Semiconductor refrigeration sheet and semiconductor refrigeration assembly

Abstract

The utility model relates to the technical field of refrigeration electric appliances, and discloses a semiconductor refrigeration sheet and a semiconductor refrigeration assembly. The semiconductor chilling plate comprises a semiconductor particle group which is arranged according to a set rule to form a cold end and a hot end which are opposite to each other; the first plate surface of the first substrate is connected with the cold end of the semiconductor particle group to serve as a cold end substrate; the first plate surface of the second substrate is connected with the hot end of the semiconductor particle group to serve as a hot end substrate; wherein the area of the first plate surface of the second substrate is larger than that of the first plate surface of the first substrate. The first substrate and the second substrate are arranged at the two ends of the semiconductor particle group to form the semiconductor chilling plate, so that the refrigerating function and the heating function of the semiconductor chilling plate are achieved. And meanwhile, the area of the first plate surface of the second substrate is larger than that of the first plate surface of the first substrate, so that the heat dissipation speed of the hot end of the semiconductor chilling plate is increased, and the refrigeration efficiency of the semiconductor chilling plate is further improved.

Description

Technical Field

[0001] The present application relates to the technical field of refrigeration appliances, for example, to a semiconductor refrigeration sheet and a semiconductor refrigeration assembly. Background Art

[0002] At present, after the semiconductor refrigeration chip is powered on, one end of the semiconductor refrigeration chip emits coldness, and this end of the substrate is the cold end substrate. The other end of the semiconductor refrigeration chip emits heat, and this end of the substrate is the hot end substrate. However, since the heat generated by the hot end of the single-stage semiconductor refrigeration chip is greater than the coldness generated by the cold end, the heat dissipation efficiency of the hot end of the semiconductor refrigeration chip is too low, which in turn leads to poor refrigeration performance of the semiconductor refrigeration chip.

[0003] In the related art, a fan is provided at the hot end of a semiconductor refrigeration chip to improve the heat dissipation efficiency of the hot end substrate of the semiconductor refrigeration chip.

[0004] In the publicly available implementation process, the following problems were found in the relevant technology:

[0005] Although the relevant technology can improve the heat dissipation efficiency of the hot end substrate of the semiconductor refrigeration plate, the use of fans to improve the heat dissipation efficiency of the semiconductor refrigeration plate is too dependent on the fans. In a small space where it is not convenient to install fans, it is not convenient to use fans to improve the heat dissipation efficiency of the hot end substrate of the semiconductor refrigeration plate.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] The embodiments of the present disclosure provide a semiconductor refrigeration sheet and a semiconductor refrigeration assembly, which improve the heat dissipation efficiency of the heating end of the semiconductor refrigeration assembly, thereby improving the refrigeration performance of the semiconductor refrigeration assembly.

[0009] In some embodiments, a semiconductor refrigeration plate is provided, comprising: a semiconductor particle group arranged in a set pattern to form relative cold ends and hot ends; a first substrate, a first surface of the first substrate connected to the cold end of the semiconductor particle group, serving as a cold end substrate; a second substrate, a first surface of the second substrate connected to the hot end of the semiconductor particle group, serving as a hot end substrate; wherein an area of ​​the first surface of the second substrate is greater than an area of ​​the first surface of the first substrate.

[0010] Optionally, it includes: A / B=1+W / Qc>1.3; wherein A is the area of ​​the first surface of the first substrate, B is the area of ​​the first surface of the second substrate, W is the input electric power of the semiconductor refrigeration plate, and Qc is the cooling capacity of the semiconductor refrigeration plate.

[0011] Optionally, a projection of the first substrate on the second substrate is located at the center of the second substrate.

[0012] In some embodiments, a semiconductor refrigeration component is provided, comprising: a reinforced shell, comprising an installation cavity; and a semiconductor refrigeration plate as described in any of the above embodiments, arranged in the installation cavity; the first substrate and the second substrate of the semiconductor refrigeration plate are both connected to the cavity wall of the installation cavity for heat conduction.

[0013] Optionally, the reinforced shell includes: a reinforcement plate, which is arranged at opposite ends of the semiconductor refrigeration plate; and a blocking portion, which is connected to the reinforcement plate to form an installation cavity with the reinforcement plate.

[0014] Optionally, the reinforcement plate includes a metal plate or an alloy plate.

[0015] Optionally, the reinforcing plate includes: a first reinforcing plate, which is arranged on the first substrate side of the semiconductor refrigeration plate, and the first reinforcing plate is thermally connected to the first substrate of the semiconductor refrigeration plate; a second reinforcing plate, which is arranged on the second substrate side of the semiconductor refrigeration plate, and the second reinforcing plate is thermally connected to the second substrate of the semiconductor refrigeration plate.

[0016] Optionally, the first reinforcing plate and the second surface of the first substrate of the semiconductor refrigeration plate have the same area; wherein the first surface of the first substrate and the second surface of the first substrate are located at opposite end surfaces of the first substrate; and / or, the second reinforcing plate and the second surface of the second substrate of the semiconductor refrigeration plate have the same area; wherein the first surface of the second substrate and the second surface of the second substrate are located at opposite end surfaces of the second substrate.

[0017] Optionally, the thickness of the second reinforcing plate is smaller than the thickness of the first reinforcing plate.

[0018] Optionally, the first substrate is connected to the first reinforcing plate via thermal conductive silicone grease; and / or the second substrate is connected to the second reinforcing plate via thermal conductive silicone grease.

[0019] Optionally, the first substrate is connected to the first reinforcing plate by bolts; and / or the second substrate is connected to the second reinforcing plate by bolts.

[0020] The semiconductor refrigeration sheet and semiconductor refrigeration assembly provided by the embodiments of the present disclosure can achieve the following technical effects:

[0021] The semiconductor refrigeration sheet provided by the embodiment of the present disclosure is formed by arranging a first substrate and a second substrate at both ends of a semiconductor particle group, so that when the semiconductor particle group is energized, one end of the semiconductor particle group forms a cold end for cooling, and the other end forms a hot end for heating. The first substrate arranged at the cold end is used as a cold end substrate, and the second substrate arranged at the hot end is used as a hot end substrate, thereby realizing the cooling function and heating function of the semiconductor refrigeration sheet. At the same time, by arranging the area of ​​the first board surface of the second substrate to be larger than the area of ​​the first board surface of the first substrate, the heat dissipation speed of the hot end of the semiconductor refrigeration sheet is increased, thereby improving the cooling efficiency of the semiconductor refrigeration sheet.

[0022] The semiconductor refrigeration assembly provided in the embodiment of the present disclosure arranges the semiconductor refrigeration sheet in the installation cavity of the reinforced shell, and uses the reinforced shell to wrap the semiconductor refrigeration sheet, so as to improve the strength of the semiconductor refrigeration sheet, reduce the damage problem of the semiconductor refrigeration sheet, and improve the service life of the semiconductor refrigeration sheet.

[0023] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0025] Figure 1 It is a structural schematic diagram of a single-pole semiconductor refrigeration plate in the related technology provided by an embodiment of the present disclosure;

[0026] Figure 2 yes Figure 1 A side view of a unipolar semiconductor refrigeration plate in the illustrated embodiment;

[0027] Figure 3 is a side view of a semiconductor cooling plate provided by an embodiment of the present disclosure;

[0028] Figure 4 is a top view of a semiconductor cooling sheet provided by an embodiment of the present disclosure;

[0029] Figure 5 It is a schematic diagram of the structure of the semiconductor refrigeration assembly provided in an embodiment of the present disclosure.

[0030] Reference numerals:

[0031] 10. semiconductor cooling sheet; 101. semiconductor particle group; 102. first substrate; 103. second substrate;

[0032] 20. semiconductor refrigeration assembly; 201. reinforced shell; 2011. reinforced plate; 2012. first reinforced plate; 2013. second reinforced plate; 2014. enclosure;

[0033] 30. Related technology single-stage semiconductor refrigeration plate; 301. Related technology cold end substrate; 302. Related technology hot end substrate; 303. Related technology semiconductor particle group. DETAILED DESCRIPTION

[0034] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0035] The terms "first", "second", etc. in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0036] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0037] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0038] Unless otherwise stated, the term "plurality" means two or more.

[0039] In the embodiments of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship, or in a "ratio" relationship. For example, A / B indicates: A or B, or the ratio of A to B.

[0040] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0041] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0042] Combination Figure 1 and Figure 2 As shown, the embodiment of the present disclosure provides a structural schematic diagram of a single-stage semiconductor refrigeration plate 30 mentioned in the related art, and the single-stage semiconductor refrigeration plate 30 includes a cold end substrate: 301, a hot end substrate 302 and a semiconductor particle group 303. Among them, since the heat generated by the hot end of the single-stage semiconductor refrigeration plate 30 is greater than the cold generated by the cold end, the heat dissipation efficiency of the hot end of the single-stage semiconductor refrigeration plate 30 is too low, which leads to poor refrigeration performance of the semiconductor refrigeration plate. The following is an improvement scheme provided by the embodiment of the present disclosure.

[0043] Combination Figure 3 and Figure 4 As shown, the embodiment of the present disclosure provides a semiconductor refrigeration sheet 10, comprising: a semiconductor particle group 101, a first substrate 102 and a second substrate 103. The semiconductor particle group 101 is arranged in a set pattern to form a relative cold end and a hot end. The first board surface of the first substrate 102 is connected to the cold end of the semiconductor particle group 101, serving as a cold end substrate. The first board surface of the second substrate 103 is connected to the hot end of the semiconductor particle group 101, serving as a hot end substrate. Among them, the area of ​​the first board surface of the second substrate 103 is greater than the area of ​​the first board surface of the first substrate 102.

[0044] The semiconductor refrigeration sheet 10 provided by the embodiment of the present disclosure is composed of a semiconductor refrigeration sheet 10 by arranging a first substrate 102 and a second substrate 103 at both ends of a semiconductor particle group 101, so that when the semiconductor particle group 101 is powered, one end of the semiconductor particle group 101 forms a cold end for cooling, and the other end forms a hot end for heating. The first substrate 102 arranged at the cold end is used as a cold end substrate, and the second substrate 103 arranged at the hot end is used as a hot end substrate, thereby realizing the cooling function and heating function of the semiconductor refrigeration sheet 10. At the same time, by arranging the area of ​​the first board surface of the second substrate 103 to be larger than the area of ​​the first board surface of the first substrate 102, the heat dissipation speed of the hot end of the semiconductor refrigeration sheet 10 is increased, thereby improving the cooling efficiency of the semiconductor refrigeration sheet 10.

[0045] Optionally, it includes: A / B=1+W / Qc>1.3, wherein A is the area of ​​the first surface of the first substrate 102, B is the area of ​​the first surface of the second substrate 103, W is the input electrical power of the semiconductor cooling sheet 10, and Qc is the cooling capacity of the semiconductor cooling sheet 10.

[0046] In this embodiment, the ratio of the area of ​​the first surface of the first substrate 102 to the area of ​​the first surface of the second substrate 103 is set to be greater than 1.3, so that the area of ​​the first surface of the first substrate 102 is greater than the area of ​​the first surface of the second substrate 103. This improves the heat dissipation speed of the hot end of the semiconductor cooling sheet 10, thereby improving the cooling efficiency of the semiconductor cooling sheet 10.

[0047] Specifically, the refrigeration energy efficiency ratio of the semiconductor refrigeration plate 10 is less than 3. The energy efficiency ratio is the ratio of the refrigeration capacity of the semiconductor refrigeration plate 10 to the total input power.

[0048] Optionally, combined Figure 3 and Figure 4 As shown, the projection of the first substrate 102 on the second substrate 103 is located at the center of the second substrate 103 .

[0049] In this embodiment, the projection of the first substrate 102 on the second substrate 103 is arranged at the center of the second substrate 103, so that the distance between the edge of the semiconductor particle group 101 and the edge of the second substrate 103 is the same, so as to improve the uniformity of heat dissipation of the semiconductor particle group 101, thereby improving the heat dissipation speed of the hot end of the semiconductor cooling sheet 10, and improving the cooling efficiency of the semiconductor cooling sheet 10.

[0050] Combination Figure 5As shown, the embodiment of the present disclosure provides a semiconductor refrigeration assembly 20, comprising: a reinforced housing 201 and a semiconductor refrigeration sheet 10 as described in any one of the above embodiments. The reinforced housing 201 includes an installation cavity. The semiconductor refrigeration sheet 10 as described in any one of the above embodiments is arranged in the installation cavity. The first substrate 102 and the second substrate 103 of the semiconductor refrigeration sheet 10 are both connected to the cavity wall of the installation cavity for heat conduction.

[0051] The semiconductor refrigeration assembly 20 provided in the embodiment of the present disclosure arranges the semiconductor refrigeration sheet 10 in the installation cavity of the reinforced shell 201, and uses the reinforced shell 201 to wrap the semiconductor refrigeration sheet 10, so as to improve the strength of the semiconductor refrigeration sheet 10, reduce the damage problem of the semiconductor refrigeration sheet 10, and improve the service life of the semiconductor refrigeration sheet 10.

[0052] Specifically, the first substrate 102 and the second substrate 103 of the semiconductor refrigeration chip 10 are often made of ceramic material, which is easy to be damaged. By providing the strengthening shell 201, the first substrate 102 and the second substrate 103 are protected to improve the strength of the semiconductor refrigeration chip 10. The damage problem of the semiconductor refrigeration chip 10 is reduced, and the service life of the semiconductor refrigeration chip 10 is increased.

[0053] Optionally, combined Figure 5 As shown, the reinforcing housing 201 includes a reinforcing plate 2011 and a blocking portion 2014. The reinforcing plate 2011 is disposed at opposite ends of the semiconductor cooling sheet 10. The blocking portion 2014 is connected to the reinforcing plate 2011 to form an installation cavity with the reinforcing plate 2011.

[0054] In this embodiment, by providing mutually connected reinforcing plates 2011 and enclosures 2014, and forming an installation cavity between the enclosures 2014 and the reinforcing plates 2011, the reinforcing plates 2011 and the enclosures 2014 are used to wrap the semiconductor cooling plate 10, so that the reinforcing plates 2011 and the enclosures 2014 provide a reinforcing effect for the semiconductor cooling plate 10. The strength of the semiconductor cooling plate 10 is improved, the damage problem of the semiconductor cooling plate 10 is reduced, and the service life of the semiconductor cooling plate 10 is increased.

[0055] Optionally, the reinforcing plate 2011 includes a metal plate or an alloy plate.

[0056] In this embodiment, a metal plate or alloy plate is provided to provide a strengthening function for the semiconductor cooling plate 10 through the strengthening plate 2011, and at the same time, the strengthening plate 2011 provides a heat dissipation function for the semiconductor cooling plate 10, so as to further improve the heat dissipation efficiency and cooling efficiency of the semiconductor cooling plate 10.

[0057] Specifically, the reinforcing plate 2011 is a metal plate or alloy plate with a high thermal conductivity. And / or, the reinforcing plate 2011 is a metal plate or alloy plate with a high mechanical strength. By using a metal plate with a high thermal conductivity or an alloy plate with a high thermal conductivity, the heat dissipation efficiency and the cooling efficiency of the semiconductor refrigeration plate 10 can be further improved. By using a metal plate with a high mechanical strength or an alloy plate with a high mechanical strength, the strength of the semiconductor refrigeration plate 10 can be further improved, the damage problem of the semiconductor refrigeration plate 10 can be reduced, and the service life of the semiconductor refrigeration plate 10 can be improved.

[0058] Optionally, combined Figure 5 As shown, the reinforcing plate 2011 includes: a first reinforcing plate 2012 and a second reinforcing plate 2013. The first reinforcing plate 2012 is arranged on the first substrate 102 side of the semiconductor refrigeration plate 10, and the first reinforcing plate 2012 and the first substrate 102 of the semiconductor refrigeration plate 10 are thermally connected. The second reinforcing plate 2013 is arranged on the second substrate 103 side of the semiconductor refrigeration plate 10, and the second reinforcing plate 2013 and the second substrate 103 of the semiconductor refrigeration plate 10 are thermally connected.

[0059] In this embodiment, a first reinforcing plate 2012 is provided on the first substrate 102 side of the semiconductor refrigeration plate 10, and the first substrate 102 and the first reinforcing plate 2012 are connected by thermal conduction, so that the first reinforcing plate 2012 is used to provide a heat dissipation function for the first substrate 102, thereby realizing the refrigeration function of the semiconductor refrigeration plate 10. A second reinforcing plate 2013 is provided on the second substrate 103 side of the semiconductor refrigeration plate 10, and the second substrate 103 and the second reinforcing plate 2013 are connected by thermal conduction, so that the second reinforcing plate 2013 is used to provide a heat dissipation function for the second substrate 103, thereby improving the heat dissipation efficiency of the hot end of the semiconductor refrigeration plate 10, thereby improving the refrigeration efficiency of the semiconductor refrigeration plate 10.

[0060] Optionally, combined Figure 5 As shown, the first reinforcing plate 2012 and the second plate surface of the first substrate 102 of the semiconductor cooling sheet 10 have the same area. The first plate surface of the first substrate 102 and the second plate surface of the first substrate 102 are located at opposite end surfaces of the first substrate 102.

[0061] In this embodiment, the first reinforcing plate 2012 and the second plate surface of the first substrate 102 of the semiconductor cooling plate 10 are arranged to have the same area, so that the first reinforcing plate 2012 can provide the first substrate 102 with reinforcing function and heat dissipation function.

[0062] Specifically, the first reinforcing plate 2012 is a rectangular parallelepiped or a step.

[0063] Specifically, when the first reinforcing plate 2012 is a step, the surface of the first reinforcing plate 2012 connected to the second surface of the first substrate 102 is the first surface of the first reinforcing plate 2012, and the surface of the first reinforcing plate 2012 opposite to the first surface of the first reinforcing plate 2012 is the second surface, and the area of ​​the first surface of the first reinforcing plate 2012 is greater than the area of ​​the second surface of the first reinforcing plate 2012.

[0064] Optionally, combined Figure 5 As shown, the second reinforcing plate 2013 and the second plate surface of the second substrate 103 of the semiconductor cooling sheet 10 have the same area. The first plate surface of the second substrate 103 and the second plate surface of the second substrate 103 are located at opposite end surfaces of the second substrate 103 .

[0065] In this embodiment, the second reinforcing plate 2013 and the second plate surface of the second substrate 103 of the semiconductor cooling plate 10 are arranged to have the same area, so that the second reinforcing plate 2013 can provide reinforcing function and heat dissipation function for the second substrate 103 .

[0066] Specifically, the second reinforcing plate 2013 is a rectangular parallelepiped or a step.

[0067] Specifically, when the second reinforcing plate 2013 is a step, the surface of the second reinforcing plate 2013 connected to the second surface of the second substrate 103 is the first surface of the second reinforcing plate 2013, the surface of the second reinforcing plate 2013 opposite to the first surface of the second reinforcing plate 2013 is the second surface, and the area of ​​the first surface of the second reinforcing plate 2013 is greater than the area of ​​the second surface of the second reinforcing plate 2013.

[0068] Optionally, combined Figure 5 As shown, the first reinforcing plate 2012 has the same area as the second surface of the first substrate 102 of the semiconductor cooling sheet 10. The first surface of the first substrate 102 and the second surface of the first substrate 102 are located at two opposite ends of the first substrate 102. The second reinforcing plate 2013 has the same area as the second surface of the second substrate 103 of the semiconductor cooling sheet 10. The first surface of the second substrate 103 and the second surface of the second substrate 103 are located at two opposite ends of the second substrate 103.

[0069] In this embodiment, the first reinforcing plate 2012 is set to have the same area as the second surface of the first substrate 102 of the semiconductor cooling plate 10, so that the first reinforcing plate 2012 provides reinforcing function and heat dissipation function for the first substrate 102. The second reinforcing plate 2013 is set to have the same area as the second surface of the second substrate 103 of the semiconductor cooling plate 10, so that the second reinforcing plate 2013 provides reinforcing function and heat dissipation function for the second substrate 103.

[0070] Exemplarily, after the first reinforcing plate 2012 , the second reinforcing plate 2013 and the enclosing portion 2014 are packaged and disposed on the semiconductor refrigeration sheet 10 , the semiconductor refrigeration assembly 20 is in a stepped shape.

[0071] Optionally, the thickness of the second reinforcing plate 2013 is smaller than the thickness of the first reinforcing plate 2012 .

[0072] In this embodiment, the thickness of the second reinforcing plate 2013 is set to be smaller than the thickness of the first reinforcing plate 2012 to reduce the thermal resistance of the hot end of the semiconductor refrigeration plate 10, so as to accelerate the heat dissipation speed of the hot end of the semiconductor refrigeration plate 10 through the thinner second reinforcing plate 2013, thereby further improving the cooling efficiency of the semiconductor refrigeration plate 10.

[0073] Optionally, the first substrate 102 and the first reinforcing plate 2012 are connected via thermal conductive silicone grease.

[0074] In this embodiment, the first substrate 102 and the first reinforcing plate 2012 are connected by thermal grease to improve the heat conduction rate between the first substrate 102 and the first reinforcing plate 2012, thereby improving the cooling rate of the semiconductor cooling plate 10.

[0075] Optionally, the second substrate 103 and the second reinforcing plate 2013 are connected via thermal conductive silicone grease.

[0076] In this embodiment, the second substrate 103 and the second reinforcing plate 2013 are connected by thermal grease to increase the heat conduction rate between the second substrate 103 and the second reinforcing plate 2013, thereby increasing the heat dissipation rate at the hot end of the semiconductor refrigeration plate 10 and further improving the cooling efficiency of the semiconductor refrigeration plate 10.

[0077] Optionally, the first substrate 102 is connected to the first reinforcing plate 2012 via thermal conductive silicone grease. The second substrate 103 is connected to the second reinforcing plate 2013 via thermal conductive silicone grease.

[0078] In this embodiment, the first substrate 102 and the first reinforcing plate 2012 are connected by thermal conductive silicone grease to improve the heat conduction rate between the first substrate 102 and the first reinforcing plate 2012, thereby improving the cooling rate of the semiconductor cooling plate 10. The second substrate 103 and the second reinforcing plate 2013 are connected by thermal conductive silicone grease to improve the heat conduction rate between the second substrate 103 and the second reinforcing plate 2013, thereby improving the heat dissipation rate of the hot end of the semiconductor cooling plate 10, thereby further improving the cooling efficiency of the semiconductor cooling plate 10.

[0079] Optionally, the first substrate 102 and the first reinforcing plate 2012 are connected by bolts.

[0080] In this embodiment, the first substrate 102 and the first reinforcing plate 2012 are connected by bolts to improve the assembly strength between the first substrate 102 and the first reinforcing plate 2012. The problem of the semiconductor refrigeration assembly 20 being damaged due to the separation of the first reinforcing plate 2012 and the first substrate 102 caused by the loose connection between the first substrate 102 and the first reinforcing plate 2012 is reduced, the service life of the semiconductor refrigeration assembly 20 is improved, and the practicality of the semiconductor refrigeration assembly 20 is improved.

[0081] Optionally, the second substrate 103 and the second reinforcing plate 2013 are connected by bolts.

[0082] In this embodiment, the second substrate 103 and the second reinforcing plate 2013 are connected by bolts to improve the assembly strength between the second substrate 103 and the second reinforcing plate 2013. The problem of the second reinforcing plate 2013 and the second substrate 103 being separated and causing damage to the semiconductor refrigeration assembly 20 due to the loose connection between the second substrate 103 and the second reinforcing plate 2013 is reduced, the service life of the semiconductor refrigeration assembly 20 is increased, and the practicality of the semiconductor refrigeration assembly 20 is improved.

[0083] Furthermore, by providing a bolt connection method, the connection thermal resistance generated by providing the thermal conductive silicone grease can be reduced, so as to further improve the heat dissipation efficiency of the semiconductor refrigeration plate 10 and improve the refrigeration efficiency of the semiconductor refrigeration plate 10.

[0084] Optionally, the first substrate 102 is connected to the first reinforcing plate 2012 by bolts. The second substrate 103 is connected to the second reinforcing plate 2013 by bolts.

[0085] In this embodiment, the first substrate 102 and the first reinforcing plate 2012 are connected by bolts to improve the assembly strength between the first substrate 102 and the first reinforcing plate 2012. The problem of the first reinforcing plate 2012 and the first substrate 102 being separated due to the loose connection between the first substrate 102 and the first reinforcing plate 2012, which causes the semiconductor refrigeration assembly 20 to be damaged, is reduced, the service life of the semiconductor refrigeration assembly 20 is improved, and the practicality of the semiconductor refrigeration assembly 20 is improved. The second substrate 103 and the second reinforcing plate 2013 are connected by bolts to improve the assembly strength between the second substrate 103 and the second reinforcing plate 2013. The problem of the second reinforcing plate 2013 and the second substrate 103 being separated due to the loose connection between the second substrate 103 and the second reinforcing plate 2013, which causes the semiconductor refrigeration assembly 20 to be damaged, is reduced, the service life of the semiconductor refrigeration assembly 20 is improved, and the practicality of the semiconductor refrigeration assembly 20 is improved.

[0086] Specifically, by providing a bolt connection method, the connection thermal resistance generated by providing the thermal conductive silicone grease can be reduced, so as to further improve the heat dissipation efficiency of the semiconductor refrigeration plate 10 and improve the refrigeration efficiency of the semiconductor refrigeration plate 10.

[0087] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A semiconductor refrigeration sheet, characterized in that: include: The semiconductor particles are arranged in a set pattern to form opposite cold ends and hot ends; A first substrate, wherein a first surface of the first substrate is connected to a cold end of the semiconductor particle group to serve as a cold end substrate; A second substrate, wherein a first surface of the second substrate is connected to the hot end of the semiconductor particle group to serve as a hot end substrate; The area of ​​the first surface of the second substrate is greater than the area of ​​the first surface of the first substrate.

2. The semiconductor cooling sheet according to claim 1, characterized in that: include: A / B=1+W / Qc>1.3; Wherein, A is the area of ​​the first surface of the first substrate, B is the area of ​​the first surface of the second substrate, W is the input electric power of the semiconductor refrigeration sheet, and Qc is the cooling capacity of the semiconductor refrigeration sheet.

3. The semiconductor cooling sheet according to claim 1, characterized in that: The projection of the first substrate on the second substrate is located at the center of the second substrate.

4. A semiconductor refrigeration component, characterized in that: include: a reinforced housing including a mounting cavity; and, The semiconductor cooling sheet according to any one of claims 1 to 3, arranged in the mounting cavity; The first substrate and the second substrate of the semiconductor refrigeration plate are both connected to the cavity wall of the installation cavity to conduct heat.

5. The semiconductor refrigeration assembly according to claim 4, characterized in that: The reinforced shell includes: Strengthening plates are arranged at two opposite ends of the semiconductor cooling plate; The enclosure portion is connected to the reinforcing plate to form an installation cavity with the reinforcing plate.

6. The semiconductor refrigeration assembly according to claim 5, characterized in that: The reinforcing plate includes a metal plate or an alloy plate.

7. The semiconductor refrigeration assembly according to claim 5, characterized in that: The reinforced panels include: A first reinforcing plate is disposed on the first substrate side of the semiconductor refrigeration plate, and the first reinforcing plate is thermally connected to the first substrate of the semiconductor refrigeration plate; The second reinforcing plate is arranged on the second substrate side of the semiconductor refrigeration plate, and the second reinforcing plate is thermally connected to the second substrate of the semiconductor refrigeration plate.

8. The semiconductor refrigeration assembly according to claim 7, characterized in that: The first reinforcing plate and the second plate surface of the first substrate of the semiconductor cooling plate have the same area; wherein the first plate surface of the first substrate and the second plate surface of the first substrate are located at two opposite end surfaces of the first substrate; and / or, The second reinforcing plate and the second plate surface of the second substrate of the semiconductor refrigeration plate have the same area; wherein the first plate surface of the second substrate and the second plate surface of the second substrate are located at opposite end surfaces of the second substrate.

9. The semiconductor refrigeration assembly according to claim 7, characterized in that: The thickness of the second strengthening plate is smaller than the thickness of the first strengthening plate.

10. The semiconductor refrigeration assembly according to claim 7, characterized in that: The first substrate and the first reinforcing plate are connected via thermal conductive silicone grease; and / or, The second substrate is connected to the second strengthening plate through thermal conductive silicone grease.

11. The semiconductor refrigeration assembly according to claim 7, characterized in that: The first base plate is connected to the first reinforcing plate by bolts; and / or, The second base plate is connected to the second reinforcing plate by bolts.

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