the liquid outlet joint are both conductively connected with the sealed cavity.

[0010] As an optional technical solution for the liquid-cooled heat dissipation component, the heat dissipation element is a plurality of heat dissipation fins which are arranged at equal intervals and protrude upwardly on the upper end surface of the base, and the plurality of heat dissipation fins and the base are an integrally formed structure; the liquid inlet connector and the liquid outlet connector are respectively arranged on both sides of the top end surface of the first accommodating cavity, and are located above the two ends of the plurality of heat dissipation fins.

[0011] As an optional technical solution for the liquid-cooled heat dissipation component, the heat dissipation element is an array of several cylinders or several polygonal cylinders that protrude upward and are arranged on the upper end surface of the base. The several cylinders or several polygonal cylinders and the base are an integrally formed structure; the height of the heat dissipation element is less than or equal to the height of the second support portion.

[0012] As an optional technical solution for the liquid cooling heat dissipation component, a third supporting portion protruding downward is provided around the second air avoidance groove, a third sealing groove is provided on the bottom surface of the third supporting portion, and a sealing member is provided in the third sealing groove; a fourth air avoidance groove is provided around the third supporting portion; a third air avoidance groove is provided around the second supporting portion, and a fourth supporting portion protruding upward is provided on the edge of the upper end surface of the base; when the upper cover is press-fitted and connected with the base, the third supporting portion is sealably inserted in the third air avoidance groove, and the fourth supporting portion is sealably inserted in the fourth air avoidance groove.

[0013] As an optional technical solution for the liquid cooling heat dissipation component, the sealing member is a sealing ring, the diameter of which is greater than the depth of the first sealing groove, the second sealing groove and the third sealing groove; a sealing gasket is also provided on the top surface of the first air avoidance groove.

[0014] As an optional technical solution for the liquid-cooled heat dissipation component, the top surface of the fourth support portion is coated with a solder paste layer, and the upper cover and the base are welded and connected through the solder paste layer; a detection line is provided around the circumferential position of the side surface of the base, and one end of the detection line is connected to an induction alarm for detecting whether the coolant in the sealed cavity leaks.

[0015] As an optional technical solution for the liquid cooling heat dissipation component, a heat conduction area for contacting the chip heat source is provided in the middle of the second accommodating cavity, and a gold-plated layer is provided on the heat conduction area.

[0016] On the other hand, the utility model provides a chip packaging structure, including any of the above-mentioned liquid-cooled heat dissipation components and a chip, a PCB and a base plate stacked and connected in sequence under the liquid-cooled heat dissipation component, the chip is arranged in the second accommodating cavity, and the liquid-cooled heat dissipation component is used for chip heat dissipation.

[0017] As an optional technical solution for the chip packaging structure, a heat-conducting layer is provided between the chip and the heat-conducting area, and the heat-conducting layer is a heat-conducting silica gel or an indium sheet.

[0018] As an optional technical solution for the chip packaging structure, through holes are provided near the four corners of the upper cover, and screw holes are provided at positions of the bottom plate corresponding to the through holes. The upper cover is locked with the bottom plate by screws to press and lock the upper cover, base, chip and PCB; a spring is also provided between the screw and the upper cover.

[0019] The beneficial effects of the utility model are:

[0020] The liquid cooling heat dissipation component and chip packaging structure provided by the utility model include an upper cover and a base, the upper cover and the base are relatively sealed and connected, a sealed first accommodating cavity is formed in the middle, and a second accommodating cavity for packaging chips is provided on the bottom surface of the base, a plurality of supporting parts and air-avoiding grooves are respectively provided on the bottom surface of the upper cover and the top surface of the base, a sealing groove is provided on the supporting part, and a sealing member is installed in the sealing groove, after the upper cover is pressed and connected with the base, each supporting part is inserted into the corresponding air-avoiding groove, and the sealing member abuts against the side wall of the air-avoiding groove or the upper end surface of the base, at this time, the heat dissipation member is in the first accommodating cavity, and a sealed The cooling liquid is injected into the first accommodating cavity through the liquid inlet joint, and the cooling liquid flows through the heat sink and is output from the liquid outlet joint to form a liquid cooling circulation system; a second accommodating cavity for packaging the chip is arranged on the bottom surface of the base, and a heat conduction area abutting against the heat source of the chip is arranged in the middle of the second accommodating cavity; under the above structure, the chip is packaged through the base of the heat dissipation component, and compared with the prior art, a separate chip packaging cover plate is no longer required to package the chip and then install a radiator on the packaging cover plate, thereby reducing the interface between the radiator and the chip; the liquid-cooled heat dissipation component is in direct contact with the heat source for heat dissipation, thereby improving the heat dissipation efficiency.

[0021] On the other hand, under this packaging structure, the fit (coverage) between the dielectric layer (thermal conductive layer) and the chip can be tested by ultrasonic scanning to ensure the quality and stability after packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a top view of the liquid cooling and heat dissipation assembly in the first embodiment of the utility model;

[0023] Figure 2 This is an exploded view of the liquid cooling and heat dissipation assembly in the first embodiment of the present utility model;

[0024] Figure 3 It is a cross-sectional view of the liquid cooling heat dissipation assembly in the first embodiment of the utility model;

[0025] Figure 4 It is an isometric schematic diagram of the upper cover in the first embodiment of the utility model;

[0026] Figure 5 It is a cross-sectional view of the upper cover in the first embodiment of the utility model;

[0027] Figure 6 It is an isometric schematic diagram of the base in the first embodiment of the utility model;

[0028] Figure 7 It is a cross-sectional view of the base in the first embodiment of the utility model;

[0029] Figure 8 This is an isometric view of the base in the first embodiment of the utility model from a bottom view;

[0030] Fig. 9 It is a side view schematic diagram of the chip packaging structure in the second embodiment of the present utility model;

[0031] Fig.10 This is an exploded schematic diagram of the chip packaging structure in the second embodiment of the present utility model;

[0032] Fig.11 This is a schematic diagram of the structure of the circular upper cover of the utility model;

[0033] Fig.12 This is a schematic diagram of the structure of the polygonal column heat sink of the utility model;

[0034] Fig.13 This is a schematic diagram of the structure of a cylindrical heat sink of the utility model;

[0035] In the figure:

[0036] 1. Upper cover; 101. Liquid inlet joint; 102. Liquid outlet joint; 103. Screw; 11. First accommodating chamber; 12. First supporting portion; 121. First sealing groove; 122. Second air-avoiding groove; 13. Third supporting portion; 131. Third sealing groove; 132. Fourth air-avoiding groove;

[0037] 2. Base; 20. Heat sink; 21. Second support portion; 201. Second sealing groove; 202. First air-avoiding groove; 22. Fourth support portion; 221. Third air-avoiding groove; 23. Second accommodating cavity; 231. Heat transfer area; 24. Detection line;

[0038] 3. BGA substrate; 31. chip; 32. thermal conductive layer; 4. PCB; 5. bottom plate. DETAILED DESCRIPTION

[0039] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0040] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] In the description of this embodiment, terms such as "up", "down", "left", and "right" and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present utility model.

[0043] In the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more than two. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0044] like Figure 1-13As shown, the utility model provides a liquid cooling heat dissipation component and a chip packaging structure, the heat dissipation device includes an upper cover 1, the bottom surface of the upper cover 1 is recessed upward to form a first accommodating cavity 11, a downwardly protruding first supporting portion 12 is provided around the first accommodating cavity 11, a second air avoidance groove 122 is provided around the first supporting portion 12, and a first sealing groove 121 is provided on the side of the first supporting portion 12 close to the second air avoidance groove 122; a top surface of the upper cover 1 is provided with a liquid inlet joint 101 and a liquid outlet joint 102 for cooling liquid circulation at intervals; a base 2, a heat dissipation element 20 is provided on the upper end surface of the base 2, a first air avoidance groove 202 is provided around the heat dissipation element 20, and a first air avoidance groove 202 is provided around the first air avoidance groove 202 There is an upwardly protruding second support portion 21, and a second sealing groove 201 is provided on the side of the second support portion 21 away from the first air avoidance groove 202; the bottom surface of the base 2 is recessed upward and provided with a second accommodating cavity 23 for encapsulating the chip 31; wherein, the upper cover 1 is press-fitted with the base 2, and sealing members are provided in the first sealing groove 121 and the second sealing groove 201. When the upper cover 1 is press-fitted with the base 2, the first support portion 12 is sealably inserted in the first air avoidance groove 202, and the second support portion 21 is sealably inserted in the second air avoidance groove 122. The first accommodating cavity 11 forms a sealed cavity body, and the liquid inlet joint 101 and the liquid outlet joint 102 are both conductively connected to the sealed cavity body.

[0045] In the liquid cooling heat dissipation component and chip packaging structure provided by the utility model, the upper cover 1 and the base 2 are relatively sealed and connected, a sealed first accommodating chamber 11 is formed in the middle, and a second accommodating chamber 23 for packaging the chip 31 is provided on the bottom surface of the upper cover 1 and the top surface of the base 2, and a plurality of supporting parts and air-avoiding grooves are provided at intervals, respectively, on the bottom surface of the upper cover 1 and the top surface of the base 2, and a sealing groove is provided on the supporting part, and a sealing member is installed in the sealing groove. After the upper cover 1 and the base 2 are pressed and connected, each supporting part is inserted into the corresponding air-avoiding groove, and the sealing member abuts against the side wall of the air-avoiding groove or the upper end surface of the base 2. At this time, the heat dissipation member 20 is in the first accommodating chamber 11, and a sealed accommodating chamber is formed, and the liquid inlet is connected to the first accommodating chamber 11. The head 101 injects cooling liquid into the first accommodating chamber 11, and the cooling liquid flows through the heat sink 20 and is then output from the liquid outlet connector 102 to form a liquid cooling circulation system; a second accommodating chamber 23 for encapsulating the chip 31 is provided on the bottom surface of the base 2, and a heat conduction area 231 abutting against the heat source of the chip 31 is provided in the middle of the second accommodating chamber 23; under the above structure, the chip 31 is encapsulated through the base 2 of the heat dissipation component, and compared with the prior art, a separate chip 31 encapsulation cover plate is no longer required to encapsulate the chip 31 and then install a radiator on the encapsulation cover plate, thereby reducing the interface between the radiator and the chip 31; the liquid cooling heat dissipation component is in direct contact with the heat source to dissipate heat, thereby improving the heat dissipation efficiency. On the other hand, under this packaging structure, the fit (coverage) between the dielectric layer (heat conduction layer 32) and the chip 31 can be ultrasonically scanned and tested to ensure the quality and stability after packaging.

[0046] Embodiment 1

[0047] In this embodiment, if Figure 1-2 As shown, the liquid cooling heat dissipation assembly provided in this embodiment is composed of an upper cover 1 and a base 2, the bottom surface of the upper cover 1 is recessed to form a first accommodating chamber 11, and the first accommodating chamber 11 is protruding from the top surface of the upper cover 1, and two joints are arranged on the top surface of the upper cover 1 and above the first accommodating chamber 11, respectively, a liquid inlet joint 101 and a liquid outlet joint 102, and the liquid inlet joint 101 and the liquid outlet joint 102 are both conductively connected to the first accommodating chamber 11. When the upper cover 1 and the base 2 are pressed or welded together, the first accommodating chamber 11 forms a sealed cavity; the coolant is injected into the first accommodating chamber 11 through the liquid inlet joint 101, and then the coolant is output through the liquid outlet joint 102, thereby forming a liquid cooling circulation heat dissipation system, wherein the coolant is water or other liquid with a high boiling point.

[0048] Specifically, Figure 3-5 As shown, two through holes are provided at intervals on the top of the first accommodating chamber 11, and the liquid inlet joint 101 and the liquid outlet joint 102 are both installed in the through holes and are conductively connected to the first accommodating chamber 11; a first supporting portion 12 is provided around the first accommodating chamber 11, and the first supporting portion 12 is provided to protrude downward relative to the upper cover 1, and a first sealing groove 121 is provided on the other side of the first supporting portion 12 away from the first accommodating chamber 11; a second air-avoiding groove 122 is provided on the bottom surface of the upper cover 1 body surrounding the first supporting portion 12; and a sealing gasket is provided on the top of the second air-avoiding groove 122; a sealing gasket is provided around the second air-avoiding groove 122; A third supporting portion 13 is provided on the bottom surface of the upper cover 1 of the groove 122, and the third supporting portion 13 is protruded downward relative to the upper cover 1, and a third sealing groove 131 is circumferentially provided on the end surface of the third supporting portion 13; a fourth air avoidance groove 132 is opened on the bottom surface of the upper cover 1 surrounding the third supporting portion 13; wherein, the upper cover 1, the first supporting portion 12, the third supporting portion 13 and the first accommodating cavity 11 are all integrally formed structures, and the height of the first supporting portion 12 is the same as the height of the third supporting portion 13, ensuring that a sealed cavity can be formed when the upper cover 1 and the base 2 are fitted together.

[0049] In this embodiment, if Figure 3 and Figure 6-7As shown, a heat sink 20 is provided in the middle of the upper end surface of the base 2, and second support portions 21 are provided at equal intervals around the heat sink 20, the second support portions 21 are arranged to protrude upward relative to the base 2, and a second sealing groove 201 is provided on the other side of the second support portion 21 away from the heat sink 20; a third air avoidance groove 221 is provided on the base 2 surrounding the second support portion 21; the interval between the heat sink 20 and the second support portion 21 is the first air avoidance groove 202; and a fourth support portion 22 is provided to protrude upward at the circumferential edge of the base 2; wherein, the height of the heat sink 20 is less than or equal to the height of the second support portion 21, and when the upper cover 1 and the base 2 are press-fitted and connected, the top of the heat sink 20 will not press against the top surface of the first accommodating cavity 11 due to its too high height; and the heights of the second support portion 21 and the fourth support portion 22 are the same.

[0050] Specifically, Figure 3 As shown, a sealing ring or other elastic sealing member made of rubber or silicone is arranged in the first, second and third sealing grooves 131 and at the top of the second air-avoiding groove 122, and the diameter of the sealing ring is greater than the depth of the sealing groove, that is, when the sealing ring is arranged in the sealing groove, a part of the sealing ring protrudes from the sealing groove, and when the upper cover 1 and the base 2 are pressed together, the protruding part of the sealing ring is squeezed relative to its abutting surface, and under the elastic effect of the sealing ring and the pressure given when the upper cover 1 and the base 2 are pressed together, the sealing ring is tightly fitted with its abutting surface; and the first support portion 12 is sealed and inserted in the first air-avoiding groove 202 The second support portion 21 is sealed and inserted in the second air avoidance groove 122, the third support portion 13 is sealed and inserted in the third air avoidance groove 221, and the fourth support portion 22 is sealed and inserted in the fourth air avoidance groove 132; at this time, the heat sink 20 is in the first accommodating chamber 11 and forms a sealed cavity; the four sealing structures arranged crosswise with each other can effectively improve the sealing of the first accommodating chamber 11 and reduce the risk of cooling liquid leakage. At the same time, the arrangement of the four support portions further enhances the pressure resistance and firmness between the upper cover 1 and the base 2; thereby, the stability and heat dissipation of the liquid-cooled heat dissipation assembly are guaranteed.

[0051] Furthermore, a solder paste layer is coated on the top surface of the fourth support portion 22, and the top of the fourth air-avoiding groove 132 and the top surface of the fourth support portion 22 are welded, fixed and sealed by the solder paste layer; the solder paste layer is preferably a low-temperature solder paste; the sealing and fitting strength between the upper cover 1 and the base 2 are enhanced by coating the solder paste layer; at the same time, the provision of the fourth support portion 22 can not only reinforce and seal the liquid-cooled heat dissipation component, but more importantly, when the operator disassembles the cold heat dissipation component, there will be residual coolant in the sealed first accommodating chamber 11 that has not been completely discharged, and as the upper cover 1 is separated from the base 2, it will adhere to the first support portion 12 and be brought out of the first accommodating chamber 11. If the fourth support portion 22 is not provided, the coolant brought out by the first support portion 12 is likely to fall on the base 2 On the substrate, it flows into PCB4 and causes short circuit and damage to the chip 31 and other components. Therefore, the most important purpose of setting the fourth support part 22 is that when the upper cover 1 and the base 2 are disassembled, the coolant brought out by the first support part 12 falls on the substrate of the base 2, and the fourth support part 22 can prevent the brought out coolant from flowing into the PCB4; on the other hand, when a small amount of coolant in the first accommodating cavity 11 leaks out from the four sealing structures, it will also be blocked by the fourth support part 22; at the same time, a detection line 24 is arranged around the side edges of the base 2, and one end of the detection line 24 is externally connected to an induction alarm. When there is a coolant leak, the detection line 24 contacts the coolant induction alarm and an alarm will be sounded, so as to detect the leak in time and prevent the chip 31 and related electronic components from being damaged by the coolant.

[0052] In this embodiment, if Figure 6 As shown, the heat sink 20 is a plurality of heat sink fins arranged on the base 2, and the heat sink fins and the base 2 are integrally formed structures; the distance between each heat sink fin is the same, and a plurality of cooling liquid flow channels are formed by setting the distance, and at the same time, the liquid inlet joint 101 and the liquid outlet joint 102 are respectively arranged on both sides of the top end surface of the first accommodating cavity 11, and are located above the two ends of the plurality of heat sink fins. When the coolant is injected from the liquid inlet joint 101, the heat on the heat sink fins is absorbed through the plurality of cooling liquid flow channels between the plurality of heat sink fins and output from the liquid outlet joint 102, thereby forming a liquid cooling circulation system, which improves the heat dissipation efficiency.

[0053] Further, such as Fig.12 and Fig.13 As shown, the heat sink 20 is a plurality of cylinders or polygonal cylinders which are arranged in an array and protrude upward on the upper end surface of the base 2. The plurality of cylinders or polygonal cylinders and the base 2 are an integrally formed structure. The contact area between the cylinders or polygonal cylinders and the coolant is larger. Therefore, using the cylinders or polygonal cylinders as the heat sink 20 can further improve the heat dissipation effect.

[0054] In this embodiment, if Figure 8As shown, the bottom of the base 2 is recessed upward and is provided with a second accommodating cavity 23 for encapsulating the chip 31. The middle of the second accommodating cavity 23 is provided with a heat conduction area 231 for contacting the heat source of the chip 31. The heat conduction area 231 is coated with a gold-plated layer, which can accelerate the conduction of heat and further improve the heat dissipation efficiency.

[0055] Embodiment 2

[0056] like Fig. 9 and Fig.10 The present invention further provides a chip packaging structure, including the liquid cooling heat dissipation component in the above-mentioned embodiment 1 and a chip 31, PCB4 and a base plate 5 which are sequentially stacked and connected below the liquid cooling heat dissipation component. The chip 31 is arranged in the second accommodating cavity 23 and directly contacts the bottom of the base 2 for heat dissipation. Compared with the traditional chip heat dissipation technology in which a heat sink is installed on the packaging cover plate of the chip 31, the heat dissipation and packaging structure of the present invention omits a separate packaging cover plate, that is, omits an interface between the heat sink and the chip 31, thereby improving the heat dissipation efficiency and also That is to say, the base 2 is used as the base 2 of the liquid cooling heat dissipation component and is also used for the packaging of the chip 31; the liquid cooling heat dissipation component is used for the heat dissipation of the chip 31; a thermal conductive layer 32 is provided between the chip 31 and the heat conduction area 231, and the thermal conductive layer 32 is a material with fast thermal conductivity and strong ductility such as thermal conductive silicone or indium sheet; after the chip packaging structure is installed and before the coolant is injected, an ultrasonic scanning test can be performed on it to detect the fit (coverage) of the medium layer (thermal conductive layer 32) and the chip 31 to ensure the quality and stability after packaging and effectively guarantee the heat dissipation performance.

[0057] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.

Claims

1. Liquid cooling heat dissipation component, characterized in that: include: An upper cover, wherein the bottom surface of the upper cover is recessed upward to form a first accommodating cavity, a downwardly protruding first supporting portion is provided around the first accommodating cavity, a second air avoidance groove is provided around the first supporting portion, and a first sealing groove is provided on the side of the first supporting portion close to the second air avoidance groove; a liquid inlet joint and a liquid outlet joint for cooling liquid circulation are provided at intervals on the top surface of the upper cover; A base, wherein a heat sink is provided on the upper end surface of the base, a first air-avoiding groove is provided around the heat sink, a second supporting portion protruding upward is provided around the first air-avoiding groove, and a second sealing groove is provided on the side of the second supporting portion away from the first air-avoiding groove; a second accommodating cavity for packaging a chip is provided on the bottom surface of the base; Among them, the upper cover is press-fitted with the base, and sealing members are provided in the first sealing groove and the second sealing groove. When the upper cover is press-fitted with the base, the first supporting portion is sealably inserted in the first air avoidance groove, and the second supporting portion is sealably inserted in the second air avoidance groove. The first accommodating cavity forms a sealed cavity, and the liquid inlet joint and the liquid outlet joint are both conductively connected with the sealed cavity.

2. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: The heat sink is a plurality of heat sink fins which are arranged at equal intervals and protrude upwardly on the upper end surface of the base, and the plurality of heat sink fins and the base are an integrally formed structure; the liquid inlet joint and the liquid outlet joint are respectively arranged on both sides of the top end surface of the first accommodating cavity, and are located above the two ends of the plurality of heat sink fins.

3. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: The heat sink is a plurality of cylinders or polygonal columns arranged in an array and protruding upward on the upper end surface of the base, and the cylinders or polygonal columns are an integrally formed structure with the base; the height of the heat sink is less than or equal to the height of the second support portion.

4. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: A third supporting portion protruding downward is provided around the second air avoidance groove, a third sealing groove is provided on the bottom surface of the third supporting portion, and a sealing member is provided in the third sealing groove; a fourth air avoidance groove is provided around the third supporting portion; a third air avoidance groove is provided around the second supporting portion, and a fourth supporting portion protruding upward is provided on the upper end surface edge of the base; when the upper cover is press-fitted and connected with the base, the third supporting portion is sealably inserted in the third air avoidance groove, and the fourth supporting portion is sealably inserted in the fourth air avoidance groove.

5. The liquid cooling heat dissipation assembly according to claim 4, characterized in that: The sealing member is a sealing ring, the diameter of which is greater than the depths of the first sealing groove, the second sealing groove and the third sealing groove; a sealing gasket is also provided on the top surface of the first air avoidance groove.

6. The liquid cooling heat dissipation assembly according to claim 4, characterized in that: The top surface of the fourth support portion is coated with a solder paste layer, and the upper cover and the base are connected by welding through the solder paste layer; a detection line is arranged around the circumferential position of the side surface of the base, and one end of the detection line is connected to an induction alarm for detecting whether the coolant in the sealed cavity leaks.

7. The liquid cooling heat dissipation assembly according to claim 6, characterized in that: A heat conduction area for contacting a heat source of a chip is provided in the middle of the second accommodating cavity, and a gold-plated layer is provided on the heat conduction area.

8. A chip packaging structure, characterized in that: It comprises the liquid-cooled heat dissipation component described in any one of claims 1-7 and a chip, a PCB and a base plate which are sequentially stacked and connected below the liquid-cooled heat dissipation component, the chip is arranged in the second accommodating cavity, and the liquid-cooled heat dissipation component is used for chip heat dissipation.

9. The chip packaging structure according to claim 8, characterized in that: A heat-conducting layer is provided between the chip and the heat-conducting area, and the heat-conducting layer is a heat-conducting silica gel or an indium sheet.

10. The chip packaging structure according to claim 9, characterized in that: Through holes are provided near the four corners of the upper cover, and screw holes are provided at positions of the bottom plate corresponding to the through holes. The upper cover is locked with the bottom plate by screws to press and lock the upper cover, base, chip and PCB; a spring is also provided between the screw and the upper cover.

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