Liquid cooling controller and vehicle

Abstract

The utility model discloses a liquid cooling controller and a vehicle. The liquid cooling controller comprises a liquid cooling plate, a liquid cooling flow channel, a liquid cooling flow channel cover plate and a heating element. The liquid cooling plate comprises a first surface, a second surface and a first side surface which are opposite; at least partial area of the first surface is recessed to form a liquid cooling flow channel, and the liquid cooling flow channel cover plate is arranged on the first surface; the first side surface is provided with an inlet and an outlet; the liquid cooling flow channel comprises a first flow channel, a second flow channel and a third flow channel, the first flow channel is communicated with the inlet, the second flow channel is communicated with the outlet, and the first flow channel and the second flow channel are communicated through the third flow channel; a flow guide rib is arranged at the joint of the first flow channel and the third flow channel; the heating element is in contact with the second surface, and the orthographic projection of the third flow channel on the second surface covers the orthographic projection of the heating element on the second surface; and / or, the heating element is in contact with the third surface, and the third surface is the surface of the side, away from the liquid cooling flow channel, of the liquid cooling flow channel cover plate. According to the liquid cooling controller, the temperature of the heating element on the circuit board can be efficiently reduced.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a liquid cooling controller and a vehicle. Background Art

[0002] With the rapid development of my country's automobile industry and the rapid development of automobile intelligence, people have higher and higher requirements for the level of automobile intelligence, especially the intelligent cockpit and autonomous driving are given more functions and higher integration. The corresponding cockpit and intelligent driving domain controller have higher and higher computing power and higher heat generation, so heat dissipation has become extremely important. Traditional heat dissipation methods, such as natural heat dissipation and fan forced air cooling, can no longer meet the heat dissipation requirements of high-computing chips in cockpits and intelligent driving domain controllers. Utility Model Content

[0003] The present application discloses a liquid cooling controller and a vehicle, which can quickly and efficiently reduce the temperature of heating elements on a circuit board by adopting liquid cooling to dissipate heat, thereby solving the problem that traditional fan forced air cooling cannot quickly cool high-power heating elements.

[0004] In order to achieve the above objectives, this application provides the following technical solutions:

[0005] A liquid cooling controller comprises a liquid cooling plate, a liquid cooling channel, a liquid cooling channel cover plate and a heating element;

[0006] The liquid cooling plate comprises a first surface and a second surface opposite to each other, and a first side surface connecting the first surface and the second surface;

[0007] At least a portion of the first surface of the liquid cooling plate is recessed to form the liquid cooling channel, and the liquid cooling channel cover plate is disposed on the first surface to cover the liquid cooling channel;

[0008] The first side of the liquid cooling plate is provided with an inlet and an outlet;

[0009] The liquid cooling channel includes a first channel, a second channel and a third channel, the first channel is connected to the inlet, the second channel is connected to the outlet, and the first channel and the second channel are connected through the third channel;

[0010] A first guide rib is provided at the connection between the first flow channel and the third flow channel, for introducing the cooling medium of the first flow channel into the third flow channel;

[0011] The heating element is in contact with the second surface, and the orthographic projection of the third flow channel on the second surface covers the orthographic projection of the heating element on the second surface;

[0012] And / or, the heating element is in contact with a third surface, and the third surface is a surface of a side of the liquid-cooling channel cover plate facing away from the liquid-cooling channel.

[0013] The above-mentioned liquid cooling controller cools down the heating element by means of liquid cooling. Specifically, the first surface of the liquid cooling plate of the present application is recessed to form a liquid cooling channel, and the liquid cooling channel cover plate covers the recessed area of ​​the liquid cooling plate to seal the liquid cooling channel. The cooling medium enters from the inlet, flows through the first channel, the third channel and the second channel in sequence, and flows out from the outlet to take away the heat of the heating element through the cooling medium, thereby achieving the cooling of the high-power heating element. A first guide rib is provided at the connection between the first channel and the third channel. The length direction of the first guide rib is parallel to the normal direction of the first side surface, which reduces the radial dimension of the connection between the first channel and the third channel. When the cooling medium enters the third channel from the first channel, the cooling medium can slowly enter the third channel, prolonging the residence time of the cooling medium in the third channel and increasing the heat dissipation effect. At the same time, the heating element is in contact with the second surface of the liquid cooling plate, and the orthographic projection of the third flow channel on the second surface is greater than or equal to the orthographic projection of the heating element on the second surface, that is, the third flow channel is the main contact part of the heating element, and the contact area with the heating element is the largest. The storage flow of the cooling medium in the third flow channel is larger, which can effectively ensure the flow rate and flow rate of the cooling medium in the heating element area, so that the third flow channel can fully absorb the heat generated by the heating element.

[0014] The heating element of the present application may also include a heating element in contact with the third surface of the liquid-cooling channel cover plate, that is, the heating element in contact with the second surface of the liquid-cooling plate shares a liquid-cooling plate. With this arrangement, the cooling medium of the liquid-cooling channel can simultaneously dissipate heat for the heating elements on both sides of the liquid-cooling plate, meeting the current requirements for the heat dissipation capabilities of highly integrated cockpits and intelligent driving domain controllers. The domain controller of the present application, through an integrated design, not only solves the heat dissipation problem of high-power intelligent cockpit heating elements and intelligent driving heating elements, but also has a compact structural design, reduces manufacturing costs and assembly space, and has great practical and economic value.

[0015] In some embodiments, the first flow channel includes a first segment, a second segment, and a third segment;

[0016] The first section is connected to the inlet, the third section is connected to the third flow channel, and the first section and the third section both extend along the first direction; the first section and the third section are connected through the second section, and the second section and the second direction form an angle with the opening facing the second flow channel; wherein the first direction is the normal direction of the first side surface, and the plane defined by the first direction and the second direction is parallel to the second surface;

[0017] and / or, the second flow channel includes a fourth section, a fifth section and a sixth section;

[0018] The fourth section is connected to the outlet, the sixth section is connected to the third flow channel, and the fourth section and the sixth section both extend along the first direction; the fourth section and the sixth section are connected through the fifth section, and the fifth section forms an angle with the second direction in which the opening is away from the first flow channel.

[0019] In some embodiments, the third flow channel extends along the second direction, and a radial dimension of the third flow channel is greater than a radial dimension of the first flow channel, and a radial dimension of the third flow channel is greater than a radial dimension of the second flow channel.

[0020] In some embodiments, a bottom wall of the third flow channel is provided with a plurality of second guide ribs, and the plurality of second guide ribs are arranged in an array.

[0021] In some embodiments, the controller further includes a circuit board, the circuit board is fixedly mounted on the second surface of the liquid cooling plate, and the heating element is fixedly mounted on a side of the circuit board facing the second surface;

[0022] And / or, the circuit board is fixedly arranged on the first surface of the liquid cooling plate, and the heating element is fixedly arranged on the side of the circuit board facing the first surface.

[0023] In some embodiments, a first heat-conducting boss is disposed on the second surface, and the heating element and the first heat-conducting boss are in contact and heat-conducted through a first heat-conducting layer;

[0024] And / or, a second heat-conducting boss is disposed on the third surface, and the heat-generating element contacts and conducts heat with the second heat-conducting boss via a second heat-conducting layer.

[0025] In some embodiments, the controller further comprises a controller cover plate, wherein the controller cover plate is disposed on a side of the circuit board away from the liquid cooling plate;

[0026] A third heat-conducting boss is disposed on a surface of the controller cover plate on one side facing the circuit board, and the third heat-conducting boss contacts the circuit board for heat conduction.

[0027] In some embodiments, the second heat-conducting boss is in heat-conducting contact with the circuit board via a second heat-conducting layer.

[0028] In some embodiments, the liquid cooling channel cover plate is welded to the liquid cooling plate.

[0029] The present application also provides a vehicle, comprising the liquid cooling controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 An exploded diagram of a liquid cooling controller provided in an embodiment of the present application;

[0031] Figure 2 A schematic diagram of the structure of a liquid cooling channel provided in an embodiment of the present application;

[0032] Figure 3 A schematic diagram of the structure of a liquid cooling controller provided in an embodiment of the present application;

[0033] Figure 4 A schematic diagram of a top view of a liquid cooling controller provided in an embodiment of the present application;

[0034] Figure 5 An exploded diagram of another liquid cooling controller provided in an embodiment of the present application;

[0035] Figure 6 An exploded diagram of another liquid cooling controller provided in an embodiment of the present application;

[0036] Figure 7 A schematic diagram of the structure of another liquid cooling controller provided in an embodiment of the present application;

[0037] Figure 8 A schematic diagram of the structure of another liquid cooling controller provided in an embodiment of the present application.

[0038] Icons: 1. Liquid cooling plate; 2. Liquid cooling channel; 3. Liquid cooling channel cover; 4. Inlet; 5. Outlet; 6. First guide rib; 7. Second guide rib; 8. Circuit board; 81. First circuit board; 82. Second circuit board; 9. First thermal conductive layer; 10. Controller cover; 101. First controller cover; 102. Second controller cover; 11. Third thermal conductive boss; 12. Antenna cover; 21. First channel; 22. Second channel; 23. Third channel; 211. First section; 212. Second section; 213. Third section; 221. Fourth section; 222. Fifth section; 223. Sixth section; 01. First heating element; 02. First thermal conductive boss; 03. Second thermal conductive boss. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application. Among them, in the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in the text is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, "multiple" refers to two or more than two.

[0040] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as suggesting or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features, and in the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more.

[0041] First, as Figure 1-Figure 4 As shown, an embodiment of the present application provides a liquid cooling controller, including a liquid cooling plate 1, a liquid cooling channel 2, a liquid cooling channel cover plate 3 and a heating element;

[0042] The liquid cooling plate 1 comprises a first surface and a second surface opposite to each other, and a first side surface connecting the first surface and the second surface;

[0043] At least a portion of the first surface of the liquid cooling plate 1 is recessed to form a liquid cooling channel 2, and a liquid cooling channel cover plate 3 is disposed on the first surface to cover the liquid cooling channel 2;

[0044] The first side of the liquid cooling plate 1 is provided with an inlet 4 and an outlet 5;

[0045] The liquid cooling channel 2 includes a first channel 21, a second channel 22 and a third channel 23. The first channel 21 is connected to the inlet 4, the second channel 22 is connected to the outlet 5, and the first channel 21 and the second channel 22 are connected through the third channel 23.

[0046] A first guide rib 6 is provided at the connection between the first flow channel 21 and the third flow channel 23, for introducing the cooling medium of the first flow channel 21 into the third flow channel 23;

[0047] The heating element is in contact with the second surface, and the orthographic projection of the third flow channel 23 on the second surface covers the orthographic projection of the heating element on the second surface. The meaning of covering is that the orthographic projection of the third flow channel 23 on the second surface is greater than the orthographic projection of the heating element on the second surface, or the orthographic projection of the third flow channel 23 on the second surface is equal to the orthographic projection of the heating element on the second surface.

[0048] In one possible implementation, refer to Figure 1 and Figure 2 ,by Figure 1 In the orientation shown, the first surface is the upper surface of the liquid cooling plate 1, and the second surface is the lower surface of the liquid cooling plate 1. Figure 2 The upper surface of the liquid cooling plate 1 is concave to form a liquid cooling channel 2, and the liquid cooling channel cover plate 3 covers the concave area of ​​the liquid cooling plate 1 to seal the liquid cooling channel 2. The cooling medium enters from the inlet 4, flows through the first channel 21, the third channel 23 and the second channel 22 in sequence, and flows out from the outlet 5, so that the heat of the heating element is taken away by the cooling medium, thereby achieving the cooling of the high-power heating element. A first guide rib 6 is provided at the connection between the first channel 21 and the third channel 23. The length direction of the first guide rib 6 is parallel to the normal direction of the first side surface, which reduces the radial dimension of the connection between the first channel 21 and the third channel 23. When the cooling medium enters the third channel 23 from the first channel 21, the cooling medium can slowly enter the third channel 23, prolonging the residence time of the cooling medium in the third channel 23 and increasing the heat dissipation effect. At the same time, the heating element contacts the second surface (lower surface) of the liquid cooling plate 1, and the orthographic projection of the third flow channel 23 on the second surface is greater than or equal to the orthographic projection of the heating element on the second surface, that is, the third flow channel 23 is the main contact part of the heating element, and the contact area with the heating element is the largest. The storage flow of the cooling medium in the third flow channel 23 is larger, which can effectively ensure the flow rate and flow of the cooling medium in the heating element area, so that the third flow channel 23 can fully absorb the heat generated by the heating element. It should be noted that the liquid cooling channel cover plate 3 of the embodiment of the present application is welded together with the liquid cooling plate 1 by a stir friction welding process, which has a simple manufacturing process, a firm and reliable structure, and a good sealing effect.

[0049] In some embodiments, the first flow channel 21 includes a first section 211 , a second section 212 , and a third section 213 ;

[0050] The first section 211 is connected to the inlet 4, and the third section 213 is connected to the third flow channel 23. The first section 211 and the third section 213 both extend along the first direction. The first section 211 and the third section 213 are connected through the second section 212. The second section 212 forms an angle with the second direction with the opening facing the second flow channel 22. The first direction is the normal direction of the first side surface, and the plane determined by the first direction and the second direction is parallel to the second surface.

[0051] and / or, the second flow channel 22 includes a fourth section 221, a fifth section 222 and a sixth section 223;

[0052] The fourth section 221 is connected to the outlet 5, and the sixth section 223 is connected to the third flow channel 23. The fourth section 221 and the sixth section 223 both extend along the first direction. The fourth section 221 and the sixth section 223 are connected through the fifth section 222, and the fifth section 222 forms an angle with the second direction with the opening away from the first flow channel 21.

[0053] In one possible implementation, refer to Figure 2 The second section 212 of the first flow channel 21 forms an angle with the second direction, with the purpose of slowing down the speed of the cooling medium when the cooling medium enters the first flow channel 21 from the inlet 4, and avoiding the instantaneous entry of the fluid into the first flow channel 21; at the same time, the fifth section 222 of the second flow channel 22 forms an angle with the second direction, with the purpose of slowing down the flow rate of the cooling medium when the cooling medium flows out through the second flow channel 22, increasing the residence time of the cooling medium in the third flow channel 23, maximizing the heat transfer of the heat of the heating element to the cooling medium in the third flow channel 23, and improving the heat dissipation efficiency.

[0054] In some embodiments, the third flow channel 23 extends along the second direction, and a radial dimension of the third flow channel 23 is greater than a radial dimension of the first flow channel 21 , and a radial dimension of the third flow channel 23 is greater than a radial dimension of the second flow channel 22 .

[0055] In one possible implementation, refer to Figure 2 , the liquid cooling channel 2 is U-shaped, and the radial dimension of the third channel 23 is larger than that of the first channel 21 and the second channel 22, that is, the volume of the third channel 23 is larger than that of the first channel 21 and the second channel 22. In this way, the contact area between the heating element and the third channel 23 is larger, and the storage volume of the cooling medium in the third channel 23 is larger. At the same time, due to the increase in the radial dimension from the first channel 21 to the third channel 23, the flow rate of the cooling medium after entering the third channel 23 will be reduced, thereby extending the residence time of the cooling medium in the third channel 23, so that the cooling medium can fully absorb the heat generated by the heating element and increase the heat dissipation effect.

[0056] In some embodiments, a plurality of second guide ribs 7 are disposed on the bottom wall of the third flow channel 23 , and the plurality of second guide ribs 7 are arranged in an array.

[0057] In one possible implementation, refer to Figure 2In order to further increase the heat dissipation effect and drainage effect, the embodiment of the present application is provided with a plurality of second guide ribs 7 on the bottom wall of the third channel 23. The second guide ribs 7 are directly opposite to the heating element area, the length direction of the second guide ribs 7 is parallel to the second direction, and the plurality of second guide ribs 7 are distributed in an array along the second direction, parallel to the flow direction of the cooling medium. It should be noted that the second guide ribs 7 are made of metal, so the second guide ribs also have a heat conduction effect. By increasing the second guide ribs 7, the contact area between the cooling medium and the second guide ribs 7 made of metal in the third flow channel 23 can be increased, the heat dissipation effect can be improved, and the overall utilization rate of the liquid cooling plate can be higher. At the same time, the plurality of second guide ribs 7 are distributed in an array, which increases the drainage and diversion effect, reduces the local pressure of the cooling medium, and can quickly guide the heat generated by the heating element along the second guide ribs 7, thereby improving the heat dissipation effect and avoiding the problem that the heat accumulates in the third flow channel 23 and cannot be quickly dissipated. It should be noted that the second guide ribs 7 in the embodiment of the present application can be in a variety of shapes, such as cylindrical, quadrangular, trapezoidal, etc.

[0058] In some embodiments, the liquid cooling controller further includes a circuit board 8, the circuit board 8 is fixedly mounted on the second surface of the liquid cooling plate 1, and the heating element is fixedly mounted on the side of the circuit board 8 facing the second surface.

[0059] In one possible implementation, refer to Figure 1 The circuit board 8 of the embodiment of the present application is fixed on the second surface of the liquid cooling plate 1. For example, the circuit board 8 is fixed on the liquid cooling plate 1 by screws. The heating element is fixed on the side of the circuit board 8 facing the second surface, so that the heating element contacts the liquid cooling plate 1 to achieve better heat dissipation.

[0060] In some embodiments, a first heat-conducting boss is disposed on the second surface, and the heat-generating element contacts and conducts heat with the first heat-conducting boss through the first heat-conducting layer 9 .

[0061] In one possible implementation, a first heat-conducting boss (not shown in the figure) is provided on the second surface of the liquid cooling plate 1, and a first heat-conducting layer 9 is provided between the first heat-conducting boss and the heating element. The heat generated by the heating element is transferred to the first heat-conducting boss of the liquid cooling plate 1 through the first heat-conducting layer 9. The first heat-conducting boss is in contact with the liquid cooling channel 2, and the cooling medium flows through the liquid cooling channel 2 to take away the heat.

[0062] In some embodiments, the liquid cooling controller further includes a controller cover 10, and the controller cover 10 is disposed on a side of the circuit board 8 away from the liquid cooling plate 1;

[0063] A third heat-conducting boss 11 is disposed on one side of the controller cover 10 facing the circuit board 8 , and the third heat-conducting boss 11 contacts the circuit board 8 for heat conduction.

[0064] In one possible implementation, refer to Figure 1The heat of the heating element on the circuit board 8 can also be transferred to the controller cover 10 through the third heat-conducting boss 11 on the controller cover 10, thereby further achieving heat dissipation and improving the heat dissipation effect.

[0065] In some embodiments, the third heat-conducting boss 11 is in heat-conducting contact with the circuit board 8 via a third heat-conducting layer.

[0066] In one possible implementation, refer to Figure 1 The heat of the heating element on the circuit board 8 can also be transferred to the third heat-conducting boss 11 of the controller cover 10 through the third heat-conducting layer (not shown in the figure), further improving the heat dissipation effect. It should be noted that the first heat-conducting layer 9 and the third heat-conducting layer are heat-conducting interface materials, such as heat-conducting silicone.

[0067] Reference Figure 3-Figure 4 The liquid cooling controller of the embodiment of the present application also includes an antenna cover 12, which is made of plastic and is fixed to the liquid cooling plate 1 and the controller cover 10 by a snap-on structure and screws to shield internal components.

[0068] Second, as Figure 5-Figure 8 As shown, the embodiment of the present application also provides another liquid cooling controller, including a liquid cooling plate 1, a liquid cooling channel 2, a liquid cooling channel cover plate 3 and a heating element;

[0069] The liquid cooling plate 1 comprises a first surface and a second surface opposite to each other, and a first side surface connecting the first surface and the second surface;

[0070] At least a portion of the first surface of the liquid cooling plate 1 is recessed to form a liquid cooling channel 2, and a liquid cooling channel cover plate 3 is disposed on the first surface to cover the liquid cooling channel 2;

[0071] The first side of the liquid cooling plate 1 is provided with an inlet 4 and an outlet 5;

[0072] The liquid cooling channel 2 includes a first channel 21, a second channel 22 and a third channel 23. The first channel 21 is connected to the inlet 4, the second channel 22 is connected to the outlet 5, and the first channel 21 and the second channel 22 are connected through the third channel 23.

[0073] A first guide rib 6 is provided at the connection between the first flow channel 21 and the third flow channel 23, for introducing the cooling medium of the first flow channel 21 into the third flow channel 23;

[0074] The heating element is in contact with the second surface, and the orthographic projection of the third flow channel 23 on the second surface covers the orthographic projection of the heating element on the second surface. The meaning of covering is that the orthographic projection of the third flow channel 23 on the second surface is greater than the orthographic projection of the heating element on the second surface, or the orthographic projection of the third flow channel 23 on the second surface is equal to the orthographic projection of the heating element on the second surface;

[0075] And / or, the heating element is in contact with a third surface, and the third surface is a surface of a side of the liquid-cooling channel cover plate 3 facing away from the liquid-cooling channel 2 .

[0076] Another possible implementation method is to refer to Figure 5 and Figure 6 , the heating element includes a first heating element 01 in contact with the second surface of the liquid-cooling plate 1 and a second heating element (not shown in the figure) in contact with the third surface of the liquid-cooling channel cover plate 3, that is, the first heating element 01 and the second heating element share a liquid-cooling plate 1, and the third channel 23 of the liquid-cooling channel 2 is the main contact part of the first heating element 01 and the second heating element, which is used to fully absorb the heat generated by the first heating element 01 and the second heating element. In this way, the cooling medium of the liquid-cooling channel 2 can simultaneously dissipate heat for the first heating element 01 and the second heating element on both sides of the liquid-cooling plate 1, meeting the current requirements for the heat dissipation capacity of highly integrated controllers. The liquid-cooled controller of the present application solves the heat dissipation problem of high-power intelligent cockpit heating elements and intelligent driving heating elements through an integrated design, and the structural design is compact, which reduces the manufacturing cost and assembly space, and has great practical value and economic value.

[0077] In other embodiments, referring to Figure 5 and Figure 6 The structural features of the liquid cooling channel 2 of the liquid cooling controller of the second aspect are the same as those of the liquid cooling channel 2 of the first aspect, and will not be repeated here.

[0078] In some other embodiments, the liquid cooling controller further comprises a circuit board 8, the circuit board 8 is fixedly mounted on the second surface of the liquid cooling plate 1, and the heating element is fixedly mounted on the side of the circuit board 8 facing the second surface;

[0079] And / or, the circuit board 8 is fixedly mounted on the first surface of the liquid cooling plate 1, and the heating element is fixedly mounted on the side of the circuit board 8 facing the first surface.

[0080] Another possible implementation method is to refer to Figure 5 and Figure 6 The circuit board 8 includes a first circuit board 81 fixed on the second surface of the liquid cooling plate 1 and a second circuit board 82 fixed on the first surface of the liquid cooling plate 1. The first circuit board 81 and the second circuit board 82 are fixed on both sides of the liquid cooling plate 1 by screws. The first heating element 01 is fixed on the side of the first circuit board 81 facing the second surface, and the second heating element is fixed on the side of the second circuit board 82 facing the first surface, so that both the first heating element 01 and the second heating element are in contact with the liquid cooling plate 1, so as to better realize the heat dissipation of the integrated heating element.

[0081] In some other embodiments, a first heat-conducting boss is provided on the second surface, and the heating element and the first heat-conducting boss are in contact and heat-conducted through the first heat-conducting layer 9;

[0082] And / or, a second heat-conducting boss is arranged on the third surface, and the heat-generating element contacts and conducts heat with the second heat-conducting boss through the second heat-conducting layer.

[0083] Another possible implementation method is to refer to Figure 5 and Figure 6 , a first heat-conducting boss 02 is provided on the second surface of the liquid-cooling plate 1, and a first heat-conducting layer (not shown in the figure) is provided between the first heat-conducting boss 02 and the first heating element 01, a second heat-conducting boss 03 is provided on the third surface of the liquid-cooling channel cover plate 3, and a second heat-conducting layer (not shown in the figure) is provided between the second heat-conducting boss 03 and the second heating element. The heat generated by the operation of the first heating element 01 is transferred to the first heat-conducting boss 02 of the liquid-cooling plate 1 through the first heat-conducting layer, and the heat generated by the operation of the second heating element is transferred to the second heat-conducting boss 03 of the liquid-cooling channel cover plate 3 through the second heat-conducting layer. Both the first heat-conducting boss 02 and the second heat-conducting boss 03 are in contact with the liquid-cooling channel 2. The cooling medium flows through the liquid-cooling channel 2 to take away the differential heat generated by the first heating element 01 and the second heating element, thereby realizing heat dissipation of the integrated heating element.

[0084] In some other embodiments, the liquid cooling controller further includes a controller cover 10, and the controller cover 10 is disposed on a side of the circuit board 8 facing away from the liquid cooling plate 1;

[0085] A third heat-conducting boss 11 is disposed on one side of the controller cover 10 facing the circuit board 8 , and the third heat-conducting boss 11 contacts the circuit board 8 for heat conduction.

[0086] Another possible implementation method is to refer to Figure 5 and Figure 6 The controller cover 10 includes a first controller cover 101 and a second controller cover 102. The first controller cover 101 is arranged on the side of the first circuit board 81 away from the liquid cooling plate 1, and the second controller cover 102 is arranged on the side of the second circuit board 82 away from the liquid cooling plate 1. A third heat-conducting boss 11 is provided on the surface of the first controller cover 101 facing the first circuit board 81, and the third heat-conducting boss 11 is in contact with the first circuit board 81 for heat conduction; a fourth heat-conducting boss (not shown in the figure) is provided on the surface of the second controller cover 102 facing the second circuit board 82 for heat conduction. In other words, the heat generated by the first heating element 01 on the first circuit board 81 is transferred to the first controller cover 101 through the third heat-conducting boss 11, and the heat generated by the second heating element on the second circuit board 82 is transferred to the second controller cover 102 through the fourth heat-conducting boss, further realizing the heat dissipation of the integrated heating element and improving the heat dissipation effect.

[0087] In some other embodiments, the third heat-conducting boss 11 is in heat-conducting contact with the circuit board 8 via a third heat-conducting layer.

[0088] Another possible implementation method is to refer to Figure 5 and Figure 6 The third heat-conducting boss 11 of the first controller cover 101 is in contact with the first circuit board 81 through a third heat-conducting layer (not shown in the figure) for heat conduction, and the fourth heat-conducting boss of the second controller cover 102 is in contact with the second circuit board 82 through a fourth heat-conducting layer (not shown in the figure) for heat conduction, thereby improving the heat dissipation effect of the integrated heating element.

[0089] Reference Figure 7-Figure 8 Another liquid cooling controller of the embodiment of the present application also includes an antenna cover 12, which is made of plastic and is fixed to the liquid cooling plate 1 and the controller cover 10 by a snap-on structure and screws to shield internal components.

[0090] It should be noted that the heating element of the embodiment of the present application is a high-computing system-on-chip (System OnChip, SOC for short), which can integrate the panoramic monitoring imaging system (Around View Monitor, AVM for short), the body system advanced driving assistance system (Advanced Driving Assistance System, ADAS for short), the head-up display device (Head-up Display, HUD for short), the driver monitoring system (Driver Monitoring System, DMS for short), the passenger monitoring system (Occupancy Monitoring System, OMS for short), the central main screen, the co-pilot screen and the left and right camera monitoring system (Camera Monitor System, CMS for short) display screen data, etc.

[0091] In a third aspect, the present application also provides a vehicle, including the liquid cooling controller of the first aspect and the second aspect. Since the vehicle includes all the technical features of the liquid cooling controller, the vehicle also includes all the beneficial effects of the liquid cooling controller, which will not be repeated here.

[0092] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A liquid cooling controller, characterized in that: It includes a liquid cooling plate, a liquid cooling channel, a liquid cooling channel cover plate and a heating element; The liquid cooling plate comprises a first surface and a second surface opposite to each other, and a first side surface connecting the first surface and the second surface; At least a portion of the first surface of the liquid cooling plate is recessed to form the liquid cooling channel, and the liquid cooling channel cover plate is disposed on the first surface to cover the liquid cooling channel; The first side of the liquid cooling plate is provided with an inlet and an outlet; The liquid cooling channel includes a first channel, a second channel and a third channel, the first channel is connected to the inlet, the second channel is connected to the outlet, and the first channel and the second channel are connected through the third channel; A first guide rib is provided at the connection between the first flow channel and the third flow channel, for introducing the cooling medium of the first flow channel into the third flow channel; The heating element is in contact with the second surface, and the orthographic projection of the third flow channel on the second surface covers the orthographic projection of the heating element on the second surface; And / or, the heating element is in contact with a third surface, and the third surface is a surface of a side of the liquid-cooling channel cover plate facing away from the liquid-cooling channel.

2. The liquid cooling controller according to claim 1, characterized in that: The first flow channel includes a first section, a second section and a third section; The first section is connected to the inlet, the third section is connected to the third flow channel, and the first section and the third section both extend along the first direction; the first section and the third section are connected through the second section, and the second section and the second direction form an angle with the opening facing the second flow channel; wherein the first direction is the normal direction of the first side surface, and the plane defined by the first direction and the second direction is parallel to the second surface; and / or, the second flow channel includes a fourth section, a fifth section and a sixth section; The fourth section is connected to the outlet, the sixth section is connected to the third flow channel, and the fourth section and the sixth section both extend along the first direction; the fourth section and the sixth section are connected through the fifth section, and the fifth section forms an angle with the second direction in which the opening is away from the first flow channel.

3. The liquid cooling controller according to claim 1, characterized in that: The third flow channel extends along the second direction, and a radial dimension of the third flow channel is greater than a radial dimension of the first flow channel, and a radial dimension of the third flow channel is greater than a radial dimension of the second flow channel.

4. The liquid cooling controller according to claim 3, characterized in that: The bottom wall of the third flow channel is provided with a plurality of second flow guide ribs, and the plurality of second flow guide ribs are arranged in an array.

5. The liquid cooling controller according to claim 1, characterized in that: The controller further comprises a circuit board, the circuit board is fixedly mounted on the second surface of the liquid cooling plate, and the heating element is fixedly mounted on a side of the circuit board facing the second surface; And / or, the circuit board is fixedly arranged on the first surface of the liquid cooling plate, and the heating element is fixedly arranged on the side of the circuit board facing the first surface.

6. The liquid cooling controller according to claim 5, characterized in that: A first heat-conducting boss is disposed on the second surface, and the heating element is in contact with the first heat-conducting boss through a first heat-conducting layer for heat conduction; And / or, a second heat-conducting boss is disposed on the third surface, and the heat-generating element contacts and conducts heat with the second heat-conducting boss via a second heat-conducting layer.

7. The liquid cooling controller according to claim 5, characterized in that: The controller further comprises a controller cover plate, wherein the controller cover plate is arranged on a side of the circuit board away from the liquid cooling plate; A third heat-conducting boss is disposed on a surface of the controller cover plate on one side facing the circuit board, and the third heat-conducting boss contacts the circuit board for heat conduction.

8. The liquid cooling controller according to claim 7, characterized in that: The third heat-conducting boss is in contact with the circuit board for heat conduction via a third heat-conducting layer.

9. The liquid cooling controller according to claim 1, characterized in that: The liquid cooling channel cover plate is welded to the liquid cooling plate.

10. A vehicle, characterized in that: Comprising a liquid cooling controller as described in any one of claims 1-9.

Images