Intelligent efficient cooling mainframe box

Abstract

The utility model discloses an intelligent efficient cooling mainframe box which comprises a case body, the case body comprises side plates symmetrically arranged on the two long edges of the case body, a filling cavity is formed in at least one side plate, the filling cavity is filled with a phase-change material filling layer, and phase-change materials are arranged in the side plates of the case body to absorb heat, so that the cooling efficiency is improved. The heat pipe heat absorption end of the heat pipe absorbs heat generated by a computer heating element and rapidly transmits the heat to the heat pipe heat dissipation end of the heat pipe, and the phase change material filling layer wrapping the outer side of the heat pipe heat dissipation end can be changed into a liquid state from a solid state after absorbing the heat, so that the heat pipe is rapidly absorbed and cooled, and the effect of efficiently cooling the internal temperature of the mainframe box is achieved; the phase-change material filling layer can achieve active heat dissipation, namely, the heat dissipation effect is automatically adjusted according to the change of the environment temperature and the equipment load, heat is absorbed when the temperature in the case is high, heat can be dissipated when the temperature drops, and compared with a traditional heat dissipation mode, the phase-change material can absorb and release heat more efficiently, and a better heat dissipation effect is provided.

Description

Technical Field

[0001] The utility model relates to the technical field of mainframe boxes, in particular to an intelligent and efficient cooling mainframe box. Background Art

[0002] With the rapid development of computer technology, the performance of computer hardware is increasing, but with it comes the problem of high heat generation. As a protective carrier for computer hardware, the heat dissipation performance of the host case directly affects the stability and service life of the computer. Traditional heat dissipation methods often rely on setting fans or water tanks in the case for heat dissipation, which requires a large space inside the case. The case itself does not have heat dissipation capacity, which will cause certain obstacles to heat dissipation. To this end, we propose an intelligent and efficient cooling host case. Utility Model Content

[0003] The technical problem to be solved by the utility model is to overcome the existing defects and provide an intelligent and efficient cooling main chassis. The phase change material filling layer can change from solid to liquid after absorbing heat, thereby absorbing heat quickly and cooling the heat pipe to achieve the effect of efficiently cooling the internal temperature of the main chassis, which can effectively solve the problems in the background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an intelligent and efficient cooling main chassis, including a chassis, the chassis including side panels symmetrically arranged on its two long sides, at least one side panel having a filling cavity opened inside, the filling cavity being filled with a phase change material filling layer, and a heat pipe being arranged in the filling cavity, the heat pipe including a heat pipe heat absorption end and a heat pipe heat dissipation end, the heat pipe heat dissipation end being arranged in the filling cavity, the phase change material filling layer being coated on the outside of the heat pipe heat dissipation end, the heat pipe heat absorption end passing through the outside of the filling cavity and being connected to the heating element in the chassis; a heat conducting plate is arranged on the outer surface of the side panel, the inner side of the heat conducting plate is in contact with the phase change material filling layer in the filling cavity, and a plurality of heat sinks are evenly arranged on the outer side of the heat conducting plate.

[0005] As a preferred technical solution of the utility model, a decorative panel is provided on the outer surface of the side panel, and the decorative panel is provided on the outer side of the heat sink.

[0006] As a preferred technical solution of the utility model, a plurality of cooling fans are evenly installed on the inner side of the decorative plate, and cooling holes are opened on the side surface of the decorative plate where the cooling fans are installed.

[0007] As a preferred technical solution of the utility model, a temperature sensor is installed in the filling cavity.

[0008] As a preferred technical solution of the utility model, the cross-sectional shape of the heat dissipation end of the heat pipe is an oblate shape.

[0009] Compared with the prior art, the beneficial effects of the utility model are as follows: by arranging phase change materials in the side panels of the chassis to absorb heat, the heat pipe heat absorbing end of the heat pipe absorbs the heat generated by the computer heating element and quickly transfers it to its heat pipe heat dissipation end, and the phase change material filling layer coated on the outside of the heat pipe heat dissipation end can change from solid to liquid after absorbing heat, thereby absorbing and quickly absorbing heat, cooling the heat pipe, and achieving the effect of efficiently cooling the internal temperature of the main chassis. In addition, the phase change material filling layer can achieve active heat dissipation, that is, automatically adjust the heat dissipation effect according to the changes in ambient temperature and equipment load, absorb heat when the temperature in the chassis is high, and dissipate heat when the temperature drops. Compared with traditional heat dissipation methods, phase change materials can absorb and release heat more efficiently and provide better heat dissipation effects. And the heat dissipation method of phase change materials can reduce the noise and power consumption of equipment, and improve the reliability and life of equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a structural schematic diagram of the utility model;

[0011] Figure 2 It is a structural schematic diagram of the side panel of the utility model;

[0012] Figure 3 This is a schematic diagram of the internal structure of the side panel of the utility model;

[0013] Figure 4 This is a schematic diagram of the structure of the side panel of the utility model after being filled with a phase change material filling layer.

[0014] In the figure: 1 chassis, 2 side panel, 3 heat conduction plate, 4 heat sink, 5 decorative panel, 6 heat dissipation hole, 7 filling cavity, 8 heat pipe, 81 heat pipe heat absorption end, 82 heat pipe heat dissipation end, 9 temperature sensor, 10 phase change material filling layer, 11 bolts, 12 support legs. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0016] See also Figure 1-4The utility model provides a technical solution: an intelligent and efficient cooling main chassis, including a chassis 1, wherein the chassis 1 includes side panels 2 symmetrically arranged on its two long sides, wherein a filling cavity 7 is opened inside one or both of the side panels 2, and the filling cavity 7 can be set in one or both of the side panels 2 according to the size of the chassis 1 and the heat dissipation requirements. The filling cavity 7 is filled with a phase change material filling layer 10, which can be a phase change material commonly used in the prior art, such as paraffin. A heat pipe 8 is arranged in the filling cavity 7, and the heat pipe 8 includes a heat pipe heat absorption end 81 and a heat pipe heat dissipation end 82. The heat pipe heat dissipation end 82 is arranged in the filling cavity 7, and the phase change material filling layer 10 is coated on the outside of the heat pipe heat dissipation end 82. The heat pipe heat absorption end 81 passes through the outside of the filling cavity 7 and is connected to the heating element in the chassis 1. The heat pipe heat absorption end 81 of the heat pipe 8 absorbs the heat generated by the computer heating element and quickly transfers it to its heat pipe heat dissipation end 82. The phase change material filling layer 10 coated on the outside of the heat pipe heat dissipation end 82 can change from solid to liquid after absorbing heat, thereby absorbing rapid heat absorption and cooling the heat pipe 8, thereby achieving the effect of efficiently cooling the internal temperature of the main chassis 1.

[0017] The phase change material filling layer 10 can achieve active heat dissipation, that is, automatically adjust the heat dissipation effect according to the changes in ambient temperature and equipment load, absorb heat when the temperature in the chassis is high, and dissipate heat when the temperature drops. Compared with traditional heat dissipation methods, phase change materials can absorb and release heat more efficiently, provide better heat dissipation effects, and the heat dissipation method of phase change materials can reduce the noise and power consumption of equipment, improve the reliability and life of equipment, and at the same time, phase change materials also have good environmental performance and will not produce harmful substances.

[0018] Preferably, a heat conducting plate 3 made of aluminum alloy is provided on the outer surface of the side panel 2, and the inner side of the heat conducting plate 3 is in contact with the phase change material filling layer 10 in the filling cavity 7, that is, the heat conducting plate 3 is used to close the filling cavity 7, and a plurality of heat sinks 4 made of aluminum alloy are evenly arranged on the outer side of the heat conducting plate 3. The heat absorbed by the phase change material filling layer 10 can be discharged to the outside through the heat conducting plate 3 and the heat sink 4, thereby cooling it to ensure long-term operation of the main chassis.

[0019] A further preferred technical solution is that a C-shaped decorative panel 5 is provided on the outer surface of the side panel 2. The decorative panel 5 is provided on the outer side of the heat sink 4 to cover the heat sink, mainly for decoration. The front and rear sides of the decorative panel 5 are connected to facilitate natural wind to take away the heat from the heat sink 4 from the front and rear sides.

[0020] Furthermore, a number of cooling fans are evenly installed on the inner side of the decorative panel 5, and cooling holes 6 are opened on the side surfaces of the decorative panel 5 where the cooling fans are installed. The heat on the heat sink 4 can be quickly discharged to the outside through the cooling holes 6 through the cooling fans, further improving the active cooling effect of the main chassis body.

[0021] Furthermore, a temperature sensor 9 is installed in the filling cavity 7, and the temperature sensor 9 is electrically connected to the processor in the host. The processor can be a host processor of a computer, or a separate single-chip microcomputer can be used to separately control the temperature sensor 9 and the cooling fan. The temperature sensor 9 is used to detect the temperature of the phase change material filling layer 10, and automatically turn on the cooling fan and intelligently control its rotation speed according to the detected temperature value through a preset program in the processor, thereby realizing intelligent and efficient cooling.

[0022] The temperature sensor 9, single chip microcomputer and cooling fan used in this application are all commonly used electronic components in the prior art. Their specific structures, working principles, circuit connections and control methods are all well-known technologies and will not be described in detail here.

[0023] According to a preferred technical solution, the cross-sectional shape of the heat pipe heat dissipation end 82 is an oblate circle, which can increase the contact area with the phase change material, thereby further improving the heat dissipation efficiency; the shape of the heat pipe heat absorption end 81 is adapted to the shape of the heating element in the chassis 1, and the gap between it and the heating surface such as the processor is reduced by filling thermal grease to accelerate heat conduction.

[0024] Optionally, screw holes are provided at the four corners of the lower surface of the base plate of the chassis 1, and bolts 11 are threadedly connected to the screw holes. A circular support foot 12 is fixedly provided at the bottom end of the bolt 11 to raise the height of the chassis 1 to prevent moisture and at the same time increase its contact area with the air for easier heat dissipation. The support feet 12 are screwed into the base plate of the chassis 1 through the bolts 11, and the height of each support foot 12 can be flexibly adjusted to make the chassis more balanced.

[0025] Further optionally, the outer surface of the support foot 12 is evenly provided with anti-slip grooves to facilitate manual rotation of the support foot 12 and the bolt 11, etc., making adjustment more convenient.

[0026] The undisclosed parts in the present utility model are all prior art, and their specific structures, materials and working principles are not described in detail. Although the embodiments of the present utility model have been shown and described, it is understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present utility model, and the scope of the present utility model is defined by the attached claims and their equivalents.

Claims

1. An intelligent and efficient cooling main chassis, comprising a chassis (1), characterized in that: The chassis (1) comprises side panels (2) symmetrically arranged on two long sides thereof, at least one side panel (2) is provided with a filling cavity (7) inside, the filling cavity (7) is filled with a phase change material filling layer (10), and a heat pipe (8) is arranged in the filling cavity (7), the heat pipe (8) comprises a heat pipe heat absorbing end (81) and a heat pipe heat dissipating end (82), the heat pipe heat dissipating end (82) is arranged in the filling cavity (7), the phase change material filling layer (10) is coated on the outside of the heat pipe heat dissipating end (82), the heat pipe heat absorbing end (81) passes through the outside of the filling cavity (7) and is connected to a heating element in the chassis (1); a heat conducting plate (3) is arranged on the outer surface of the side panel (2), the inner side of the heat conducting plate (3) is in contact with the phase change material filling layer (10) in the filling cavity (7), and a plurality of heat sinks (4) are evenly arranged on the outer side of the heat conducting plate (3).

2. The intelligent and efficient cooling mainframe box according to claim 1, characterized in that: The outer surface of the side plate (2) is provided with a decorative plate (5), and the decorative plate (5) is arranged on the outer side of the heat sink (4).

3. The intelligent and efficient cooling mainframe box according to claim 2, characterized in that: A plurality of cooling fans are evenly installed on the inner side of the decorative plate (5), and cooling holes (6) are provided on the side surfaces of the decorative plate (5) where the cooling fans are installed.

4. An intelligent and efficient cooling mainframe box according to claim 2 or 3, characterized in that: A temperature sensor (9) is installed in the filling cavity (7).

5. The intelligent and efficient cooling mainframe box according to claim 1, characterized in that: The cross-sectional shape of the heat pipe heat dissipation end (82) is an oblate circle.

6. The intelligent and efficient cooling mainframe box according to claim 1, characterized in that: Screw holes are provided at the four corners of the bottom surface of the chassis (1), bolts (11) are threadedly connected in the screw holes, and circular supporting feet (12) are fixedly provided at the bottom ends of the bolts (11).

7. The intelligent and efficient cooling mainframe box according to claim 6, characterized in that: The outer surfaces of the supporting feet (12) are evenly provided with anti-slip patterns.

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