Chip packaging structure with high thermal conductivity

Abstract

The utility model discloses a chip packaging structure with high thermal conductivity performance, comprising a main body assembly which comprises a substrate; the heat conduction assembly comprises limiting frames fixed to the upper surfaces of the four corners of the base plate, movable grooves formed in the limiting frames on one side, moving grooves formed in the limiting frames on the other side, movable blocks slidably connected to the interiors of the movable grooves and limiting plates fixed to the outer surfaces of the movable blocks. And the guide assembly comprises a guide pipe fixed to the upper surface of the limiting frame, movable frames are fixed to the outer surfaces of the two sides of the limiting plate, and one side of each movable frame is slidably connected to the interior of the corresponding movable groove. The utility model aims to solve the problems that when an existing chip is subjected to heat conduction treatment, heat is transmitted to a heat dissipation metal shell by adopting a heat conduction plate, but the existing heat conduction plate is fixed on a substrate by adopting an adhesive mode, and in the mode, when the heat conduction plate needs to be replaced, the damage surface of the interior of the chip is large, and the heat dissipation effect is poor. Therefore, parts in the chip cannot be reused.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging structures, in particular to a chip packaging structure with high thermal conductivity. Background Art

[0002] A chip packaging structure with high thermal conductivity is a packaging solution designed for chip heat dissipation needs. Its main function is to effectively conduct and dissipate the heat generated by the chip to keep the chip within the normal operating temperature range and improve the performance and stability of electronic products.

[0003] However, it still has the following disadvantages in actual use:

[0004] When the existing chip is subjected to heat conduction treatment, the heat is transferred to the heat dissipation metal shell by using a heat conduction plate. However, the existing heat conduction plate is fixed on the substrate by adhesive. This method causes large damage to the inside of the chip when the heat conduction plate needs to be replaced, so the parts inside the chip cannot be reused. Summary of the invention

[0005] The utility model aims to provide a chip packaging structure with high thermal conductivity to solve the problem raised in the above background technology that, when the existing chip is subjected to heat conduction treatment, heat is transferred to the heat dissipation metal shell by using a heat conduction plate, but the existing heat conduction plate is fixed on the substrate by means of adhesive. When the heat conduction plate needs to be replaced, this method causes a large damage to the inside of the chip, so that the parts inside the chip cannot be reused.

[0006] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0007] The utility model is a chip packaging structure with high thermal conductivity, comprising:

[0008] A main body component, the main body component comprising a base plate;

[0009] The heat conduction assembly includes a limit frame fixed on the upper surface of the four corners of the base plate, a movable groove opened inside the limit frame on one side, a movable groove opened inside the limit frame on the other side, a movable block slidably connected to the movable groove, and a limit plate fixed on the outer surface of the movable block;

[0010] A guide assembly comprises a guide tube fixed on the upper surface of the limiting frame.

[0011] Furthermore, movable frames are fixed to the outer surfaces of both sides of the limiting plate, and one side of the movable frame is slidably connected to the inside of the movable groove.

[0012] Furthermore, a fixing column is fixed on the middle surface of both ends of the base plate, a pressing plate is movably connected inside the top of the fixing column, and a connecting plate is fixed on the outer surface of the top of the fixing column.

[0013] Furthermore, a silicone pad is fixed inside the top end of the guide tube, and connection holes are arranged in a circle inside the silicone pad.

[0014] Furthermore, a connecting column is movably connected to the middle of the silicone pad, and a connecting ball is fixed to the lower surface of the connecting column.

[0015] Furthermore, a heat conducting plate is fixed on the upper surface of the limiting plate;

[0016] Wherein, the upper surface of the heat conducting plate is in contact with the pressing plate.

[0017] Furthermore, a bottom plate is fixed on the lower surface of the substrate, pins are fixed equidistantly inside the top of the bottom plate, and a heat dissipation metal shell is fixed on the upper surface of the bottom plate;

[0018] Wherein, the lower surface of the heat dissipation metal shell is in contact with the upper surface of the guide tube.

[0019] Compared with the prior art, the advantages of the present invention are:

[0020] The utility model provides a limit frame and a limit plate, when taking out the heat conducting plate, an upward force is applied to the limit plate so that a movable block connected to one side of the limit frame is moved to the top of the limit frame, and the heat conducting plate can be easily removed from the limit plate. When fixing the heat conducting plate, the pressing plate can be fixed to the top of the heat conducting plate. This solution can not only quickly remove the heat conducting plate from the limit plate, but also has a simple structure and is easy to operate when fixing the heat conducting plate.

[0021] Based on the first beneficial effect, with the coordinated use of the guide tube and the connecting column, when fixing the heat dissipation metal shell, first insert the connecting column into the guide tube, then the heat dissipation metal shell can be quickly placed on the top of the base plate, and the screws are put into the heat dissipation metal shell and fixed to the base plate. During the installation process, the heat dissipation metal shell is placed more stably and the efficiency of installing the heat dissipation metal shell is higher.

[0022] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0025] Figure 2 This is a structural diagram of the bottom plate of the utility model;

[0026] Figure 3 For this utility model Figure 2 A magnified image of point A;

[0027] Figure 4 This is a structural diagram of the substrate of the utility model;

[0028] Figure 5 For this utility model Figure 4 The enlarged view of point B;

[0029] Figure 6 It is a cross-sectional view of the guide tube of the utility model.

[0030] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0031] 11. Bottom plate; 12. Pins; 13. Heat dissipation metal shell; 14. Base plate; 15. Heat conduction plate;

[0032] 21. Limiting frame; 22. Movable slot; 23. Movable block; 24. Limiting plate; 25. Movable slot; 26. Movable frame; 27. Fixed column; 28. Connecting plate; 29. ​​Pressing plate;

[0033] 31. Guide tube; 32. Silicone pad; 33. Connecting hole; 34. Connecting column; 35. Connecting ball. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0035] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.

[0036] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0037] See also Figure 1-Figure 5 As shown, this embodiment is a chip packaging structure with high thermal conductivity, including:

[0038] A main body component, the main body component includes a base plate 14;

[0039] The heat conduction assembly includes a limit frame 21 fixed to the upper surface of the four corners of the base plate 14, a movable groove 22 opened inside the limit frame 21 on one side, a movable groove 25 opened inside the limit frame 21 on the other side, a movable block 23 slidably connected to the inside of the movable groove 22, and a limit plate 24 fixed to the outer surface of the movable block 23;

[0040] A guide assembly, the guide assembly includes a guide tube 31 fixed on the upper surface of the limit frame 21;

[0041] A movable frame 26 is fixed to the outer surfaces of both sides of the limiting plate 24, and one side of the movable frame 26 is slidably connected to the inside of the movable groove 25;

[0042] The movable frame 26 is provided to facilitate applying the force of moving up and down to the limit plate 24;

[0043] A fixing column 27 is fixed to the middle surface of both ends of the base plate 14, a pressing plate 29 is movably connected to the top of the fixing column 27, and a connecting plate 28 is fixed to the outer surface of the top of the fixing column 27;

[0044] The fixing column 27 is used to receive and install the connecting plate 28. By pulling the pressing plate 29 in the fixing column 27, the heat conducting plate 15 can be fixed on the limiting plate 24.

[0045] A heat conducting plate 15 is fixed to the upper surface of the limiting plate 24;

[0046] The upper surface of the heat conducting plate 15 is in contact with the pressing plate 29;

[0047] The heat conducting plate 15 is used to transfer heat to the heat dissipating metal shell 13, thereby dissipating heat inside the chip.

[0048] A bottom plate 11 is fixed to the lower surface of the substrate 14, pins 12 are fixed equidistantly inside the top of the bottom plate 11, and a heat dissipation metal shell 13 is fixed to the upper surface of the bottom plate 11;

[0049] The lower surface of the heat dissipation metal shell 13 is in contact with the upper surface of the guide tube 31;

[0050] The bottom plate 11 is used to receive and install the substrate 14 and the pins 12. The pins 12 are used to electrically connect the chip to the circuit board. The heat dissipation metal shell 13 is used to transfer the heat inside the chip out.

[0051] When taking out the heat conducting plate 15;

[0052] After the screws fixed in the connecting plate 28 and the pressing plate 29 are taken out, an outward dragging force is applied to the pressing plate 29 so that the pressing plate 29 is taken out from the fixing column 27, and an upward force is applied to the moving frame 26 so that the moving frame 26 moves in the moving groove 25, thereby driving the limiting plate 24 to move upward synchronously. When the limiting plate 24 moves upward, the movable block 23 moves synchronously in the limiting frame 21, so that the heat conducting plate 15 is higher than the height of the limiting frame 21, and the heat conducting plate 15 can be quickly taken out from the limiting frame 21.

[0053] This step can not only quickly remove the heat conducting plate 15 from the limiting plate 24, but also the structure is simple and easy to operate when fixing the heat conducting plate 15;

[0054] See also Figure 1 and Figure 6 As shown, this embodiment is based on the above embodiment 1 and also includes:

[0055] A silicone pad 32 is fixed inside the top of the guide tube 31, and connecting holes 33 are arranged in a circle inside the silicone pad 32;

[0056] The silicone pad 32 is used to limit the connection ball 35. When the connection hole 33 is set, the silicone pad 32 can be deformed, so that the connection ball 35 can pass through the inside of the silicone pad 32 easily.

[0057] A connecting column 34 is movably connected to the middle of the silicone pad 32, and a connecting ball 35 is fixed to the lower surface of the connecting column 34;

[0058] The connecting column 34 receives and installs the heat dissipation metal shell 13, and further receives and installs the connecting ball 35;

[0059] When fixing the heat dissipation metal shell 13;

[0060] After aligning the connection ball 35 with the middle of the guide tube 31, a downward force is applied to the heat dissipation metal shell 13, and the connection ball 35 passes through the middle of the silicone pad 32. With the assistance of the connection hole 33, the silicone pad 32 is deformed, so that the connection ball 35 passes through the middle of the silicone pad 32, and the heat dissipation metal shell 13 can be fixed to the top of the bottom plate 11.

[0061] This step enables the heat dissipation metal shell 13 to be placed more stably, and the efficiency of installing the heat dissipation metal shell 13 is higher.

[0062] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0063] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A chip packaging structure with high thermal conductivity, characterized in that: include: A main body component, the main body component comprising a base plate (14); The heat conduction component comprises a limit frame (21) fixed to the upper surface of the four corners of the base plate (14), a movable groove (22) provided inside the limit frame (21) on one side, a movable groove (25) provided inside the limit frame (21) on the other side, a movable block (23) slidably connected to the inside of the movable groove (22), and a limit plate (24) fixed to the outer surface of the movable block (23); A guide assembly, the guide assembly comprising a guide tube (31) fixed on the upper surface of the limiting frame (21).

2. The chip packaging structure with high thermal conductivity according to claim 1, characterized in that: A movable frame (26) is fixed to the outer surfaces of both sides of the limiting plate (24), and one side of the movable frame (26) is slidably connected to the inside of the movable groove (25).

3. The chip packaging structure with high thermal conductivity according to claim 1, characterized in that: A fixing column (27) is fixed to the middle surface of both ends of the base plate (14), a pressing plate (29) is movably connected inside the top end of the fixing column (27), and a connecting plate (28) is fixed to the outer surface of the top end of the fixing column (27).

4. The chip packaging structure with high thermal conductivity according to claim 1, characterized in that: A silicone pad (32) is fixed inside the top end of the guide tube (31), and connection holes (33) are arranged in a circular pattern inside the silicone pad (32).

5. The chip packaging structure with high thermal conductivity according to claim 4, characterized in that: A connecting column (34) is movably connected to the middle of the silicone pad (32), and a connecting ball (35) is fixed to the lower surface of the connecting column (34).

6. The chip packaging structure with high thermal conductivity according to claim 1, characterized in that: A heat conducting plate (15) is fixed on the upper surface of the limiting plate (24); The upper surface of the heat conducting plate (15) is in contact with the pressing plate (29).

7. The chip packaging structure with high thermal conductivity according to claim 1, characterized in that: A bottom plate (11) is fixed to the lower surface of the substrate (14), pins (12) are fixed at equal intervals inside the top of the bottom plate (11), and a heat dissipation metal shell (13) is fixed to the upper surface of the bottom plate (11); The lower surface of the heat dissipating metal shell (13) is in contact with the upper surface of the guide tube (31).

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