Heat dissipation device
By using the heat dissipation device of the first and second heat exchange components in the stage lamp, and using the gradient heat transfer of three ways, the problem of poor heat dissipation effect of the stage lamp LED light source module is solved, and a more balanced temperature distribution and Longer equipment life.
Patent Information
- Application Number
- CN202420778265.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-04-15
AI Technical Summary
The prior art is difficult to effectively dissipate the stage lamp through conventional radiators, resulting in poor heat dissipation effect, heat accumulation, and equipment life.
Using a heat dissipation device including a first heat exchange assembly and a second heat exchange assembly, the heat transfer is transferred through three channels through gradient heat transfer, and the liquid phase working fluid is used to transfer heat between the evaporation end and the condensing end, and combined with the radiator itself. Heat diffusion, equalization temperature distribution.
It significantly improves the heat dissipation effect, extends the thermal balance time of the stage lamp, reduces the maximum temperature, and increases the service life of the equipment.
Smart Images
Figure CN222230490U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of LED lamps, and in particular to a heat dissipation device. Background Art
[0002] Stage lighting, also known as "stage illumination", is one of the means of stage art modeling. Using stage lighting equipment (such as lighting fixtures, slides, control systems, etc.) and technical means, with the development of the plot, with light color and its changes, it can show the environment, create atmosphere, highlight the central characters, create a sense of stage space and time, shape the external image of the stage performance, and provide necessary lighting effects (such as wind, rain, clouds, water, lightning).
[0003] In the prior art, due to the limited size of the stage light, it is difficult to effectively dissipate heat for the LED light source module of the stage light through a conventional heat sink. Utility Model Content
[0004] In order to overcome the problems existing in the related technology, the present application provides a top film device, which realizes gradient heat transfer and heat exchange in three paths through a first heat exchange component, a second heat exchange component and a radiator, so that the temperature range of the radiator is more balanced, thereby improving the heat dissipation effect of the radiator as a whole.
[0005] A first aspect of the present application provides a heat dissipation device, comprising:
[0006] A radiator, one end of which is a heat source action surface for contacting with the stage light;
[0007] a first heat exchange component, wherein the evaporation end and the condensation end of the first heat exchange component are provided through the radiator, the evaporation end of the first heat exchange component is close to the heat source action surface, and the condensation end of the first heat exchange component is far away from the heat source action surface;
[0008] A second heat exchange component is located inside the first heat exchange component, and the evaporation end and the condensation end of the second heat exchange component are penetrated by the radiator;
[0009] Wherein, the first heat exchange component and the second heat exchange component are filled with liquid phase working medium for heat exchange.
[0010] In a possible implementation of the first aspect above, the heat sink includes a first plate body, a second plate body, and a fin group stacked in sequence;
[0011] A first through hole group is formed between the first plate body and the second plate body, the evaporation end of the first heat exchange component is penetrated by the first through hole group, and the end surface of the first plate body away from the second plate body is the heat source action surface;
[0012] A second through hole group is formed between the second plate body and the fin group, and the evaporation end of the second heat exchange component is penetrated by the second through hole group;
[0013] The fin assembly is provided with a third through hole group and a fourth through hole group parallel to the horizontal plane of the first plate body, and the distance between the third through hole group and the second plate body is smaller than the distance between the fourth through hole group and the second plate body;
[0014] The condensing end of the first heat exchange component is penetrated by the fourth through hole group, and the condensing end of the second heat exchange component is penetrated by the third through hole group.
[0015] In a possible implementation of the first aspect, the first heat exchange assembly includes a plurality of first annular heat pipes arranged side by side, the evaporation ends of the plurality of first annular heat pipes are penetrated by the first through hole group, and the condensation ends of the plurality of first annular heat pipes are penetrated by the fin group;
[0016] The second heat exchange assembly includes a plurality of second annular heat pipes arranged side by side, the evaporation ends of the plurality of second annular heat pipes are penetrated by the second through hole group, and the condensation ends of the plurality of second annular heat pipes are penetrated by the fin group.
[0017] In a possible implementation of the first aspect above, the first annular heat pipe includes two symmetrically arranged U-shaped heat pipes, and a discretely distributed and strip-shaped capillary structure is arranged in the pipe of the U-shaped heat pipe, and the capillary structure is used to drain the liquid-phase working medium.
[0018] In a possible implementation of the first aspect above, the two U-shaped heat pipes are connected and fixed by a sealing rubber ring, and the outer circumference of the U-shaped heat pipe is also coated with a heat conductor.
[0019] In a possible implementation of the first aspect above, the heat conductor includes one of a silicone thermal conductive sheet, a conductive sponge, an artificial graphite sheet, and thermal grease.
[0020] In a possible implementation of the first aspect above, the fin group includes a plurality of heat dissipation fins perpendicular to the second plate body.
[0021] In a possible implementation of the first aspect, the heat sink is an aluminum sheet, and the distance between adjacent aluminum sheets is 1 mm to 3 mm.
[0022] In a possible implementation of the first aspect above, the number of the first loop heat pipes is 8; the number of the second loop heat pipes is 7.
[0023] In a possible implementation of the first aspect above, the first plate body and the second plate body are made of pure copper, and the first ring-shaped heat pipe and the second ring-shaped heat pipe are both made of copper pipes.
[0024] The technical solution provided by this application may have the following beneficial effects:
[0025] The present application provides a heat dissipation device, in which the heat generated by the heat source of the stage lamp can be transferred and exchanged through three paths: the first heat exchange component, the second heat exchange component, and the radiator itself. After the heat is transferred to the radiator through the heat source action surface, the heat is first absorbed by the evaporation end of the first heat exchange component. The liquid phase working fluid at the evaporation end is heated and vaporized and then flows to the condensation end located in the radiator. Under the synergistic effect of the radiator, it condenses and flows back to the evaporation end. After the heat source passes through the heat exchange of the first heat exchange component, part of the heat is lost. The remaining heat is exchanged through the evaporation end and the condensation end of the second heat exchange component. Finally, the remaining heat is diffused through the radiator itself, thereby realizing the gradient heat exchange of the heat source, improving the overall heat conduction and heat dissipation effect of the radiator, prolonging the thermal equilibrium time inside the stage lamp, reducing the maximum temperature of thermal equilibrium, and effectively increasing the service life of the stage lamp. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] The above and other objects, features and advantages of the present application will become more apparent through a more detailed description of exemplary embodiments of the present application in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present application.
[0027] Figure 1 is a schematic structural diagram of a heat dissipation device shown in an embodiment of the present application;
[0028] Figure 2 is an exploded schematic diagram of a heat dissipation device shown in an embodiment of the present application;
[0029] Figure 3 It is another structural schematic diagram of the heat dissipation device shown in an embodiment of the present application.
[0030] Reference numerals:
[0031] 1. Radiator; 11. First plate body; 12. Second plate body; 13. Fin group; 14. First through hole group; 15. Second through hole group; 16. Third through hole group; 17. Fourth through hole group;
[0032] 2. a first heat exchange component; 21. a first annular heat pipe;
[0033] 3. a second heat exchange component; 22. a second annular heat pipe;
[0034] 4. Heat source action surface. DETAILED DESCRIPTION
[0035] The preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.
[0036] The inventor of the utility model found in the heat dissipation test of the stage lamp that the heat diffusion of the radiator is gradient distributed, and the heat conducted through the radiator is difficult to transfer to the tail of the radiator (i.e., the end away from the heat source surface), which makes it difficult to meet the heat dissipation requirements of high-power stage lights.
[0037] In response to the above problems, an embodiment of the present application provides a heat dissipation device, which realizes gradient heat transfer and heat exchange in three paths through a first heat exchange component 2, a second heat exchange component 3 and a radiator 1, so that the temperature range of the radiator 1 is more balanced, thereby improving the heat dissipation effect of the radiator 1 as a whole.
[0038] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.
[0039] Figure 1 It is a schematic diagram of the structure of the heat dissipation device shown in an embodiment of the present application.
[0040] The heat dissipation device in one embodiment of the present application includes:
[0041] A radiator 1, one end of which is a heat source action surface 4 for contacting with a stage light;
[0042] A first heat exchange component 2, wherein the evaporation end and the condensation end of the first heat exchange component 2 are provided through the radiator 1, the evaporation end of the first heat exchange component 2 is close to the heat source action surface 4, and the condensation end of the first heat exchange component 2 is far away from the heat source action surface 4;
[0043] A second heat exchange component 3 is located inside the first heat exchange component 2, and the evaporation end and the condensation end of the second heat exchange component 3 are penetrated by the radiator 1;
[0044] The first heat exchange component 2 and the second heat exchange component 3 are filled with liquid working fluid for heat exchange.
[0045] The heat dissipation device in this embodiment includes a radiator 1, a first heat exchange component 2 and a second heat exchange component 3, wherein the evaporation end and the condensation end of the first heat exchange component 2 and the evaporation end and the condensation end of the second heat exchange component 3 are all arranged on the radiator 1, the evaporation end of the first heat exchange component 2 is close to the heat source action surface 4, and the condensation end is far away from the heat source action surface 4, and the second heat exchange component 3 is located at the inner periphery of the first heat exchange component 2, therefore, the distance between the evaporation end of the second heat exchange component 3 and the heat source action surface 4 is greater than the distance between the evaporation end of the first heat exchange component 2 and the heat source action surface 4, and the distance between the condensation end of the second heat exchange component 3 and the heat source action surface 4 is less than the distance between the condensation end of the first heat exchange component 2 and the heat source action surface 4.
[0046] When the heat source of the stage lamp is transferred to the radiator 1 through the heat source action surface 4, the heat dissipation process is as follows: first, the heat transferred from the heat source to the surface of the radiator 1 through the heat source action surface 4 is the original heat. After the original heat is conducted to the evaporation end of the first heat exchange component 2, the liquid phase working medium in the first heat exchange component 2 absorbs the heat and vaporizes into gas and floats to the condensation end. The vaporized liquid phase working medium condenses into liquid at the condensation end and flows back to the evaporation end. The evaporation end of the first heat exchange component 2 is in the radiator 1 area with the highest temperature in the heat source conduction direction, and its condensation end is in the radiator 1 area with the lowest temperature in the heat source conduction direction. Through the first heat exchange component 2, the end of the radiator 1 (i.e., the end away from the heat source action surface 4) can be effectively utilized. On the one hand, the heat conduction efficiency of the heat source can be improved. On the other hand, by utilizing the end of the radiator 1 to dissipate heat, the overall heat dissipation effect is improved under air convection. The heat conducted through the first heat exchange component 2 loses part of the heat, and then passes through the evaporation end and the condensation end of the second heat exchange component 3 to achieve heat transfer and heat dissipation, further reducing the hot spot concentration at one end of the radiator 1 close to the heat source action surface 4. After the heat source of the stage light passes through the first heat exchange component 2 and the second heat exchange component 3, the remaining heat is conducted to the low temperature area through the radiator 1.
[0047] For example, the liquid working fluid may be water, ethanol, cooling oil or cooling liquid.
[0048] The embodiment of the present application improves the gradient heat transfer and heat exchange of the stage light through three heat transfer and heat exchange pathways, which can improve the overall heat transfer effect of the radiator 1, avoid heat accumulation on the heat source action surface 4, and reduce the hot spots of the heat source of the stage light.
[0049] In an exemplary embodiment, please refer to Figure 2The radiator 1 of the heat dissipation device comprises a first plate body 11, a second plate body 12 and a fin group 13 which are stacked in sequence; a first through hole group 14 is formed between the first plate body 11 and the second plate body 12, the evaporation end of the first heat exchange component 2 is penetrated by the first through hole group 14, and the end surface of the first plate body 11 away from the second plate body 12 is the heat source action surface 4; a second through hole group 15 is formed between the second plate body 12 and the fin group 13, the evaporation end of the second heat exchange component 3 is penetrated by the second through hole group 15; the fin group 13 is provided with a third through hole group 16 and a fourth through hole group 17 which are parallel to the horizontal plane of the first plate body 11, and the distance between the third through hole group 16 and the second plate body 12 is smaller than the distance between the fourth through hole group 17 and the second plate body 12; the condensation end of the first heat exchange component 2 is penetrated by the fourth through hole group 17, and the condensation end of the second heat exchange component 3 is penetrated by the third through hole group 16.
[0050] In this example, see Figure 2 and Figure 3 The assembly between the first plate body 11, the second plate body 12 and the radiator 1 can be carried out as follows: first, the condensing end of the second heat exchange component 3 is inserted into the third through hole group 16 of the radiator 1, and the second plate body 12 is covered on the end surface of the radiator 1, and then the condensing end of the first heat exchange component 2 is inserted into the fourth through hole group 17 of the radiator 1, and then the first plate body 11 is covered on the second plate body 12.
[0051] Regarding the connection method between the first plate body 11 and the second plate body 12, welding or threaded connection can be used for fixing. After the first plate body 11 and the second plate body 12 are fixed in the above manner, the second plate body 12 and the radiator 1 can be pressed and fixed by the first heat exchange component 2, eliminating the need to fix the second plate body 12 and the radiator 1, and has the advantages of simple structure, convenience and speed.
[0052] Specifically, the first through hole group 14 formed by overlapping the first plate body 11 and the second plate body 12 can be formed by cutting on the surface of the first plate body 11 and the second plate body 12 along the width direction or the length direction of the first plate body 11 by metal cutting, thereby forming corresponding through grooves, and the first plate body 11 and the second plate body 12 can be overlapped to form the above-mentioned first through hole group 14.
[0053] Specifically, the third through hole group 16 and the fourth through hole group 17 of the fin group can be cut by water jet cutting.
[0054] In an exemplary embodiment, the first heat exchange assembly 2 of the heat dissipation device comprises a plurality of first annular heat pipes 21 arranged side by side, the evaporation ends of the plurality of first annular heat pipes 21 are penetrated by the first through hole group 14, and the condensation ends of the plurality of first annular heat pipes 21 are penetrated by the fin group 13;
[0055] The second heat exchange assembly 3 includes a plurality of second annular heat pipes 22 arranged side by side, the evaporation ends of the plurality of second annular heat pipes 22 are penetrated by the second through hole group 15 , and the condensation ends of the plurality of second annular heat pipes 22 are penetrated by the fin group 13 .
[0056] Specifically, see Figure 2 The shape of the first loop heat pipe 21 can be set to a "mouth" shape. Multiple first loop heat pipes 21 are arranged side by side to form the above-mentioned first heat exchange component 2. The inner side of the multiple first loop heat pipes 21 accommodates the second loop heat pipe 22, so that the first loop heat pipe 21 can perform the first heat transfer and heat exchange on the original heat, the second loop heat pipe 22 performs the second heat transfer and heat exchange, and the third heat transfer and heat exchange is performed through the radiator 1 itself, effectively realizing gradient heat transfer.
[0057] In an exemplary embodiment, the first annular heat pipe 21 of the heat dissipation device includes two symmetrically arranged U-shaped heat pipes, and the U-shaped heat pipes are provided with discretely distributed and strip-shaped capillary structures, and the capillary structures are used to guide the liquid phase medium. The capillary structure provided in the U-shaped heat pipe can increase the contact area and heat absorption capacity of the liquid phase medium, and improve the heat transfer and heat dissipation capacity of the evaporation end.
[0058] In an exemplary embodiment, the two U-shaped heat pipes of the heat dissipation device are connected and fixed by a sealing rubber ring, and the outer periphery of the U-shaped heat pipe is also coated with a heat conductor. The outer periphery of the U-shaped heat pipe protects the heat conductor. When the evaporation end and the condensation end of the U-shaped heat pipe are installed in the corresponding through-hole group, the contact surface between the U-shaped heat pipe and the through-hole group can be increased, and the air gap between the U-shaped heat pipe and the through-hole group can be reduced, thereby improving the heat transfer capacity of the first plate body 11, the second plate body 12, the fin group 13 and the corresponding annular heat pipe.
[0059] In an exemplary embodiment, the heat conductor of the heat dissipation device includes one of a silicone heat conductive sheet, a conductive sponge, an artificial graphite sheet, and a thermal grease. Specifically, when the heat conductor is a silicone heat conductive sheet, a conductive sponge, or an artificial graphite sheet, it is attached to the outer periphery of the U-shaped heat pipe by double-sided tape, and when thermal grease is used, the thermal grease is coated on the corresponding surfaces of the first plate body 11, the second plate body 12, and the fin group 13.
[0060] In an exemplary embodiment, the fin group 13 of the heat dissipation device includes a plurality of heat dissipation fins perpendicular to the second plate body 12 .
[0061] In an exemplary embodiment, the heat sink of the heat dissipation device is an aluminum sheet, and the spacing between adjacent aluminum sheets is 1 mm to 3 mm.
[0062] In an exemplary embodiment, the number of the first annular heat pipes 21 of the heat dissipation device is 8; the number of the second annular heat pipes 22 is 7. The number of through-holes in the first through-hole group 14 and the fourth through-hole group 17 is the same as the number of the first annular heat pipes 21. The through-holes provided on the first plate body 11 and the second plate body 12, and the first through-hole group 14 with the through-holes overlapping each other cover the end surface of the first plate body 11. When heat is transferred from the heat source action surface 4 to the first annular heat pipe 21, heat exchange can be performed through the internal liquid working medium.
[0063] In an exemplary embodiment, the first plate body 11 and the second plate body 12 of the heat dissipation device are made of pure copper, and the first annular heat pipe 21 and the second annular heat pipe 22 are both made of copper pipes.
[0064] Compared with the prior art, the present application adopts a first heat exchange component 2 and a second heat exchange component 3 to improve the heat transfer and heat exchange capacity of the radiator 1, and realizes efficient heat conduction through gradient heat transfer in three paths, which can effectively reduce the heat source temperature of the stage lamp.
[0065] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.
Claims
1. A heat dissipation device, characterized in that: include: A radiator, one end of which is a heat source action surface for contacting with the stage light; a first heat exchange component, wherein the evaporation end and the condensation end of the first heat exchange component are provided through the radiator, the evaporation end of the first heat exchange component is close to the heat source action surface, and the condensation end of the first heat exchange component is far away from the heat source action surface; A second heat exchange component is located inside the first heat exchange component, and the evaporation end and the condensation end of the second heat exchange component are penetrated by the radiator; Wherein, the first heat exchange component and the second heat exchange component are filled with liquid phase working medium for heat exchange.
2. The heat dissipation device according to claim 1, characterized in that: The heat sink comprises a first plate body, a second plate body and a fin group which are stacked in sequence; A first through hole group is formed between the first plate body and the second plate body, the evaporation end of the first heat exchange component is penetrated by the first through hole group, and the end surface of the first plate body away from the second plate body is the heat source action surface; A second through hole group is formed between the second plate body and the fin group, and the evaporation end of the second heat exchange component is penetrated by the second through hole group; The fin assembly is provided with a third through hole group and a fourth through hole group parallel to the horizontal plane of the first plate body, and the distance between the third through hole group and the second plate body is smaller than the distance between the fourth through hole group and the second plate body; The condensation end of the first heat exchange component is penetrated by the fourth through hole group, and the condensation end of the second heat exchange component is penetrated by the third through hole group.
3. The heat dissipation device according to claim 2, characterized in that: The first heat exchange assembly includes a plurality of first annular heat pipes arranged side by side, the evaporation ends of the plurality of first annular heat pipes are penetrated by the first through hole group, and the condensation ends of the plurality of first annular heat pipes are penetrated by the fin group; The second heat exchange assembly includes a plurality of second annular heat pipes arranged side by side, the evaporation ends of the plurality of second annular heat pipes are penetrated by the second through hole group, and the condensation ends of the plurality of second annular heat pipes are penetrated by the fin group.
4. The heat dissipation device according to claim 3, characterized in that: The first annular heat pipe includes two symmetrically arranged U-shaped heat pipes, and the pipes of the U-shaped heat pipes are provided with discretely distributed and strip-shaped capillary structures, and the capillary structures are used to drain the liquid phase working medium.
5. The heat dissipation device according to claim 4, characterized in that: The two U-shaped heat pipes are connected and fixed by a sealing rubber ring, and the outer circumference of the U-shaped heat pipe is also coated with a heat conductor.
6. The heat dissipation device according to claim 5, characterized in that: The heat conductor includes one of a silicone heat conductive sheet, a conductive sponge, an artificial graphite sheet and a heat conductive silicone grease.
7. The heat dissipation device according to claim 2, characterized in that: The fin group includes a plurality of heat dissipation fins perpendicular to the second plate body.
8. The heat dissipation device according to claim 7, characterized in that: The heat sink is an aluminum sheet, and the spacing between adjacent aluminum sheets is 1 mm to 3 mm.
9. The heat dissipation device according to claim 3, characterized in that: The number of the first ring-shaped heat pipes is 8; the number of the second ring-shaped heat pipes is 7.
10. The heat dissipation device according to claim 3, characterized in that: The first plate body and the second plate body are made of pure copper, and the first annular heat pipe and the second annular heat pipe are both made of copper pipes.