Impedance circuit board

Abstract

The utility model relates to the technical field of circuit boards, and particularly discloses an impedance circuit board which comprises a mainboard, the mainboard comprises a substrate and panels covering the upper surface and the lower surface of the substrate, a plurality of heat dissipation assemblies are embedded in the two sides of the substrate, the heat dissipation assemblies are used for conducting heat dissipation on elements on the mainboard, and the heat dissipation assemblies are used for conducting heat dissipation on the elements on the mainboard. The heat dissipation assembly comprises a built-in part and a fixed part, the built-in part is embedded in a built-in groove formed in the substrate, the fixed part is fixedly connected with the built-in part, and the fixed part is used for fixing the whole body on an electric appliance. According to the impedance circuit board, heat dissipation can be effectively carried out on the interior of the mainboard through the built-in part, the mainboard can be lifted to a certain height while the fixed part of the heat dissipation assembly carries out heat conduction, the mainboard can make full contact with air conveniently, heat of the mainboard is taken away, and the heat dissipation efficiency of the circuit board can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an impedance circuit board. Background Art

[0002] Impedance circuit board is a good laminated structure that can control the characteristic impedance of the printed circuit board. Its routing can form an easily controllable and predictable transmission line structure, which is called an impedance board.

[0003] When the impedance board is in use, if the current in the circuit is too large, it will exceed the rated value of the impedance board, causing it to heat up and possibly burn the circuit board. In the prior art, the outer surface of the circuit board is usually cooled to suppress its temperature, which results in a smaller contact area between the heat dissipation structure and the circuit board, affecting its heat dissipation efficiency.

[0004] Therefore, those skilled in the art provide an impedance circuit board to solve the problems raised in the above background technology. Utility Model Content

[0005] The purpose of the utility model is to provide an impedance circuit board to solve the following technical problems:

[0006] How to improve the heat dissipation efficiency of impedance circuit boards.

[0007] The purpose of the utility model can be achieved through the following technical solutions:

[0008] An impedance circuit board comprises a main board, wherein the main board comprises a substrate and panels covering the upper and lower surfaces of the substrate;

[0009] A plurality of heat dissipation components are embedded on both sides of the substrate, and the heat dissipation components are used to dissipate heat from components on the mainboard;

[0010] The heat dissipation component includes a built-in part and a fixed part. The built-in part is buried in a built-in groove arranged in the substrate. The fixed part is fixedly connected to the built-in part, and the fixed part is used to fix the whole on the electrical appliance.

[0011] Through the above technical solution, the heat dissipation component can effectively dissipate heat from the inside of the motherboard through the built-in part, and the fixed part of the heat dissipation component can lift the motherboard to a certain height while conducting heat, so as to facilitate full contact between the motherboard and the air and take away the heat of the motherboard.

[0012] Further, the built-in part is composed of a plurality of heat-conducting strips, the heat-conducting strips cooperate with the built-in grooves, and the heat-conducting strips are distributed in a continuous S shape;

[0013] Through the above technical solution, the contact area between the heat conductive strip and the mainboard can be increased to effectively dissipate heat.

[0014] Furthermore, the fixing part comprises a heat-conducting block, one side of the heat-conducting block is provided with a card slot, and the card slot and the heat-conducting strip are engaged with each other;

[0015] Through the above technical solution, the built-in part and the fixed part can be snap-fitted together, which is convenient for installation and disassembly and easy to use.

[0016] Furthermore, the fixed part further comprises a support plate and a bottom plate, the bottom plate is fixedly connected to a lower side of the support plate, and an upper side of the support plate is fixedly connected to the heat conducting block;

[0017] Through the above technical solution, the support plate, the bottom plate and the heat conductive block are integrated as a whole, which can conduct the internal temperature of the mainboard to the outside, and can effectively support the mainboard and the heat dissipation components.

[0018] Furthermore, a cooling liquid cavity is fixedly provided inside the support plate, and the cooling liquid cavity contains cooling liquid;

[0019] Through the above technical solution, the support plate guides the heat of the heat-conducting block into the interior of the cooling liquid cavity and cools it through the coolant, thereby improving the heat dissipation efficiency.

[0020] Furthermore, the bottom plate is threadedly connected with screws, and the screws are used to fix the bottom plate on the electrical appliance;

[0021] Through the above technical solution, the screws can fix the whole thing on the electrical appliance.

[0022] Furthermore, the base plate further comprises an insertion port, the insertion port is used to fix the fixing part, and the insertion port and the built-in groove are mutually connected;

[0023] Through the above technical solution, the insertion port and the built-in groove facilitate the installation of the heat-conducting block and the heat-conducting strip.

[0024] Furthermore, the heat conducting strip and the heat conducting block are both made of copper;

[0025] Through the above technical solution, copper has good thermal conductivity and can effectively transfer the heat of the motherboard to the outside.

[0026] Beneficial effects of the utility model:

[0027] (1) The utility model is provided with a heat dissipation component and a support mechanism. The heat dissipation component is built into the mainboard and dissipates heat to the mainboard through heat-conducting strips and heat-conducting blocks. The support plate can transfer the heat of the heat-conducting blocks to the internal cooling liquid chamber for cooling. At the same time, the support plate lifts the mainboard to a certain height, which is convenient for the mainboard to fully contact with the air and take away the heat of the mainboard through the air, thereby effectively improving the heat dissipation efficiency of the mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The utility model is further described below in conjunction with the accompanying drawings.

[0029] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0030] Figure 2 It is a schematic diagram of the connection structure of the heat sink of the utility model;

[0031] Figure 3 It is a schematic diagram of the internal structure of the utility model;

[0032] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0033] Reference numerals:

[0034] 1. Main board; 101. Panel; 102. Baseboard; 102a. Built-in slot; 102b. Insertion port; 2. Heat dissipation assembly; 202c. Card slot; 201. Thermal strip; 202. Thermal block; 203. Support plate; 204. Cooling liquid chamber; 205. Bottom plate; 3. Screws. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] Please see attached Figure 1-4 , an impedance circuit board in an embodiment of the utility model comprises a main board 1, the main board 1 comprises a substrate 102 and a panel 101 covering the upper and lower surfaces of the substrate 102;

[0037] Multiple heat dissipation components 2 are embedded on both sides of the base plate 102, and the heat dissipation components 2 are used to dissipate heat from the components on the main board 1;

[0038] The heat dissipation component 2 includes a built-in part and a fixed part. The built-in part is buried in a built-in groove 102a provided in the substrate 102. The fixed part is fixedly connected to the built-in part, and the fixed part is used to fix the whole on the electrical appliance.

[0039] The heat dissipation component 2 can effectively dissipate heat from the inside of the mainboard 1 through the built-in part, and the fixed part of the heat dissipation component 2 can lift the mainboard 1 to a certain height while conducting heat, so that the mainboard 1 can fully contact with the air and take away the heat of the mainboard 1.

[0040] The built-in part is composed of a plurality of heat-conducting strips 201, which cooperate with the built-in grooves 102a. The heat-conducting strips 201 are distributed in a continuous S shape, which can increase the contact area between the heat-conducting strips 201 and the mainboard 1 for effective heat dissipation.

[0041] The fixed part includes a heat conductive block 202, and a slot 202c is provided on one side of the heat conductive block 202. The slot 202c and the heat conductive strip 201 are engaged with each other, so that the built-in part and the fixed part can be engaged with each other, which is convenient for installation and disassembly and easy to use.

[0042] The fixed part also includes a support plate 203 and a base plate 205. The base plate 205 is fixedly connected to the lower side of the support plate 203, and the upper side of the support plate 203 is fixedly connected to the heat conductive block 202. The support plate 203, the base plate 205 and the heat conductive block 202 are a whole, which can conduct the internal temperature of the mainboard 1 to the outside, and can effectively support the mainboard 1 and the heat dissipation component 2.

[0043] A cooling liquid cavity 204 is fixedly disposed inside the support plate 203. The cooling liquid cavity 204 contains cooling liquid. The support plate 203 introduces the heat of the heat-conducting block 202 into the cooling liquid cavity 204 and cools it through the cooling liquid, thereby improving the heat dissipation efficiency.

[0044] The bottom plate 205 is threadedly connected with screws 3, and the screws 3 are used to fix the bottom plate 205 on the electrical appliance.

[0045] The base plate 102 further includes an insertion port 102 b, which is used for fixing the portion, and the insertion port 102 b and the built-in groove 102 a are interconnected.

[0046] The heat conducting strip 201 and the heat conducting block 202 are both made of copper.

[0047] Working principle: When the impedance circuit board is in use, heat is dissipated through the thermal strip 201, and the thermal strip 201 is in a continuous S shape, which can increase the heat conduction area and effectively absorb the heat of the mainboard 1. The thermal strip 201 then transfers the heat to the thermal block 202. The heat of the thermal block 202 is transferred to the internal cooling liquid chamber 204 through the support plate 203 for cooling. At the same time, the support plate 203 lifts the mainboard 1 to a certain height, which is convenient for the mainboard 1 to fully contact with the air and take away the heat of the mainboard 1 through the air, thereby effectively improving the heat dissipation efficiency of the mainboard 1.

[0048] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. An impedance circuit board, characterized in that: It comprises a main board (1), wherein the main board (1) comprises a substrate (102) and a panel (101) covering the upper and lower surfaces of the substrate (102); A plurality of heat dissipation components (2) are embedded on both sides of the base plate (102), and the heat dissipation components (2) are used to dissipate heat from components on the main board (1); The heat dissipation component (2) comprises a built-in part and a fixed part, the built-in part is embedded in a built-in groove (102a) provided in the base plate (102), the fixed part is fixedly connected to the built-in part, and the fixed part is used to fix the whole on the electrical appliance.

2. The impedance circuit board according to claim 1, characterized in that: The built-in part is composed of a plurality of heat-conducting strips (201), the heat-conducting strips (201) cooperate with the built-in grooves (102a), and the heat-conducting strips (201) are distributed in a continuous S shape.

3. An impedance circuit board according to claim 2, characterized in that: The fixed part comprises a heat-conducting block (202), one side of the heat-conducting block (202) is provided with a clamping groove (202c), and the clamping groove (202c) and the heat-conducting strip (201) are mutually engaged and clamped.

4. The impedance circuit board according to claim 1, characterized in that: The fixed part further comprises a support plate (203) and a bottom plate (205), wherein the bottom plate (205) is fixedly connected to a lower side of the support plate (203), and an upper side of the support plate (203) is fixedly connected to the heat conducting block (202).

5. The impedance circuit board according to claim 4, characterized in that: A cooling liquid cavity (204) is fixedly arranged inside the support plate (203), and the cooling liquid cavity (204) contains cooling liquid.

6. The impedance circuit board according to claim 4, characterized in that: The bottom plate (205) is threadedly connected with screws (3), and the screws (3) are used to fix the bottom plate (205) on the electrical appliance.

7. The impedance circuit board according to claim 1, characterized in that: The base plate (102) further comprises an insertion opening (102b), wherein the insertion opening (102b) is used to fix the fixing part, and the insertion opening (102b) and the built-in groove (102a) are interconnected.

8. The impedance circuit board according to claim 2, characterized in that: The heat conducting strip (201) and the heat conducting block (202) are both made of copper.

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