Air cooling heat dissipation device and domain controller

Abstract

The utility model provides an air cooling heat radiation device and a domain controller, comprising a closed housing, a heat conduction interface material, a heat radiation fan and heat radiation ribs, the closed housing is arranged outside a to-be-cooled device, and the heat conduction interface material is arranged between the closed housing and the to-be-cooled device; the heat dissipation fan and the heat dissipation ribs are arranged on the closed shell; the heat dissipation ribs are arranged on the periphery of the heat dissipation fan so that outlet air of the heat dissipation fan can be diffused to the surface of the closed shell along a heat dissipation air channel formed by the heat dissipation ribs. According to the air cooling heat dissipation device and the domain controller, through reasonable arrangement of the closed shell and the heat dissipation ribs, the heat dissipation efficiency is effectively improved, and the heat dissipation cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to an air-cooled heat dissipation device and a domain controller. Background Art

[0002] An automotive domain controller is a centralized electronic control unit (ECU) that integrates the functions of multiple traditional ECUs onto a more powerful processor hardware platform. This centralized electronic architecture is designed to improve the integration of system functions, reduce development and manufacturing costs, and improve overall performance. Common domain controllers include power domain, body domain, chassis domain, assisted driving domain, and cockpit (or infotainment) domain. The core computing chip inside the domain controller generates a lot of heat. If there is no reasonable heat dissipation path to dissipate the heat of the chip, the product is likely to not work properly.

[0003] In the prior art, the more common heat dissipation treatment method is to make the chip and the metal shell contact through the thermal interface material, so that the heat is transferred from the chip surface to the metal shell. At this time, the metal shell is equivalent to a large heat sink. Commonly used thermal interface materials for domain controllers include thermal grease, thermal gel and thermal pads. After the metal shell absorbs the heat source of the chip, it also needs to better dissipate heat to nature to achieve thermal balance of the product. At present, the heat dissipation methods of metal shells usually include the following:

[0004] (1) Natural heat dissipation, that is, the metal shell relies on radiation heat dissipation to the outside air.

[0005] (2) Liquid cooling: that is, setting up cooling water channels inside the domain controller to remove the heat from the metal shell by connecting cooling liquid. It is suitable for high-power products with liquid cooling conditions.

[0006] However, natural heat dissipation is inefficient and not conducive to heat dissipation of high-power products; liquid cooling is costly and requires a circulating coolant system. Utility Model Content

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an air-cooled heat dissipation device and a domain controller, which effectively improve the heat dissipation efficiency and reduce the heat dissipation cost through the reasonable arrangement of a closed shell and heat dissipation ribs.

[0008] In order to overcome the above-mentioned shortcomings, the utility model provides an air-cooled heat dissipation device, comprising a closed shell, a thermal interface material, a heat dissipation fan and heat dissipation ribs: the closed shell is arranged outside the device to be cooled, and the thermal interface material is arranged between the closed shell and the device to be cooled; the heat dissipation fan and the heat dissipation ribs are arranged on the closed shell; the heat dissipation ribs are arranged around the heat dissipation fan, so that the air outlet of the heat dissipation fan can be diffused to the surface of the closed shell along the heat dissipation air duct formed by the heat dissipation ribs.

[0009] In an embodiment of the present invention, a boss is disposed on the surface of the closed housing, and the heat dissipation fan is fixed on the boss.

[0010] In an embodiment of the present invention, the boss is a conical boss.

[0011] In an embodiment of the present invention, the closed housing includes an upper housing and a lower housing, and the upper housing and the lower housing form a closed space to accommodate the component to be cooled.

[0012] In an embodiment of the utility model, the heat dissipation fan and the heat dissipation ribs are arranged on the upper shell.

[0013] In one embodiment of the utility model, the heat dissipation ribs include high heat dissipation ribs and low heat dissipation ribs; the high heat dissipation ribs are arranged in a preset area around the heat dissipation fan; the low heat dissipation ribs are arranged in a non-preset area around the heat dissipation fan, the longitudinal height of the high heat dissipation ribs is greater than the longitudinal height of the low heat dissipation ribs, and the low heat dissipation ribs extend from the corresponding high heat dissipation ribs.

[0014] In an embodiment of the present invention, the high heat dissipation ribs are arranged in a manner of radiating from the heat dissipation fan to the surroundings and are evenly distributed in the preset area.

[0015] In an embodiment of the present invention, the low heat dissipation ribs are distributed in parallel in the non-preset area.

[0016] In an embodiment of the present invention, the heat dissipation fan is arranged at a position corresponding to a maximum heat source of the device to be cooled.

[0017] In addition, the utility model provides a domain controller, comprising a domain controller body and the above-mentioned air-cooling heat dissipation device;

[0018] The domain controller body serves as a device to be cooled;

[0019] The air-cooling and heat dissipation device is arranged on the domain controller body, and is used for air-cooling and heat dissipating the domain controller body.

[0020] As described above, the air-cooling heat dissipation device and domain controller of the utility model have the following beneficial effects:

[0021] (1) Through the reasonable arrangement of the closed shell and heat dissipation ribs, it can achieve the purpose of waterproof and dustproof, with a high protection level;

[0022] (2) The design of the heat dissipation duct makes the air outlet of the cooling fan smoother; the heat dissipation duct radiates from the center of the heat source to the surrounding areas, and the duct curve transition resistance is small, achieving the purpose of low wind pressure and large air volume, and effectively reducing the noise caused by heat dissipation;

[0023] (3) The heat dissipation ribs are closely attached to the distribution of heat sources. In places with high heat generation, heat dissipation ribs that meet the requirements are designed. In places with low heat generation, the height of the heat dissipation ribs is reduced, thereby effectively improving the heat dissipation efficiency and reducing the heat dissipation cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the exploded structure of an air-cooling heat dissipation device applied to a device to be cooled in one embodiment of the present invention.

[0025] Figure 2 Shown is a side view structural schematic diagram of an air-cooling heat dissipation device applied to a device to be cooled in one embodiment of the utility model;

[0026] Figure 3 The figure shows a side view of the upper shell of the air-cooling heat dissipation device of the present invention in one embodiment;

[0027] Figure 4 The figure shows a side view of the upper shell of the air-cooling heat dissipation device of the present invention in another embodiment;

[0028] Figure 5 Shown is a schematic structural diagram of a domain controller in an embodiment of the present invention. DETAILED DESCRIPTION

[0029] The following is a description of the implementation of the present invention by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0030] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the utility model, should still fall within the scope of the technical content disclosed by the utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the utility model. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the utility model without substantial change of the technical content.

[0031] The air-cooled heat dissipation device and domain controller of the utility model effectively improve the heat dissipation efficiency of the heat dissipation device and reduce the heat dissipation cost by creatively setting a closed shell and heat dissipation ribs, and can achieve the purpose of waterproof and dustproof, with a high protection level, thus being extremely practical.

[0032] like Figure 1-Figure 4 As shown, in one embodiment, the air-cooling heat dissipation device of the utility model is applied to a device to be cooled 5, including a closed housing 1, a heat dissipation fan 2, a thermal interface material 3 and heat dissipation ribs 4.

[0033] The closed housing 1 is arranged outside the device to be cooled 5, and a thermal interface material 3 is arranged between the closed housing and the device to be cooled 5. The closed housing 1 is provided with a containing space inside for placing the device to be cooled 5. The space between the device to be cooled 5 and the closed housing 1 is filled with a thermal interface material 3 to conduct the heat energy generated by the device to be cooled 5 to the closed housing 1. Preferably, the thermal interface material 3 is made of thermal grease, thermal gel or thermal gasket. It should be noted that the device to be cooled 5 can be an electronic device, such as a device that requires air cooling and heat dissipation, such as a domain controller circuit board.

[0034] The closed housing 1 is provided with the heat dissipation fan 2 and heat dissipation ribs 4. The heat dissipation ribs 4 are arranged around the heat dissipation fan 2 so that the air discharged from the heat dissipation fan 2 is diffused to the surface of the closed housing 1 along the heat dissipation air channel formed by the heat dissipation ribs 4, thereby realizing rapid heat dissipation on the surface of the closed housing 1.

[0035] In one embodiment, the closed housing 1 includes an upper housing 11 and a lower housing 12. The upper housing 11 and the lower housing 12 form a closed space to accommodate the device to be cooled 5. The closed housing 1 has no other through holes except for the through holes for installation and fixation, so that the device to be cooled 5 is isolated from the outside world, thereby effectively preventing the device to be cooled 5 from short-circuiting and being damaged by splashing water or falling metal objects, so as to be suitable for harsh working environments. In one embodiment, the upper housing 11 and the lower housing 12 are adaptively combined by means of structures such as snaps.

[0036] Preferably, the cooling fan 2 and the cooling ribs 4 are arranged on the upper shell 11. If the cooling requirement of the device to be cooled 5 is high, cooling fans and cooling ribs can also be arranged on both the upper shell 11 and the lower shell 12 to achieve double-sided heat dissipation of the closed housing 1.

[0037] When a cooling fan is installed on the top of the cooling rib, the wind resistance in the cooling duct is relatively large, which will cause a large wind loss, poor cooling effect, and high noise. Figure 3 As shown, in one embodiment, a boss 13 is provided on the surface of the closed housing 1, and the cooling fan 2 is fixed on the boss 13, so as to realize the positioning of the cooling fan 2. Preferably, the boss 13 is a conical boss. Compared with the wind resistance at the contact point between the air inlet of the vertically placed cooling fan and the closed housing 1, after the center position of the air duct is designed into a conical structure, the conical surface is concave inward into a curved surface, thereby smoothly changing the direction of the air outlet, effectively reducing the wind resistance and noise.

[0038] Since the heat source of the device to be cooled cannot be evenly distributed, the heat dissipation ribs of the present invention also need to be adaptively adjusted according to the distribution of the heat source. Figure 4As shown, in one embodiment, the heat dissipation ribs 4 include high heat dissipation ribs 41 and low heat dissipation ribs 42. The high heat dissipation ribs 41 are arranged in a preset area around the heat dissipation fan 2; the low heat dissipation ribs 42 are arranged in a non-preset area around the heat dissipation fan, the longitudinal height of the high heat dissipation ribs 41 is greater than the longitudinal height of the low heat dissipation ribs 42, and the low heat dissipation ribs 42 extend from the corresponding high heat dissipation ribs 41. Wherein, the high heat dissipation ribs 41 start from the center of the heat dissipation fan 2 and are arranged radially in the preset area around the heat dissipation fan. The preset area corresponds to the area where the heat energy of the device to be cooled 5 is large. The low heat dissipation ribs 42 extend from the corresponding high heat dissipation ribs 41 and are arranged in parallel in the non-preset area. The non-preset area corresponds to the area where the heat energy of the device to be cooled 5 is small. Through the above arrangement, in places with large heat energy, the heat dissipation ribs are designed with high dimensions so that they can absorb more heat; in places with small heat energy, lower heat dissipation ribs are used, thereby reducing unnecessary material waste and achieving the effect of energy saving and cost reduction.

[0039] Depend on Figure 3 and Figure 4 It can be seen that the heat dissipation ribs 4 form a heat dissipation duct centered on the heat dissipation fan 2. The heat dissipation duct frame diffuses the air outlet of the heat dissipation fan 2 to the surroundings along the heat dissipation duct. Each heat dissipation duct is a curved structure, so that the wind has low resistance, high wind speed and low noise when flowing through the heat dissipation duct, thereby achieving efficient heat dissipation. Among them, the center of the heat dissipation duct is the position of the heat dissipation fan 2, and this position is selected at the position corresponding to the maximum heat source of the device to be cooled 5, thereby further accelerating heat dissipation.

[0040] In one embodiment, the heat dissipation rib 4 is integrally formed with the closed housing 1. Specifically, the heat dissipation rib 4 is integrally formed with the upper shell 11 of the closed housing 1. It should be noted that the present invention does not impose any specific restrictions on the connection method between the heat dissipation rib and the closed housing, which should still be covered by the claims of the present invention. Figure 5 As shown, in one embodiment, the domain controller of the present invention includes a domain controller body and the above-mentioned air-cooling heat dissipation device.

[0041] The domain controller body is used as a device to be cooled. The domain controller body can be applied to intelligent driving, assisted driving control and intelligent cockpit of passenger cars and other industrial vehicles.

[0042] The air-cooling and heat dissipation device is arranged on the domain controller body, and is used for air-cooling and heat dissipating the domain controller body.

[0043] In summary, the air-cooled heat dissipation device and domain controller of the utility model can achieve the purpose of waterproof and dustproof through the reasonable arrangement of the closed shell and heat dissipation ribs, and has a high protection level; the design of the heat dissipation duct makes the air outlet of the heat dissipation fan smoother; the heat dissipation duct radiates from the center of the heat source to the surroundings, and the transition resistance of the duct curve is small, which achieves the purpose of low wind pressure and large air volume, and effectively reduces the noise caused by heat dissipation; the heat dissipation ribs are closely attached to the distribution of the heat source, and the heat dissipation ribs that meet the requirements are designed in places with high heat generation; the height of the heat dissipation ribs is reduced in places with low heat generation, thereby effectively improving the heat dissipation efficiency and reducing the heat dissipation cost. Therefore, the utility model effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0044] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. An air-cooled heat dissipation device, characterized in that: Includes enclosed housing, thermal interface material, cooling fan and heat dissipation ribs: The closed housing is arranged outside the device to be cooled, and the thermal interface material is arranged between the closed housing and the device to be cooled; The closed housing is provided with the heat dissipation fan and the heat dissipation ribs; the heat dissipation ribs are arranged around the heat dissipation fan so that the air outlet of the heat dissipation fan is diffused to the surface of the closed housing along the heat dissipation air channel formed by the heat dissipation ribs.

2. The air-cooling heat dissipation device according to claim 1, characterized in that: The surface of the closed shell is provided with a boss, and the heat dissipation fan is fixed on the boss.

3. The air-cooling heat dissipation device according to claim 2, characterized in that: The boss is a conical boss.

4. The air-cooling heat dissipation device according to claim 1, characterized in that: The closed housing comprises an upper shell and a lower shell, and the upper shell and the lower shell form a closed space to accommodate the device to be cooled.

5. The air-cooling heat dissipation device according to claim 4, characterized in that: The heat dissipation fan and the heat dissipation ribs are arranged on the upper shell.

6. The air-cooling heat dissipation device according to claim 1, characterized in that: The heat dissipation ribs include high heat dissipation ribs and low heat dissipation ribs; the high heat dissipation ribs are arranged in a preset area around the heat dissipation fan; the low heat dissipation ribs are arranged in a non-preset area around the heat dissipation fan, the longitudinal height of the high heat dissipation ribs is greater than the longitudinal height of the low heat dissipation ribs, and the low heat dissipation ribs extend from the corresponding high heat dissipation ribs.

7. The air-cooling heat dissipation device according to claim 6, characterized in that: The high heat dissipation ribs are arranged in a manner of radiating from the heat dissipation fan to the surrounding areas and are evenly distributed in the preset area.

8. The air-cooling heat dissipation device according to claim 6, characterized in that: The low heat dissipation ribs are distributed in parallel in the non-preset area.

9. The air-cooling heat dissipation device according to claim 1, characterized in that: The heat dissipation fan is arranged at a position corresponding to a maximum heat source of the device to be cooled.

10. A domain controller, characterized in that: It comprises a domain controller body and the air-cooling heat dissipation device according to any one of claims 1 to 9; The domain controller body serves as a device to be cooled; The air-cooling and heat dissipation device is arranged on the domain controller body, and is used for air-cooling and heat dissipating the domain controller body.

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