Semiconductor device production mounting equipment

Abstract

The utility model provides semiconductor device production mounting equipment which comprises a mounting box, a three-axis linear motor is mounted on the upper side in the mounting box, a mounting head is mounted at a Z-axis sliding block of the three-axis linear motor, and a circuit board positioning table assembly and a patch placement table are mounted on the left side and the right side of the lower side in the mounting box respectively. Through the arrangement of the mounting table, the first linear motor, the second linear motor, the through groove and the U-shaped positioning block, the circuit board can be positioned, and the condition that the circuit board is placed obliquely is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of device production, and in particular relates to a semiconductor device production mounting device. Background Art

[0002] When semiconductor devices are produced, it is usually necessary to mount the patches on the circuit boards. Existing mounting equipment for semiconductor device production includes a body, a mounting cavity is provided on the body, a slide rail is fixedly provided on the inner wall of the back side of the mounting cavity, and a connecting rod is movably provided in the slide rail. The utility model provides an installation box, a central control module, a battery, a push rod motor, a limit rod, a conductive plate, a connecting plate, a conductive column and a negative electrode column. When this mounting equipment is in use, it can alarm when the circuit board is placed crookedly, and the user is also required to straighten the circuit board, and the operation is relatively complicated. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a semiconductor device production mounting equipment, which can position the circuit board and avoid the circuit board being placed crookedly.

[0004] The utility model is realized by the following technical solutions:

[0005] A semiconductor device production and placement equipment includes a placement box, a three-axis linear motor is installed on the upper side of the interior of the placement box, and is characterized in that a placement head is installed at the Z-axis slider of the three-axis linear motor, and a circuit board positioning table assembly and a patch placement table are installed on the left and right sides of the lower side of the interior of the placement box, respectively. The circuit board positioning table assembly includes a mounting table, and a second linear motor and a first linear motor are installed on the upper and lower sides of the interior of the mounting table, respectively. A through groove is opened on the upper part of the mounting table, and U-shaped positioning blocks are installed on the upper parts of the sliders of the first linear motor and the second linear motor.

[0006] Preferably, the first linear motor and the second linear motor are distributed in a cross shape.

[0007] Preferably, the through groove is shaped as a cross.

[0008] Compared with the prior art, the beneficial effects of the utility model are:

[0009] 1. In the present invention, the arrangement of the mounting platform, the first linear motor, the second linear motor, the through slot, and the U-shaped positioning block is conducive to positioning the circuit board and avoiding the situation where the circuit board is placed crookedly.

[0010] 2. In the present invention, the three-axis linear motor and the arrangement of the mounting head are conducive to mounting the patch on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of the utility model.

[0012] Figure 2 It is a structural schematic diagram of a circuit board positioning platform assembly of the utility model.

[0013] In the figure:

[0014] 1. Mounting box; 2. Box door; 3. Three-axis linear motor; 4. Mounting head; 5. SMT placement table; 6. Circuit board positioning table assembly; 61. Mounting table; 62. First linear motor; 63. Second linear motor; 64. Through slot; 65. U-shaped positioning block. DETAILED DESCRIPTION

[0015] The utility model is described in detail below in conjunction with the accompanying drawings. Figure 1 As shown, a semiconductor device production mounting equipment includes a mounting box 1, a box door 2 is connected to the front hinge of the mounting box 1, a three-axis linear motor 3 is installed on the upper side of the interior of the mounting box 1, a mounting head 4 is installed on the Z-axis slider of the three-axis linear motor 3, and a circuit board positioning table assembly 6 and a patch placement table 5 are installed on the left and right sides of the lower side of the interior of the mounting box 1 respectively.

[0016] In this embodiment, combined with the Figure 2 As shown, the circuit board positioning platform assembly 6 includes a mounting platform 61, and the second linear motor 63 and the first linear motor 62 are respectively installed on the upper and lower sides of the interior of the mounting platform 61, and the first linear motor 62 and the second linear motor 63 are distributed in a cross shape. A through slot 64 is opened on the upper part of the mounting platform 61, and the shape of the through slot 64 is set to be a cross shape. The upper parts of the sliders of the first linear motor 62 and the second linear motor 63 are both installed with U-shaped positioning blocks 65. The first linear motor 62 and the second linear motor 63 both adopt bidirectional screw linear motors, and the first linear motor 62 and the second linear motor 63 are arranged opposite to the through slot 64. After the user places the circuit board on the mounting platform 61, the first linear motor 62 and the second linear motor 63 drive the U-shaped positioning block 65 to move to the middle of the mounting platform 61, so as to position the circuit board to avoid the situation where the circuit board is skewed and the patch fails.

[0017] In this embodiment, specifically, the mounting platform 61 is fixedly mounted to the mounting box 1 .

[0018] How it works

[0019] In the utility model, the mounting box 1, the three-axis linear motor 3, the mounting head 4, the first linear motor 62, and the second linear motor 63 are all connected to the control device of the external production workshop, the patch is placed on the patch placement table 5, the three-axis linear motor 3 drives the mounting head 4 to move, the mounting head 4 attaches and moves the patch to the upper part of the circuit board, and the patch is installed on the circuit board to realize the patch mounting function.

[0020] Utilizing the technical solution described in the utility model, or those skilled in the art designing similar technical solutions inspired by the technical solution of the utility model to achieve the above-mentioned technical effects, all fall within the protection scope of the utility model.

Claims

1. A semiconductor device production and placement equipment, the semiconductor device production and placement equipment comprising a placement box (1), a three-axis linear motor (3) is installed on the upper side of the interior of the placement box (1), characterized in that: A mounting head (4) is installed at the Z-axis slider of the three-axis linear motor (3); a circuit board positioning platform assembly (6) and a patch placement platform (5) are installed on the left and right sides of the lower inner side of the mounting box (1); the circuit board positioning platform assembly (6) comprises a mounting platform (61); a second linear motor (63) and a first linear motor (62) are installed on the upper and lower sides of the mounting platform (61); a through slot (64) is provided on the upper part of the mounting platform (61); and U-shaped positioning blocks (65) are installed on the upper parts of the sliders of the first linear motor (62) and the second linear motor (63).

2. The semiconductor device production and placement equipment according to claim 1, characterized in that: The first linear motor (62) and the second linear motor (63) are distributed in a cross shape.

3. The semiconductor device production and placement equipment according to claim 1, characterized in that: The through groove (64) is shaped like a cross.

4. The semiconductor device production and placement equipment according to claim 1, characterized in that: The first linear motor (62) and the second linear motor (63) are arranged opposite to the through slot (64).

5. The semiconductor device production and placement equipment according to claim 1, characterized in that: The mounting platform (61) is fixedly mounted on the mounting box (1).

6. The semiconductor device production and mounting equipment according to claim 1, characterized in that: The front hinge of the mounting box (1) is connected with a box door (2).

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