Heat dissipation protection structure of vehicle-mounted equipment

Abstract

The utility model provides a heat dissipation protection structure of vehicle-mounted equipment. The heat dissipation protection structure of the vehicle-mounted equipment comprises a circuit board assembly and a heat dissipation assembly, the heat dissipation assembly comprises a heat dissipation piece, a heat dissipation decoration piece and a heat insulation layer. The heat dissipation piece and the circuit board assembly are arranged in a stacked mode, and the heat dissipation piece is used for conducting heat dissipation on the circuit board assembly; the heat dissipation decoration part is arranged on the side, opposite to the circuit board assembly, of the heat dissipation part, and the heat dissipation decoration part is provided with heat dissipation through holes formed in the stacking direction of the circuit board assembly and the heat dissipation part. The heat insulation layer is arranged between the heat dissipation piece and the heat dissipation decoration piece and used for conducting heat insulation between the heat dissipation piece and the heat dissipation decoration piece. According to the heat dissipation protection structure of the vehicle-mounted equipment, the risk that a user is scalded due to contact can be reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of vehicle-mounted heat dissipation protection, and in particular, relates to a heat dissipation protection structure for vehicle-mounted equipment. Background Art

[0002] With the increase in consumer demand and the continuous development and optimization of agricultural machinery, agricultural machinery vehicle-mounted products have emerged. However, among the agricultural machinery vehicle-mounted products provided by the existing technology, the performance of the agricultural machinery vehicle-mounted products used in agricultural machinery is relatively high, resulting in relatively large power consumption of the entire agricultural machinery equipment. As CPU modules and 5G modules in agricultural machinery vehicle-mounted products, they generate a lot of heat. At the same time, agricultural machinery equipment needs to operate in high-temperature outdoor environments. Agricultural machinery vehicle-mounted products absorb the sun's ultraviolet rays, causing the surface temperature of the agricultural machinery equipment to be too high, and users will be burned when they touch the agricultural machinery equipment. Utility Model Content

[0003] In order to address the deficiencies in the prior art, the present application provides a heat dissipation protection structure for vehicle-mounted equipment, which can reduce the risk of burns caused by contact by users.

[0004] On the one hand, the present application provides a vehicle-mounted device heat dissipation protection structure, including:

[0005] Circuit board assemblies; and

[0006] Heat dissipation components, including heat dissipation parts, heat dissipation decorative parts and heat insulation layers;

[0007] The heat sink is stacked with the circuit board assembly, and the heat sink is used to dissipate heat from the circuit board assembly; the heat sink decorative component is arranged on the side of the heat sink facing away from the circuit board assembly, and the heat sink decorative component has heat dissipation through holes arranged along the stacking direction of the circuit board assembly and the heat sink; the heat insulation layer is arranged between the heat sink and the heat sink decorative component, and the heat insulation layer is used to insulate between the heat sink and the heat sink decorative component.

[0008] In a possible embodiment, the thermal insulation layer includes a nanoporous structure or aerogel.

[0009] In a possible embodiment, there are a plurality of heat dissipation through holes, and the plurality of heat dissipation through holes are arranged in an array on the heat dissipation decorative component.

[0010] In a possible embodiment, the thermal conductivity of the heat dissipation decorative component is less than or equal to 0.2 W / (M*K).

[0011] In a possible embodiment, the heat sink has a recess on a side facing away from the circuit board assembly, and the heat dissipation decorative element and the heat insulation layer are both disposed in the recess.

[0012] In a possible embodiment, the vehicle-mounted equipment heat dissipation protection structure also includes a shell structure and a display screen, the shell structure has a accommodating cavity, the display screen is arranged outside the accommodating cavity and is electrically connected to the circuit board assembly; the circuit board assembly is accommodated in the accommodating cavity, part of the heat dissipation assembly is arranged outside the accommodating cavity, and another part of the heat dissipation assembly extends into the accommodating cavity.

[0013] In a possible embodiment, the circuit board assembly includes a circuit board and a heating element disposed on the circuit board; the heat dissipation element of the heat dissipation assembly includes a heat dissipation step, the heat dissipation step is protruding toward the circuit board assembly, and the heat dissipation step extends into the accommodating cavity and contacts the heat dissipation element.

[0014] In a possible embodiment, the heating element includes a first heating element and a second heating element that are spaced apart, and the first heating element and the second heating element are both arranged on the circuit board; the heat dissipation step includes a first heat dissipation step and a second heat dissipation step that are spaced apart, and the first heat dissipation step and the second heat dissipation step are both protruding toward the circuit board assembly; the first heat dissipation step extends into the accommodating cavity and contacts the first heating element, and the second heat dissipation step extends into the accommodating cavity and contacts the second heating element.

[0015] In a possible embodiment, a heat conductor is arranged between the heat generating element and the heat dissipation step, and the heat conductor is used to conduct the heat generated by the heat generating element to the heat dissipation step; the heat conductor includes a first heat conductor and a second heat conductor, the first heat conductor is arranged between the first heat generating element and the first heat dissipation step, and the second heat conductor is arranged between the second heat generating element and the second heat dissipation step.

[0016] In a possible embodiment, the shell structure includes a first shell, a second shell and a sealing ring, the first shell and the second shell are covered and combined to form the accommodating cavity, and the sealing ring is arranged between the first shell and the second shell; the display screen is arranged on the side of the first shell facing away from the second shell; the circuit board assembly is arranged between the first shell and the second shell; the heat sink of a part of the heat dissipation assembly is arranged on the side of the second shell facing away from the first shell, and the heat dissipation step of the heat dissipation assembly passes through the second shell and extends into the accommodating cavity.

[0017] The heat dissipation protection structure for vehicle-mounted equipment provided by the present application is that the heat generated during the operation of the circuit board assembly will be conducted to the heat sink. By setting a heat insulation layer between the heat sink and the heat dissipation decorative part, on the one hand, the heat insulation effect of the heat insulation layer can reduce the heat conducted from the heat sink to the heat dissipation decorative part, and can avoid scalding the user due to the excessive temperature of the heat dissipation decorative part. In addition, the heat dissipation decorative part is provided with heat dissipation through holes, which is conducive to increasing the heat dissipation area of ​​the heat dissipation decorative part, thereby reducing the temperature of the heat dissipation decorative part. On the other hand, the heat insulation layer can reduce the external heat conducted to the heat sink through the heat dissipation decorative part, and then can reduce the external heat conducted to the electronic components on the circuit board assembly, and can prevent the environmental temperature from being too high and damaging the electronic components of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some implementation methods provided by the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is an assembly structure diagram of a heat dissipation protection structure for vehicle-mounted equipment provided by an embodiment of the present application;

[0020] Figure 2 This is a decomposed structural diagram of a heat dissipation protection structure of an on-vehicle device provided by an embodiment of the present application;

[0021] Figure 3 is a cross-sectional view of a heat dissipation protection structure of an on-vehicle device provided by an embodiment of the present application;

[0022] Figure 4 is a structural diagram of a circuit board assembly provided by an embodiment of the present application;

[0023] Figure 5 It is a decomposition structure diagram of a heat dissipation component provided in one embodiment of the present application. DETAILED DESCRIPTION

[0024] The technical solution of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described implementation methods are only part of the implementation methods of the present application, rather than all the implementation methods. Based on the implementation methods in the present application, all other implementation methods obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0025] The following descriptions of the embodiments are with reference to the attached diagrams to illustrate specific embodiments that the present application can be implemented in. The directional terms mentioned in the description of the present application, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "top surface", "side", "bottom surface", "top wall", "side wall", "bottom wall", "inner side wall", "circumferential side wall", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, the "connection" and "coupling" involved, unless otherwise specified, include direct connection (coupling) and indirect connection (coupling).

[0026] With the increase in consumer demand and the continuous development and optimization of agricultural machinery, agricultural machinery vehicle-mounted products have emerged. However, among the agricultural machinery vehicle-mounted products provided by the existing technology, the performance of the agricultural machinery vehicle-mounted products used in agricultural machinery is relatively high, resulting in relatively large power consumption of the entire agricultural machinery equipment. As CPU modules and 5G modules in agricultural machinery vehicle-mounted products, they generate a lot of heat. At the same time, agricultural machinery equipment needs to operate in high-temperature outdoor environments. Agricultural machinery vehicle-mounted products absorb the sun's ultraviolet rays, causing the surface temperature of the agricultural machinery equipment to be too high, and users will be burned when they touch the agricultural machinery equipment.

[0027] To solve the technical problems caused by the above-mentioned prior art:

[0028] The present application provides a heat dissipation protection structure for a vehicle-mounted device. The heat dissipation protection structure for the vehicle-mounted device provided by the present application includes but is not limited to applications in agricultural machinery equipment, engineering machinery equipment, traffic equipment, transportation equipment, mining equipment, industrial control equipment, medical equipment, etc., and the present application does not impose any restrictions on this.

[0029] See also Figure 1 , Figure 2 and Figure 3 , Figure 1 This is an assembly structure diagram of a heat dissipation protection structure for vehicle-mounted equipment provided by an embodiment of the present application. Figure 2 is a decomposed structural diagram of a heat dissipation protection structure of an on-vehicle device provided by an embodiment of the present application, Figure 3 It is a cross-sectional view of a heat dissipation protection structure of an in-vehicle device provided in one embodiment of the present application.

[0030] In one embodiment, taking the vehicle-mounted device heat dissipation protection structure 1000 as a display device as an example, the vehicle-mounted device heat dissipation protection structure 1000 includes a heat dissipation protection component 100, a housing structure 200, and a display screen 300. The housing structure 200 has a receiving cavity 201, a portion of the heat dissipation protection component 100 is received in the receiving cavity 201, another portion of the heat dissipation protection component 100 is disposed outside the receiving cavity 201, and the display screen 300 is disposed outside the receiving cavity 201.

[0031] The heat dissipation protection member 100 of the vehicle-mounted equipment heat dissipation protection structure 1000 includes a circuit board assembly 10 and a heat dissipation assembly 20. The circuit board assembly 10 is used to be electrically connected to the display screen 300. The heat dissipation assembly 20 is stacked with the circuit board assembly 10. The heat dissipation assembly 20 is used to dissipate heat from the circuit board assembly 10 to reduce damage to electronic components on the circuit board assembly 10 due to overheating, thereby ensuring that the circuit board assembly 10 can work normally. At the same time, the heat dissipation assembly 20 is also used to isolate the heat emitted by the circuit board assembly 10 to prevent the outside of the heat dissipation assembly 20 from overheating and scalding the user.

[0032] The shell structure 200 includes a first shell 202, a second shell 203 and a sealing member 204. The first shell 202 and the second shell 203 are covered and combined to form a receiving cavity 201. The sealing member 204 is clamped between the periphery of the first shell 202 on the side facing the second shell 203 and the periphery of the second shell 203 on the side facing the first shell 202, so that the receiving cavity 201 formed after the first shell 202 and the second shell 203 are covered has better sealing performance, thereby making the display screen 300 more waterproof.

[0033] The circuit board assembly 10 is arranged in the accommodating cavity 201 formed by the first shell 202 and the second shell 203, part of the heat dissipation assembly 20 is arranged on the side of the second shell 203 facing away from the first shell 202, and the other part of the heat dissipation assembly 20 passes through the second shell 203 and extends into the accommodating cavity 201 formed by the first shell 202 and the second shell 203. The display screen 300 is arranged on the side of the first shell 202 facing away from the second shell 203, and the display screen 300 is bonded and fixed to the first shell 202 by foam glue.

[0034] It should be understood that the assembly process of the vehicle-mounted equipment heat dissipation protection structure 1000 is as follows:

[0035] First, the display screen 300 is mounted on the side of the first housing 202 facing away from the second housing 203 , and is pressurized for 15 seconds using a pressure-maintaining fixture.

[0036] Then, the heat dissipation assembly 20 is installed on the side of the second housing 203 facing away from the first housing 202 , and the heat dissipation assembly 20 is locked to the second housing 203 by screws.

[0037] Then, the sealing member 204 is disposed on the side of the second housing 203 facing the first housing 202 .

[0038] Then, the circuit board assembly 10 is installed on the side of the second housing 203 facing the first housing 202 , and the circuit board assembly 10 is locked to the second housing 203 by screws.

[0039] Finally, the first housing 202 with the display screen 300 installed thereon is mounted on the second housing 203 with the heat dissipation assembly 20, the sealing member 204 and the circuit board assembly 10 installed thereon, and the first housing 202 and the second housing 203 are fixed by a screw locking process.

[0040] See also Figures 2 to 5 , Figure 4 is a structural diagram of a circuit board assembly provided in one embodiment of the present application, Figure 5 It is a decomposition structure diagram of a heat dissipation component provided in one embodiment of the present application.

[0041] In the heat dissipation protection structure 1000 of the vehicle-mounted equipment provided in this embodiment, the heat dissipation protection component 100 includes a circuit board assembly 10 and a heat dissipation assembly 20. The heat dissipation assembly 20 includes a heat sink 21, a heat dissipation decorative component 22 and a heat insulation layer 23. The heat sink 21 is stacked with the circuit board assembly 10, and the heat sink 21 is used to dissipate heat from the circuit board assembly 10. The heat dissipation decorative component 22 is arranged on the side of the heat sink 21 facing away from the circuit board assembly 10, and the heat dissipation decorative component 22 has a heat dissipation through hole 221 arranged along the stacking direction of the circuit board assembly 10 and the heat sink 21. The heat insulation layer 23 is arranged between the heat sink 21 and the heat dissipation decorative component 22, and the heat insulation layer 23 is used to insulate between the heat sink 21 and the heat dissipation decorative component 22.

[0042] The heat dissipation protection structure 1000 of the vehicle-mounted equipment provided by the present application is that the heat generated during the operation of the circuit board assembly 10 will be conducted to the heat sink 21. By setting a heat insulation layer 23 between the heat sink 21 and the heat dissipation decorative part 22, on the one hand, the heat insulation effect of the heat insulation layer 23 can reduce the heat conducted from the heat sink 21 to the heat dissipation decorative part 22, and can avoid scalding the user due to the excessive temperature of the heat dissipation decorative part 22. In addition, the heat dissipation decorative part 22 is provided with a heat dissipation through hole 221, which is in direct contact with the air, which can reduce the heat propagation path, help increase the heat dissipation area of ​​the heat dissipation decorative part 22, and then reduce the temperature of the heat dissipation decorative part 22. On the other hand, the heat insulation layer 23 can reduce the external heat from being conducted to the heat sink 21 through the heat dissipation decorative part 22, and then reduce the external heat from being conducted to the upper electronic components of the circuit board assembly 10, and can prevent the environmental temperature from being too high and damaging the electronic components of the circuit board assembly 10.

[0043] See also Figures 2 to 5In one embodiment, the circuit board assembly 10 of the heat dissipation protection component 100 includes a circuit board 11 and a heating element 12 disposed on the circuit board 11. The heat dissipation element 21 of the heat dissipation assembly 20 includes a heat dissipation step 211, which is protruding toward the circuit board assembly 10, and the heat dissipation step 211 passes through the second shell 203 of the shell structure 200 and extends into the accommodating cavity 201. The heating element 12 and the heat dissipation step 211 are arranged opposite to each other and spaced apart, and a heat conducting element 24 is arranged between the heating element 12 and the heat dissipation step 211, and the heat conducting element 24 is used to conduct the heat generated by the heating element 12 to the heat dissipation step 211. On the one hand, by the arrangement of the heat dissipation step 211, the distance between the heating element 12 and the heat dissipation element 21 is reduced, so that the heat generated by the heating element 12 is conducted to the heat dissipation step 211 of the heat dissipation element 21. On the other hand, by the arrangement of the heat conducting element 24, the speed at which the heat generated by the heating element 12 is conducted to the heat dissipation element 21 can be increased, thereby enabling the heating element 12 on the circuit board 11 to dissipate heat in a timely manner.

[0044] In a specific embodiment, the heating element 12 includes a first heating element 121 and a second heating element 122 that are spaced apart, and the first heating element 121 and the second heating element 122 are both arranged on the circuit board 11. Taking the application of the heat dissipation protection component 100 to a display device as an example, the first heating element 121 of the circuit board assembly 10 is a CPU module, and the second heating element 122 of the circuit board assembly 10 is a 5G module. It should be understood that the first heating element 121 and the second heating element 122 can be other electronic components or electronic modules, and this application does not limit this. The heat dissipation step 211 includes a first heat dissipation step 2111 and a second heat dissipation step 2112 that are spaced apart, and the first heat dissipation step 2111 and the second heat dissipation step 2112 are both protruding toward the circuit board assembly 10, and the first heat dissipation step 2111 and the second heat dissipation step 2112 are both penetrated through the second shell 203 of the shell structure 200 and extend into the accommodating cavity 201. The heat conducting member 24 includes a first heat conducting member 241 and a second heat conducting member 242 . The first heat conducting member 241 is disposed between the first heat generating member 121 and the first heat dissipation step 2111 , and the second heat conducting member 242 is disposed between the second heat generating member 122 and the second heat dissipation step 2112 .

[0045] In this embodiment, the first heat-conducting member 241 and the second heat-conducting member 242 are both thermally conductive gels. The air between the first heating element 121 and the first heat dissipation step 2111 is discharged through the thermally conductive gel, and the air between the second heating element 122 and the second heat dissipation step 2112 is discharged through the thermally conductive gel. This can reduce the barrier of air to the heat conduction between the first heating element 121 and the second heating element 122, which is beneficial to improving the heat dissipation efficiency and heat dissipation speed of the first heating element 121 and the second heating element 122.

[0046] It is understandable that in some other embodiments, the first heat-conducting member 241 and the second heat-conducting member 242 may be thermally conductive silicone, thermally conductive silicone grease, copper, etc., and the present application does not impose any limitation on this.

[0047] It is understandable that in some other embodiments, the first heat conductor 241 and the second heat conductor 242 can be omitted, the first heat dissipation member 21 is tightly fitted with the surface of the first heat dissipation step 2111, and the second heat dissipation member 21 is tightly fitted with the surface of the second heat dissipation step 2112. The present application does not impose any restrictions on this.

[0048] See also Figures 2 to 5 In one embodiment, the heat insulation layer 23 is aerogel, and the density of aerogel is only 3.55 kg / m 3 The density of aerogel is only 2.75 times that of air. The nanoporous mesh structure in the aerogel achieves heat insulation. By arranging aerogel between the heat sink 21 and the heat sink decorative part 22, on the one hand, the heat insulation effect of aerogel can reduce the heat conducted from the heat sink 21 to the heat sink decorative part 22, and can avoid scalding the user due to the excessive temperature of the heat sink decorative part 22. Moreover, the heat sink decorative part 22 is provided with a heat dissipation through hole 221, which is conducive to increasing the heat dissipation area of ​​the heat sink decorative part 22, thereby reducing the temperature of the heat sink decorative part 22. On the other hand, aerogel can reduce the external heat conducted to the heat sink 21 through the heat sink decorative part 22, and then reduce the external heat conducted to the electronic components on the circuit board assembly 10, which can prevent the environmental temperature from being too high and damaging the electronic components of the circuit board assembly 10.

[0049] It should be understood that in some other embodiments, the thermal insulation layer 23 may be a nanoporous structure of other materials, and the present application does not limit this.

[0050] See also Figures 2 to 5 In one embodiment, the number of heat dissipation through holes 221 on the heat dissipation decorative member 22 in the heat dissipation protection component 100 is multiple, and the multiple heat dissipation through holes 221 are arranged in an array on the heat dissipation decorative member 22. By arranging the multiple heat dissipation through holes 221 in a row, the heat dissipation area of ​​the heat dissipation component 20 can be increased, and at the same time, it is beneficial to improve the aesthetics of the heat dissipation protection component 100.

[0051] See also Figures 2 to 5In one embodiment, the thermal conductivity of the heat dissipation decorative element 22 in the heat dissipation protection component 100 is less than or equal to 0.2W / (M*K). By limiting the thermal conductivity of the heat dissipation decorative element 22 to be less than or equal to 0.2W / (M*K), the heat conduction from the heat dissipation element 21 to the heat dissipation decorative element 22 is reduced, so that the heat dissipation decorative element 22 will not be overheated, thereby reducing the risk of users being burned by touching the heat dissipation decorative element 22. It can be understood that the heat dissipation decorative element 22 provided in this embodiment includes but is not limited to being formed of materials such as plastic, asbestos, and silicate.

[0052] See also Figures 2 to 5 In one embodiment, the heat sink 21 in the heat dissipation protection component 100 has a recess 212 on the side facing away from the circuit board assembly 10, and the heat dissipation decorative component 22 and the heat insulation layer 23 are both arranged in the recess 212, so that the surface of the heat dissipation decorative component 22 on the side facing away from the heat sink 21 will not expose the recess 212 of the heat sink 21, which can make the overall volume of the heat dissipation protection component 100 smaller, which is conducive to the assembly of the heat dissipation protection component 100.

[0053] The above are some implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A heat dissipation protection structure for vehicle-mounted equipment, characterized in that: include: Circuit board assembly; as well as Heat dissipation components, including heat dissipation parts, heat dissipation decorative parts and heat insulation layers; The heat sink is stacked with the circuit board assembly, and the heat sink is used to dissipate heat from the circuit board assembly; the heat sink decorative component is arranged on the side of the heat sink facing away from the circuit board assembly, and the heat sink decorative component has heat dissipation through holes arranged along the stacking direction of the circuit board assembly and the heat sink; the heat insulation layer is arranged between the heat sink and the heat sink decorative component, and the heat insulation layer is used to insulate between the heat sink and the heat sink decorative component.

2. The heat dissipation protection structure for vehicle-mounted equipment according to claim 1, characterized in that: The heat insulation layer includes a nanoporous structure or an aerogel.

3. The vehicle-mounted equipment heat dissipation protection structure according to claim 1, characterized in that: There are multiple heat dissipation through holes, and the multiple heat dissipation through holes are arranged in an array on the heat dissipation decorative component.

4. The heat dissipation protection structure for vehicle-mounted equipment according to claim 1, characterized in that: The thermal conductivity of the heat dissipation decorative component is less than or equal to 0.2 W / (M*K).

5. The vehicle-mounted equipment heat dissipation protection structure according to claim 1, characterized in that: The heat sink has a recess on one side facing away from the circuit board assembly, and the heat sink decorative element and the heat insulation layer are both arranged in the recess.

6. The heat dissipation protection structure for vehicle-mounted equipment according to claim 1, characterized in that: The vehicle-mounted equipment heat dissipation protection structure also includes a shell structure and a display screen, the shell structure has a accommodating cavity, the display screen is arranged outside the accommodating cavity and is electrically connected to the circuit board assembly; the circuit board assembly is accommodated in the accommodating cavity, part of the heat dissipation assembly is arranged outside the accommodating cavity, and another part of the heat dissipation assembly extends into the accommodating cavity.

7. The heat dissipation protection structure for vehicle-mounted equipment according to claim 6, characterized in that: The circuit board assembly includes a circuit board and a heating element arranged on the circuit board; The heat sink of the heat dissipation assembly includes a heat dissipation step, which is protruding toward the circuit board assembly and extends into the accommodating cavity and contacts the heat sink.

8. The heat dissipation protection structure for vehicle-mounted equipment according to claim 7, characterized in that: The heating element comprises a first heating element and a second heating element which are arranged at intervals, and the first heating element and the second heating element are both arranged on the circuit board; The heat dissipation step includes a first heat dissipation step and a second heat dissipation step arranged at intervals, and the first heat dissipation step and the second heat dissipation step are both protruded toward the circuit board assembly; the first heat dissipation step extends into the accommodating cavity and contacts the first heat generating element, and the second heat dissipation step extends into the accommodating cavity and contacts the second heat generating element.

9. The heat dissipation protection structure for vehicle-mounted equipment according to claim 8, characterized in that: A heat conductor is arranged between the heat generating element and the heat dissipation step, and the heat conductor is used to conduct the heat generated by the heat generating element to the heat dissipation step; the heat conductor includes a first heat conductor and a second heat conductor, the first heat conductor is arranged between the first heat generating element and the first heat dissipation step, and the second heat conductor is arranged between the second heat generating element and the second heat dissipation step.

10. The heat dissipation protection structure for vehicle-mounted equipment according to claim 7, characterized in that: The housing structure comprises a first housing, a second housing and a sealing ring, wherein the first housing and the second housing are covered and combined to form the accommodating cavity, and the sealing ring is arranged between the first housing and the second housing; The display screen is arranged on a side of the first shell facing away from the second shell; The circuit board assembly is disposed between the first shell and the second shell; Part of the heat dissipation element of the heat dissipation assembly is arranged on a side of the second shell facing away from the first shell, and the heat dissipation step of the heat dissipation assembly penetrates the second shell and extends into the accommodating cavity.

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