Desktop computer mainboard comprising QFN (Quad Flat No-lead) packaging storage chip

Abstract

The utility model belongs to the technical field of desktop computer mainboards, and discloses a desktop computer mainboard comprising a QFN (Quad Flat No-lead) packaging storage chip, which comprises a circuit board, a central processing unit, double slots, an IO (Input / Output) control chip and IO equipment, wherein the IO equipment is positioned on one side, adjacent to the slots, of the central processing unit and is used for executing an instruction of the central processing unit to control the desktop computer; the BIOS storage chip serves as the most basic input / output system of the desktop computer mainboard and is located on one side of the IO control chip; wherein the BIOS storage chip is a QFN (Quad Flat No-lead) packaged BIOS storage chip; according to the utility model, the data transmission between the BGA central processing unit and the double DDR5 UDIMM slots is more efficient and stable, and meanwhile, the BGA central processing unit has the beneficial effects of good heat dissipation effect, efficient and convenient assembly and the like.

Description

Technical Field

[0001] The utility model relates to the technical field of desktop mainboards, in particular to a desktop mainboard comprising a QFN packaged storage chip. Background Art

[0002] The motherboard, also called mainboard, systemboard, or motherboard, is one of the most basic and important components of a computer. The main circuit system and heat dissipation components (devices) that make up the computer are installed on the motherboard. The main circuit system generally includes BIOS chip, I / O control chip, keyboard and panel control switch interface, indicator light connector, expansion slot, DC power supply connector of the motherboard and plug-in card, etc.

[0003] With the rapid iteration of computer technology, people have put forward higher and higher requirements on the efficiency and stability of data transmission between BGA central processing unit and dual DDR5 UDIMM slots, that is, high efficiency and stability. However, the SOP packaged BIOS chips used in some motherboard structures in the existing technology can no longer meet this requirement. Therefore, it is urgent to design a BIOS chip on the motherboard that can meet this requirement. Utility Model Content

[0004] In view of this, the purpose of the utility model is to provide a desktop motherboard including a QFN packaged memory chip, aiming to make the data transmission between the BGA central processing unit and the dual DDR5 UDIMM slots more efficient and stable.

[0005] To achieve the above objectives, the utility model discloses a desktop motherboard including a QFN packaged memory chip, comprising:

[0006] A circuit board, serving as a circuit carrier for each electronic component of the desktop motherboard;

[0007] A central processing unit, located in the middle of the circuit board, serves as a computing and control module of the desktop computer;

[0008] Dual slots for inserting memory cards, located on one side of the CPU;

[0009] An IO control chip, located on a side of the CPU adjacent to the slot, for executing instructions of the CPU to control the IO devices of the desktop computer;

[0010] The BIOS storage chip, as the most basic input / output system of the desktop motherboard, is located on one side of the IO control chip;

[0011] Wherein, the BIOS storage chip is a QFN packaged BIOS storage chip.

[0012] The utility model is further configured to include: a plurality of tantalum capacitors, which are evenly distributed in a linear manner at intervals on a side of the central processing unit away from the dual slots.

[0013] The utility model is further configured to include: a heat sink and a bracket fastener, wherein the bracket fastener is symmetrically distributed on both sides of the central processing unit, a heat sink is snap-connected to the bracket fastener, and the heat sink abuts against the heat sink.

[0014] The utility model is further configured as follows: the bracket fastener is fixedly arranged on the circuit board by threaded connection.

[0015] The utility model is further configured to include a power supply interface, a PCIE interface and a data transmission interface.

[0016] The utility model is further configured as follows: the central processing unit is a BGA central processing unit.

[0017] The utility model is further configured as follows: the dual slots are dual DDR5 UDIMM slots.

[0018] The utility model is further configured to include an audio interface.

[0019] The utility model is further configured to include a hard disk interface.

[0020] The utility model is further configured as follows: the hard disk interface is an M.2 hard disk interface.

[0021] In summary, compared with the prior art, the utility model provides a desktop motherboard including a QFN packaged memory chip, which can make the data transmission between the BGA central processor and the dual DDR5 UDIMM slots more efficient and stable, and at the same time has the beneficial effects of good heat dissipation, efficient and convenient assembly, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 is a three-dimensional structural schematic diagram of a desktop motherboard including a QFN packaged memory chip provided in this embodiment;

[0024] Figure 2It is a rear view schematic diagram of a desktop motherboard including a QFN packaged memory chip provided in this embodiment.

[0025] Figure numerals: 1. circuit board; 2. central processing unit; 3. dual slots; 4. IO control chip; 5. BIOS storage chip; 6. tantalum capacitor; 7. heat sink; 8. bracket fastener; 9. power interface; 10. PCIE interface; 11. data transmission interface; 12. audio interface; 13. hard disk interface. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the utility model more clearly understood, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0027] In the description of the present invention, it should be noted that the terms "front", "rear", "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0028] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can also be the internal connection of two components, it can be a wireless connection, or it can be a wired connection. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0029] In addition, the technical features involved in the different embodiments of the utility model described above can be combined with each other as long as they do not conflict with each other.

[0030] A desktop motherboard including a QFN packaged memory chip, such as Figure 1 and Figure 2 As shown, including:

[0031] Circuit board 1, serving as a circuit carrier for various electronic components of the desktop motherboard;

[0032] The central processing unit 2 is located in the middle of the circuit board 1 and serves as the computing and control module of the desktop computer;

[0033] In this embodiment, the CPU 2 is a BGA CPU 2 .

[0034] Dual slots 3 for inserting memory cards, located on one side of the CPU 2;

[0035] In this embodiment, the dual slots 3 are dual DDR5 UDIMM slots.

[0036] It should be noted that UDIMM, the full name of which is Unbuffered DIMM, means that the address and control signals directly reach the DRAM chip on the DIMM without passing through a buffer or making any timing adjustments. Since UDIMM does not have any cache between the CPU and the memory, the latency is smaller at the same frequency.

[0037] It should be further explained that, in some embodiments, the size specifications and the limiting method of the dual slots 3 can be selectively set according to actual conditions and are not specifically limited here.

[0038] The IO control chip 4 is located on one side of the slot adjacent to the CPU 2 and is used to execute instructions from the CPU 2 to control the IO devices of the desktop computer;

[0039] The BIOS storage chip 5, as the most basic input / output system of the desktop motherboard, is located on one side of the IO control chip 4;

[0040] The BIOS storage chip 5 is a QFN packaged BIOS storage chip.

[0041] It should be noted that compared with the SOP packaged chip used in the traditional motherboard structure, the QFN packaged BIOS storage chip used in this motherboard structure has the physical advantages of small size, light weight and large storage capacity, and has the quality advantages of strong heat dissipation, good electrical performance and high reliability, which can make the data transmission between the BGA central processor and the dual DDR5 UDIMM slots more efficient and stable.

[0042] Furthermore, the present embodiment further includes a plurality of tantalum capacitors 6 , which are evenly distributed in a linear manner at intervals on a side of the CPU 2 away from the dual sockets 3 .

[0043] It should be noted that compared with the aluminum electrolytic capacitors used on traditional motherboards, the tantalum capacitor 6 on this motherboard structure has the advantages of high energy density, high reliability, high stability of electrical properties and a wider operating temperature range, which can make the data transmission and line current between the BGA central processor and the dual DDR5 UDIMM slots more stable.

[0044] Furthermore, the present embodiment also includes a heat sink 7 and a bracket fastener 8, the bracket fastener 8 is symmetrically distributed on both sides of the central processing unit 2, a heat sink (not shown) is snap-connected to the bracket fastener 8, and the heat sink 7 is in contact with the heat sink; the heat sink 7 efficiently concentrates most of the heat generated by the electronic components of the mainboard during operation, and then quickly dissipates the heat to the outside through the heat sink.

[0045] It should be noted that compared with the traditional motherboard structure that directly fixes the radiator on the circuit board 1 with screws, the present motherboard structure, through the setting of a pair of bracket fasteners 8 on both sides of the central processing unit 2, and then by connecting the radiator to the bracket fasteners 8, can achieve rapid installation or disassembly of the radiator, which is beneficial for the staff to efficiently assemble or repair the motherboard. At the same time, since the bracket fasteners 8 can support larger radiators, the overall heat dissipation effect of the motherboard can be effectively improved.

[0046] In this embodiment, the bracket fastener 8 is fixed on the circuit board 1 by threaded connection.

[0047] It should be noted that, in some embodiments, the connection and fixing method between the bracket fastener 8 and the circuit board 1 can also be selectively set according to actual needs, and is not limited to the threaded connection method, and is not specifically limited here.

[0048] Furthermore, this embodiment also includes a power interface 9 , a PCIE interface 10 , a data transmission interface 11 , an audio interface 12 and a hard disk interface 13 .

[0049] It should be noted that, in the specific implementation process, the power interface 9 is used to electrically connect to an external power source, the data transmission interface 11 is used to transmit data to an external electronic device, the audio interface 12 is used to connect to an audio device, and the hard disk interface 13 is used to connect to a hard disk; wherein, the full name of PCIE is Peripheral Component Interconnect Express, which is a high-speed serial computer expansion bus standard. PCIE belongs to high-speed serial point-to-point dual-channel high-bandwidth transmission, and the connected devices are allocated exclusive channel bandwidth and do not share bus bandwidth. It mainly supports active power management, error reporting, end-to-end reliability transmission, hot plugging, and quality of service functions.

[0050] In this embodiment, the hard disk interface 13 is an M.2 hard disk interface.

[0051] It should be noted that, in some embodiments, the model of the hard disk interface 13 can also be selectively set according to actual needs, and is not specifically limited here.

[0052] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. A desktop motherboard comprising a QFN packaged memory chip, characterized in that: include: A circuit board (1) serving as a circuit carrier for each electronic component of the desktop motherboard; A central processing unit (2), located in the middle of the circuit board (1), serving as a computing and control module of the desktop computer; A dual slot (3) for inserting a memory card, located on one side of the central processing unit (2); An IO control chip (4), located on a side of the central processing unit (2) adjacent to the slot, and used for executing instructions of the central processing unit (2) to control the IO device of the desktop computer; A BIOS storage chip (5), as the most basic input / output system of the desktop motherboard, is located on one side of the IO control chip (4); Wherein, the BIOS storage chip (5) is a QFN packaged BIOS storage chip.

2. The desktop motherboard comprising a QFN packaged memory chip as claimed in claim 1, characterized in that: It also includes a plurality of tantalum capacitors (6), which are evenly distributed in a linear manner at intervals on a side of the central processing unit (2) away from the dual slots (3).

3. The desktop motherboard comprising a QFN packaged memory chip as claimed in claim 1 or 2, characterized in that: It also comprises a heat sink (7) and a bracket fastener (8), wherein the bracket fastener (8) is symmetrically distributed on both sides of the central processing unit (2), a heat sink is snap-connected to the bracket fastener (8), and the heat sink (7) abuts against the heat sink.

4. The desktop motherboard comprising a QFN packaged memory chip as claimed in claim 3, characterized in that: The bracket fastener (8) is fixedly arranged on the circuit board (1) by means of a threaded connection.

5. The desktop motherboard comprising a QFN packaged memory chip as claimed in claim 1 or 4, characterized in that: It also includes a power supply interface (9), a PCIE interface (10) and a data transmission interface (11).

6. The desktop motherboard comprising a QFN packaged memory chip as claimed in claim 1, characterized in that: The central processing unit (2) is a BGA central processing unit.

7. The desktop motherboard comprising a QFN packaged memory chip as claimed in claim 1, characterized in that: The dual slots (3) are dual DDR5 UDIMM slots.

8. The desktop motherboard comprising a QFN packaged memory chip as claimed in claim 5, characterized in that: An audio interface (12) is also included.

9. The desktop motherboard comprising a QFN packaged memory chip as claimed in any one of claims 6 to 8, characterized in that: It also includes a hard disk interface (13).

10. The desktop motherboard comprising a QFN packaged memory chip as claimed in claim 9, characterized in that: The hard disk interface (13) is an M.2 hard disk interface.

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