Welding station capable of rapidly cooling

Abstract

The utility model discloses a soldering station capable of cooling quickly, which relates to the field of soldering stations, and comprises a shell, a control panel arranged in the shell, a semiconductor cooling box connected in the shell, a cooling plate connected in the semiconductor cooling box, and a heat discharge plate connected at the side end of the cooling plate. One end of the semiconductor cooling box is connected with a first fan, and the other end is connected with a second fan. By electrifying the semiconductor cooling box, the cooling plate and the heat extraction plate form a semiconductor refrigeration structure, the device adopts semiconductor refrigeration, not only can the control panel be cooled, but also no refrigerant is needed, no pollution is caused, the reliability is high, the service life is long, the cooling effect is good, and the problem that after an existing welding table works for a long time, the internal temperature is continuously increased, and the service life is prolonged is solved. And in a severe case, the welding platform is even overheated and short-circuited, and the welding platform is damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of soldering stations, in particular to a soldering station capable of rapidly cooling down. Background Art

[0002] A soldering station is a hand tool commonly used in electronic soldering processes. Its working principle is to use the electrothermal effect to heat the solder to a molten state, and to weld two workpieces together through the wetting and solidification of the solder. The soldering station plays an important role in the welding process. It can improve welding efficiency, control welding temperature, and ensure welding quality. It is widely used in various welding scenarios.

[0003] A small transformer is installed inside the soldering station to adjust the output voltage, thereby regulating the heating temperature. The transformer will generate heat when working. After the soldering station has been working for a long time, its internal temperature will continue to rise, which will affect its working performance. In severe cases, it may even cause the soldering station to overheat and short-circuit, causing damage.

[0004] In order to solve this technical problem, the utility model proposes a soldering station capable of rapid cooling. Utility Model Content

[0005] The main purpose of the utility model is to provide a soldering station that can quickly cool down, which can effectively solve the problems mentioned in the background technology.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A soldering station capable of rapid cooling comprises an outer shell, a control board is arranged in the outer shell, a semiconductor cooling box is connected in the outer shell, a cooling plate is connected in the semiconductor cooling box, a heat exhaust plate is connected at the side end of the cooling plate, a No. 1 fan is connected at one end of the semiconductor cooling box, a No. 2 fan is connected at the other end, a heat sink is connected at the side end of the heat exhaust plate, two air inlet slots are connected at the upper end of the semiconductor cooling box, a support block is connected on the bottom plate of the outer shell, the support block is connected to the lower end of the control board, and a heat dissipation slot is provided at the side end of the outer shell.

[0008] Preferably, the semiconductor cooling box is located at the side end of the control board, the No. 1 fan is located between the cooling plate and the control board, the No. 2 fan is located at the side end of the heat dissipation plate, and the heat sink is located between the No. 2 fan and the heat dissipation plate.

[0009] Preferably, the air inlet slot passes through the shell, one air inlet slot is located between fan No. 1 and the cooling plate, and the other air inlet slot is located at the upper end of the heat sink, and dust-proof nets are provided at the upper end of the air inlet slot and the side end of the heat sink.

[0010] Preferably, the side end of the semiconductor cooling box is connected to an air guide cover, the air guide cover is located at the side end of the second fan, and the air outlet at the side end of the air guide cover is connected to an air supply pipe.

[0011] Preferably, a control box is provided at the side end of the shell, the air supply pipe is plugged into the control box, the control box is connected to the control board and the semiconductor cooling box through wires, and a connecting line is connected to the side end of the control box.

[0012] Preferably, the tail end of the connecting line is connected to a soldering pen, a soldering iron rod is inserted into the soldering pen, an air supply duct is provided in the soldering pen, the air supply duct is located at the outer end of the soldering iron rod, and the air supply duct is connected to the air supply pipe.

[0013] Preferably, a temperature detector is provided in the housing, and the temperature detector is connected to the control box; a buzzer is provided in the housing, and the temperature detector is connected to the buzzer.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] The utility model provides a semiconductor cooling box, which can blow cold air to the control board to cool it and dissipate heat. Specifically, the semiconductor cooling box is energized, and the cooling plate and the heat exhaust plate form a semiconductor refrigeration structure. The cooling plate will generate low temperature, and fan No. 1 will be started. Fan No. 1 will inhale air through the air inlet slot, and then the air will be cooled by the surface of the cooling plate and converted into cold air to be blown to the control board, so as to cool the control board. The cold air will finally be discharged from the heat dissipation slot together with the heat generated by the control board. The device adopts semiconductor refrigeration, which can not only cool the control board, but also does not require refrigerant, is pollution-free, has high reliability, long service life, and good cooling effect. The problem that the internal temperature of the existing soldering station will continue to rise after working for a long time, thereby affecting its working performance, and in severe cases even causing the soldering station to overheat and short-circuit, causing damage, is solved.

[0016] In the utility model, by providing an air duct, the heat generated by the heat exhaust plate can be discharged into the air duct through the No. 2 fan and the air guide cover, and then injected into the soldering pen through the air duct, and finally discharged from the air duct at the lower end of the soldering pen. In this way, the solder can be preheated while waiting for the electric soldering iron rod to be heated, so that this part of the heat will not be wasted, which not only improves work efficiency but also has the advantages of energy saving and environmental protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of a soldering station capable of rapid cooling according to the utility model;

[0018] Figure 2 This is a schematic diagram of the internal structure of a soldering station capable of rapid cooling according to the utility model;

[0019] Figure 3 This is a schematic diagram of the structure of a semiconductor cooling box of a soldering station capable of rapidly cooling down according to the utility model;

[0020] Figure 4 This is a schematic diagram of the cooling plate structure of a soldering station capable of rapid cooling according to the utility model;

[0021] Figure 5 This is a schematic diagram of the cross-sectional structure of a soldering station capable of rapid cooling according to the utility model;

[0022] Figure 6 The utility model is a schematic diagram of the structure of a soldering pen of a soldering station capable of rapid cooling.

[0023] In the figure: 1. Shell; 2. Control board; 3. Semiconductor cooling box; 4. Cooling plate; 5. Heat dissipation plate; 6. Fan No. 1; 7. Fan No. 2; 8. Heat sink; 9. Air inlet slot; 10. Support block; 11. Heat sink; 12. Air guide cover; 13. Air duct; 14. Control box; 15. Connecting wire; 16. Soldering pen; 17. Electric soldering iron rod; 18. Air duct; 19. Temperature detector; 20. Buzzer. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0025] like Figure 1-6 As shown, a soldering station that can quickly cool down includes a shell 1, a control board 2 is arranged in the shell 1, and various electrical components such as transformers are arranged on the control board 2, which will generate heat when working. A semiconductor cooling box 3 is connected to the shell 1, and the semiconductor cooling box 3 can generate low-temperature cold air. The semiconductor cooling box 3 is located at the side end of the control board 2, and the cold air generated by the semiconductor cooling box 3 will blow toward the control board 2. A control box 14 is arranged at the side end of the shell 1, and a display screen and operation buttons are arranged at the outer end of the control box 4. The control box 14 is connected to the control board 2 and the semiconductor cooling box 3 through wires. The control box 14 can adjust the voltage output by the control board 2 and control the on and off of the semiconductor cooling box 3.

[0026] A temperature detector 19 is arranged in the shell 1, and the temperature detector 19 is used to detect the temperature inside the shell 1. The temperature detector 19 is connected to the control box 14. The data detected by the temperature detector 19 will be transmitted to the control box 14 and displayed on its display screen. A buzzer 20 is arranged in the shell 1, and the temperature detector 19 is connected to the buzzer 20. When the temperature detector 19 detects that the temperature is too high, it can trigger the buzzer 20 to alarm, thereby reminding the operator. A support block 10 is connected to the bottom plate of the shell 1, and the support block 10 is connected to the lower end of the control board 2. The support block 10 is used to support and fix the control board 2, and can make the lower end of the control board 2 have a gap for circulating air, so that cold air can pass through, so that the control board 2 can be cooled more efficiently.

[0027] A cooling plate 4 is connected inside the semiconductor cooling box 3, and a heat exhaust plate 5 is connected to the side end of the cooling plate 4. The cooling plate 4 and the heat exhaust plate 5 together form a semiconductor cooling structure. The cooling plate 4 will generate low temperature, and the heat exhaust plate 5 will generate heat. A fan No. 1 is connected to one end of the semiconductor cooling box 3. The fan No. 1 is located between the cooling plate 4 and the control board 2. The fan No. 1 is used to blow the cold air generated by the cooling plate 4 to the control board 2. A heat sink 8 is connected to the side end of the heat exhaust plate 5. The heat sink 8 is used to absorb the heat generated by the heat exhaust plate 5 and assist it in heat dissipation. The other end of the semiconductor cooling box 3 is connected to a fan No. 2, and the heat sink 8 is located between the fan No. 2 and the heat exhaust plate 5. The side end of the semiconductor cooling box 3 is connected to an air guide hood 12, and the air guide hood 12 is located at the fan No. 2. At the side end of the fan 7, the second fan 7 is used to blow the heat of the heat sink 8 to the wind guide cover 12. Two air inlet slots 9 are connected to the upper end of the semiconductor cooling box 3, one air inlet slot 9 is located between the first fan 6 and the cooling plate 4, and the other air inlet slot 9 is located at the upper end of the heat sink 8. The air outlet at the side end of the wind guide cover 12 is connected to the air supply pipe 13. The wind guide cover 12 is used to gather the wind blown out by the second fan 7 and inject it into the air supply pipe 13 together. A heat dissipation slot 11 is provided at the side end of the outer shell 1. The heat dissipation slot 11 is used to discharge the cold air generated by the semiconductor cooling box 3 together with the heat generated by the control board 2. Dust-proof nets are provided on the upper end of the air inlet slot 9 and the side end of the heat dissipation slot 11 to prevent dust from entering the outer shell 1 and avoiding dust from polluting the control board 2.

[0028] The air supply pipe 13 is plugged into the control box 14, and a connecting wire 15 is connected to the side end of the control box 14. A soldering pen 16 is connected to the tail end of the connecting wire 15. A soldering iron rod 17 is plugged into the soldering pen 16. The connecting wire 15 is used to transmit the voltage output by the control board 2 to the soldering pen 16, so that the soldering iron rod 17 is energized to heat it. An air supply duct 18 is provided in the soldering pen 16. The air supply duct 18 is located at the outer end of the soldering iron rod 17. The air supply duct 18 is connected to the air supply pipe 13, so that the hot air in the air supply pipe 13 will enter the air supply duct 18 and then be blown out from the lower end of the soldering pen 16. The soldering pen 16 is aimed at the solder, and the hot air will be able to heat the solder, thereby preheating it.

[0029] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A soldering station capable of rapid cooling, comprising a housing (1), characterized in that: A control board (2) is arranged in the housing (1), a semiconductor cooling box (3) is connected in the housing (1), a cooling plate (4) is connected in the semiconductor cooling box (3), a heat dissipation plate (5) is connected at the side end of the cooling plate (4), a first fan (6) is connected at one end of the semiconductor cooling box (3), and a second fan (7) is connected at the other end, a heat dissipation fin (8) is connected at the side end of the heat dissipation plate (5), two air inlet slots (9) are connected at the upper end of the semiconductor cooling box (3), a support block (10) is connected to the bottom plate of the housing (1), the support block (10) is connected to the lower end of the control board (2), and a heat dissipation slot (11) is provided at the side end of the housing (1).

2. A soldering station capable of rapid cooling according to claim 1, characterized in that: The semiconductor cooling box (3) is located at the side end of the control board (2), the No. 1 fan (6) is located between the cooling plate (4) and the control board (2), the No. 2 fan (7) is located at the side end of the heat dissipation plate (5), and the heat sink (8) is located between the No. 2 fan (7) and the heat dissipation plate (5).

3. A soldering station capable of rapid cooling according to claim 1, characterized in that: The air inlet slots (9) pass through the housing (1), one air inlet slot (9) is located between the first fan (6) and the cooling plate (4), and the other air inlet slot (9) is located at the upper end of the heat sink (8), and dust-proof nets are provided at the upper end of the air inlet slot (9) and the side end of the heat sink (11).

4. A soldering station capable of rapid cooling according to claim 1, characterized in that: The side end of the semiconductor cooling box (3) is connected to an air guide cover (12), the air guide cover (12) is located at the side end of the second fan (7), and the air outlet at the side end of the air guide cover (12) is connected to an air supply pipe (13).

5. A soldering station capable of rapid cooling according to claim 4, characterized in that: A control box (14) is provided at the side end of the housing (1), the air supply pipe (13) is plugged into the control box (14), the control box (14) is connected to the control board (2) and the semiconductor cooling box (3) via wires, and a connecting wire (15) is connected to the side end of the control box (14).

6. A soldering station capable of rapid cooling according to claim 5, characterized in that: The tail end of the connecting line (15) is connected to a soldering pen (16), an electric soldering iron rod (17) is inserted into the soldering pen (16), an air supply duct (18) is arranged in the soldering pen (16), the air supply duct (18) is located at the outer end of the electric soldering iron rod (17), and the air supply duct (18) is connected to the air supply pipe (13).

7. A soldering station capable of rapid cooling according to claim 5, characterized in that: A temperature detector (19) is arranged in the housing (1), and the temperature detector (19) is connected to the control box (14); a buzzer (20) is arranged in the housing (1), and the temperature detector (19) is connected to the buzzer (20).

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