ECONO module

Abstract

The utility model belongs to the technical field of semiconductor devices, and discloses an ECONO module which comprises a DCDC power supply circuit, a gate drive circuit and an inversion full-bridge circuit which are packaged in an ECONO shell, the DCDC power supply circuit and the gate drive circuit are integrated into the ECONO module, the external circuit structure is simplified, external connection is reduced, and the reliability of the ECONO module is improved. Therefore, the problems that in the prior art, an external circuit is complex, the system size is large, cost is high, and electrical performance and reliability are affected are solved, and the system has the advantages of being high in integration degree, small in size, low in cost and good in electrical performance and reliability.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor devices, and in particular to an ECONO module. Background Art

[0002] Power modules are core devices for power conversion and circuit control, and their downstream applications are extensive, including new energy vehicles, industry, consumer electronics, etc. Especially in the automotive and industrial fields, the demand for power modules is relatively stable, and they are the main source of incremental demand for power devices. The growth potential of the power module market is huge.

[0003] At present, conventional power modules only have full-bridge or half-bridge circuits encapsulated inside. In actual work, such power modules also need to be used in conjunction with external DCDC power supply circuits and gate drive circuits. The DCDC power supply circuit is used to provide DC drive voltage (such as VDD voltage, VCC voltage) and ground connection to the power module, while the gate drive circuit is used to provide a drive level signal to the gate of the switch tube in the power module. This design structure makes the external circuit complex, which is not conducive to system integration and simplification.

[0004] In addition, since the DCDC power supply circuit and gate drive circuit are located outside the power module, the system volume and cost may be increased. At the same time, the external connection may also introduce additional parasitic inductance and capacitance, affecting the electrical performance and reliability of the system.

[0005] On the other hand, with the continuous expansion of power module application areas and the continuous improvement of performance requirements, higher requirements are placed on the integration, efficiency and reliability of power modules. However, the existing power module structure is difficult to meet these growing demands.

[0006] In view of the above problems, the existing technology needs to be improved urgently. Utility Model Content

[0007] The purpose of the present application is to provide an ECONO module having the advantages of high integration, small size, low cost, good electrical performance and reliability.

[0008] The present application provides an ECONO module, including a DCDC power supply circuit, a gate drive circuit and an inverter full-bridge circuit encapsulated in an ECONO housing;

[0009] The inverter full-bridge circuit includes four switch tubes, wherein two of the switch tubes form a half-bridge circuit, and the other two of the switch tubes form another half-bridge circuit, and the two half-bridge circuits are connected in parallel;

[0010] The gate drive circuit includes two half-bridge drive circuits connected to a PWM signal input terminal, the PWM signal input terminal is used to input an external PWM signal, and the two half-bridge drive circuits are also respectively connected to the two half-bridge circuits and are respectively used to drive the switch tubes of the two half-bridge circuits to turn on and off;

[0011] The DCDC power supply circuit is connected to the two half-bridge drive circuits and is used to provide a DC drive voltage and a ground connection to the two half-bridge drive circuits.

[0012] By integrating the DCDC power supply circuit and the gate drive circuit into the ECONO module, the external circuit structure is simplified and the external connections are reduced, thereby solving the problems of complex external circuits, large system volume, high cost, and affected electrical performance and reliability in the prior art. It has the advantages of high integration, small volume, low cost, good electrical performance and reliability.

[0013] Preferably, each of the half-bridge circuits comprises an upper half-bridge switch tube and a lower half-bridge switch tube;

[0014] The source of the upper half-bridge switch tube and the drain of the lower half-bridge switch tube in each half-bridge circuit are connected to form an AC signal output end; the drains of the upper half-bridge switch tubes of the two half-bridge circuits are connected in parallel to form a DC signal input positive electrode; the sources of the lower half-bridge switch tubes of the two half-bridge circuits are connected in parallel to form a DC signal input negative electrode.

[0015] Preferably, two PWM signal input terminals are provided, and the two PWM signal input terminals are respectively used to input a first PWM signal and a second PWM signal, the first PWM signal is used to drive the two upper half-bridge switch tubes, and the second PWM signal is used to drive the two lower half-bridge switch tubes.

[0016] Preferably, each of the half-bridge driving circuits comprises at least one gate driving chip, and the gates and Kelvin source pins of the two switching tubes in each of the half-bridge circuits are connected to the corresponding gate driving chip to form a driving loop;

[0017] Each of the gate driving chips is connected to the DCDC power supply circuit and the PWM signal input terminal.

[0018] Preferably, each of the half-bridge drive circuits includes a gate drive chip, and the gate drive chip is an isolated dual-channel gate drive chip, and the gate and Kelvin source pins of the two switch tubes in the same half-bridge circuit are connected to the same corresponding gate drive chip.

[0019] An isolated dual-channel gate driver chip is used as the core component of the half-bridge driver circuit. This design has many key functions, including simplifying the circuit structure, improving driving efficiency, enhancing electrical isolation, optimizing signal transmission and flexible control.

[0020] Preferably, a first resistor, a second resistor and a capacitor are arranged between the gate of each switching tube and the corresponding gate driving chip, the first resistor is connected in series between the gate of the switching tube and the corresponding gate driving chip, the second resistor is connected in series between the gate of the switching tube and the Kelvin source pin, one end of the capacitor is connected to one end of the first resistor close to the corresponding gate driving chip, and the other end is connected to the Kelvin source pin of the switching tube.

[0021] Preferably, each of the gate driving chips is connected to the PWM signal input terminal via a third resistor.

[0022] Preferably, the switch tube is a MOSFET tube, an IGBT tube or a silicon carbide switch tube.

[0023] Preferably, the ECONO module further comprises two DBC substrates with a gap, wherein one of the half-bridge circuits and the corresponding half-bridge driving circuit are arranged on one of the DBC substrates, and the other half-bridge circuit and the corresponding half-bridge driving circuit are arranged on the other DBC substrate.

[0024] By adopting a layout of two spaced DBC substrates, the high-power ECONO module of the present application can more effectively manage heat distribution and reduce the formation of hot spots. This design allows heat to be more evenly distributed to the two DBC substrates, reducing the heat load of a single substrate, thereby reducing deformation caused by thermal expansion and contraction. At the same time, the spacing between the two substrates can also promote air circulation, further enhance the heat dissipation effect, and leave space for the substrate to expand and contract, avoiding structural damage caused by thermal expansion and contraction.

[0025] Preferably, the ECONO module further comprises a thermistor encapsulated in the ECONO housing.

[0026] Beneficial effects: The ECONO module provided by the present application simplifies the external circuit structure and reduces external connections by integrating the DCDC power supply circuit and the gate drive circuit into the ECONO module, thereby solving the problems of complex external circuits, large system volume, high cost, and affected electrical performance and reliability in the prior art. The module has the advantages of high integration, small volume, low cost, good electrical performance and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1This is a structural diagram of the gate drive circuit and the inverter full-bridge circuit in the ECONO module provided in an embodiment of the present application.

[0028] Figure 2 It is a structural schematic diagram of a half-bridge drive circuit.

[0029] Figure 3 This is a layout diagram of the gate drive circuit and the inverter full-bridge circuit in the ECONO module provided in an embodiment of the present application on the DBC substrate.

[0030] Explanation of reference numerals: 1. gate drive circuit; 101. half-bridge drive circuit; 102. gate drive chip; 103. first resistor; 104. second resistor; 105. capacitor; 106. third resistor; 2. inverter full-bridge circuit; 201. switch tube; 3. DBC substrate; 4. thermistor. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0032] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0033] In the field of new energy vehicles and industrial automation, power modules, as core devices for power conversion and circuit control, play a vital role. With the continuous advancement of technology, the market demand for efficient, reliable and easy-to-integrate power modules is increasing. However, traditional power modules have some limitations in design, especially in simplifying the external circuit structure.

[0034] Traditional power modules are usually only packaged with full-bridge or half-bridge circuits, and need to cooperate with external DCDC power supply circuits and gate drive circuits when working. These external circuits are used to provide the necessary voltage and drive signals to the power module, but they also increase the complexity and cost of the system. Especially in high-power application scenarios, the complexity of external circuits not only increases the difficulty of design and maintenance, but may also affect the reliability and performance of the system.

[0035] In order to solve these problems, the present application proposes an innovative ECONO module design, wherein the ECONO module refers to a power module packaged based on the ECONO packaging method.

[0036] Please refer to Figure 1-Figure 3 , an ECONO module in some embodiments of the present application includes a DCDC power supply circuit (not shown in the figure), a gate drive circuit 1 and an inverter full-bridge circuit 2 encapsulated in an ECONO housing;

[0037] The inverter full-bridge circuit 2 includes four switch tubes 201, wherein two switch tubes 201 form a half-bridge circuit, and the other two switch tubes 201 form another half-bridge circuit. The two half-bridge circuits are connected in parallel (eg Figure 1 In the figure, the two switch tubes 201 on the left form a half-bridge circuit, and the two switch tubes 201 on the right form another half-bridge circuit);

[0038] The gate drive circuit 1 includes two PWM signal input terminals (eg Figure 1 The PWM signal input terminal is used to input an external PWM signal. The two half-bridge driving circuits 101 are also connected to the two half-bridge circuits respectively, and are used to drive the switch tubes 201 of the two half-bridge circuits to turn on and off respectively;

[0039] The DCDC power supply circuit is connected to the two half-bridge drive circuits 101 and is used to provide a DC drive voltage and a ground connection (eg Figure 1 In the figure, the VDD terminal is the connection terminal where the DCDC power supply circuit provides the VDD voltage to the two half-bridge drive circuits 101, the VCC terminal is the connection terminal where the DCDC power supply circuit provides the VCC voltage to the two half-bridge drive circuits 101, and the GND terminal is the connection terminal where the DCDC power supply circuit provides the ground connection to the two half-bridge drive circuits 101).

[0040] By integrating the DCDC power supply circuit and the gate drive circuit 1 into the ECONO module, the external circuit structure is simplified and the external connections are reduced, thereby solving the problems of complex external circuits, large system volume, high cost, and affected electrical performance and reliability in the prior art. The module has the advantages of high integration, small volume, low cost, good electrical performance and reliability.

[0041] Specifically, see Figure 1 Each half-bridge circuit includes an upper half-bridge switch tube and a lower half-bridge switch tube (such as Figure 1 In the figure, the two switch tubes 201 on the upper side are upper half-bridge switch tubes, and the two switch tubes 201 on the lower side are lower half-bridge switch tubes);

[0042] The source of the upper half-bridge switch tube and the drain of the lower half-bridge switch tube in each half-bridge circuit are connected to form an AC signal output terminal (thereby having two AC signal output terminals in total, such as Figure 1 The drains of the upper half-bridge switches of the two half-bridge circuits are connected in parallel to form the positive electrode of the DC signal input (such as Figure 1 IN+ terminal in the two half-bridge circuits); the sources of the lower half-bridge switches of the two half-bridge circuits are connected in parallel to form the negative electrode of the DC signal input (such as Figure 1 The DC signal input positive electrode and the DC signal input negative electrode are used to input DC signals, and the two AC signal output terminals are used to output the converted AC signals.

[0043] This design realizes the function of the inverter full-bridge circuit 2 through a specific half-bridge circuit connection structure. Each half-bridge circuit is composed of two upper and lower switch tubes 201, which can realize the conversion from DC to AC. The source of the upper half-bridge switch tube and the drain of the lower half-bridge switch tube are connected to form an AC signal output end, and an AC signal can be generated when the two switch tubes are alternately turned on. The drains of the upper half-bridge switch tubes of the two half-bridge circuits are connected in parallel to form the positive electrode of the DC signal input, and the sources of the lower half-bridge switch tubes are connected in parallel to form the negative electrode of the DC signal input. This connection method realizes the input of DC signals.

[0044] The design of connecting two half-bridge circuits in parallel not only simplifies the circuit structure, but also improves the power carrying capacity of the circuit. This parallel structure can disperse the current and reduce the current stress of a single switch tube 201, thereby improving the reliability and efficiency of the system.

[0045] In some embodiments, see Figure 1 There are two PWM signal input terminals (PWM1 terminal and PWM2 terminal), and the two PWM signal input terminals are respectively used to input a first PWM signal and a second PWM signal. The first PWM signal is used to drive two upper half-bridge switch tubes, and the second PWM signal is used to drive two lower half-bridge switch tubes.

[0046] By setting two independent PWM signal input terminals, which are used to input PWM signals for controlling the upper half-bridge and lower half-bridge switch tubes, respectively, the upper and lower half-bridge switch tubes in the inverter full-bridge circuit 2 are controlled separately. Specifically, the first PWM signal is specifically used to drive the two upper half-bridge switch tubes, and the second PWM signal is specifically used to drive the two lower half-bridge switch tubes. This design allows the upper and lower half-bridge switch tubes to be independently controlled, thereby improving the flexibility and accuracy of the drive. A variety of control strategies can be used to generate the first PWM signal and the second PWM signal. For example, a complementary PWM control strategy can be used, in which the first PWM signal and the second PWM signal are complementary to ensure that the upper and lower half-bridge switch tubes are not turned on at the same time. Another strategy is phase shift PWM control, which controls the output voltage and current by adjusting the phase difference between the two PWM signals.

[0047] Among them, see Figure 1 , Figure 2 Each half-bridge driving circuit 101 includes at least one gate driving chip 102, and the gates and Kelvin source pins of the two switch tubes 201 in each half-bridge circuit are connected to the corresponding gate driving chip 102 to form a driving loop;

[0048] Each gate driver chip 102 is connected to a DCDC power supply circuit and a PWM signal input terminal (wherein the DCDC power supply circuit provides a VDD voltage to the gate driver chip 102 to drive the gate driver chip 102 to work, and the DCDC power supply circuit also provides a VCC voltage to the gate driver chip 102, so that the gate driver chip 102 drives the switch tube 201 using the VCC voltage).

[0049] By using at least one gate driver chip 102 in each half-bridge drive circuit 101, and connecting the gate and Kelvin source pins of the two switch tubes 201 in each half-bridge circuit to the corresponding gate driver chip 102 to form a drive loop, effective drive control of the switch tube 201 is achieved. This connection method can ensure that each switch tube 201 can obtain an accurate drive signal, thereby improving the working efficiency and reliability of the inverter full-bridge circuit 2. At the same time, by connecting each gate driver chip 102 to the DCDC power supply circuit and the PWM signal input terminal, the problem of drive voltage supply and PWM signal input is solved.

[0050] In a specific implementation, the selection of the gate driver chip 102 can be flexibly configured according to actual needs. For example, a single-channel or dual-channel gate driver chip 102 can be selected, or chips with different current driving capabilities can be selected according to power requirements. For high-power applications, a gate driver chip 102 with an isolation function can be considered to improve the safety and reliability of the system.

[0051] There are also many variations in the connection between the gate driver chip 102 and the switch tube 201. The most common method is to directly connect the output end of the gate driver chip 102 to the gate of the switch tube 201, but in some cases, it may be necessary to add some additional circuits between the gate driver chip 102 and the switch tube 201. For example, a small resistor can be added to limit the gate current, or a Zener diode can be added to protect the gate from overvoltage.

[0052] In some optional embodiments, see Figure 2 Each half-bridge driving circuit 101 includes a gate driving chip 102, and the gate driving chip 102 is an isolated dual-channel gate driving chip. The gate and Kelvin source pins of the two switch tubes 201 in the same half-bridge circuit are connected to the same corresponding gate driving chip 102.

[0053] An isolated dual-channel gate driver chip is used as a core component of the half-bridge driver circuit 101. This design has multiple key functions such as simplifying the circuit structure, improving the driving efficiency, enhancing the electrical isolation, optimizing the signal transmission and flexible control.

[0054] The isolated dual-channel gate driver chip contains two independent drive channels, which are used to drive the upper and lower switch tubes 201 in the half-bridge circuit respectively, to achieve faster and more accurate switch control. This not only improves the drive efficiency, but also provides the possibility of implementing more complex control strategies. In addition, connecting the gate and Kelvin source pins of the two switch tubes 201 to the same driver chip reduces the signal transmission path and reduces the influence of parasitic inductance and capacitance. This optimization can significantly increase the switching speed, thereby reducing switching losses and improving overall efficiency.

[0055] In other optional embodiments, each half-bridge drive circuit 101 includes two gate drive chips 102, and the gate and Kelvin source pins of the two switch tubes 201 in the same half-bridge circuit are respectively connected to two corresponding gate drive chips 102 (that is, the gate and Kelvin source pins of one switch tube 201 are connected to one of the gate drive chips 102, and the gate and Kelvin source pins of the other switch tube 201 are connected to the other gate drive chip 102).

[0056] By using two independent gate driver chips 102 in each half-bridge driver circuit 101, and connecting two switch tubes 201 in the same half-bridge circuit respectively, a more flexible and reliable driver design is achieved. This design has many advantages, including providing greater driving capability, more precise control of switching timing, reducing the load of a single driver chip, improving system redundancy, etc., so as to better meet the needs of high-power and high-reliability applications and improve overall performance and stability.

[0057] Preferably, see Figure 1 , Figure 2 A first resistor 103, a second resistor 104 and a capacitor 105 are arranged between the gate of each switch tube 201 and the corresponding gate driver chip 102. The first resistor 103 is connected in series between the gate of the switch tube 201 and the corresponding gate driver chip 102, the second resistor 104 is connected in series between the gate of the switch tube 201 and the Kelvin source pin, one end of the capacitor 105 is connected to one end of the first resistor 103 close to the corresponding gate driver chip 102, and the other end is connected to the Kelvin source pin of the switch tube 201.

[0058] This drive circuit configuration realizes fine control of the on and off process of the switch tube 201 by reasonably allocating the resistor and capacitor 105, which not only improves the driving efficiency, but also enhances the reliability of the circuit. Specifically, the first resistor 103 can limit the gate charging current, prevent the driver chip from overloading, and suppress parasitic oscillation. The second resistor 104 forms a discharge path to speed up the switch tube 201 and reduce the turn-off loss. The capacitor 105 constitutes a bootstrap circuit to provide an additional gate drive voltage, which helps the switch tube 201 to turn on quickly.

[0059] The resistance values ​​of the first resistor 103 and the second resistor 104 and the capacitance value of the capacitor 105 can be set according to actual needs. Specifically, the resistance value of the first resistor 103 depends on the type of the switch tube 201 and the output capacity of the driver chip. A smaller resistance value can provide a faster turn-on speed, but may increase the ringing effect; a larger resistance value can better suppress oscillation, but will slightly reduce the turn-on speed; the resistance value of the second resistor 104 is selected based on providing an appropriate discharge path without affecting the turn-on performance; a larger capacitance value of the capacitor 105 can provide a stronger bootstrap effect, but will also increase the switch delay, and it is necessary to balance the two for setting.

[0060] Preferably, see Figure 2 , each gate driving chip 102 is connected to the PWM signal input terminal through a third resistor 106 .

[0061] By adding a third resistor 106 between the gate driver chip 102 and the PWM signal input terminal, current limiting protection, filtering, impedance matching and isolation protection can be achieved, thereby effectively improving the transmission quality and reliability of the PWM drive signal and optimizing the performance and stability of the entire ECONO module.

[0062] The resistance value of the third resistor 106 can be set according to actual needs, depending on the requirements of the system and the characteristics of the PWM signal. For example, for high-frequency PWM signals, a smaller resistance value may be selected to reduce signal attenuation; while for application scenarios requiring stronger isolation protection, a larger resistance value may be selected.

[0063] In the case where each half-bridge driving circuit 101 includes a gate driving chip 102 (an isolated dual-channel gate driving chip), a third resistor 106 is connected between the gate driving chip 102 and each PWM signal input terminal (PWM1 terminal and PWM2 terminal). Figure 1 , Figure 2 As shown. In the case where each half-bridge driving circuit 101 includes two gate driving chips 102, each gate driving chip 102 is connected to a corresponding PWM signal input terminal through a third resistor 106 (the gate driving chip 102 of the upper half-bridge switch tube is connected to the PWM1 terminal, and the gate driving chip 102 of the lower half-bridge switch tube is connected to the PWM2 terminal).

[0064] Among them, the type of switch tube 201 can be set according to actual needs, for example, a MOSFET tube, an IGBT tube or a silicon carbide switch tube. These switch tube types have their own advantages in high-power applications. MOSFET tubes have the characteristics of high switching speed and low conduction loss, and are suitable for high-frequency applications. IGBT tubes combine the high input impedance of MOSFET and the low conduction loss characteristics of bipolar transistors, and are suitable for medium-high voltage and high-current applications. Silicon carbide switch tubes have the advantages of wide bandgap semiconductors, can operate under high temperature, high voltage and high frequency conditions, and have higher efficiency and power density.

[0065] Specifically, see Figure 3 The ECONO module further includes two DBC substrates 3 with a gap, wherein one half-bridge circuit and a corresponding half-bridge driving circuit 101 are arranged on one of the DBC substrates 3 , and the other half-bridge circuit and a corresponding half-bridge driving circuit 101 are arranged on the other DBC substrate 3 .

[0066] By adopting a layout of two spaced DBC substrates 3, the high-power ECONO module of the present application can more effectively manage heat distribution and reduce the formation of hot spots. This design allows heat to be more evenly distributed on the two DBC substrates 3, reducing the heat load of a single substrate, thereby reducing deformation caused by thermal expansion and contraction. At the same time, the spacing between the two substrates can also promote air circulation, further enhance the heat dissipation effect, and leave space for the substrate to expand and contract, avoiding structural damage caused by thermal expansion and contraction.

[0067] The spacing between the two DBC substrates 3 can be adjusted according to actual needs. This spacing can not only provide sufficient electrical isolation, but also provide space for thermal expansion. Each DBC substrate 3 can adopt a sandwich structure in which a ceramic substrate (such as aluminum oxide or aluminum nitride) is sandwiched between two copper layers, the upper copper layer is used for circuit wiring, and the lower copper layer is used for heat dissipation. In addition, a layer of gold can be electroplated on the upper copper layer to improve solderability and adhesion. For example, in a specific embodiment, the ceramic substrate of the DBC substrate 3 is a 0.38mm thick aluminum nitride ceramic, the thickness of its two copper layers is 1OZ, and a 2um thick gold layer is electroplated on the upper copper layer.

[0068] In some embodiments, see Figure 3 The ECONO module also includes a thermistor 4 encapsulated in the ECONO housing. The ECONO module is also provided with two temperature measuring terminals (such as Figure 3 The NTC1 terminal and the NTC2 terminal in the circuit are used to output the detection signal of the thermistor 4.

[0069] The introduction of thermistor 4 enables the module to monitor the temperature in real time, providing a basis for temperature protection. Through the two temperature measuring terminals, the external control circuit can obtain the module temperature information at any time and take cooling or protection measures in time (for example, when the temperature is too high, turn off each switch tube 201 or reduce the output power).

[0070] The working process of the ECONO module is as follows: a DC signal enters through the IN+ terminal and the IN- terminal, and the first PWM signal and the second PWM signal are respectively input into the PWM1 terminal and the PWM2 terminal through an external circuit. The gate driver chip 102 adjusts the duty ratio of turning on and off the upper and lower half-bridge switches according to the first PWM signal and the second PWM signal, and corresponding AC signals can be obtained at the OUT1 terminal and the OUT2 terminal according to the duty ratio.

[0071] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0072] The above description is only an embodiment of the present application and is not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An ECONO module, characterized in that: It comprises a DCDC power supply circuit, a gate drive circuit (1) and an inverter full-bridge circuit (2) which are encapsulated in an ECONO housing; The inverter full-bridge circuit (2) comprises four switch tubes (201), wherein two of the switch tubes (201) form a half-bridge circuit, and the other two of the switch tubes (201) form another half-bridge circuit, and the two half-bridge circuits are connected in parallel; The gate drive circuit (1) comprises two half-bridge drive circuits (101) connected to a PWM signal input end, the PWM signal input end being used to input an external PWM signal, and the two half-bridge drive circuits (101) are also respectively connected to the two half-bridge circuits and respectively used to drive the switch tubes (201) of the two half-bridge circuits to turn on and off; The DCDC power supply circuit is connected to the two half-bridge drive circuits (101), and is used to provide a direct current drive voltage and a ground connection to the two half-bridge drive circuits (101).

2. The ECONO module according to claim 1, characterized in that: Each of the half-bridge circuits includes an upper half-bridge switch tube and a lower half-bridge switch tube; The source of the upper half-bridge switch tube and the drain of the lower half-bridge switch tube in each half-bridge circuit are connected to form an AC signal output end; the drains of the upper half-bridge switch tubes of the two half-bridge circuits are connected in parallel to form a DC signal input positive electrode; the sources of the lower half-bridge switch tubes of the two half-bridge circuits are connected in parallel to form a DC signal input negative electrode.

3. The ECONO module according to claim 2, characterized in that: There are two PWM signal input terminals, which are used to input a first PWM signal and a second PWM signal respectively. The first PWM signal is used to drive the two upper half-bridge switch tubes, and the second PWM signal is used to drive the two lower half-bridge switch tubes.

4. The ECONO module according to claim 1, characterized in that: Each of the half-bridge drive circuits (101) comprises at least one gate drive chip (102), and the gates and Kelvin source pins of the two switch tubes (201) in each of the half-bridge circuits are connected to the corresponding gate drive chip (102) to form a drive loop; Each of the gate drive chips (102) is connected to the DCDC power supply circuit and the PWM signal input terminal.

5. The ECONO module according to claim 4, characterized in that: Each of the half-bridge drive circuits (101) comprises a gate drive chip (102), and the gate drive chip (102) is an isolated dual-channel gate drive chip, and the gates and Kelvin source pins of the two switch tubes (201) in the same half-bridge circuit are both connected to the same corresponding gate drive chip (102).

6. The ECONO module according to claim 4, characterized in that: A first resistor (103), a second resistor (104) and a capacitor (105) are arranged between the gate of each switch tube (201) and the corresponding gate drive chip (102); the first resistor (103) is connected in series between the gate of the switch tube (201) and the corresponding gate drive chip (102); the second resistor (104) is connected in series between the gate of the switch tube (201) and a Kelvin source pin; one end of the capacitor (105) is connected to one end of the first resistor (103) close to the corresponding gate drive chip (102); and the other end is connected to the Kelvin source pin of the switch tube (201).

7. The ECONO module according to claim 4, characterized in that: Each of the gate drive chips (102) is connected to the PWM signal input terminal via a third resistor (106).

8. The ECONO module according to claim 1, characterized in that: The switch tube (201) is a MOSFET tube, an IGBT tube or a silicon carbide switch tube.

9. The ECONO module according to claim 1, characterized in that: It also comprises two DBC substrates (3) with a gap, wherein one of the half-bridge circuits and the corresponding half-bridge drive circuit (101) are arranged on one of the DBC substrates (3), and the other half-bridge circuit and the corresponding half-bridge drive circuit (101) are arranged on the other DBC substrate (3).

10. The ECONO module according to claim 1, characterized in that: Also included is a thermistor (4) encapsulated in the ECONO housing.

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