Film resistance network space debris detection circuit and method based on coding mode

Abstract

The invention provides a thin-film resistor network space debris detection circuit and method based on a coding mode, and the circuit comprises a coding thin-film resistor network which is composed of a parallel resistor wire array with the front side and the back side orthogonally arranged, the signal generation module is used for generating on-off signals through broken lines caused by fragment impact; the on-off comparison circuit is connected with the coding thin-film resistor net and is used for converting the on-off state of the resistor wire into an identification signal of a high level or a low level; the on-off identification circuit is connected with the on-off comparison circuit and used for collecting identification signals of all channels in parallel and outputting a disconnection state; resistor wires of the coding film resistor net are connected with signal channels in a grouping circulation connection mode, and the total number of the signal channels is smaller than that of the resistor wires. According to the invention, the size information in two dimension directions can be identified, and the positioning precision of the impact position can be improved, so that the detection parameter testing precision of the whole detector is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of space debris environment detection, and particularly relates to a space debris detection circuit and method for a thin-film resistor network based on an encoding method. Background Art

[0002] There are numerous sub-millimeter and millimeter-sized micro debris in the space environment, and the probability of collision with spacecraft is very high, bringing considerable risks. In order to obtain space micro debris environment parameters, various countries have carried out research on space micro debris detection technologies with various principles and on-orbit tests. In the early stage, detectors mainly using single detection methods such as semiconductor detectors, ionization detectors, piezoelectric detectors, resistor grid detectors, and acoustic emission were mainly used to obtain debris flux information. In recent years, foreign countries have gradually paid attention to the comprehensive detection of multiple physical parameters such as space debris flux, size, velocity, and direction, and have developed various space debris detection structures with combined detection technologies, including the combination of thin-film resistors and acoustic emission detection. The selection of the circuit processing method for such sensors as thin-film resistors will have an important impact on the detection performance of the detector. The existing design methods of thin-film resistor grid circuits have imperfect detection effects, and circuit design optimization is required to improve their ability to obtain debris information. Summary of the Invention

[0003] In view of this, the present invention provides a space debris detection circuit and method for a thin-film resistor network based on an encoding method. One or more embodiments of this specification simultaneously relate to a space debris detection method for a thin-film resistor network based on an encoding method, a space debris detection device for a thin-film resistor network based on an encoding method, a computing device, a computer-readable storage medium, and a computer program to solve the technical defects existing in the prior art.

[0004] According to a first aspect of the present invention, there is provided a space debris detection circuit for a thin-film resistor network based on an encoding method, comprising:

[0005] An encoded thin-film resistor network composed of a parallel resistor wire array orthogonally arranged on the front and back sides, for generating a break-make signal through the wire break caused by debris impact;

[0006] A break-make comparison circuit connected to the encoded thin-film resistor network, for converting the break-make state of the resistor wire into a high-level or low-level identification signal;

[0007] A break-make identification circuit connected to the break-make comparison circuit, for simultaneously collecting the identification signals of each channel and outputting the wire break state;

[0008] Wherein, the resistor wires of the encoded thin-film resistor network are connected to the signal channels through a grouped cyclic connection method, and the total number of signal channels is less than the total number of resistor wires.

[0009] In some embodiments, the width and spacing of the resistive wires encoding the thin-film resistive network are both 50 microns, the number of single-sided wires is 2000, and the two-sided orthogonal arrangement forms an effective detection area of 20 cm × 20 cm.

[0010] In some embodiments, the on-off comparison circuit includes a voltage-dividing resistor and a comparator. One end of the voltage-dividing resistor is connected to the signal channel, and the other end is connected to the power supply voltage;

[0011] One input terminal of the comparator is connected to the voltage-dividing node of the signal channel, and the other input terminal is connected to a preset threshold voltage;

[0012] When the resistive wire connected to the signal channel is broken, the voltage at the voltage-dividing node exceeds the threshold voltage, and the comparator outputs a high level as the broken-wire identification.

[0013] In some embodiments, the on-off identification circuit uses an FPGA chip, whose I / O channels are directly connected to the signal channels and can simultaneously collect the level states of all signal channels;

[0014] The FPGA chip identifies the high level as the broken-wire state and the low level as the non-broken-wire state, and the detection period is less than 1 microsecond.

[0015] In some embodiments, the resistive wires of the thin-film resistive network are divided into upper and lower groups. The number of upper signal channels is n, the number of lower signal channels is m, and m = n + 2, where both m and n are natural numbers;

[0016] The upper wires are divided into m / 2 cyclic groups, each group contains n wires and is sequentially connected to n signal channels;

[0017] The lower wires are divided into n / 2 cyclic groups, each group contains m wires and is sequentially connected to m signal channels.

[0018] In some embodiments, the number of resistive wires is 24. The 12 upper wires are divided into 3 cyclic groups, and each group is connected to 4 signal channels;

[0019] The 12 lower wires are divided into 2 cyclic groups, and each group is connected to 6 signal channels;

[0020] The total number of signal channels is 10, realizing the on-off detection of 24 wires.

[0021] According to the second aspect of the present invention, there is provided a method for detecting space debris of a thin-film resistive network based on an encoding method. This method is implemented based on the foregoing circuit, and the method includes:

[0022] Determine the number of the specific broken resistive wire according to the broken-wire signals of the upper and lower groups of signal channels;

[0023] When a debris impact causes adjacent wires to break, the impact location is located by cross - verifying the wire - break combinations in the upper and lower channels.

[0024] In some embodiments, locating the impact position by cross - verifying the wire - break combinations in the upper and lower channels includes:

[0025] Determining the X and Y coordinates of the debris by cross - checking the wire - break signals on the front and back sides;

[0026] Calculating the sizes of the debris in the X and Y dimensions based on the number of wire breaks on both sides.

[0027] According to the third aspect of the present invention, there is provided a thin - film resistive network space debris detection device based on an encoding method, including:

[0028] A determination module configured to determine the resistor wire numbers of the specific broken wires according to the wire - break signals of the upper and lower groups of signal channels;

[0029] A positioning module configured to, when a debris impact causes adjacent wires to break, locate the impact position by cross - verifying the wire - break combinations in the upper and lower channels.

[0030] In some embodiments, locating the impact position by cross - verifying the wire - break combinations in the upper and lower channels includes:

[0031] Determining the X and Y coordinates of the debris by cross - checking the wire - break signals on the front and back sides;

[0032] Calculating the sizes of the debris in the X and Y dimensions based on the number of wire breaks on both sides.

[0033] In at least one embodiment of the present invention, by adopting a structure in which parallel resistor wire arrays are respectively prepared on the front and back sides of a thin film, and the circuit processing method adopts a form of multi - channel resistor wire high - speed on / off judgment, it can identify the size information in two - dimensional directions, and at the same time obtain the information of the impact time and position through physical means, which can improve the positioning accuracy of the impact position, thereby improving the test accuracy of the detection parameters of the entire detector. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a schematic diagram of the simple structure of a debris detector on the International Space Station in the prior art;

[0035] Figure 2 is a schematic diagram of the signal channel encoding method in a thin - film resistive network space debris detection circuit provided in some embodiments of this specification;

[0036] Figure 3 is a schematic diagram of the on / off comparison circuit of a single signal channel in a thin - film resistive network space debris detection circuit provided in some embodiments of this specification;

[0037] Figure 4 It is a schematic diagram of a coded-film resistor network detection circuit in a space debris detection circuit based on a coding method provided by some embodiments of this specification;

[0038] Figure 5 It is a flowchart of a space debris detection method based on a coded-film resistor network provided by some embodiments of this specification;

[0039] Figure 6 It is a schematic diagram of one-dimensional decoding of the positions of 24 resistor wires in a space debris detection circuit based on a coded-film resistor network provided by some embodiments of this specification;

[0040] Figure 7 It is a schematic diagram of orthogonal design of a resistor wire array in a space debris detection circuit based on a coded-film resistor network provided by some embodiments of this specification;

[0041] Figure 8 It is a schematic diagram of a simple structure of a space debris detection device based on a coded-film resistor network provided by some embodiments of this specification. Specific Embodiments

[0042] Many specific details are set forth in the following description in order to provide a thorough understanding of this specification. However, this specification can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the connotation of this specification. Therefore, this specification is not limited by the specific embodiments disclosed below.

[0043] The terms used in one or more embodiments of this specification are for the purpose of describing specific embodiments only and are not intended to limit one or more embodiments of this specification. The singular forms "a" and "the" used in one or more embodiments of this specification and the appended claims are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the term "and / or" used in one or more embodiments of this specification refers to and encompasses any and all possible combinations of one or more of the associated listed items. The modifications of "one" and "multiple" mentioned in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that unless clearly specified otherwise in the context, it should be understood as "one or more".

[0044] It should be understood that although the terms first, second, etc. may be used in one or more embodiments of this specification to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of one or more embodiments of this specification, the first may also be referred to as the second, and similarly, the second may also be referred to as the first. Depending on the context, the word "if" as used herein may be interpreted as "when" or "while" or "in response to determining".

[0045] As Figure 1 shown, the debris detector on the International Space Station is designed as a two-layer detector structure. The first-layer sensor adopts a thin-film resistor structure for obtaining the debris size, and 4 acoustic emission sensors are also arranged on the thin-film resistor for obtaining the impact position information; the second-layer sensor adopts a structure with 4 acoustic emission sensors arranged on a thin metal plate, and the impact position is located through the acoustic emission signal. The first-layer sensor is a structure with single-sided parallel resistance wires prepared on the thin film, and the circuit processing method is to connect multiple resistance wires in parallel. When the debris impacts the thin-film resistor, it will cause local resistance wire breakage, resulting in a change in the parallel resistance value. The number of broken wires is determined according to the change amount of the resistance value, and the size information of the debris is further evaluated. The impact time and impact position information of the debris are realized by relying on the 4 acoustic emission sensors on the thin film. The two-layer structure is combined to realize the measurement of parameters such as the flux, size, speed, and direction of the debris.

[0046] The debris detector on the International Space Station adopts a combined detection method of thin-film resistance grid and acoustic emission. The first-layer detector has a structure of preparing a single-layer parallel resistance wire array on the thin film. The signal processing method is to connect multiple resistance wires in parallel. When debris impacts the resistance wire array, local resistance wires will break, resulting in a change in the parallel resistance value. The number of broken wires is determined according to the magnitude of the resistance value change, and the size information of the debris is further evaluated. From this technical solution, it can be seen that this detection method only tests the size in one-dimensional direction, and its size test is related to the accuracy of the resistance value test. Factors such as the difference in the processing technology of the resistance wires and partial damage to the resistance wires will affect the accuracy of obtaining size information; this technical solution shows that the thin-film resistance grid cannot obtain the impact time and position information of the debris and needs to rely on 4 acoustic emission sensors on the thin-film resistance to achieve it. Since the thin-film resistance grid is a parallel resistance wire array, the wave signal propagation speed generated by the ultra-high-speed impact of debris shows anisotropic characteristics, and the speed difference in each direction is relatively large. The error of positioning analysis and time calculation through the wave signal propagation speed is relatively large. Usually, the positioning error can reach several centimeters, and the corresponding time error can reach several microseconds. Since the overall detector needs to further analyze the debris impact direction information based on the impact position of the thin-film resistance grid and further analyze the debris impact speed information based on the impact time of the thin-film resistance grid, the speed of the debris usually reaches several kilometers per second. Assuming that the front-to-back distance of the entire combined detector structure is 20 cm, the time for the debris to travel between the two detection structures is dozens of microseconds, which will cause relatively large errors in the detector's detection of the debris impact direction and impact speed, affecting the overall detection performance of the detector. In order to obtain more accurate debris environment parameters, it is necessary to optimize the detection structure of this thin-film resistance grid and its signal processing method.

[0047] The present invention designs a thin-film resistance network detection circuit based on an encoding method, which adopts a structure of preparing parallel resistance wire arrays on the front and back sides of the thin film. The circuit processing method adopts a circuit form of comparator judgment and multi-channel signal encoding design to identify the on-off information of each resistance wire to test information such as the size, impact position, and impact time of the debris. The adopted thin-film resistance network detection structure can distinguish the size in two-dimensional directions. The detection error of the debris impact position is ±100 microns, and the test error of the debris impact time is ±1 microsecond. Taking the distance between the two detection structures of 20 cm as an example, the average measurement error of the detector in the speed range of 6.5 km / s to 8 km / s is about 9%.

[0048] Compared with the existing detector design methods, the thin-film resistor network detection circuit based on the coding method in the present invention directly obtains the two-dimensional direction size, impact time, and position information of the debris. In the existing method, the thin-film resistor grid is only used for one-dimensional direction size testing, and it is also necessary to rely on the acoustic emission sensors arranged on the thin-film resistor grid to obtain the impact time and impact position information. The detection principle and circuit form are different. This method can improve the accuracy of the debris size, impact position information, and impact time, and enhance the performance of the overall detector.

[0049] According to some embodiments of this specification, a thin-film resistor network space debris detection circuit based on the coding method is provided, specifically including: a coded thin-film resistor network composed of a parallel resistor wire array orthogonally arranged on the front and back sides, which is used to generate on-off signals through wire breaks caused by debris impacts; an on-off comparison circuit connected to the coded thin-film resistor network, which is used to convert the on-off state of the resistor wires into identification signals of high or low levels; an on-off identification circuit connected to the on-off comparison circuit, which is used to collect the identification signals of each channel in parallel and output the wire break state; among them, the resistor wires of the coded thin-film resistor network are connected to the signal channels through a grouped cyclic connection method, and the total number of signal channels is less than the total number of resistor wires.

[0050] The orthogonal arrangement on the front and back sides means that the resistor wires are vertically cross-arranged on the front and back sides of the thin-film substrate to form a grid structure for two-dimensional coordinate positioning. The parallel resistor wire array is an aggregate composed of slender resistor elements arranged at equal intervals, serving as the physical sensing unit of the detection network. The coded thin-film resistor network is a composite structure that groups and codes the wires through specific connection rules, realizing the detection of more wire states with fewer signal channels. The on-off signal is the circuit state change signal generated when the resistor wire breaks, reflecting the debris impact event. The on-off comparison circuit is a hardware module that converts the wire resistance change into a logic level, including voltage-dividing resistors and voltage comparators. The identification signal is the high or low level signal output by the comparator, used to represent the on-off state of the wire. The wire break state refers to the open-circuit situation of the circuit caused by the physical break of the wire, which is direct evidence of the debris impact. The grouped cyclic connection is a wiring strategy that groups the wires according to specific rules and rotates them to connect to the signal channels. The total number of signal channels refers to the actual number of circuit channels used for detection, which is much less than the total number of wires.

[0051] Through the innovative orthogonal grid design and coding multiplexing technology, the hardware architecture is significantly simplified while ensuring the detection accuracy. The thin-film resistor structure has the advantages of light weight and low power consumption. Combined with the high-speed signal processing circuit, it can monitor space debris impact events in real time and accurately locate them. The grouped cyclic connection method breaks through the limitations of traditional point-to-point detection, making it possible to deploy large-scale wire arrays in a compact manner, which is particularly suitable for fields such as spacecraft protection that are sensitive to volume and weight.

[0052] The beneficial effects of one of the embodiments in this specification at least include: adopting a structure in which parallel resistor wire arrays are respectively prepared on the front and back sides of a thin film, and the circuit processing method adopts a form of multi-channel resistor wire high-speed on / off judgment, which can identify size information in two-dimensional directions. At the same time, the information of the impact time and position is obtained physically, which can improve the positioning accuracy of the impact position, thereby improving the test accuracy of the detection parameters of the entire detector.

[0053] In some embodiments, the width and spacing of the resistor wires of the coded thin-film resistor network are both 50 microns, the number of single-sided wires is 2000, and the two sides are orthogonally formed to form an effective detection area of 20 cm × 20 cm.

[0054] The width of the resistor wire refers to the lateral physical size of the conductor on the thin-film substrate, which directly affects the current-carrying capacity and the sensitivity of wire breakage. The resistor wire spacing is the minimum distance between the edges of adjacent wires, which determines the minimum resolution unit of the detection grid. The single-sided wires are a set of parallel wires arranged on a single surface of the thin-film substrate, constituting the basic layer of the detection network.

[0055] In some embodiments, the on / off comparison circuit includes a voltage-dividing resistor and a comparator. One end of the voltage-dividing resistor is connected to the signal channel, and the other end is connected to the power supply voltage; one input end of the comparator is connected to the voltage-dividing node of the signal channel, and the other input end is connected to a preset threshold voltage; when the resistor wire connected to the signal channel is broken, the voltage of the voltage-dividing node exceeds the threshold voltage, and the comparator outputs a high level as the wire breakage identification.

[0056] The voltage-dividing resistor is a fixed-value component connected in series in the detection circuit, which is used to reduce the input voltage proportionally to a suitable detection range. The comparator is an analog device with differential input ends, which outputs high and low level signals by comparing the input signal with the reference voltage. The voltage sampling point at the connection of each resistor in the resistor network of the voltage-dividing node is used to obtain a specific proportion of the voltage value. The threshold voltage is a preset reference voltage value, which is used as the critical standard for the comparator to determine the state of the input signal.

[0057] In some embodiments, the on / off identification circuit uses an FPGA chip, and its I / O channels are directly connected to the signal channels, which can simultaneously collect the level states of all signal channels; the FPGA chip identifies the high level as the wire breakage state and the low level as the non-wire breakage state, and the detection period is less than 1 microsecond.

[0058] In some embodiments, the resistor wires of the coded thin-film resistor network are divided into upper and lower groups. The number of upper signal channels is n, and the number of lower signal channels is m, and m = n + 2, where m and n are both natural numbers; the upper wires are divided into m / 2 cyclic groups, each group contains n wires and are sequentially connected to n signal channels; the lower wires are divided into n / 2 cyclic groups, each group contains m wires and are sequentially connected to m signal channels.

[0059] In some embodiments, the number of resistance wires is 24. The 12 upper wires are divided into 3 cyclic groups, with each group connected to 4 signal channels; the 12 lower wires are divided into 2 cyclic groups, with each group connected to 6 signal channels; the total number of signal channels is 10, realizing the on / off detection of 24 wires.

[0060] The beneficial effects of at least one of the embodiments in this specification include: adopting a structure of respectively preparing parallel resistance wire arrays on the front and back sides of the thin film, and the circuit processing method adopts a form of high-speed on / off judgment of multi-channel resistance wires, which can identify the size information in two-dimensional directions, and at the same time obtain the impact time and position information through physical means, which can improve the positioning accuracy of the impact position, thereby improving the detection parameter test accuracy of the entire detector.

[0061] The following further introduces the present invention through a specific example:

[0062] As Figure 2 shown, when performing coding design, the resistance wires are divided into two groups, with 12 wires in each group. In this way, 10 readout signal channels are designed, namely 4 upper readout signal channels n1 to n4 and 6 lower readout signal channels m1 to m6. As Figure 2 shown, the two groups of resistance wires are connected through different cyclic sequences and interlaced with each other: 12 resistance wires are led out from above, divided into m / 2 = 3 cycles, with each cycle being n = 4 signals, and 12 resistance wires are led out from below, divided into n / 2 = 2 cycles, with each cycle being m = 6 signals. In this way, 24 resistance wires can be led out by 10 readout signal channels.

[0063] Continuing to refer to Figure 3 , the on / off comparison circuit adopts a circuit design of a comparator to output the identification of the on / off state of the resistance wires connected to the signal channels. Three resistance wires are connected to the n1 signal channel, and the three resistance wires are grounded to form a parallel circuit structure. A comparator circuit is used to compare the voltage signals at the two input ends. One input end of the comparator is connected to the n1 signal channel, and the n1 signal channel is connected to the voltage signal VCC through a voltage-dividing resistor R. The voltage signal of the n1 signal channel can be calculated through the voltage-dividing signal, and the other input end of the comparator is connected to the voltage signal VCC1.

[0064] The on-off comparison circuit of the present invention can output the mark of the on-off state of the resistance wire connected to the signal channel. When none of the three resistance wires connected to the n1 signal channel are broken, as the initial state, the voltage division of the n1 signal channel input to the comparator is designed to be less than the voltage VCC1 at the other end of the comparator. At this time, the comparator is designed to output a low level as a mark that no break occurs; when any of the three resistance wires connected to the n1 signal channel is broken, the resistance value of the parallel circuit formed by them increases, resulting in an increase in the voltage division input to the comparator on the n1 signal channel. At this time, as long as one resistance wire is broken, the voltage division input to the comparator on the n1 signal channel will be greater than the voltage VCC1 at the other end of the comparator. At this time, the comparator is designed to output a high level as a mark of the break. According to the same circuit design, the above n1 to n4 and m1 to m6 are designed as a 10-way on-off comparison circuit, which can generate marks of the on-off states of 24 resistance wires.

[0065] The on-off identification circuit adopts a circuit of an FPGA chip. The I / O channel of the FPGA chip can directly identify the level state in the signal channel. The signal channels n1 to n4 and m1 to m6 are respectively connected to the I / O channels of the FPGA chip. The signals of the signal channels can be read out simultaneously to identify their high and low level identification states. A low level is identified as no line break, and a high level is identified as a line break.

[0066] Continue to refer Figure 4 , shows a schematic diagram of the single-sided structure of the thin film resistor network detection circuit based on the encoding method. It can identify the on-off status of 24 resistor wires through 10 signal channels. The 10 signal channels are collected simultaneously through the FPGA chip. The time period for the entire detection circuit to identify the on-off status can be less than 1 microsecond.

[0067] like Figure 5 As shown, corresponding to the above-mentioned circuit embodiment, the present specification also provides an embodiment of a thin-film resistor network space debris detection method based on coding, which is implemented based on the aforementioned circuit, and includes: determining the specific broken resistor wire number according to the broken wire signals of the upper and lower groups of signal channels; when the debris impact causes the adjacent wire to break, locating the impact position by cross-verifying the broken wire combination of the upper and lower channels.

[0068] In some embodiments, the position decoding method determines the X and Y coordinates of the fragment by crossing the line break signals on the front and back sides; and calculates the size of the fragment in two dimensions, X and Y, according to the number of line breaks on both sides.

[0069] As a specific example, Figure 6As shown in the figure, taking the one-dimensional decoding method of 24 resistance wire positions as an example, the circles in the figure indicate that the third and fourth resistance wires are broken. The third resistance wire is connected to the lower signal channel m2, and the fourth resistance wire is connected to the upper signal channel n2. When decoding, according to the lower signal channel m2, it can be inferred that the broken wire position is the third or the fifteenth resistance wire; according to the upper signal channel n2, it can be inferred that the broken wire position is the fourth, twelfth, or twentieth resistance wire; in the broken wire event caused by debris impact, only adjacent resistance wires will be broken. Then, these two broken wire signals must come from two consecutive resistance wires. Only the third and fourth resistance wires are adjacent, and the fifteenth, twelfth, and twentieth resistance wires are not adjacent.

[0070] As another specific example, the same circuit design is adopted on both the front and back sides of the thin film. The resistance wire arrays on both sides are orthogonally designed. As Figure 7 shown, according to the broken wire number information on both sides, the number of broken wires and the broken wire position information can be further obtained.

[0071] When designing a thin film resistance network detection structure with, for example, 2000 resistance wires on the front side and 2000 resistance wires on the back side, based on the coding method, the readout signal channels on one side of the thin film resistance network detection circuit can be designed as n = 44 and m = n + 2 = 46. The on-off states of 2024 resistance wires can be identified through 90 signal channels on one side. Through 180 signal channels on the front and back sides, the number of broken wires, the broken wire positions, etc. of 2000 resistance wires on the front side and 2000 resistance wires on the back side can be identified. Its circuit scale is small, and the time period for the entire detection circuit to identify the on-off state can be less than 1 microsecond.

[0072] Corresponding to the above method embodiments, this specification also provides embodiments of a thin film resistance network space debris detection device based on the coding method. Figure 8 shows a schematic structural diagram of a thin film resistance network space debris detection device provided in some embodiments of this specification. As Figure 8 shown, the device includes:

[0073] A determination module 801, configured to determine the resistance wire number of the specific broken wire according to the broken wire signals of the upper and lower groups of signal channels;

[0074] A positioning module 802, configured to locate the impact position by cross-verifying the broken wire combinations of the upper and lower channels when debris impact causes adjacent wires to break.

[0075] In some embodiments, locating the impact position by cross-verifying the broken wire combinations of the upper and lower channels includes:

[0076] Determine the X and Y coordinates of the fragment by the intersection of the broken line signals on the front and back sides;

[0077] Calculate the sizes of the fragment in the X and Y dimensions according to the number of broken lines on both sides.

[0078] For example, the size of the fragment in the X dimension can be determined based on the minimum and maximum values of the X coordinates of the determined fragment, and the size of the fragment in the Y dimension can be determined based on the minimum and maximum values of the Y coordinates of the determined fragment. Or, calculate the approximate rectangular area of the corresponding fragment through the minimum and maximum values of the X coordinates and the minimum and maximum values of the Y coordinates. Or, form an irregular area of the corresponding fragment according to each X and Y coordinate.

[0079] The above is a schematic solution of a space debris detection device based on a coded thin-film resistor network according to this embodiment. It should be noted that the technical solution of the space debris detection device based on the coded thin-film resistor network belongs to the same concept as the above-mentioned technical solution of the space debris detection method based on the coded thin-film resistor network. For the details not described in detail in the technical solution of the space debris detection device based on the coded thin-film resistor network, reference can be made to the description of the technical solution of the space debris detection method based on the coded thin-film resistor network.

[0080] The preferred embodiments of this specification disclosed above are only used to help explain this specification. The selected embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made according to the content of the present invention. These embodiments are selected and specifically described in this specification to better explain the principle and practical application of the present invention, so that those skilled in the art can understand and utilize this specification well. This specification is only limited by the claims and their full scope and equivalents.

Claims

1. A thin-film resistor network space debris detection circuit based on an encoding method, characterized in that Including: A coded thin-film resistor network composed of a parallel resistor wire array with orthogonal front and back sides, used to generate on-off signals through wire breaks caused by debris impact; An on-off comparison circuit connected to the coded thin-film resistor network, used to convert the on-off state of the resistor wires into identification signals of high or low levels; An on-off identification circuit connected to the on-off comparison circuit, used to collect the identification signals of each channel in parallel and output the wire break state; Among them, the resistor wires of the coded thin-film resistor network are connected to the signal channels through a grouped cyclic connection method, and the total number of signal channels is less than the total number of resistor wires.

2. The circuit according to claim 1, wherein: The width and spacing of the resistor wires of the coded thin-film resistor network are both 50 microns, the number of single-sided wires is 2000, and the orthogonal formation of the front and back sides forms an effective detection area of 20 cm × 20 cm.

3. The circuit according to claim 1, wherein: The on-off comparison circuit includes a voltage-dividing resistor and a comparator. One end of the voltage-dividing resistor is connected to the signal channel, and the other end is connected to the power supply voltage; One input end of the comparator is connected to the voltage-dividing node of the signal channel, and the other input end is connected to a preset threshold voltage; When the resistor wire connected to the signal channel is broken, the voltage of the voltage-dividing node exceeds the threshold voltage, and the comparator outputs a high level as the wire break identification.

4. The circuit according to claim 1, wherein: The on-off identification circuit uses an FPGA chip, and its I / O channels are directly connected to the signal channels, and can collect the level states of all signal channels simultaneously; The FPGA chip identifies the high level as the wire break state and the low level as the non-wire break state, and the detection period is less than 1 microsecond.

5. The circuit according to claim 1, wherein: The resistor wires of the coded thin-film resistor network are divided into upper and lower groups. The number of upper signal channels is n, and the number of lower signal channels is m, and m = n + 2, where m and n are both natural numbers; The upper wires are divided into m / 2 cyclic groups, each group contains n wires and is sequentially connected to n signal channels; The lower wires are divided into n / 2 cyclic groups, each group contains m wires and is sequentially connected to m signal channels.

6. The circuit according to claim 5, wherein: The number of resistor wires is 24. The 12 upper wires are divided into 3 cyclic groups, and each group is connected to 4 signal channels; The 12 lower wires are divided into 2 cyclic groups, and each group is connected to 6 signal channels; The total number of signal channels is 10, realizing the on-off detection of 24 wires.

7. A method for detecting space debris by a thin-film resistor network based on an encoding method, characterized in that, The method is implemented based on the circuit according to any one of claims 1 to 6, and the method includes: Determining the specific resistor wire number of the broken wire according to the wire break signals of the upper and lower groups of signal channels; When adjacent wires are broken due to debris impact, the impact position is located by cross-verifying the wire break combinations of the upper and lower channels.

8. The method according to claim 7, characterized in that: Locating the impact position by cross-verifying the wire break combinations of the upper and lower channels, including: Cross-determining the X and Y coordinates of the debris through the wire break signals on the front and back sides; Calculating the sizes of the debris in the X and Y dimensions according to the number of double-sided wire breaks.

9. A thin-film resistor network space debris detection device based on an encoding method, characterized in that Including: A determination module configured to determine the specific resistor wire number of the broken wire according to the wire break signals of the upper and lower groups of signal channels; The positioning module is configured to locate the impact position by cross - verifying the wire break combinations of the upper and lower channels when the adjacent wires are broken due to the impact of debris.

10. The device according to claim 9, characterized in that: Locating the impact position by cross - verifying the wire break combinations of the upper and lower channels includes: Determining the X and Y coordinates of the debris by cross - checking the wire break signals on the front and back sides; Calculating the dimensions of the debris in the X and Y dimensions according to the number of wire breaks on both sides.

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