Refrigeration mobile charging device

Abstract

The utility model discloses a refrigeration mobile charging device, which is characterized in that an air inlet area and an air outlet area are arranged on a shell, and an accommodating cavity is arranged in the shell; the rechargeable battery is accommodated in the accommodating cavity; the air duct component is fixed in the containing cavity and provided with a support containing space, an air inlet duct and an air outlet duct, the air inlet duct and the air outlet duct are communicated with the support containing space, the air inlet duct is further communicated with the air inlet area, and the air outlet duct is further communicated with the air outlet area; the heat dissipation support is fixed in the containing cavity and comprises a heat absorption part and a heat dissipation part, and the heat dissipation part is contained in the support containing space; the semiconductor chilling plate is powered by the rechargeable battery, the heating face of the semiconductor chilling plate is in heat conduction connection with the heat absorption part, and the refrigerating face of the semiconductor chilling plate is used for being in heat conduction connection with handheld electronic equipment. The fan is used for enabling airflow to sequentially flow through the air inlet area, the air inlet channel, the support containing space, the air outlet channel and the air outlet area. According to the utility model, the handheld electronic equipment can be effectively cooled.

Description

Technical Field

[0001] The utility model relates to the technical field of mobile charging power supplies, in particular to a refrigeration mobile charging device. Background Art

[0002] A mobile charging power source, mobile charger, power bank or mobile charging device, etc., is a portable mobile charging device that can store energy and can be carried around, and is mainly used to charge consumer electronic products such as handheld mobile electronic devices. The main components of a portable mobile charging device include: a battery for storing electrical energy, and a circuit for stabilizing the output voltage / current. In order to extend the working time of handheld mobile electronic devices as much as possible, handheld mobile electronic devices are used in conjunction with mobile charging devices. However, when mobile charging devices and handheld mobile electronic devices are used for a long time, a large amount of heat will be generated. In order to improve the stability of mobile charging devices and handheld mobile electronic devices during use, it is necessary to cool down the handheld mobile electronic devices and mobile charging devices. The cooling methods include refrigeration and heat dissipation.

[0003] Most of the mobile charging devices in the prior art have too complicated internal structures, and during use, some cannot actively cool down the mobile charging device itself, and some cannot actively cool down the handheld mobile electronic device.

[0004] Therefore, there is an urgent need for a refrigeration mobile charging device that can effectively cool down the mobile charging device and the handheld mobile electronic device. Utility Model Content

[0005] The utility model aims to provide a refrigeration mobile charging device which can effectively cool down a mobile charging power source and a handheld mobile electronic device.

[0006] In order to achieve the above-mentioned purpose, the technical solution provided by the utility model is: to provide a refrigeration mobile charging device, which has the function of cooling and charging a handheld electronic device, and is characterized in that it includes:

[0007] A shell body, on which an air inlet area and an air outlet area are formed, and a receiving cavity is formed therein;

[0008] A rechargeable battery is contained in the containing cavity;

[0009] An air duct component is fixed in the accommodating cavity and is provided with a bracket accommodating space, and an air inlet duct and an air outlet duct communicating with the bracket accommodating space, and the air inlet duct is also communicated with the air inlet area, and the air outlet duct is also communicated with the air outlet area;

[0010] A heat dissipation bracket, fixed in the accommodating cavity, the heat dissipation bracket comprises a heat absorbing portion and a heat dissipation portion, the heat dissipation portion is accommodated in the bracket accommodating space;

[0011] A semiconductor refrigeration sheet, wherein the semiconductor refrigeration sheet is powered by the rechargeable battery, a heat-generating side of the semiconductor refrigeration sheet is heat-conductively connected to the heat-absorbing portion, and a cooling side of the semiconductor refrigeration sheet is used for heat-conductively connecting to a handheld electronic device;

[0012] The fan is used to make the air flow flow through the air inlet area, the air inlet duct, the bracket accommodating space, the air outlet duct and the air outlet area in sequence.

[0013] The heat absorbing part is a flat structure, the heat dissipating part is provided with a plurality of heat dissipating fins, a heat dissipating channel is formed between two adjacent heat dissipating fins, and the heat dissipating part is also provided with a fan slot, and the fan is installed in the fan slot.

[0014] The housing comprises an upper cover and a bottom shell, the upper portion of the bottom shell is an open structure and is connected to the accommodating cavity formed in the bottom shell, and the upper cover is disposed on the open structure.

[0015] The air inlet area is arranged at the side wall of the bottom shell, and the air outlet area is arranged at the bottom of the bottom shell.

[0016] The air duct component includes a flat air duct body, a support portion arranged on the lower side of the air duct body, the air inlet duct formed by a partition plate arranged on the upper side of the air duct body, and the air outlet duct arranged on the upper and lower sides of the air duct body. The air duct component is supported on the bottom of the bottom shell through the support portion.

[0017] The number of the air inlet passages is two, the air inlet areas are arranged at two opposite sides of the bottom shell, and each air inlet passage is arranged opposite to one of the air inlet areas.

[0018] The air inlet area and the air outlet area are both arranged at the side wall of the bottom shell, and one of the two ends of one side wall of the bottom shell is respectively provided with an air outlet area.

[0019] The upper side and the lower side of the upper cover are respectively provided with a first heat-conducting groove and a second heat-conducting groove, and the bottoms of the first heat-conducting groove and the second heat-conducting groove are also connected to form a through groove, a first heat-conducting metal sheet is arranged in the first heat-conducting groove, a second heat-conducting metal sheet is arranged in the second heat-conducting groove, and a third heat-conducting metal sheet is arranged in the through groove, and the first heat-conducting metal sheet is thermally connected to the second heat-conducting metal sheet through the third heat-conducting metal sheet, and the lower surface of the second heat-conducting metal sheet is thermally connected to a cooling surface of the semiconductor refrigeration sheet, and the upper surface of the first heat-conducting metal sheet is thermally connected to the electronic device.

[0020] It also includes a magnetic ring or a plurality of magnets distributed in an annular direction, and the magnetic ring or the plurality of magnets distributed in an annular direction are connected to the inner wall of one side surface of the shell.

[0021] It also includes a semiconductor refrigeration film limit block made of heat insulation material, the semiconductor refrigeration film limit block is arranged on the heat absorption part, a limit area is formed inside the semiconductor refrigeration film limit block, and the semiconductor refrigeration film is arranged in the limit area.

[0022] Compared with the prior art, the refrigeration and mobile charging device of the utility model is provided with a heat dissipation bracket and a fan, which can dissipate heat from the heated side of the semiconductor refrigeration plate in time, ensure the cooling effect of the cooled side of the semiconductor refrigeration plate, and can effectively cool down the handheld mobile electronic device, improve the user experience, and reduce the risk of spontaneous combustion.

[0023] The present invention will become more clear through the following description in conjunction with the accompanying drawings, which are used to explain the embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Shown is a schematic diagram of an embodiment of the refrigeration type mobile charging power supply of the utility model.

[0025] Figure 2 As shown Figure 1 The schematic diagram of the refrigeration mobile charging power supply with the upper cover removed is shown.

[0026] Figure 3 As shown Figure 1 An exploded view of the refrigerated mobile charging power supply is shown.

[0027] Figure 4 As shown Figure 3 A view from another direction of the exploded view shown.

[0028] Figure 5 Shown is a schematic structural diagram of a bottom shell of the refrigeration type mobile charging power supply of the utility model.

[0029] Figure 6 Shown is a structural schematic diagram of another bottom shell of the refrigeration type mobile charging power supply of the utility model.

[0030] Description of the accompanying drawings: refrigeration mobile charging device 100, shell 1, bottom shell 1a, upper cover 1b, magnetic ring 10, accommodating chamber 11, air inlet area 12, air outlet area 13, semiconductor limit block 15, limit area 151, rechargeable battery 2, first heat conducting groove 20, second heat conducting groove 21, through groove 22, first heat conducting metal sheet 23, second heat conducting metal sheet 24, third heat conducting metal sheet 25, heat dissipation bracket 3, heat absorption part 31, heat dissipation part 32, heat dissipation fins 321, heat dissipation channel 322, fan slot 323, semiconductor refrigeration sheet 4, air duct component 5, fan 5a, air duct body 50, air inlet duct 51, air outlet duct 52, bracket accommodating space 53, support part 54, wireless charging coil 9. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of them. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0033] refer to Figure 1 In order to more conveniently explain the present invention, an X, Y, and Z reference coordinate system is established to assist in explaining the relationship between the layout directions of the components. Figure 1 For example, the X direction is the width direction of the housing 1, the Y direction is the length direction of the housing 1, and the Z direction is the thickness direction or vertical direction of the housing 1, and each of the X, Y, and Z directions has two opposite sides. This coordinate system is only used for auxiliary explanation and should not be regarded as limiting the actual layout position of the internal components of the present invention.

[0034] refer to Figure 1 , 2 , 3, 4, the utility model discloses a refrigeration mobile charging device 100, which is used to cool and / or charge a handheld electronic device.

[0035] The utility model refrigeration mobile charging device 100 has the function of cooling and charging handheld electronic devices. Since handheld electronic devices will generate a lot of heat during long-term use, if they are not cooled in time, the temperature of the handheld electronic devices will be very high, which will greatly reduce the running smoothness of the handheld electronic devices and the user experience. In severe cases, the handheld electronic devices may even spontaneously combust. Among them, handheld electronic devices mainly refer to mobile phones, tablets, handheld game consoles, etc.

[0036] The refrigeration mobile charging device 100 provided in the embodiment of the utility model comprises:

[0037] A housing 1, wherein a receiving chamber 11 is provided inside the housing 1, and the housing 1 also has an air inlet area and an air outlet area (the air inlet area and the air outlet area will be described below);

[0038] It should be noted that the air inlet area is for allowing ambient air to enter the accommodating cavity 11, and the air outlet area is for allowing hot air in the accommodating cavity 11 to be discharged, and both the air inlet area and the air outlet area are opened on the shell 1. More specifically, the air inlet area and the air outlet area are both hole structures provided on the shell 1, for example, they can be circular holes or waist-shaped holes.

[0039] A rechargeable battery 2, the rechargeable battery 2 is accommodated in the accommodation cavity 11;

[0040] The air duct component 5 is fixed in the accommodating cavity 11 and is provided with a bracket accommodating space 53, and an air inlet duct 51 and an air outlet duct 52 communicating with the bracket accommodating space 53, wherein the air inlet duct 51 is communicated with the air inlet area, and the air outlet duct 52 is communicated with the air outlet area;

[0041] The heat dissipation bracket 3 is fixed in the accommodating cavity 11, and the heat dissipation bracket 3 includes a heat absorption portion 31 and a heat dissipation portion 32, and the heat dissipation portion 32 is accommodated in the bracket accommodating space 53; specifically, as shown in Figure 3 , 4 In the embodiment shown, the portion where the upper side of the heat dissipation bracket 3 contacts the heating side of the semiconductor cooling sheet 4 substantially forms the heat absorption portion 31. The function of the heat absorption portion 31 is to absorb the heat carried by the heating side of the semiconductor cooling sheet 4. The rest of the heat dissipation bracket 3 except the heat absorption portion 31 can be regarded as the heat dissipation portion 32. In order to ensure a better heat dissipation effect, the heat dissipation bracket 3 is usually made of a metal material with good thermal conductivity, such as aluminum.

[0042] During the working process of the utility model, the heat dissipation bracket 3 is used to dissipate heat for the semiconductor refrigeration sheet 4. Therefore, the temperature of the heat dissipation bracket 3 will increase. If the heat dissipation bracket 3 is not cooled down in time, the heat dissipation bracket 3 will be in a relatively high temperature state, which will greatly reduce the effect of heat dissipation for the semiconductor refrigeration sheet 4, thereby affecting the refrigeration effect of the semiconductor refrigeration sheet 4. At the same time, the accommodating cavity 11 will also be in a high temperature state, further affecting the normal operation of other electronic components.

[0043] Since the heat dissipation part 32 is accommodated in the bracket accommodating space 53, the air inlet duct 51 and the air outlet duct 52 are connected to the bracket accommodating space 53, and the air inlet duct 51 is also connected to the air inlet area, and the air outlet duct 52 is also connected to the air outlet area, the ambient air at room temperature can more conveniently exchange heat with the heat dissipation part 32, and the hot air around the heat dissipation part 32 can conveniently flow out from the accommodating cavity 11 through the air outlet area and return to the ambient air.

[0044] A semiconductor refrigeration sheet 4, wherein the semiconductor refrigeration sheet 4 is powered by the rechargeable battery 2, the heat-generating side of the semiconductor refrigeration sheet 4 is heat-conductively connected to the heat-absorbing portion 31, and the cooling side of the semiconductor refrigeration sheet 4 is used to cool the handheld electronic device;

[0045] An adaption circuit is also required to be provided between the rechargeable battery 2 and the semiconductor refrigeration sheet 4 to adapt the voltage and current suitable for the semiconductor refrigeration sheet 4 to work properly. Since one surface of the semiconductor refrigeration sheet 4 is in a heating state and the other surface is in a cooling state during operation. The heating side of the semiconductor refrigeration sheet 4 needs to dissipate the heat conveniently to ensure the cooling effect of the semiconductor refrigeration sheet 4. Therefore, in order to facilitate heat dissipation, the heating side of the semiconductor refrigeration sheet 4 is thermally connected to the heat absorption part 31. In this embodiment, the heating side of the semiconductor refrigeration sheet 4 is directly attached to the heat absorption part 31. The heat absorption part 31 can be set to a flat structure to contact the heating side of the semiconductor refrigeration sheet 4 as much as possible, and in order to better perform heat exchange, a coating such as thermal conductive silicone grease can also be coated.

[0046] The function of the air duct component 5 is to allow the ambient air to conveniently contact and heat exchange with the heat dissipation bracket 3 through the air inlet area and the air inlet duct 51 provided on the housing 1. After the ambient air contacts and heat exchanges with the heat dissipation bracket 3, the ambient air is heated to become hot air, which is transferred to the air outlet area provided on the housing 1 through the air outlet duct 52, and flows out from the air outlet area and returns to the ambient air. Therefore, the functions of the air inlet duct 51 and the air outlet duct 52 are to allow the ambient air and hot air to flow along a predetermined path, which helps to optimize the airflow path.

[0047] Specific to Figure 3 , 4 In the embodiment shown in FIG. 5 , the air inlet area 12 is provided on both opposite side walls of the bottom shell 1a, and the air outlet area 13 is provided on the bottom of the bottom shell 1a. Both the air inlet area 12 and the air outlet area 13 are formed through a hole structure provided on the side wall or the bottom of the bottom shell 1a.

[0048] The fan 5 a is used to form airflow among the air inlet area 12 , the air inlet duct 51 , the heat dissipation portion 32 , the air outlet duct 52 and the air outlet area 13 to take away the heat carried by the heat dissipation portion 32 .

[0049] The function of the fan 5a is to generate airflow power so that the heat carried by the heat dissipation part 32 can be quickly exchanged with the ambient air to keep the heat dissipation part 32 at a relatively low temperature.

[0050] In one embodiment, reference Figure 3 and 4 The heat absorbing portion 31 is a flat structure, the heat dissipating portion 32 is provided with a plurality of heat dissipating fins 321, a heat dissipating channel 322 is formed between two adjacent heat dissipating fins 321, and the heat dissipating portion 32 is also provided with a fan slot 323, and the fan 5a is installed in the fan slot 323.

[0051] by Figure 3 , 4 5 as an example, one working mode of the fan 5a is to blow air downward (toward the bottom of the accommodating cavity 11, or the negative direction of the Z direction), and the ambient air. The heat carried by the heat dissipation portion 32 is quickly heat-exchanged with the ambient air, and the hot air formed flows downward from the heat dissipation channel 322 through the air outlet 52. Due to the action of the fan 5a, a fast-flowing airflow is formed on the surface of the heat dissipation portion 32, which accelerates the heat exchange between the ambient air and the heat dissipation portion 32, ensures that the heat dissipation portion 32 is in a relatively low temperature state, and maintains the heat dissipation effect of the heat dissipation bracket 3.

[0052] refer to Figure 1 , 2 and 3, the housing 1 comprises an upper cover 1b and a bottom shell 1a, the upper portion of the bottom shell 1a is an open structure and communicates with the accommodating cavity 11 formed in the bottom shell 1a, and the upper cover 1b is disposed on the open structure.

[0053] In the embodiment of the utility model, the housing 1 can be divided into two parts, one part is the bottom shell 1a, and the other part is the upper cover 1b. The upper part of the bottom shell 1a is an open structure, and the open structure of the upper part of the bottom shell 1a is connected to the accommodating cavity 11. When the upper cover 1b is opened, the various components of the utility model can be installed in the accommodating cavity 11 from the open structure, or taken out from the accommodating cavity 11. In addition, the upper cover 1b can be separated from or combined with the bottom shell 1a in the Z direction.

[0054] refer to Figure 3 , 4 In the embodiment shown in FIG. 5 , the air inlet area 12 is arranged at the side wall of the bottom shell 1 a, and the air outlet area 13 is arranged at the bottom of the bottom shell 1 a.

[0055] In this embodiment, under the action of the fan 5a, the ambient air enters the air inlet duct 51 from the air inlet area 12 provided on the side wall of the bottom shell 1a, and then flows from the air inlet duct 51 to the bracket accommodating space 53. The ambient air exchanges heat with the heat dissipation part 32, and then flows through the air outlet duct 52 to the air outlet area 13 provided at the bottom of the bottom shell 1a and returns to the ambient air.

[0056] refer to Figure 3 , 4 In the illustrated embodiment, the air duct component 5 includes a flat air duct body 50, a support portion 54 provided on the lower side of the air duct body 50, the air inlet duct 51 formed by a partition provided on the upper side of the air duct body 50, and the air outlet duct 52 provided through the upper and lower sides of the air duct body 50. The air duct component 5 is supported on the bottom of the bottom shell 1a through the support portion 54.

[0057] Specific to Figure 3 and 4 In the embodiment shown, preferably, the air duct component 5 is an integrally molded structure of plastic material, the number of the air inlet ducts 51 is two, and the air inlet area 12 is arranged on two opposite sides of the bottom shell 1a. Specifically, the two air inlet ducts 51 are arranged parallel to the air duct main body 50, and are respectively opposite to one of the air inlet areas 12 on the two opposite sides of the bottom shell 1a, and the air outlet duct 52 is arranged to penetrate the air duct main body 50, and the air outlet duct 52 is located directly above the air outlet area 13 and is arranged opposite to the air outlet area 13.

[0058] refer to Figure 6 In the illustrated embodiment, the air inlet area 12 and the air outlet area 13 are both arranged at the side walls of the bottom shell 1a, and one of the two ends of one side wall of the bottom shell 1a is provided with an air outlet area 13 respectively.

[0059] refer to Figure 6 In the illustrated embodiment, the air duct component 5 is formed at the bottom of the bottom shell 1 a , and each of the air outlet areas 13 is correspondingly provided with an air outlet duct 52 .

[0060] refer to Figure 6 In the embodiment shown, the air duct component 5 is integrally formed with the bottom shell 1a, and the air outlet duct 52 is formed by a partition. It should be noted that the arrangement structure of the fan 5a is not limited to the following. Figure 6 The structure shown can form Figure 6 The airflow direction is indicated by the arrow.

[0061] refer to Figure 3 and 4 In the illustrated embodiment, a first heat-conducting groove 20 and a second heat-conducting groove 21 are respectively provided on the upper side and the lower side of the upper cover 1b, and the bottoms of the first heat-conducting groove 20 and the second heat-conducting groove 21 are also connected to form a through groove 22, a first heat-conducting metal sheet 23 is arranged in the first heat-conducting groove 20, a second heat-conducting metal sheet 24 is arranged in the second heat-conducting groove 21, and a third heat-conducting metal sheet 25 is arranged in the through groove 22, and the first heat-conducting metal sheet 23 is thermally connected to the second heat-conducting metal sheet 24 through the third heat-conducting metal sheet 25, and the lower surface of the second heat-conducting metal sheet 24 is thermally connected to the cooling side of the semiconductor refrigeration sheet 4, and the upper surface of the first heat-conducting metal sheet 23 is thermally connected to the electronic device.

[0062] refer to Figure 3 , 4 , further comprising a magnetic ring 10 or a plurality of magnets distributed in an annular direction, wherein the magnetic ring 10 is connected to the inner wall of one side of the housing 1. Figure 3 , 4 In the illustrated embodiment, the magnetic ring 10 is connected to the inner wall of the upper cover 1b (the upper cover 1b can be regarded as one of the side surfaces of the housing 1). When a handheld electronic device is placed on the outer wall of the upper cover 1b for charging and / or cooling, the handheld electronic device is magnetically adsorbed by the magnetic ring 10, and the handheld electronic device can be retained on the outer wall of the upper cover 1b without slipping.

[0063] refer to Figure 3 , 4 , which is a schematic diagram of an embodiment of the cooperation of the semiconductor cooling sheet 4, the wireless charging coil 9, the magnetic ring 10 and the upper cover 1b. In the structural schematic diagram, when viewed from the vertical direction, i.e., the Z direction, the semiconductor cooling sheet 4 is located at the bottom, and the cooling side of the semiconductor cooling sheet 4 faces upward, and the wireless charging coil 9 is located above the semiconductor cooling sheet 4. In addition, there is a circular hole in the middle of the wireless charging coil 9, and the third heat-conducting metal sheet 25 is just arranged on the circular hole.

[0064] In addition, the magnetic ring 10 is located outside the wireless charging coil 9 , and the magnetic ring 10 can be embedded in the inner wall of the upper cover 1 b .

[0065] refer to Figure 3 , 4 , and also includes a semiconductor refrigeration film limit block 15 made of heat insulation material, the semiconductor refrigeration film limit block 15 is arranged on the upper part of the heat absorption part 31, the semiconductor refrigeration film limit block 15 forms a limit area 151, and the semiconductor refrigeration film 4 is arranged in the limit area 151.

[0066] Specific to Figure 4 , 5 In the embodiment shown, the semiconductor refrigeration plate limit block 15 is made of hard foam material. In fact, all materials with poor thermal conductivity, including hard foam material, can be used. In this way, the heat exchange on both sides of the semiconductor refrigeration plate 4 can be limited as much as possible, and the semiconductor refrigeration plate 4 can be limited at the same time.

[0067] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A refrigeration mobile charging device (100), having the function of cooling and charging a handheld electronic device, characterized in that: include: A shell (1) having an air inlet area (12) and an air outlet area (13) formed thereon, and a receiving cavity (11) therein; A rechargeable battery (2) accommodated in the accommodation cavity (11); An air duct component (5) is fixed in the accommodating cavity (11) and is provided with a bracket accommodating space (53), and an air inlet duct (51) and an air outlet duct (52) which are in communication with the bracket accommodating space (53), wherein the air inlet duct (51) is also in communication with the air inlet area (12), and the air outlet duct (52) is also in communication with the air outlet area (13); A heat dissipation bracket (3) fixed in the accommodating cavity (11), the heat dissipation bracket (3) comprising a heat absorbing portion (31) and a heat dissipation portion (32), the heat dissipation portion (32) being accommodated in the bracket accommodating space (53); A semiconductor refrigeration sheet (4), the semiconductor refrigeration sheet (4) being powered by the rechargeable battery (2), the heat-generating side of the semiconductor refrigeration sheet (4) being heat-conductively connected to the heat-absorbing portion (31), and the cooling side of the semiconductor refrigeration sheet (4) being heat-conductively connected to a handheld electronic device; The fan (5a) is used to make the air flow flow through the air inlet area (12), the air inlet duct (51), the bracket accommodating space (53), the air outlet duct (52) and the air outlet area (13) in sequence.

2. The refrigeration mobile charging device according to claim 1, characterized in that: The heat absorbing portion (31) is a flat structure, the heat dissipating portion (32) is provided with a plurality of heat dissipating fins (321), a heat dissipating channel (322) is formed between two adjacent heat dissipating fins (321), and the heat dissipating portion (32) is further provided with a fan slot (323), and the fan (5a) is installed in the fan slot (323).

3. The refrigeration mobile charging device according to claim 1, characterized in that: The housing (1) comprises an upper cover (1b) and a bottom shell (1a); the upper portion of the bottom shell (1a) is an open structure and is connected to the accommodating cavity (11) formed in the bottom shell (1a); and the upper cover (1b) is disposed on the open structure.

4. The refrigeration mobile charging device according to claim 3, characterized in that: The air inlet area (12) is arranged at the side wall of the bottom shell (1a), and the air outlet area (13) is arranged at the bottom of the bottom shell (1a).

5. The refrigeration mobile charging device according to claim 4, characterized in that: The air duct component (5) comprises a flat air duct body (50), a support portion (54) arranged at the lower side of the air duct body (50), an air inlet duct (51) formed by a partition plate arranged at the upper side of the air duct body (50), and an air outlet duct (52) arranged through the upper and lower sides of the air duct body (50). The air duct component (5) is supported on the bottom of the bottom shell (1a) via the support portion (54).

6. The refrigeration mobile charging device according to claim 5, characterized in that: The number of the air inlet ducts (51) is two, the air inlet areas (12) are arranged on two opposite sides of the bottom shell (1a), and each air inlet duct (51) is arranged opposite to one of the air inlet areas (12).

7. The refrigeration mobile charging device according to claim 3, characterized in that: The air inlet area (12) and the air outlet area (13) are both arranged on the side wall of the bottom shell (1a), and an air outlet area (13) is respectively provided at both ends of one side wall of the bottom shell (1a).

8. The refrigeration mobile charging device according to claim 7, characterized in that: The upper side and the lower side of the upper cover (1b) are respectively provided with a first heat-conducting groove (20) and a second heat-conducting groove (21), and the groove bottoms of the first heat-conducting groove (20) and the second heat-conducting groove (21) are also connected to form a through groove (22), a first heat-conducting metal sheet (23) is arranged in the first heat-conducting groove (20), a second heat-conducting metal sheet (24) is arranged in the second heat-conducting groove (21), and a third heat-conducting metal sheet (25) is arranged in the through groove (22), and the first heat-conducting metal sheet (23) is thermally connected to the second heat-conducting metal sheet (24) through the third heat-conducting metal sheet (25), and the lower surface of the second heat-conducting metal sheet (24) is thermally connected to a cooling surface of the semiconductor refrigeration sheet (4), and the upper surface of the first heat-conducting metal sheet (23) is thermally connected to the electronic device.

9. The refrigeration mobile charging device according to claim 1, characterized in that: It also comprises a magnetic ring (10) or a plurality of magnets distributed in an annular direction, wherein the magnetic ring (10) or the plurality of magnets distributed in an annular direction are connected to the inner wall of one side surface of the shell (1).

10. The refrigeration mobile charging device according to claim 1, characterized in that: It also comprises a semiconductor refrigeration film limit block (15) made of heat insulating material, the semiconductor refrigeration film limit block (15) is arranged on the heat absorption part (31), a limit area (151) is formed inside the semiconductor refrigeration film limit block (15), and the semiconductor refrigeration film (4) is arranged in the limit area (151).

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