Jig for magnetron sputtering coating of thin-film resistor

Abstract

A jig for magnetron sputtering coating of a thin-film resistor comprises a rotating frame, a plurality of clamps which are circumferentially distributed on the periphery of the rotating frame and used for fixing a coating substrate, and a plurality of fixing mechanisms connected between the clamps and the rotating frame. The clamp comprises a clamp body, a plurality of mounting grooves which are arranged at intervals along the length direction of the clamp body and are used for mounting a film-coated substrate, and two sputtering holes which are respectively arranged on the front and back surfaces of the clamp body and are communicated with the mounting grooves; by limiting the structure of the jig, clamping of the multiple coated substrates is achieved through the clamps, the multiple clamps are installed and fixed in cooperation with the structure of the rotating frame, the loading amount of the coated substrates is greatly increased, the coating uniformity of the coated substrates is guaranteed, meanwhile, the utilization rate and production efficiency of a target material can be improved, and the production cost is reduced. Compared with an existing magnetic control coating clamp, the clamp is easy to install, operation is simplified, the clamp can be repeatedly used for a long time, frequent disassembly is not needed, labor intensity is greatly reduced, and production cost is saved.

Description

Technical Field

[0001] The utility model belongs to the technical field of magnetron sputtering coating, and in particular relates to a fixture used for magnetron sputtering coating of thin film resistors. Background Art

[0002] Resistors can use thick film materials or thin film materials. Thin film resistors use a thin film resistor layer on top of an insulating material. With the rapid development of electronic information technology, more and more thin film resistor products are widely used, and the corresponding vacuum coating equipment and the manufacture of corresponding special fixtures are becoming increasingly important in the improvement of coating technology. Magnetron sputtering coating is one of the widely used coating technologies. Because high-speed sputtering is performed under low pressure, the ionization rate of the gas must be effectively increased. Magnetron sputtering introduces a magnetic field on the surface of the target cathode and uses the magnetic field to constrain charged particles to increase the plasma density and increase the sputtering rate. The principle is to use the process of electrons accelerating to fly to the substrate under the action of the electric field to collide with the sputtering gas argon, ionize a large number of argon ions and generate electrons. The electrons fly to the substrate film and continuously collide with argon atoms in the process, generating more argon ions and electrons. Argon ions are accelerated to bombard the metal target under the action of the electric field, diffracting a large number of target atoms, and the neutral target atoms (or molecules) are deposited on the surface of the substrate. Coating technology.

[0003] During the production process of thin film resistors, the ceramic substrate needs to be sputtered with a resistor layer and an electrode layer. During the sputtering process, vacuuming and other processes take a long time, so it is necessary to increase the loading capacity to ensure the efficiency of ceramic substrate coating and production costs. Traditional magnetron sputtering coating fixtures can generally be divided into several types, such as single-strip vertical and single-chip types. The small loading capacity of the traditional method results in low production efficiency and waste of target materials, leading to increased production costs. Therefore, for the preparation of a large number of thin film resistor metal film layers, traditional fixtures have great defects and need to be further improved. Utility Model Content

[0004] The utility model aims to overcome the shortcomings of the prior art and provide a fixture for magnetron sputtering coating of thin film resistors.

[0005] The utility model adopts the following technical solutions:

[0006] A fixture for magnetron sputtering coating of thin film resistors, comprising a rotating frame, a plurality of clamps circumferentially distributed on the outer circumference of the rotating frame for fixing the coated substrate, and a plurality of fixing mechanisms respectively connected between the plurality of clamps and the rotating frame, wherein the clamp comprises a clamp body, a plurality of mounting grooves for mounting the coated substrates arranged at intervals along the length direction of the clamp body, two sputtering holes respectively arranged on the front and back sides of the clamp body and connected to the mounting grooves, and a limit plate extending outwardly from the side of the clamp body, wherein the mounting groove extends inwardly from the side of the clamp body, and the limit plate and the mounting groove can be relative to each other and can cover the plurality of mounting grooves of adjacent clamps.

[0007] Furthermore, the fixing mechanism includes a fixing ring arranged on the top of the rotating frame, a rotating block rotatably arranged on the top of the clamp body, and a locking member arranged between the fixing ring and the rotating block.

[0008] Furthermore, the locking member includes a first locking hole arranged on the fixing ring, a second locking hole arranged on the rotating block opposite to the first locking hole, and a locking bolt passing through the first locking hole and cooperating with the second locking hole. The rotating block can be rotated until it is perpendicular to the clamp body so that the second locking hole is opposite to the first locking hole.

[0009] Furthermore, the fixing mechanism also includes a positioning member arranged between the bottom of the clamp body and the rotating frame, and the positioning member includes a positioning block arranged outside the rotating frame and a positioning groove arranged at the bottom of the clamp body and extending upward to allow the positioning block to be embedded.

[0010] Furthermore, the positioning block includes a positioning section extending outward from the outer side of the rotating frame and a limiting section extending upwardly arranged perpendicular to the positioning section, and the positioning section can be embedded in the relative positioning grooves.

[0011] Furthermore, the rotating frame is square, and four clamps are provided, which are respectively arranged on four sides of the rotating frame.

[0012] Furthermore, the clamp body is square.

[0013] Furthermore, the shape of the mounting groove is adapted to the shape of the coating substrate.

[0014] Furthermore, a connection plate is provided at the bottom of the rotating frame, and a connection hole is provided on the connection plate.

[0015] Furthermore, the rotating frame also includes a shielding plate arranged on a side of the rotating frame.

[0016] From the above description of the utility model, it can be seen that compared with the prior art, the beneficial effects of the utility model are as follows: the present application limits the structure of the jig, and the clamping of multiple coated substrates is realized by the clamp, and cooperates with the structure of the rotating frame to realize the installation and fixation of multiple clamps, so as to greatly increase the loading amount of coated substrates, while ensuring the uniformity of coating of the coated substrates, it can also improve the utilization rate of the target material and the production efficiency. Compared with the existing magnetron coating clamp, the clamp is simple to install, the operation is simplified, it can be reused for a long time, and there is no need for frequent disassembly, which greatly reduces labor intensity and saves production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The structure of the utility model is shown in FIG. Figure 1 ;

[0018] Figure 2 The structure of the utility model is shown in FIG. Figure 2 ;

[0019] Figure 3 is a schematic diagram of the structure of the rotating frame;

[0020] Figure 4 is a schematic diagram of the structure of the fixture;

[0021] In the figure, 1-rotating frame, 2-clamp, 3-fixing mechanism, 11-connecting plate, 12-connecting hole, 13-shielding plate, 21-clamp body, 22-mounting groove, 23-sputtering hole, 24-limiting plate, 31-fixing ring, 32-rotating block, 33-locking piece, 331-first locking hole, 332-second locking hole, 333-locking bolt, 34-positioning piece, 341-positioning block, 342-positioning groove, 343-positioning section, 344-limiting section. DETAILED DESCRIPTION

[0022] The present invention is further described below through specific implementation methods.

[0023] Reference Figures 1 to 4 As shown, a fixture for thin film resistor magnetron sputtering coating includes a rotating frame 1, four clamps 2 and four fixing mechanisms 3.

[0024] The rotating frame 1 is connected to the rotating device of magnetron sputtering coating, and the rotating frame 1 is driven to rotate by the rotating device. Specifically, the rotating frame 1 is square, including a connecting plate 11 arranged at its bottom and connected to the rotating device, and four shielding plates 13 detachably arranged on its four sides, and a connecting hole 12 connected to the rotating device is arranged on the connecting plate 11; by setting the shielding plate 13, when the coating substrate is subjected to magnetron sputtering coating, the other side that does not need to be coated is not affected, thereby ensuring the uniformity of the coating of the coated substrate; further, the rotating device is a commonly used device in the field of magnetron sputtering coating technology, and its specific structure and working principle will not be further described here.

[0025] Four clamps 2 are respectively arranged on four sides of the rotating frame 1. The clamps 2 include a clamp body 21, a plurality of mounting grooves 22 for mounting the coated substrates arranged at intervals along the length direction of the clamp body 21, two sputtering holes 23 respectively arranged on the front and back sides of the clamp body 21 and connected with the mounting grooves 22, and a limit plate 24 arranged on the side of the clamp body 21 and extending outward. The mounting groove 22 extends inward from one side of the clamp body 212; the limit plate 24 is arranged on the other side of the clamp body 21 and is opposite to the mounting groove 22. Shielding multiple mounting grooves 22 of adjacent clamps 2; two sputtering holes 23 are respectively opposite to the front and back sides of the coated substrate. After the coating substrate is installed, the four clamps 2 are respectively fixed on the four sides of the rotating frame 1, so that the coated substrate in the mounting groove 22 can be limited by the limiting plates 24 of the adjacent clamps 2, and is not easy to fall off from the mounting groove 22 during the rotation process, thereby affecting the magnetron sputtering coating work of the coated substrate; specifically, the clamp body 21 is square, and the shape of the mounting groove 22 is adapted to the shape of the coating substrate.

[0026] Four fixing mechanisms 3 are respectively connected between the four clamps 2 and the rotating frame 1. The fixing mechanisms 3 include a fixing ring 31 arranged at the top of the rotating frame 1 opposite to the connecting plate 11, a rotating block 32 rotatably arranged at the top of the clamp body 21, a locking member 33 arranged between the fixing ring 31 and the rotating block 32, and a positioning member 34 arranged between the bottom of the clamp body 21 and the rotating frame 1. After the clamp 2 clamps the coated substrate, the clamp 2 is first positioned on the side of the rotating frame 1 by the positioning member 34, and then the clamp 2 is fixed to the side of the rotating frame 1 by the locking member 33 to complete the installation of the clamp 2.

[0027] The locking member 33 includes a first locking hole 331 arranged on the fixing ring 31, a second locking hole 332 arranged on the rotating block 32 and opposite to the first locking hole 331, and a locking bolt 333 passing through the first locking hole 331 and cooperating with the second locking hole 332. The rotating block 32 can be rotated to be perpendicular to the fixture body 21, so that the second locking hole 332 is opposite to the first locking hole 331, so as to cooperate with the locking bolt 333 to fix the fixture 2; specifically, the rotating block 32 can be rotated 180° and set on the top of the fixture body 21. When the coated substrate completes the front magnetron sputtering coating, it can be directly disassembled and turned over so that the back side of the coated substrate faces outward for reverse magnetron sputtering coating. There is no need to disassemble and re-install the coated substrate, which greatly shortens the coating substrate replacement time and thus improves work efficiency.

[0028] The positioning member 34 includes a positioning block 341 arranged on the outside of the rotating frame 1 and a positioning groove 342 arranged on the bottom of the clamp body 21 and extending upward to allow the positioning block 341 to be embedded. The positioning block 341 cooperates with the positioning groove 342 to achieve the positioning of the clamp 2 and the rotating frame 1, ensuring that the locking member 33 can lock the clamp 2; specifically, the positioning block 341 includes a positioning section 343 extending outward from the outside of the rotating frame 1 and a limiting section 344 extending upward perpendicular to the positioning section 343. The positioning section 343 can be embedded in the relative positioning groove 342, and the limiting section 344 can prevent the clamp 2 from detaching from the rotating frame 1 from the side after positioning.

[0029] During magnetron sputtering coating, multiple coated substrates are first placed one by one into multiple mounting grooves 22, and then four fixtures 2 with coated substrates are fixed one by one on four sides of the rotating frame 1, and finally the rotating frame 1 is placed in a rotating device for sputtering.

[0030] The present application limits the structure of the fixture, and uses the fixture to clamp multiple coated substrates, and cooperates with the structure of the rotating frame 1 to achieve the installation and fixation of multiple fixtures 2, so as to greatly increase the loading amount of coated substrates. While ensuring the uniformity of coating on the coated substrates, it can also improve the utilization rate of the target material and the production efficiency. Compared with the existing magnetron coating fixture, the fixture is simple to install and the operation is simplified. It can be reused for a long time without frequent disassembly, which greatly reduces labor intensity and saves production costs.

[0031] The above description is only a preferred embodiment of the present invention, and therefore cannot be used to limit the scope of implementation of the present invention. That is, equivalent changes and modifications made according to the scope of application of the present invention and the contents of the specification should still fall within the scope covered by the present invention.

Claims

1. A fixture for thin film resistor magnetron sputtering coating, characterized in that: It includes a rotating frame, a plurality of clamps circumferentially distributed on the outer circumference of the rotating frame for fixing the coated substrate, and a plurality of fixing mechanisms respectively connected between the plurality of clamps and the rotating frame, the clamp includes a clamp body, a plurality of mounting grooves for mounting the coated substrates arranged at intervals along the length direction of the clamp body, two sputtering holes respectively arranged on the front and back sides of the clamp body and connected with the mounting grooves, and a limit plate extending outwardly from the side of the clamp body, the mounting groove extends inwardly from the side of the clamp body, and the limit plate and the mounting groove can cover the plurality of mounting grooves of adjacent clamps relative to each other.

2. The fixture for thin film resistor magnetron sputtering coating according to claim 1, characterized in that: The fixing mechanism comprises a fixing ring arranged on the top of the rotating frame, a rotating block rotatably arranged on the top of the clamp body, and a locking piece arranged between the fixing ring and the rotating block.

3. The fixture for thin film resistor magnetron sputtering coating according to claim 2, characterized in that: The locking member includes a first locking hole arranged on the fixing ring, a second locking hole arranged on the rotating block opposite to the first locking hole, and a locking bolt passing through the first locking hole and cooperating with the second locking hole. The rotating block can be rotated until it is perpendicular to the fixture body so that the second locking hole is opposite to the first locking hole.

4. The fixture for thin film resistor magnetron sputtering coating according to claim 2, characterized in that: The fixing mechanism also includes a positioning member arranged between the bottom of the clamp body and the rotating frame, and the positioning member includes a positioning block arranged outside the rotating frame and a positioning groove arranged at the bottom of the clamp body and extending upwards for the positioning block to be embedded.

5. The fixture for thin film resistor magnetron sputtering coating according to claim 4, characterized in that: The positioning block comprises a positioning section extending outward from the outer side of the rotating frame and a limiting section extending upwardly arranged perpendicular to the positioning section, and the positioning section can be embedded in the relative positioning grooves.

6. The fixture for thin film resistor magnetron sputtering coating according to claim 1, characterized in that: The rotating frame is square, and four clamps are provided, which are respectively arranged on four sides of the rotating frame.

7. The fixture for thin film resistor magnetron sputtering coating according to claim 1, characterized in that: The clamp body is square.

8. The fixture for thin film resistor magnetron sputtering coating according to claim 1, characterized in that: The shape of the mounting groove is adapted to the shape of the coating substrate.

9. The fixture for thin film resistor magnetron sputtering coating according to claim 1, characterized in that: A connecting plate is arranged at the bottom of the rotating frame, and a connecting hole is arranged on the connecting plate.

10. The fixture for thin film resistor magnetron sputtering coating according to claim 9, characterized in that: The rotating frame also includes a shielding plate arranged on the side of the rotating frame.

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