Nested graphene field effect transistor sensor chip packaging structure

Abstract

The nested graphene field effect transistor sensor chip packaging structure comprises sensor core particles, a packaging substrate and a packaging panel, the sensor core particle is provided with a core particle substrate, a sealing glue layer, an electrode, a graphene channel and a plurality of electrode bonding pads, and the packaging substrate comprises an embedded window and a plurality of plate edge half-hole bonding pads; the sensor core particle is installed in the embedded window, the plate edge half-hole bonding pad and the electrode bonding pad are bonded and conducted through a conductive adhesive, and the plate edge half-hole bonding pad is conducted with the corresponding PIN and the via hole test point through an inner layer circuit; a biochemical reaction window and a plurality of test point avoiding holes are formed in the packaging panel; the size of the used packaging panel and packaging substrate structure is similar to the size of a silk-screen printing electrochemical structure, the packaging panel and packaging substrate structure are matched with an electrode bonding pad of a sensor core particle, a 3PIN or 4PIN electrode structure is adopted, the requirements of productization process production and application are met, the consistency and repeatability of function and performance indexes of a packaging electrode chip are ensured, and the production cost is reduced. And the repeatability of test and application research results is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor integrated circuit packaging, and in particular to a nested graphene field effect transistor sensor chip packaging structure. Background Art

[0002] Graphene field effect transistor biosensor is a biosensor technology with great potential. Its working principle is based on the excellent performance of graphene materials and the characteristics of Dirac points. Graphene is a two-dimensional carbon-based nanomaterial with a honeycomb structure. It has the characteristics of high electron mobility of several thousand to millions of cm² / vs, strong conductivity, bipolar field effect, and good biocompatibility. Graphene has the characteristics of high surface area, strong adsorption and excellent conductivity. It can be used to fix biorecognition elements and realize rapid and sensitive detection of biomolecules. Dirac points are a special energy level structure in graphene materials. The existence of Dirac points greatly improves the conductivity and sensitivity of graphene. By giving full play to the superior performance of graphene and Dirac points, graphene biosensors can achieve highly sensitive and selective detection of biomolecules, providing new ideas and methods for research and clinical diagnosis in the field of biomedicine.

[0003] Graphene field effect transistor biosensors (SGGTs) can achieve specific recognition and highly sensitive detection of heavy metal ions by virtue of their high sensitivity and rapid response, taking advantage of graphene's high electron mobility and good biocompatibility, thus bringing new approaches to the monitoring and management of heavy metal pollution. In addition to detecting heavy metals, the characteristics of Dirac points give graphene biosensors extremely high sensitivity and selectivity for biomolecule detection. In the fields of disease diagnosis, virus detection, drug screening, environmental monitoring, pesticide residue detection, food safety, etc., graphene biosensors can achieve rapid and accurate detection of trace biomolecules, and have broad application prospects.

[0004] Hefei University of Technology has authorized the invention patent "A split-gate SGGT sensor, its preparation method and application (CN116482205A)", has used semiconductor MEMS technology to develop graphene field effect transistor sensor chips, has realized the preparation method of modifying biometric elements on the sensor electrode surface and graphene channel surface, and has completed a variety of heavy metal detection methods.

[0005] At present, it is urgent to launch a product graphene field effect transistor sensor package electrode chip based on the existing laboratory scientific research results. Since biological substances and liquid reagents are directly used in the preparation and application process of graphene field effect transistor sensors, there are special requirements for packaging, preparation and application, mainly including strict restrictions on the biocompatibility of packaging materials and harmful organic pollution in the packaging process. Therefore, it is impossible to directly use the existing semiconductor integrated circuit chip packaging process. Special equipment and special materials must be used to design and develop the graphene field effect transistor sensor chip packaging process according to the requirements of the medical device manufacturing environment. Utility Model Content

[0006] The utility model aims to provide a nested graphene field effect transistor sensor chip packaging structure, aiming to overcome the defects of the prior art, solve the problem of harmful organic pollution in the packaging process and the inability to directly use the existing semiconductor integrated circuit chip packaging.

[0007] To this end, the utility model proposes a nested graphene field effect transistor sensor chip packaging structure, including a sensor core particle, a packaging substrate and a packaging panel; the sensor core particle has a core particle base, a sealing glue layer, and electrodes including a source electrode, a drain electrode, and a gate electrode, and also includes a graphene channel and a plurality of electrode pads connected to the electrodes, the packaging substrate includes an embedded window and a plurality of board edge half-hole pads distributed on its edge, and each of the board edge half-hole pads is provided with an inner layer circuit, a PIN foot and a via test point corresponding thereto;

[0008] The sensor core is installed in the embedded window, the half-hole pad on the edge of the board is bonded and connected to the electrode pad with conductive glue, and at the same time, the half-hole pad on the edge of the board is connected to the corresponding PIN pin and the via test point through the inner layer circuit; the packaging panel and the packaging substrate are insulated and sealed by a glue film, and the packaging panel is provided with a biochemical reaction window corresponding to the sensor core gate and the graphene channel, and a plurality of test point avoidance holes corresponding to the via test points.

[0009] As a preferred technical solution of the present application, the thickness of the sensor core particle should not be greater than the thickness of the packaging substrate, and the upper surface of the sealing glue layer on the upper surface of the sensor core particle is on the same plane as the upper surface of the packaging substrate.

[0010] As a preferred technical solution of the present application, when the depth of the embedded window is consistent with the thickness of the sensor core particle, a packaging back plate is provided on the back of the packaging substrate and the sensor core particle.

[0011] As a preferred technical solution of the present application, the packaging panel material has good solvent resistance and biocompatibility, and the panel material includes but is not limited to polytetrafluoroethylene PTFE, polyetheretherketone PEEK, and polyimide PI.

[0012] As a preferred technical solution of the present application, the bottom surface of the packaging panel is coated with an adhesive film with good solvent resistance, and the adhesive film material includes but is not limited to polyurethane PU adhesive, epoxy adhesive and polyolefin adhesive.

[0013] As a preferred technical solution of the present application, when the sensor core particle 100 has three electrode pads, three board edge half-hole pads are distributed on the edge of the embedded window, and there are also three via test points; the back of the packaging substrate includes three PIN pins; when the sensor core particle has four electrode pads, four board edge half-hole pads are distributed on the edge of the embedded window, and there are also four via test points; the back of the packaging substrate includes four PIN pins.

[0014] As a preferred technical solution of the present application, the contact points between the sensor core particle and the four sides of the embedded window are fixed and sealed by UV glue.

[0015] As a preferred technical solution of the present application, four positioning holes are provided on the packaging panel, and four corresponding positioning holes are also provided on the packaging substrate.

[0016] As a preferred technical solution of the present application, the graphene channel is used to connect the source and the drain in the electrode.

[0017] As a preferred technical solution of the present application, the packaging substrate is cut from a whole PCB board or FPC circuit board, and multiple packaging substrates are assembled in an array; the packaging panel is also assembled in an array.

[0018] The nested graphene field effect transistor sensor chip packaging structure provided by the utility model adopts special packaging equipment and special materials that are tolerant to organic solvents and have good bio-correspondence, thereby avoiding possible harmful organic pollution in the packaging process and subsequent preparation process, meeting the environmental requirements for medical device manufacturing, and ensuring the consistency and repeatability of the functions and performance indicators of the graphene field effect transistor sensor packaging electrode chip.

[0019] The graphene field effect transistor sensor package electrode chip packaging structure uses a packaging panel and a packaging substrate including an embedded window, multiple board edge half-hole pads, multiple via test points, multiple PIN pins and inner layer circuits to achieve packaging, and adopts a 3PIN pin or 4PIN pin electrode structure to facilitate the direct application of the graphene field effect transistor sensor package electrode chip for testing and application research after the existing electrochemical workstation software is upgraded, and improves the repeatability of the test and application research results.

[0020] In addition to the above-described purposes, features and advantages, the present application also has other purposes, features and advantages. The present application will be further described in detail with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0022] Figure 1 It is a schematic diagram of the exploded structure of the nested graphene field effect transistor sensor chip packaging structure of the utility model;

[0023] Figure 2 It is a structural schematic diagram of a graphene field effect transistor sensor core particle in a nested graphene field effect transistor sensor chip packaging structure of the utility model;

[0024] Figure 3-1 It is a structural schematic diagram of the front side of the packaging substrate in the nested graphene field effect transistor sensor chip packaging structure of the utility model;

[0025] Figure 3-2 It is a structural schematic diagram of the back side of the packaging substrate in the nested graphene field effect transistor sensor chip packaging structure of the utility model;

[0026] Figure 4-1 It is a front schematic diagram of a double array assembly of packaging substrates in a nested graphene field effect transistor sensor chip packaging structure of the utility model;

[0027] Figure 4-2 It is a schematic diagram of the reverse side of the double array assembly of the packaging substrate in the nested graphene field effect transistor sensor chip packaging structure of the utility model;

[0028] Figure 5 It is a schematic diagram of a double array assembly of a packaging panel in a nested graphene field effect transistor sensor chip packaging structure of the utility model;

[0029] Figure 6 It is a schematic diagram of a double array layout of a packaging backplane in a nested graphene field effect transistor sensor chip packaging structure of the utility model;

[0030] Explanation of the reference numerals: 100, sensor core particle; 200, packaging substrate; 300, upper and lower cover plates; 110, core particle base; 120, graphene channel; 130, electrode; 140, electrode pad; 150, sealing adhesive layer; 210, embedded window; 220, half-hole pad on the edge of the board; 230, via test point; 240, PIN foot; 250, inner layer circuit; 310, packaging panel; 320, packaging backplane; 311, biochemical reaction window; 312, test point avoidance hole. DETAILED DESCRIPTION

[0031] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0032] like Figure 1 , Figure 2 , Figure 3-1 , Figure 3-2 As shown, the nested graphene field effect transistor sensor chip packaging structure of the utility model includes three parts: a graphene field effect transistor sensor core particle 100, a packaging substrate 200 and an upper and lower cover plate 300; wherein the graphene field effect transistor sensor core particle 100 has several parts including a core particle base 110, a graphene channel 120, an electrode 130, an electrode pad 140 and a sealing adhesive layer 150; the packaging substrate 200 includes an embedded window 210, a plurality of board edge half-hole pads 220, a plurality of via test points 230, a plurality of PIN pins 240 and an inner layer circuit 250.

[0033] like Figure 2 As shown, the depth of the embedding window 210 of the packaging substrate 200 is consistent with the thickness of the sensor core 100; if the embedding window 210 passes through the packaging substrate 200, the thickness of the packaging substrate 200 is consistent with the thickness of the sensor core 100; ensure that the upper surface of the sealing glue layer 150 of the sensor core 100 embedded in the embedding window 210 is in the same plane as the upper surface of the packaging substrate 200.

[0034] A plurality of board edge half-hole pads 220 are distributed on the edge of the embedded window 210 of the packaging substrate 200, and the board edge half-hole pads 220 are respectively connected to a plurality of PIN pins 240 through the inner layer circuit 250 of the packaging substrate 200, so as to realize that the gate and graphene channel of the graphene field effect transistor sensor and the PIN pins 240 of the nested graphene field effect transistor sensor packaging electrode chip are on different surfaces of the graphene field effect transistor sensor packaging electrode chip.

[0035] The electrode pad 140 on the graphene field effect transistor sensor core particle 100 is bonded and connected to the corresponding half-hole pad 220 on the edge of the board by conductive glue. By controlling the viscosity and dispensing amount of the conductive glue, it is ensured that the conductive glue does not exceed the front side of the packaging substrate 200. The conductive glue preferably uses a conductive polymer dispersion with good biocompatibility, conductive graphite slurry or graphite-based conductive glue.

[0036] The packaging panel 310 is made of materials with good solvent resistance and biocompatibility, including but not limited to polytetrafluoroethylene PTFE, polyetheretherketone PEEK, polyimide PI, etc. One side of the packaging panel 310 is coated with a good solvent-resistant adhesive film, the adhesive film material includes but is not limited to polyurethane PU adhesive, epoxy adhesive and polyolefin adhesive, which is used to insulate and seal the electrode pad 140 and the conductive adhesive of the graphene field effect transistor sensor core particle 100, so as to prevent the electrode pad 140 and the conductive adhesive from chemically reacting or electrically contacting with the application reagent, thereby interfering with the electrochemical detection signal.

[0037] Specifically, the core substrate 110, as a structure supporting the graphene and electrodes of the graphene field effect transistor sensor, can ensure the graphene and electrode patterning of the graphene field effect transistor. The core substrate 110 material includes but is not limited to glass, silicon oxide, ceramics, polymer materials or flexible materials. The thickness of the core substrate 110 should not be greater than the thickness of the packaging substrate 200. The core substrate 110 is usually a whole-piece structure through an array, and a semiconductor MEMS processing technology is used to perform plasma etching, photoresist patterning, and gold sputtering operations on the whole core substrate to pattern graphene, electrodes and sealing glue layers, and finally cut into a single graphene field effect transistor sensor core 100.

[0038] Graphene is a two-dimensional highly conductive material with high electron mobility, and the graphene channel 120 is used as a channel connecting the source and drain of the field effect transistor sensor. The graphene is first transferred to the entire structure of the core particle substrate 110 array, and then MEMS processing such as photoresist patterning, plasma etching and photoresist stripping is used to form a reserved patterned graphene channel between the source and drain of the field effect transistor sensor.

[0039] The field effect transistor sensor electrodes are divided into a source, a drain, a gate and an electrode pad 140 respectively connected to each electrode, and the graphene channel 120 connects the source and the drain and forms a graphene channel between the source and the drain. The sensor core particle 100 supporting 3PIN pin packaging in the utility model patent has a source, a drain and a gate, and a graphene channel; the sensor core particle 100 supporting 4PIN pin packaging has 2 independent drains, a common source and a gate, and 2 independent graphene channels.

[0040] The sealing glue layer 150 firmly bonds the field effect transistor sensor electrode and the various parts of the graphene together to form a stable overall structure, and at the same time forms a dense insulating protective layer, and only forms a transparent window at the field effect transistor sensor gate, graphene channel and electrode pad. The other parts of the core particle substrate 110 and the source, drain and electrode pad of the field effect transistor sensor are completely insulated and sealed by the sealing glue layer 150, so that only the source and graphene channel of the graphene field effect transistor sensor core particle 100 can contact the reaction reagent during subsequent chemical modification and application detection. The sealing glue preferably uses UV-8 glue or PI coating glue.

[0041] like Figure 3-1 and Figure 3-2 As shown, the packaging substrate 200 is processed by PCB board or FPC circuit board manufacturing technology, and the front and back sides are different. The front side of the packaging substrate 200 includes an embedding window 210 for the graphene field effect transistor sensor core 100. The embedding window 210 determines whether to penetrate the packaging substrate 200 according to the thickness of the graphene field effect transistor sensor core 100 to be nested, and ensures that the upper surface of the sealing glue layer 150 of the sensor core 100 is in the same plane as the upper surface of the packaging substrate 200. Three board edge half-hole pads 220 are distributed on the edge of the embedding window 210, and there are also three via test points 230; the back side includes three PIN pins 240, and the board edge half-hole pads 220 are respectively connected to the three PIN pins 240 and the via test points 230 through the inner layer circuit 250 of the packaging substrate 200.

[0042] When the sensor core particle 100 has four electrode pads, four board edge half-hole pads 220 are distributed at the edge of the embedded window 210 , and there are also four via test points 230 ; the reverse side of the package substrate 200 includes four PIN pins 240 .

[0043] During subsequent preparation and application, the graphene channel 120 and the surface of the electrode 130 are usually facing upwards to ensure good and uniform contact with the modification reagent and the detection reagent. At this time, the PIN pin 240 is facing downwards to facilitate the circuit structure design of the excitation voltage and the electrical signal detection device.

[0044] like Figure 4-1 , 4-2 , Figure 5 , Figure 6 As shown, the packaging substrate 200 adopts array paneling, and the paneling manufacturing process adopts PCB board or FPC circuit board manufacturing and processing technology. Similarly, the packaging panel 310 and the packaging backplane 320 also adopt array paneling.

[0045] The packaging panel 310 is made of materials with good solvent resistance and biocompatibility, including but not limited to polytetrafluoroethylene PTFE, polyetheretherketone PEEK, polyimide PI, etc. One side of the packaging panel 310 is coated with a single-sided adhesive film with good solvent resistance. The adhesive film material includes but is not limited to polyurethane PU adhesive, epoxy adhesive and polyolefin adhesive, which is used to insulate and seal the electrode pad 140 of the graphene field effect transistor sensor core particle 100 and the bonding part of the packaging process to prevent the electrode pad 140 and the conductive adhesive solder from interfering with the electrochemical signal detection.

[0046] The packaging back plate 320 serves as a fixing film for the sensor core 100 and the packaging substrate 200. When the embedding window 210 of the packaging substrate 200 does not penetrate the packaging substrate 200, the packaging back plate 320 may not be used. The packaging panel 310 and the packaging back plate 320 are respectively made of array panels, and the panel making process adopts the test strip processing technology. The packaging panel 310 and the packaging back plate 320 each have a medical single-sided adhesive with good biocompatibility on one side.

[0047] The packaging process of the nested graphene field effect transistor sensor package electrode chip of the utility model is as follows:

[0048] The first step is to embed the core particles: first, place the array of package substrates 200 flat and positioned on a special tray. If the array of package substrates 200 is not penetrated by the embedding window 210, first apply a good flow of fixing glue to the middle of the bottom surface of the embedding window 210. Pay attention to strictly control the amount of glue, and do not spread to the surrounding of the embedding window 210. Then use a special suction cup to smoothly and completely place the cut sensor core particles 100 into the embedding window 210 on the front of the package substrate 200. Check and confirm that the upper surface of the sealing glue layer 150 of the sensor core particles 100 is in the same plane as the upper surface of the package substrate 200, and each electrode pad 140 corresponds to the board edge half-hole pad 220 distributed at the edge of the embedding window 210.

[0049] The second step is to dispense conductive glue: use a glue dispenser to load the conductive glue onto the electrode pad 140 and the half-hole pad 220 on the edge of the board, control the viscosity and amount of the conductive glue, ensure that the conductive glue does not exceed the front of the packaging substrate 200, and detect and confirm that the corresponding electrode pad 140 and the half-hole pad 220 on the edge of the board are completely conductive; the conductive glue preferably uses a conductive polymer dispersion with good biocompatibility, a conductive graphite slurry or a graphite-based conductive glue.

[0050] The third step is to dispense UV glue: use a glue dispenser to load UV glue into the contact seals on the four sides of the sensor core particle 100 and the embedded window 210, and use a UV glue curing machine to cure the UV glue.

[0051] The fourth step is the core electrode conduction test: Use a flying probe tester to test the insulation and conduction values ​​between the sensor core 100 and the PIN pins of the packaging substrate 200 after UV glue curing, and monitor the test process and fault points in real time, and add conductive glue as needed and then perform flying probe test again until all unqualified ones are eliminated.

[0052] The fifth step is to attach the packaging panel: use a suction cup to absorb the packaging panel on the side without single-sided adhesive, remove the transfer film on the side of the single-sided adhesive, and use the suction cup to place the packaging panel on the packaging substrate 200 that has passed the flying probe test. First, visually align the 4 positioning holes of the panel with the 4 positioning holes of the packaging substrate 200, and then use a roller or scraper to move and pressurize the packaging panel from one side to make the single-sided adhesive of the packaging panel and the packaging substrate 200 completely bonded.

[0053] Step 6. Attach the packaging backplane: Leave it still for 12 to 24 hours. After the conductive adhesive is completely cured, turn over the packaging substrate 200 that has been attached to the packaging panel, use a suction cup to absorb the packaging backplane on the side without single-sided adhesive, remove the transfer film on the single-sided adhesive side, and use a suction cup to place the packaging backplane on top of the packaging substrate 200. First, visually align the 4 positioning holes of the backplane with the 4 positioning holes of the packaging substrate 200, and then use a roller or scraper to move and press the packaging panel from one side to make the single-sided adhesive of the packaging backplane and the packaging substrate 200 completely bonded.

[0054] Step 7, cutting and packaging: After pasting the packaging backplane 320, the nested graphene field effect transistor sensor package electrode chip assembly is cut into a single piece of graphene field effect transistor sensor package electrode chip finished product by processes including but not limited to laser cutting, die cutting or roller cutting. The graphene field effect transistor sensor is very sensitive to humidity, so it needs to be stored in a moisture-proof storage cabinet for electronic products, or in a moisture-proof packaging bag and sealed with a moisture-proof agent.

[0055] The working principle and working process of the nested graphene field effect transistor sensor chip packaging structure of the present invention are briefly described below.

[0056] The nested graphene field effect transistor sensor electrode package electrode chip is small in size, light in weight, and maintains good consistency, which meets the application research requirements of subsequent functional group modification and fluid chip packaging. It can be easily integrated into various application instruments and equipment to realize the miniaturization and integration of graphene field effect transistor biosensors, and meet the future development trend of graphene field effect transistor biosensor applications.

[0057] The 3PIN and 4PIN pin structures of the nested graphene field effect transistor sensor package electrode chip are compatible with the hardware interfaces of the existing three-electrode system and four-electrode system of electrochemical workstations or portable electrochemical detection devices. It only requires the electrochemical technology application module of the existing electrochemical workstation or portable electrochemical detection device software system to add the application module development for graphene Dirac point detection, which greatly facilitates the application research and product promotion of graphene field effect transistor biosensors.

[0058] The nested graphene field effect transistor sensor package electrode chip has the gate and graphene channel involved in the biochemical reaction and the PIN pin for collecting electrochemical detection signals on different surfaces, which can realize the isolation structure design of the liquid path module and the circuit module in the graphene field effect transistor biosensor application detection instrument device, and facilitate the subsequent development of detection instruments in the fields of disease diagnosis, virus detection, drug screening, environmental monitoring, pesticide residue detection, food safety, etc., especially the development of medical devices.

[0059] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A nested graphene field effect transistor sensor chip packaging structure, characterized in that: It comprises a sensor core particle (100), a packaging substrate (200) and a packaging panel (310); The sensor core particle (100) comprises a core particle base (110), a sealing glue layer (150), and an electrode (130) comprising a source electrode, a drain electrode, and a gate electrode, and also comprises a graphene channel (120) connected to the electrode (130) and a plurality of electrode pads (140). The packaging substrate (200) comprises an embedded window (210) and a plurality of board edge half-hole pads (220) distributed on the edge thereof, and each of the board edge half-hole pads (220) is provided with a corresponding inner layer circuit (250), a PIN foot (240) and a via test point (230); The sensor core particle (100) is installed in the embedded window (210), the board edge half-hole pad (220) and the electrode pad (140) are bonded and connected by conductive glue, and at the same time, the board edge half-hole pad (220) is sequentially connected to the corresponding PIN pin (240) and the via test point (230) through the inner layer circuit (250); the packaging panel (310) and the packaging substrate (200) are insulated and sealed by a glue film, and the packaging panel (310) is provided with a biochemical reaction window (311) and a plurality of test point avoidance holes (312).

2. The nested graphene field effect transistor sensor chip packaging structure according to claim 1, characterized in that: The thickness of the sensor core particle (100) is less than or equal to the thickness of the packaging substrate (200), and the upper surface of the sealing glue layer (150) of the sensor core particle (100) and the upper surface of the packaging substrate (200) are on the same plane.

3. The nested graphene field effect transistor sensor chip packaging structure according to claim 1, characterized in that: The depth of the embedded window (210) is consistent with the thickness of the sensor core particle (100), and a packaging back plate (320) is provided on the back of the packaging substrate (200) and the sensor core particle (100).

4. The nested graphene field effect transistor sensor chip packaging structure according to claim 1, characterized in that: The sensor core particle (100) has three electrode pads, three board edge half-hole pads (220) are distributed correspondingly to the edge of the embedded window (210), and there are also three via-hole test points (230); the reverse side of the package substrate (200) includes three PIN pins (240).

5. The nested graphene field effect transistor sensor chip packaging structure according to claim 1, characterized in that: The sensor core particle (100) has four electrode pads, four board edge half-hole pads (220) are distributed on the edge of the embedded window (210), and there are also four via-hole test points (230); the reverse side of the package substrate (200) includes four PIN pins (240).

6. The nested graphene field effect transistor sensor chip packaging structure according to claim 1, characterized in that: The sensor core particle (100) and the embedded window (210) are fixed and sealed at four contact points using UV glue.

7. The nested graphene field effect transistor sensor chip packaging structure according to claim 1, characterized in that: The packaging panel (310) is provided with four positioning holes, and the packaging substrate (200) is also provided with four corresponding positioning holes.

8. The nested graphene field effect transistor sensor chip packaging structure according to claim 1, characterized in that: The graphene channel (120) is connected to a source electrode and a drain electrode in the electrode (130) respectively.

9. The nested graphene field effect transistor sensor chip packaging structure according to claim 1, characterized in that: The packaging substrate (200) is cut from a whole PCB board or FPC circuit board, and a plurality of packaging substrates (200) are assembled in an array.

10. The nested graphene field effect transistor sensor chip packaging structure according to claim 9, characterized in that: The packaging panel (310) is also cut from a whole panel, and the packaging panel (310) is also assembled in an array.

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