Heat dissipation device applied to wave soldering

Abstract

The utility model relates to the technical field of wave soldering machines, discloses a heat dissipation device applied to wave soldering, and solves the problem that the heat dissipation work of wave soldering is affected due to the fact that the temperature cannot be reduced when a motor dissipates heat for wave soldering. The motor monitoring unit obtains an early warning signal according to a height signal of dust accumulated on a motor winding and a motor temperature signal detected by the temperature sensor, the early warning signal is output to the control center, and the motor monitoring unit comprises a primary detection circuit and a secondary detection circuit; one end of the secondary detection circuit is connected with the primary detection circuit and the temperature sensor, and the other end of the secondary detection circuit is connected with the control center, so that the heat dissipation efficiency of the motor on wave soldering is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of wave soldering machines, in particular to a heat dissipation device applied to wave soldering. Background Art

[0002] Wave soldering is to make the soldering surface of the plug-in board directly contact with high-temperature liquid tin to achieve the purpose of soldering. The high-temperature liquid tin maintains an inclined surface, and a special device makes the liquid tin form a wave-like phenomenon, so it is called "wave soldering". Its main material is solder bar, so wave soldering machines are used in electrical production and processing factories. Heat dissipation for wave soldering is particularly important. A large amount of heat will be generated in the process of soldering tin bars and high-temperature liquid tin. This heat needs to be dissipated, otherwise it will also damage the wave soldering machine. The lead-free wave soldering machine with a mobile heat dissipation device provided in the patent application number 201820118503.2 uses the cooperation of the motor and the heat dissipation fan to dissipate heat, thereby ensuring the normal operation of wave soldering.

[0003] If the wave soldering is always in a strong working state, the motor also needs to be in a strong working state. The wave soldering generates heat, and the motor is also prone to generate heat when working. In addition, large machines such as wave soldering and motors are prone to dust entry, and too much dust on the motor windings is more likely to cause the motor to heat up, and then cause the motor to burn out. In order to avoid this phenomenon, a temperature sensor is generally set to detect the temperature of the motor and output it to the control center. The control center performs corresponding processing according to the temperature of the motor. However, if only the temperature is detected and the dust on the windings is ignored, the temperature of the motor will not drop, affecting the heat dissipation of the wave soldering. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies of the prior art, the utility model provides a heat dissipation device for wave soldering, which solves the problem that the temperature of the motor cannot be reduced when dissipating heat for wave soldering, thereby affecting the heat dissipation work of the wave soldering.

[0006] (II) Technical solution

[0007] In order to solve the above problems, the utility model provides the following technical solutions: a heat dissipation device applied to wave soldering, comprising a motor, a temperature sensor, and a control center, wherein the heat dissipation device further comprises a motor monitoring unit, wherein the motor monitoring unit obtains an early warning signal according to a height signal of dust accumulated on the motor winding and a temperature signal of the motor detected by the temperature sensor, and the early warning signal is output to the control center;

[0008] The motor monitoring unit includes a primary detection circuit and a secondary detection circuit;

[0009] One end of the secondary detection circuit is connected to the primary detection circuit and the temperature sensor, and the other end of the secondary detection circuit is connected to the control center.

[0010] Preferably, the primary detection circuit obtains a distance signal according to the height of the accumulated dust, obtains a height signal based on the distance signal, and turns on the secondary detection circuit based on the height signal.

[0011] Preferably, the primary detection circuit performs a subtraction operation based on the distance signal to obtain the height signal.

[0012] Preferably, the primary detection circuit amplifies the height signal.

[0013] Preferably, the secondary detection circuit temperature sensor detects the temperature signal of the motor and performs a subtraction operation to obtain a warning signal.

[0014] Preferably, the secondary detection circuit performs a subtraction operation on the temperature signal to obtain a change signal, amplifies the change signal, and uses the amplified change signal as a warning signal.

[0015] (III) Beneficial effects

[0016] Compared with the prior art, the utility model provides a heat dissipation device applied to wave soldering, which has the following beneficial effects:

[0017] 1. The motor monitoring unit included in the heat dissipation device obtains an early warning signal according to the height signal of the dust accumulated on the motor winding and the temperature signal of the motor detected by the temperature sensor. The early warning signal is output to the control center, so as to detect the dust on the motor winding, avoid the phenomenon that the temperature of the motor cannot be lowered due to only detecting the temperature and ignoring the dust on the winding, and solve the problem that the temperature of the motor cannot be lowered when dissipating heat for wave soldering, thereby affecting the heat dissipation work of wave soldering, thereby ensuring the efficiency of the heat dissipation of the motor for wave soldering.

[0018] 2. The primary detection circuit included in the motor monitoring unit utilizes the distance signal set above the motor winding, and performs subtraction operation on the distance signal based on the operational amplifier U1B, thereby obtaining the dust height signal, and utilizing the diode D2 to determine whether there is too much dust on the motor winding, thereby increasing the possibility of the motor heating up, thereby preliminarily ensuring the temperature of the motor during operation.

[0019] 3. The secondary detection circuit included in the motor monitoring unit uses the operational amplifier U4B to perform subtraction operation on the temperature signal when the motor is running, so as to determine the temperature rise when dust accumulates on the motor winding, and output a warning signal to the control center, thereby ensuring the temperature of the motor when dissipating heat for wave soldering and avoiding the possibility of the motor being burned out. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the circuit principle of the motor monitoring unit provided by the utility model. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-Figure 2 The utility model provides a new technical solution: a heat dissipation device applied to wave soldering, comprising a motor, a temperature sensor, and a control center. The heat dissipation device also comprises a motor monitoring unit. The motor monitoring unit obtains an early warning signal according to a height signal of dust accumulated on the motor winding and a temperature signal of the motor detected by the temperature sensor. The early warning signal is output to the control center.

[0024] The motor monitoring unit includes a primary detection circuit and a secondary detection circuit;

[0025] One end of the secondary detection circuit is connected to the primary detection circuit and the temperature sensor, and the other end of the secondary detection circuit is connected to the control center.

[0026] The primary detection circuit uses a distance sensor to detect dust on the winding to obtain a distance signal between the distance sensor and the dust. The distance sensor is installed above the position where the winding is prone to dust accumulation. An ultrasonic sensor with a model similar to AS5600-ASOM can be used to collect the distance signal. The obtained distance signal is transmitted to the operational amplifier U1B through the resistor R1 and subtracted from the standard signal provided by the resistor R12, wherein the standard signal is the distance signal when the distance sensor is just installed above the winding and there is no dust accumulated on the winding. The output of the operational amplifier U1B is the dust height signal. In order to avoid the height signal from being too small in amplitude, the height signal is transmitted to the operational amplifier U3B for amplification. If the amplified height signal turns on the diode D2, it indicates that too much dust has accumulated on the winding at this time. Then the diode D2 turns on the thyristor Q2 through the capacitor C1, and the secondary detection circuit is started at this time.

[0027] The secondary detection circuit transmits the temperature signal of the motor detected by the temperature sensor during operation to the operational amplifier U4B through the thyristor Q2 in two ways. One way is transmitted to the in-phase end of the operational amplifier U4B through the resistor R3, and the other way is transmitted to the inverting end of the operational amplifier U4B after delay through the resistor R9 and the capacitor C2. The temperature signal is an analog signal, and the operational amplifier U4B subtracts the two temperature signals to output the change signals of the two temperature signals, that is, the temperature rise of the motor can be obtained through the change signal. In order to avoid the amplitude of the change signal being too small, resulting in the inability to output the change signal to the control center, the change signal is amplified by the transistor Q1 and output to the control center as a warning signal, reminding the control center to clean the dust on the motor windings, as there is a risk of burning the motor, otherwise the heat dissipation of the wave soldering cannot be guaranteed.

[0028] For example, in actual use, the distance signal detected by the distance sensor of the primary detection circuit is 1.2V, and the standard signal provided by the resistor R12 is 1.3V, so the obtained height signal is 0.1V. The height signal is amplified to 1V by the operational amplifier U3B, and the diode D2 is turned on, and the secondary detection circuit is started. The 3.5V temperature signal detected by the temperature sensor is transmitted to the operational amplifier U4B through the resistor R3. The operational amplifier U4B subtracts the 3.5V temperature signal from the 3.2V temperature signal delayed by the resistor R9 and the capacitor C2, and obtains a 0.3V change signal. The change signal is amplified to 2V by the transistor Q1 and then output to the control center as a warning signal.

[0029] The primary detection circuit includes an op amp U1B, an inverting end of the op amp U1B is respectively connected to one end of a resistor R1 and one end of a resistor R7, the other end of the resistor R1 is connected to the out pin of the distance sensor U1, a non-inverting end of the op amp U1B is respectively connected to one end of a resistor R12 and one end of a resistor R8, the other end of the resistor R12 is respectively connected to the vcc pin of the distance sensor U1 and connected to a positive polarity power supply VCC, an inverting end of the op amp U1B is respectively connected to the other end of the resistor R7 and one end of the resistor R6, the other end of the resistor R6 is connected to the non-inverting end of the op amp U3B, an inverting end of the op amp U3B is respectively connected to one end of a resistor R2 and one end of a resistor R5, an output end of the op amp U3B is respectively connected to the other end of the resistor R5 and the positive electrode of the diode D2, the negative electrode of the diode D2 is connected to one end of the capacitor C1, the other end of the capacitor C1 is respectively connected to the other end of the resistor R2, the other end of the resistor R8, the gnd pin of the distance sensor U1 and connected to ground.

[0030] The secondary detection circuit includes a thyristor Q2, the anode of the thyristor Q2 is connected to the temperature sensor, the control electrode of the thyristor Q2 is connected to the negative electrode of the diode D1 in the primary detection circuit and one end of the capacitor C1, the cathode of the thyristor Q2 is connected to one end of the resistor R3, the other end of the resistor R3 is respectively connected to one end of the resistor R9, one end of the resistor R11, and the in-phase end of the operational amplifier U4B, the inverting end of the operational amplifier U3B is respectively connected to the other end of the resistor R9, one end of the capacitor C2, and one end of the resistor R10, The output end of amplifier U4B is respectively connected to the other end of resistor R109 and the base of transistor Q1, the collector of transistor Q1 is respectively connected to one end of resistor R4 and the control center, the emitter of transistor Q1 is connected to one end of resistor R13, the other end of resistor R4 and the other end of resistor R12 in the primary detection circuit are connected to the positive polarity power supply VCC, the other end of resistor R13 is respectively connected to the other end of capacitor C2, the other end of resistor R11, the other end of capacitor C1 in the primary detection circuit and connected to ground.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for wave soldering, comprising a motor, a temperature sensor, and a control center, characterized in that: The heat dissipation device further comprises a motor monitoring unit, which obtains an early warning signal according to a height signal of dust accumulated on the motor winding and a temperature signal of the motor detected by a temperature sensor, and outputs the early warning signal to a control center; The motor monitoring unit includes a primary detection circuit and a secondary detection circuit; One end of the secondary detection circuit is connected to the primary detection circuit and the temperature sensor, and the other end of the secondary detection circuit is connected to the control center.

2. The heat dissipation device for wave soldering according to claim 1, characterized in that: The primary detection circuit obtains a distance signal according to the height of the accumulated dust, obtains a height signal based on the distance signal, and turns on the secondary detection circuit based on the height signal.

3. The heat dissipation device for wave soldering according to claim 2, characterized in that: The primary detection circuit performs a subtraction operation based on the distance signal to obtain a height signal.

4. The heat dissipation device for wave soldering according to claim 1, characterized in that: The primary detection circuit amplifies the height signal.

5. The heat dissipation device for wave soldering according to claim 1, characterized in that: The secondary detection circuit temperature sensor detects the temperature signal of the motor and performs a subtraction operation to obtain an early warning signal.

6. The heat dissipation device for wave soldering according to claim 1, characterized in that: The secondary detection circuit performs a subtraction operation on the temperature signal to obtain a change signal, amplifies the change signal, and uses the amplified change signal as an early warning signal.

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