Heat dissipation structure and electronic equipment
By setting up interlaced heat dissipation fins and through holes of different lengths in the heat dissipation structure of electronic devices, the airflow impedance problem caused by dense fins is solved, and more efficient heat dissipation and protection effects are achieved, reducing costs.
Patent Information
- Application Number
- CN202420255263.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-01
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-02-01
AI Technical Summary
The heat dissipation structure of existing electronic equipment increases the airflow impedance due to the dense heat dissipation fin design, which affects the heat dissipation effect. At the same time, the protection function is required to avoid the entry of external impurities, which is difficult to take into account both.
Design a heat dissipation structure, by setting first and second heat dissipation fins of different lengths in the carrier frame and arranged in an interlaced manner in the second direction, the heat dissipation through holes is formed to reduce the airflow impedance while ensuring the protection effect, using copper or Aluminum materials improve thermal conductivity.
It achieves improving heat dissipation efficiency, reducing airflow impedance, improving air volume and heat dissipation efficiency while ensuring protective effects, while reducing structural weight and reducing costs.
Smart Images
Figure CN222232964U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and electronic equipment. Background Art
[0002] In the heat dissipation structure of electronic equipment (for example, laptop computers), heat is usually dissipated through a fan heat dissipation module. Specifically, heat is first conducted by a copper sheet, then transferred to the heat dissipation structure by a heat pipe, and finally the fan blows the airflow to the heat dissipation structure and then flows out of the electronic equipment, thereby taking away the heat inside the electronic equipment, thereby achieving heat dissipation. In the existing heat dissipation structure, a plurality of heat dissipation fins are arranged at intervals in a frame, and the upper and lower ends of the heat dissipation fins are respectively connected to the upper and lower frames of the frame. The heat dissipation fins have good thermal conductivity to facilitate rapid heat dissipation. However, since the heat dissipation structure is connected to the inside and outside of the electronic equipment, the heat dissipation structure also needs to have a protective function to prevent external particles or impurities from entering the electronic equipment through the heat dissipation structure and damaging the electronic components inside the electronic equipment. Therefore, the heat dissipation fins in the heat dissipation structure are usually designed to be very dense. This dense structure increases the impedance of the airflow and affects the heat dissipation effect of the fan. Utility Model Content
[0003] The present disclosure provides a heat dissipation structure and an electronic device to at least solve the above-mentioned problems in the prior art.
[0004] To achieve the above objectives, the present disclosure provides the following technical solutions: a heat dissipation structure, comprising:
[0005] A carrier frame, having a heat dissipation through hole formed therein, wherein the heat dissipation through hole penetrates the carrier frame along a first direction;
[0006] A plurality of first heat dissipation fins, wherein the plurality of first heat dissipation fins are arranged at intervals along the second direction, and both ends of each first heat dissipation fin in the third direction are connected to the carrier;
[0007] A plurality of second heat dissipating fins are arranged at intervals along the second direction, each of the second heat dissipating fins is arranged between two adjacent first heat dissipating fins, and one end of each of the second heat dissipating fins in the third direction is connected to the hole wall of the heat dissipating through hole, the length of the first heat dissipating fin in the third direction is greater than the length of the second heat dissipating fin in the third direction, and the first direction, the second direction and the third direction are perpendicular to each other.
[0008] In one embodiment, the carrier comprises:
[0009] The first side plate and the second side plate are arranged at intervals along the second direction;
[0010] The third side plate and the fourth side plate are spaced apart along the third direction, the third side plate is connected to the first side plate and the second side plate on two opposite sides in the second direction, and the fourth side plate is connected to the first side plate and the second side plate on two opposite sides in the second direction; wherein,
[0011] The first side plate, the second side plate, the third side plate and the fourth side plate are surrounded by the heat dissipation through holes.
[0012] In one possible implementation manner, a portion of the plurality of second heat dissipating fins is connected to the third side plate at one end in the third direction, and another portion of the plurality of second heat dissipating fins is connected to the fourth side plate at one end in the third direction.
[0013] In one possible implementation manner, a first through hole is formed on the first heat dissipation fin, and the first through hole penetrates the first heat dissipation fin along the second direction.
[0014] In one possible implementation manner, a second through hole is provided on the second heat dissipation fin, and the second through hole penetrates the second heat dissipation fin along the second direction.
[0015] In one embodiment, the first through hole and the second through hole are coaxially arranged.
[0016] In one possible implementation, the number of the first through holes and the number of the second through holes are plural.
[0017] In one possible implementation manner, the first heat dissipation fins, the second heat dissipation fins, and the third heat dissipation fins are made of copper or aluminum.
[0018] In one possible implementation manner, the material of the first heat dissipation fin and the second heat dissipation fin is a combination of aluminum and copper.
[0019] The present disclosure also provides an electronic device, which includes the above-mentioned heat dissipation structure.
[0020] In the above-mentioned heat dissipation structure, by arranging the first heat dissipation fins and the second heat dissipation fins of different lengths in the carrier frame, and arranging the first heat dissipation fins and the second heat dissipation fins alternately along the second direction, the first heat dissipation fins and the second heat dissipation fins can ensure the arrangement density, so that the heat dissipation structure has a good protection effect. At the same time, the heat dissipation space of the heat dissipation through hole is increased to reduce the impedance of the airflow, increase the air volume and increase the heat dissipation efficiency, thereby achieving the heat dissipation structure while ensuring the protection effect. Improve the heat dissipation effect.
[0021] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:
[0023] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.
[0024] Figure 1 A schematic structural diagram of the heat dissipation structure of an embodiment of the present disclosure is shown;
[0025] Figure 2 Shows Figure 1 Structural schematic diagram of the middle load-bearing frame;
[0026] Figure 3 Shows Figure 1 A schematic diagram of the structure of the first heat dissipation fin;
[0027] Figure 4 Shows Figure 1 Schematic diagram of the structure of the second heat sink fin.
[0028] Description of the numbers in the figure:
[0029] In the figure: 11, supporting frame, 111, first side plate, 112, second side plate, 113, third side plate, 114, fourth side plate, 115, heat dissipation through hole, 12, first heat dissipation fin, 121, first through hole, 13, second heat dissipation fin, 131, second through hole. DETAILED DESCRIPTION
[0030] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.
[0031] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of this disclosure can be achieved, and this document is not limited here.
[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0033] For ease of explanation, Figure 1 A three-dimensional rectangular coordinate system is added, wherein the direction of the X-axis is the first direction, i.e., the direction in which the heat dissipation through hole 115 penetrates the carrier frame 11; the direction of the Y-axis is the second direction, i.e., the setting direction of the first side plate 111 and the second side plate 112; the direction of the Z-axis is the third direction, i.e., the setting direction of the third side plate 113 and the fourth side plate 114; and the first direction, the second direction and the third direction are perpendicular to each other.
[0034] Please also read Figure 1 The present embodiment provides a heat dissipation structure, which includes a carrier frame 11, a plurality of first heat dissipation fins 12 and a plurality of second heat dissipation fins 13. A heat dissipation through hole 115 is formed inside the carrier frame 11, and the heat dissipation through hole 115 penetrates the carrier frame 11 along the first direction. The plurality of first heat dissipation fins 12 are arranged at intervals along the second direction, and both ends of each first heat dissipation fin 12 in the third direction are connected to the carrier frame 11. The plurality of second heat dissipation fins 13 are arranged at intervals along the second direction, and each second heat dissipation fin 13 is arranged between two adjacent first heat dissipation fins 12, and one end of each second heat dissipation fin 13 in the third direction is connected to the hole wall of the heat dissipation through hole 115, and the length of the first heat dissipation fin 12 in the third direction is greater than the length of the second heat dissipation fin 13 in the third direction.
[0035] In the above-mentioned heat dissipation structure, by arranging the first heat dissipation fins 12 and the second heat dissipation fins 13 of different lengths in the carrier frame 11, and arranging the first heat dissipation fins 12 and the second heat dissipation fins 13 alternately along the second direction, the first heat dissipation fins 12 and the second heat dissipation fins 13 can ensure the arrangement density, so that the heat dissipation structure has a good protection effect. At the same time, the heat dissipation space of the heat dissipation through hole 115 is increased to reduce the impedance of the airflow, increase the air volume and increase the heat dissipation efficiency, thereby achieving the heat dissipation effect of the heat dissipation structure while ensuring the protection effect; and by setting the first heat dissipation fins 12 and the second heat dissipation fins 13 to different lengths, the overall weight of the heat dissipation structure can be reduced, and less material is used, thereby reducing costs.
[0036] In this embodiment, the plurality of first heat dissipation fins 12 and the plurality of heat dissipation fins may be arranged at equal intervals or at unequal intervals.
[0037] See also Figure 2 In some embodiments, the carrier frame 11 includes a first side plate 111, a second side plate 112, a third side plate 113 and a fourth side plate 114, the first side plate 111 and the second side plate 112 are spaced apart along the second direction, the third side plate 113 and the fourth side plate 114 are spaced apart along the third direction, the third side plate 113 is connected to the first side plate 111 and the second side plate 112 on opposite sides in the second direction, and the fourth side plate 114 is connected to the first side plate 111 and the second side plate 112 on opposite sides in the second direction, the first side plate 111, the second side plate 112, the third side plate 113 and the fourth side plate 114 are surrounded by heat dissipation holes 115, and the structure of the formed heat dissipation holes 115 is a rectangular structure, and the shape of the rectangular heat dissipation holes 115 is more regular, so as to stably install the first heat dissipation fins 12 and the second heat dissipation fins 13, thereby improving the heat dissipation effect.
[0038] See also Figure 1 In some embodiments, a portion of the plurality of second heat dissipating fins 13 is connected to the third side plate 113 at one end in the third direction, a portion of the plurality of second heat dissipating fins 13 is spaced from the fourth side plate 114 at the other end in the third direction, another portion of the plurality of second heat dissipating fins 13 is connected to the fourth side plate 114 at one end in the third direction, and another portion of the plurality of second heat dissipating fins 13 is spaced from the third side plate 113 at the other end in the third direction; specifically, any two adjacent second heat dissipating fins 13 form a group, one second heat dissipating fin 13 in each group is connected to the third side plate 113, and another second heat dissipating fin 13 in each group is connected to the fourth side plate 114, so that the plurality of second heat dissipating fins 13 arranged at intervals along the second direction can be staggered in the third direction, so that the gaps formed between the plurality of second heat dissipating fins 13 and the carrier 11 can also be staggered in the third direction, so that the arrangement of the plurality of second heat dissipating fins 13 in the heat dissipating through-hole 115 is more balanced, thereby improving the protection effect of the heat dissipation structure on the electronic components inside the electronic device, and making the heat dissipation structure more beautiful.
[0039] See also Figure 3 In some embodiments, a first through hole 121 is formed on the first heat dissipation fin 12, and the first through hole 121 penetrates the first heat dissipation fin 12 along the second direction; see Figure 4 The second heat dissipating fin 13 is provided with a second through hole 131, and the second through hole 131 penetrates the second heat dissipating fin 13 along the second direction; the first through hole 121 and the second through hole 131 are coaxially arranged, and the number of the first through hole 121 and the number of the second through hole 131 are multiple.
[0040] In this way, a plurality of first heat dissipation fins 12 and a plurality of heat dissipation fins are arranged at intervals in the second direction to form a plurality of gaps. By opening a first through hole 121 in each first heat dissipation fin 12 and setting a second through hole 131 on each second heat dissipation fin 13, the plurality of gaps can be connected along the second direction, so that when the heat dissipation airflow blown by the external fan enters the plurality of gaps formed in the heat dissipation through hole 115 along the first direction, it can also flow along the first through hole 121 and the second through hole 131, so that the heat dissipation air can be evenly dispersed in the heat dissipation through hole 115, so as to avoid excessive noise due to too rapid local airflow in the heat dissipation through hole 115, and to avoid too slow airflow at other positions of the heat dissipation through hole 115 to affect the heat dissipation efficiency.
[0041] In this embodiment, the diameter of the first through hole 121 is 3-5 mm, and the diameter of the second through hole 131 is 3-5 mm. Specifically, the first through hole 121 and the second through hole 131 are both 3 mm in diameter.
[0042] In some embodiments, the material of the first heat dissipating fin 12, the second heat dissipating fin 13 and the third heat dissipating fin is copper or aluminum, or the material of the first heat dissipating fin 12 and the second heat dissipating fin 13 is a combination of aluminum and copper. By adopting copper, aluminum or a combination of copper and aluminum with a higher thermal conductivity, the heat dissipation effect of the first heat dissipating fin 12 and the second heat dissipating fin 13 is better.
[0043] The present disclosure also provides an electronic device, which includes the above-mentioned heat dissipation structure; illustratively, the electronic device can be a laptop computer. Specifically, the heat dissipation structure is arranged on the shell of the laptop and connects the inside and outside of the shell so that the heat generated by the electronic components inside the shell can be quickly dissipated through the heat dissipation structure.
[0044] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.
Claims
1. A heat dissipation structure, characterized in that: include: A carrier frame, having a heat dissipation through hole formed therein, the heat dissipation through hole penetrating the carrier frame along a first direction; A plurality of first heat dissipation fins, wherein the plurality of first heat dissipation fins are arranged at intervals along the second direction, and both ends of each first heat dissipation fin in the third direction are connected to the support frame; A plurality of second heat dissipation fins, wherein the plurality of second heat dissipation fins are arranged at intervals along the second direction, each of the second heat dissipation fins is arranged between two adjacent first heat dissipation fins, and one end of each of the second heat dissipation fins in the third direction is connected to the hole wall of the heat dissipation through hole; wherein, The length of the first heat dissipation fin in the third direction is greater than the length of the second heat dissipation fin in the third direction, and the first direction, the second direction and the third direction are perpendicular to each other.
2. The heat dissipation structure according to claim 1, characterized in that: The carrier frame comprises: The first side plate and the second side plate are arranged at intervals along the second direction; The third side plate and the fourth side plate are spaced apart along the third direction, the third side plate is connected to the first side plate and the second side plate on two opposite sides in the second direction, and the fourth side plate is connected to the first side plate and the second side plate on two opposite sides in the second direction; wherein, The first side plate, the second side plate, the third side plate and the fourth side plate are surrounded by the heat dissipation through holes.
3. The heat dissipation structure according to claim 2, characterized in that: A portion of the plurality of second heat dissipating fins is connected to the third side plate at one end in the third direction, and another portion of the plurality of second heat dissipating fins is connected to the fourth side plate at one end in the third direction.
4. The heat dissipation structure according to claim 2, characterized in that: The first heat dissipation fin is provided with a first through hole, and the first through hole penetrates the first heat dissipation fin along the second direction.
5. The heat dissipation structure according to claim 4, characterized in that: The second heat dissipation fin is provided with a second through hole, and the second through hole penetrates the second heat dissipation fin along the second direction.
6. The heat dissipation structure according to claim 5, characterized in that: The first through hole and the second through hole are coaxially arranged.
7. The heat dissipation structure according to claim 5, characterized in that: The number of the first through holes and the number of the second through holes are plural.
8. The heat dissipation structure according to claim 5, characterized in that: The first heat dissipation fins, the second heat dissipation fins and the third heat dissipation fins are made of copper or aluminum.
9. The heat dissipation structure according to claim 1, characterized in that: The first heat dissipation fin and the second heat dissipation fin are made of aluminum-copper combination.
10. An electronic device, characterized in that: It comprises the heat dissipation structure as described in any one of claims 1 to 9.