High-temperature testing device for chip capacitor

Abstract

The utility model discloses a high-temperature testing device for a chip capacitor, which comprises a case, a high-temperature detection mechanism is arranged on the inner side of the case, and the high-temperature detection mechanism comprises a heating unit, a testing seat, a first electrode, a second electrode, a power supply unit and a display unit. The testing device is simple in structure and reasonable in design, the heating unit, the testing seat, the power supply unit and the display unit are integrated into a whole, operation convenience and testing efficiency are improved, in addition, the testing seat limits the heating part in the case, units below the testing seat are prevented from being affected, high temperature of the upper part of the case can be further isolated by arranging the heat insulation part, and the testing efficiency is improved. The lower power supply unit and the display unit are prevented from being affected, the guide pipe is arranged to provide insertion conditions for the wires, the connection process of all the units is simplified, the high-temperature test workload of the chip capacitor is reduced, and the operation convenience is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitor detection equipment, in particular to a high-temperature testing device for a chip capacitor. Background Art

[0002] MLCCs play a central role in the electronics industry, especially in highly integrated electronic devices. These capacitors are named for their multilayer ceramic dielectric and compact metal electrode layers, which enable them to provide relatively high capacitance in a very small volume. High temperature testing of MLCCs is critical because they are often used in high temperature environments such as in-vehicle electronic systems, industrial control equipment, and other high-performance applications. In these environments, MLCCs must be able to withstand long-term high temperature effects without losing performance, so comprehensive testing of their thermal stability, capacitance consistency, and long-term reliability is key to ensuring their stable operation in harsh environments.

[0003] However, in the traditional high-temperature test method, MLCC is usually heated in an oven until its expansion or explosion is observed, and then its failure temperature is recorded. The main problem with this method is that it cannot provide detailed performance data about the capacitor at different temperature stages, and can only determine its final failure point. In addition, this method is inefficient because each test sample needs to be monitored individually, and there is a lack of continuous data recording of the performance of the capacitor under thermal stress. This leads to an incomplete analysis of the behavior of MLCC under different working conditions, making it difficult to accurately evaluate its reliability and stability in actual applications. Therefore, a more efficient high-temperature test method that can provide continuous performance monitoring is needed. Utility Model Content

[0004] The purpose of the utility model is to provide a high temperature testing device for chip capacitors to solve the problems raised in the above background technology.

[0005] To achieve the above object, the utility model provides the following technical solution: a high temperature test device for a chip capacitor, comprising a chassis, characterized in that a high temperature detection mechanism is provided on the inner side of the chassis;

[0006] The high temperature detection mechanism comprises:

[0007] A heating unit, wherein the heating unit is arranged inside the chassis;

[0008] A test seat, which is detachably arranged at the lower end of the heating unit, and a plurality of first electrodes and second electrodes are arranged on the surface of the test seat;

[0009] A power supply unit, the power supply unit is arranged inside the chassis, and the power supply unit is connected to the first electrode;

[0010] A display unit is disposed inside the chassis and is connected to the second electrode.

[0011] Preferably, a heat insulating portion is provided inside the test seat, and a plurality of guide tubes penetrating the test seat are provided inside the heat insulating portion.

[0012] Preferably, a protective cover is provided on the upper end surface of the test socket, and the protective cover is intended to reduce the impact of capacitor explosion.

[0013] Preferably, an observation window is provided on the side of the chassis, and the observation window is used to observe the internal situation of the chassis during the test process.

[0014] Preferably, the heat insulating part is heat insulating ceramic.

[0015] Preferably, a heat insulating sealing sleeve is provided at the end of the guide tube, and the heat insulating sealing sleeve is intended to reduce heat diffusion.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] The high temperature testing device of a chip capacitor is provided with a high temperature detection mechanism, which includes a heating unit, a test seat, a first electrode, a second electrode, a power supply unit, and a display unit. By integrating the heating unit, the test seat, the power supply unit, and the display unit into one, the operation convenience and the test efficiency are improved. In addition, the test seat restricts the heating part inside the chassis to avoid the lower unit being affected.

[0018] The high-temperature testing device for chip capacitors can further isolate the high temperature of the upper part of the chassis by arranging a heat insulation part to prevent the power supply unit and the display unit below from being affected. The guide tube can provide insertion conditions for the wires, simplifying the connection process of each unit, reducing the workload of high-temperature testing of chip capacitors, and improving operational convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the internal structure of the utility model;

[0020] Figure 2 It is an enlarged view of point A of the utility model;

[0021] Figure 3 It is a front view of the utility model;

[0022] Figure 4 This is a schematic diagram of the internal structure of the utility model when the power supply unit and the display unit are an integrated structure.

[0023] In the figure: 1. chassis; 2. high temperature detection mechanism; 201. heating unit; 202. test socket; 203. first electrode; 204. second electrode; 205. power supply unit; 206. display unit; 3. thermal insulation part; 4. guide tube; 5. protective cover; 6. observation window; 7. thermal insulation sealing sleeve. Implementation

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0026] In the description of this patent, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "setting" should be understood in a broad sense, for example, it can be fixed connection, setting, or detachable connection, setting, or integrated connection, setting. For ordinary technicians in this field, the specific meanings of the above terms in this patent can be understood according to specific circumstances.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "several" is two or more, unless otherwise clearly and specifically defined. Example

[0028] See also Figure 1-4 As shown, the utility model provides a technical solution of a high temperature test device for a chip capacitor: a high temperature test device for a chip capacitor, comprising a chassis 1, and a high temperature detection mechanism 2 is arranged inside the chassis 1;

[0029] The high temperature detection mechanism 2 includes a heating unit 201, a test socket 202, a power supply unit 205, and a display unit 206. The heating unit 201 is arranged inside the chassis 1, and the test socket 202 is detachably arranged at the lower end of the heating unit 201. A plurality of first electrodes 203 and second electrodes 204 are arranged on the surface of the test socket 202. The power supply unit 205 is arranged inside the chassis 1, and the power supply unit 205 is connected to the first electrode 203. The display unit 206 is arranged inside the chassis 1, and the display unit 206 is connected to the second electrode 204. In this embodiment, the heating unit 201 is specifically a heating plate, the power supply unit 205 is specifically a variable frequency power supply, and the display unit 206 is a digital multimeter. In the specific implementation process, a sealing groove can be opened on the inner side of the chassis 1 and the edge of the test socket 202 to facilitate taking out and putting in. In addition, as Figure 4 As shown, the power supply unit 205 and the display unit 206 may also be an integrated structure (such as the grid analyzer in the prior art). When it is necessary to perform a thermal stress test on the chip capacitor, the chip capacitor needs to be placed between the first electrode 203 and the second electrode 204 and fixed, and then the test socket 202 is placed in the chassis 1, and then the variable frequency power supply is connected to the first electrode 203, the second electrode 204 is connected to the digital multimeter, and the digital multimeter is connected to the variable frequency power supply to form a loop, and then the heating plate is controlled to continue to heat up and the digital multimeter data is recorded and detected. When the chip capacitor fails, the heating plate is turned off and this point is marked as the failure temperature. Finally, the recorded data is analyzed to understand the performance of the chip capacitor at different temperatures and its failure mode.

[0030] The test socket 202 is provided with a heat insulating portion 3 inside, and a plurality of guide tubes 4 passing through the test socket 202 are provided inside the heat insulating portion 3. In a specific implementation process, one end of the guide tube 4 can lead to the heating portion of the chassis 1, and the other end can lead to the power supply unit 205 and the display unit 206. The connecting wires can be directly fixed on the sides of the first electrode 203 and the second electrode 204, and then the wires are passed through the guide tube 4 to connect with the power supply unit 205 or the display unit 206. This method can avoid repeated connection of wires for secondary testing. During the test process, the heat insulating portion 3 can effectively isolate the high temperature of the upper part of the chassis 1 to avoid affecting other units below.

[0031] A protective cover 5 is installed on the upper end surface of the test socket 202 . The protective cover 5 can block the fragments of the chip capacitor when it explodes, thereby protecting the heating unit 201 inside the chassis 1 .

[0032] An observation window 6 is installed on the side of the chassis 1. The observation window 6 can ensure that the tester can directly observe the internal situation of the chassis 1 under safe conditions and monitor the test process in real time.

[0033] The heat insulating part 3 is heat insulating ceramic. By designing the heat insulating part 3 as heat insulating ceramic, heat transfer can be effectively prevented, heat loss can be reduced, and protection can be provided for the power supply unit 205 and the display unit 206 at the same time.

[0034] The end of the guide tube 4 is provided with a heat-insulating sealing sleeve 7. The heat-insulating sealing sleeve 7 can effectively prevent heat from diffusing outward from the guide tube 4, further control heat diffusion, and improve the accuracy and reliability of the test results.

[0035] The working principle of the utility model is as follows:

[0036] When performing a thermal stress test on a chip capacitor, a high-temperature testing device for a chip capacitor of the present embodiment needs to place the chip capacitor between the first electrode 203 and the second electrode 204 and fix them, then place the test socket 202 in the chassis 1, then sequentially connect the variable frequency power supply to the first electrode 203, the second electrode 204 to the digital multimeter, and the digital multimeter to the variable frequency power supply to form a loop, then control the heating plate to continue to heat up and record and detect the digital multimeter data, turn off the heating plate when the chip capacitor fails, and mark this point as the failure temperature, and finally analyze the recorded data to understand the performance of the chip capacitor at different temperatures and its failure mode; the high-temperature testing device integrates a heating unit 201, a test socket 202, a power supply unit 205 and a display unit 206, optimizes the convenience of operation and test efficiency, and the test socket 202 and the heat insulation part 3 in the device effectively isolate the high temperature area and protect the key units from heat. In addition, the built-in guide tube 4 simplifies the connection process, reduces the test workload, and further improves the practicality and convenience of operation of the device.

[0037] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A high temperature testing device for a chip capacitor, comprising a chassis (1), characterized in that: A high temperature detection mechanism (2) is provided on the inner side of the chassis (1); The high temperature detection mechanism (2) comprises: A heating unit (201), wherein the heating unit (201) is arranged inside the chassis (1); A test seat (202), the test seat (202) being detachably arranged at the lower end of the heating unit (201), and a plurality of first electrodes (203) and second electrodes (204) being arranged on the surface of the test seat (202); A power supply unit (205), the power supply unit (205) being arranged inside the chassis (1), and the power supply unit (205) being connected to the first electrode (203); A display unit (206), wherein the display unit (206) is arranged inside the chassis (1), and the display unit (206) is connected to the second electrode (204).

2. The high temperature testing device for chip capacitors according to claim 1, characterized in that: A heat insulating portion (3) is arranged inside the test seat (202), and a plurality of guide tubes (4) penetrating the test seat (202) are arranged inside the heat insulating portion (3).

3. The high temperature testing device for chip capacitors according to claim 1, characterized in that: The upper end surface of the test socket (202) is provided with a protective cover (5), and the protective cover (5) is intended to reduce the impact of capacitor explosion.

4. The high temperature testing device for chip capacitors according to claim 1, characterized in that: An observation window (6) is provided on the side of the chassis (1), and the observation window (6) is used to observe the internal conditions of the chassis (1) during the test process.

5. The high temperature testing device for chip capacitors according to claim 2, characterized in that: The heat insulating part (3) is heat insulating ceramic.

6. The high temperature testing device for chip capacitors according to claim 2, characterized in that: The end of the guide tube (4) is provided with a heat insulating sealing sleeve (7), and the heat insulating sealing sleeve (7) is intended to reduce heat diffusion.

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