Switching power supply of servo motor

Abstract

The utility model relates to the technical field of motor switching power supplies, and more specifically relates to a switching power supply of a servo motor, comprising a housing provided with a plurality of heat dissipation holes; the driving board is fixedly arranged in the shell and is provided with an external power supply, a wiring port for outputting voltage, a transformer and an integrated chip; the heat dissipation assembly is fixedly arranged on the driving board; and the heat conduction assembly is respectively abutted against the heat dissipation assembly, the transformer and the chip and is used for conducting heat dissipated by the transformer and the chip to the heat dissipation assembly. According to the switching power supply of the servo motor, through cooperation of the heat conduction assembly and the heat dissipation assembly, heat conduction and heat dissipation are carried out on the chip and the transformer of the power supply, so that the probability of thermal damage of the chip and the transformer due to overhigh heat can be reduced; the problem that in the prior art, a fan and cooling fins on a switching power supply are poor in cooling effect is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of motor switching power supplies, and more specifically, to a switching power supply for a servo motor. Background Art

[0002] A switching power supply is a power supply that uses modern power electronics technology to control the on-off time ratio of the switch tube to maintain a stable output voltage. It is widely used in industrial automation control, military equipment, scientific research equipment, power equipment and other fields.

[0003] The switching power supply is generally composed of four parts: the main circuit, the control circuit, the detection circuit, and the auxiliary power supply. Specifically, the driver board of the switching power supply is usually equipped with an EMC area, an input rectifier and filter area, a control area, a transformer area, a feedback area, and an output rectifier and filter area. With the development of modern intelligent control and digitalization, the requirements for the amplitude and frequency of the output voltage of the switching power supply are gradually increasing. The transformer area and the control area of ​​the switching power supply may be accompanied by heat generation during the rectification process, which also makes these two areas vulnerable to damage.

[0004] In the prior art, heat is often dissipated by arranging a fan or a heat sink on the driving board, but the effect is often poor. Therefore, it is necessary to design a switching power supply for a servo motor with good heat dissipation effect. Utility Model Content

[0005] The main purpose of the utility model is to provide a switching power supply for a servo motor, aiming to solve the problem of poor heat dissipation effect of a fan and a heat sink on the switching power supply in the prior art.

[0006] In order to solve the above technical problems, a switching power supply for a servo motor is proposed, comprising: a housing provided with a plurality of heat dissipation holes;

[0007] A driving board is fixedly arranged in the housing, provided with a connection port for an external power supply and an output voltage, a transformer and an integrated chip;

[0008] A heat dissipation component is fixedly arranged on the driving board;

[0009] The heat-conducting component is respectively in contact with the heat-dissipating component, the transformer and the chip, and is used for conducting the heat dissipated by the transformer and the chip to the heat-dissipating component.

[0010] In any of the above technical solutions, further, the heat conducting component includes:

[0011] A first heat absorbing member is fixedly disposed on the driving board and is disposed corresponding to the chip;

[0012] A second heat absorbing member is fixedly disposed on the driving board and disposed between the driving board and the transformer;

[0013] A first heat-conducting member, two ends of which are respectively connected to the first heat-absorbing member and the heat-dissipating assembly;

[0014] The second heat conducting member has two ends connected to the second heat absorbing member and the heat dissipating component respectively.

[0015] In any of the above technical solutions, further, the heat conducting component also includes:

[0016] A third heat absorbing member is fixedly disposed on a side of the chip away from the driving board;

[0017] The third heat-conducting member has two ends connected to the third heat-absorbing member and the heat-dissipating component respectively.

[0018] In any of the above technical solutions, further, the first heat absorption member is configured in a ring shape, and the chip is located inside the first heat absorption member.

[0019] In any of the above technical solutions, further, the driving board is provided with a groove adapted to the first heat absorbing member, and the first heat absorbing member is arranged in the groove.

[0020] In any of the above technical solutions, further, the first heat absorbing component is hollow and sealed, and is filled with coolant.

[0021] In any of the above technical solutions, further, the heat dissipation component includes:

[0022] A heat dissipation base, fixedly disposed on the driving board and connected to the heat conducting component;

[0023] A plurality of heat sinks are evenly arranged on a side of the heat sink base away from the driving board.

[0024] In any of the above technical solutions, further, the heat dissipation base is symmetrically arranged in two relative to the transformer, a plurality of heat sinks are respectively arranged on the two heat dissipation bases, and the heat conduction component is respectively connected to the two heat dissipation bases.

[0025] In any of the above technical solutions, further, a heat insulation layer is provided between the heat dissipation base and the driving board.

[0026] The beneficial effects are:

[0027] 1. The switching power supply of the servo motor of the present invention conducts the heat from the transformer and the chip to the heat dissipation component by setting a heat conduction component. On the one hand, it can improve the heat conduction efficiency of the main heat-generating components in the switching power supply, on the other hand, it can quickly dissipate the heat from the heat-generating components through the heat dissipation component, and on the other hand, it can reduce the thermal impact of the main heat-generating components on the other components on the driver board;

[0028] 2. Through the cooperation of thermal conductive components and heat dissipation components, heat conduction and heat dissipation can be carried out for chips and transformers, which can also reduce the probability of thermal damage to chips and transformers due to excessive heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 It is a three-dimensional structural schematic diagram of a switching power supply of a servo motor of the utility model;

[0031] Figure 2 It is a partial structural schematic diagram of a switching power supply of a servo motor of the utility model;

[0032] Figure 3 It is a schematic diagram of the top view of a switching power supply of a servo motor of the utility model;

[0033] Figure 4 The utility model is a three-dimensional structural schematic diagram of a heat-conducting component and a heat-dissipating base of a switching power supply of a servo motor.

[0034] The following are the descriptions of the reference numerals:

[0035] 1. Shell;

[0036] 2. Driver board; 201. Transformer; 202. Chip;

[0037] 3. heat dissipation assembly; 301. heat dissipation base; 302. heat sink;

[0038] 4. Heat-conducting component; 401. First heat-absorbing component; 402. Second heat-absorbing component; 403. First heat-conducting component; 404. Second heat-conducting component; 405. Third heat-absorbing component; 406. Third heat-conducting component. DETAILED DESCRIPTION

[0039] Below, the example embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the example embodiments described herein. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0040] It should be noted that, as shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "a kind" and / or "the" do not specifically refer to the singular, but may also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or device may also include other steps or elements.

[0041] If the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0042] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0044] The utility model proposes a switching power supply for a servo motor, which is mainly used for connecting to the servo motor, and outputs a stable voltage of a required size through an external power supply and rectifying the power supply. Moreover, through the cooperation of a heat dissipation component and a heat conduction component, the main heat dissipation components on a switching power supply driving board are targeted for heat dissipation, so as to avoid heat accumulation on the driving board and improve the heat dissipation effect.

[0045] A switching power supply of a servo motor of the present application is described in detail through the following embodiments.

[0046] In this embodiment, if Figures 1 to 4 As shown, the switching power supply of the servo motor includes:

[0047] The housing 1 is provided with a plurality of heat dissipation holes;

[0048] The driving board 2 is fixedly arranged in the housing 1, and is provided with a connection port for an external power supply and an output voltage, a transformer 201 and an integrated chip 202;

[0049] The heat dissipation component 3 is fixedly arranged on the driving board 2;

[0050] The heat conducting component 4 is respectively in contact with the heat dissipating component 3 , the transformer 201 and the chip 202 , and is used for conducting the heat dissipated by the transformer 201 and the chip 202 to the heat dissipating component 3 .

[0051] In the technical solution, the housing 1 is divided into an upper housing and a lower housing, which are connected in a disassembled manner, and a plurality of rows of heat dissipation holes are evenly arranged on the upper housing to allow the heat in the housing 1 to flow outward. The driver board 2 is horizontally arranged in the housing 1 from front to back, with a wiring port on the front side and a rectifier bridge on the rear side, and an EMC area, a feedback area and a control area are arranged adjacent to the wiring port. The control area and the feedback area are both provided with a chip 202 integrated on the driver board 2, and a transformer 201 is arranged on the rear side of the control area and the feedback area.

[0052] In some technical solutions, the transformer 201 is arranged in the middle position of the driving board 2 in the left and right directions, the heat dissipation component 3 is arranged corresponding to the transformer 201, and the heat conduction component 4 conducts the heat from the transformer 201 and the chip 202 to the heat dissipation component 3.

[0053] The heat conduction efficiency of the heat conducting component 4 is greater than or equal to 200 w / m·k. Specifically, the material of the heat conducting component 4 can be set to copper.

[0054] The heat dissipation component 3 is usually made of iron or steel to save costs. In other words, the heat conduction efficiency of the heat dissipation component 3 is usually greater than 80w / m·k.

[0055] In this embodiment, the heat conducting component 4 includes:

[0056] The first heat absorbing member 401 is fixedly disposed on the driving board 2 and is disposed corresponding to the chip 202;

[0057] The second heat absorbing member 402 is fixedly disposed on the driving board 2 and disposed between the driving board 2 and the transformer 201;

[0058] The first heat conducting member 403 has two ends connected to the first heat absorbing member 401 and the heat dissipating assembly 3 respectively;

[0059] The second heat conducting member 404 has two ends connected to the second heat absorbing member 402 and the heat dissipating component 3 respectively.

[0060] In the present technical solution, the first heat absorbing member 401 surrounds the outside of the control area and the feedback area. The first heat conducting member 403 is a sheet structure, and the two ends are respectively fixed on the first heat absorbing member 401 and the heat dissipation component 3. When in use, the heat emitted from the control area and the feedback area diffuses outward through the air and the driving board 2, and the heat emitted by the driving board 2 is absorbed by the first heat absorbing member 401, and is conducted to the heat dissipation component 3 through the first heat conducting member 403 fixed thereon.

[0061] The second heat absorbing member 402 is an annular structure, fixed on the driving board 2 in the lower area of ​​the transformer 201, and a heat insulating pad or a heat insulating layer is provided between the second heat absorbing member 402 and the driving board 2. The second heat conducting member 404 is a sheet structure, and its two ends are respectively fixed on the second heat absorbing member 402 and the heat dissipating component 3. When in use, the heat emitted by the transformer 201 when working is diffused outward through the air and the second heat absorbing member 402, and the heat on the second heat absorbing member 402 is conducted to the heat dissipating component 3 by the second heat conducting member 404.

[0062] In some technical solutions, the first heat conductor 403 and the second heat conductor 404 are both set to two or more, which on the one hand increases the number of hot spots and improves the heat conduction efficiency; on the other hand, it increases the points where the heat dissipation component 3 receives heat and balances the heat dissipation utilization rate of the heat dissipation component 3.

[0063] In some other technical solutions, gaps are reserved between the first heat conductor 403 , the second heat conductor 404 and the driving board 2 to reduce the ability of the heat conducted by the first heat conductor 403 and the second heat conductor 404 to flow to the driving board 2 .

[0064] In this embodiment, the heat conducting component 4 further includes:

[0065] The third heat absorbing member 405 is fixedly disposed on a side of the chip 202 away from the driving board 2;

[0066] The third heat conducting member 406 has two ends connected to the third heat absorbing member 405 and the heat dissipating assembly 3 respectively.

[0067] In the present technical solution, the third heat absorbing member 405 is fixed on the upper side of the chip 202, the third heat conducting member 406 is a deformable heat conducting member, which can be set as a copper wire, and the rigidity of the third heat conducting member 406 is less than that of the first heat conducting member 403. When in use, the third heat absorbing member 405 is adhered to the upper side of the chip 202, and the two ends of the third heat conducting member 406 are fixedly connected to the third heat absorbing member 405 and the heat dissipation component 3 respectively.

[0068] In some technical solutions, the third heat absorbing member 405 and the third heat conducting member 406 are both provided in two or more portions to connect different chips 202. Meanwhile, the third heat conducting member 406 is provided as a deformable heat conducting member, so that the third heat conducting member 406 can avoid the components on the driving board 2.

[0069] In this embodiment, the first heat sink 401 is configured in a ring shape, and the chip 202 is located in the first heat sink 401 .

[0070] In the present technical solution, the shape of the first heat absorption member 401 is the same as the shape of the outer edges of the control area and the feedback area, so that the distances between each point on the first heat absorption member 401 and the corresponding extensions of the control area and the feedback area are relatively fixed, so that the first heat absorption member 401 can stably absorb the heat emitted from the control area and the feedback area.

[0071] In some specific technical solutions, the first heat absorption member 401 is configured to be an irregular or broken line ring to adapt to the shapes of the control area and the feedback area.

[0072] In this embodiment, a groove adapted to the first heat absorbing member 401 is provided on the driving board 2 , and the first heat absorbing member 401 is disposed in the groove.

[0073] In the present technical solution, the groove is provided to increase the contact area between the first heat absorbing member 401 and the driving board 2 , and can conduct the heat inside the driving board 2 to a certain extent.

[0074] In some technical solutions, a heat insulation layer is provided on a side of the groove away from the control area and the feedback area, that is, a heat insulation layer is provided on the outer circle of the groove.

[0075] It is worth noting that, in the present technical solution, the control area and the feedback area are directly set in adjacent positions; in actual settings, they can be set in different areas, and the first heat absorption member 401 and the first heat conductor 403 are respectively set in the two areas; or, the first heat conductor 403 and the first heat absorption member 401 are only set in the control area.

[0076] In this embodiment, the first heat absorbing member 401 is hollow and sealed, and is filled with cooling liquid.

[0077] In the present technical solution, such an arrangement can form a cold zone where the first heat conductor 403 is connected to the first heat absorber 401, and the rest of the first heat absorber 401 is heated by the heat dissipated by the chip 202 to form a hot zone, which will promote heat convection and accelerate the heat dissipation rate.

[0078] In this embodiment, the heat dissipation component 3 includes:

[0079] The heat dissipation base 301 is fixedly disposed on the driving board 2 and connected to the heat conduction component 4;

[0080] A plurality of heat sinks 302 are evenly arranged on a side of the heat sink base 301 away from the driving board 2 .

[0081] In the present technical solution, the heat dissipation base 301 is strip-shaped and is fixed horizontally on the driving board 2 from front to back, and the first heat conductive member 403, the second heat conductive member 404 and the third heat conductive member 406 of the heat conductive assembly 4 are all connected to the base. A plurality of heat sinks 302 are evenly fixed on the upper side of the heat dissipation base 301 from front to back. Specifically, when in use, in order to facilitate the heat dissipation base 301 to transfer heat to each heat sink 302, the heat dissipation base 301 can be set to be the same material as the heat conductive member.

[0082] In this embodiment, two heat dissipation bases 301 are symmetrically arranged relative to the transformer 201 , a plurality of heat sinks 302 are respectively arranged on the two heat dissipation bases 301 , and the heat conduction components 4 are respectively connected to the two heat dissipation bases 301 .

[0083] In this technical solution, the two heat dissipation bases 301 are bilaterally symmetrical, which facilitates the connection of the various heat-conducting parts of the heat-conducting assembly 4 and can also prevent the heat on the driving board 2 from accumulating to one side.

[0084] In this embodiment, a heat insulation layer is provided between the heat dissipation base 301 and the driving board 2 .

[0085] In the present technical solution, the provision of a heat insulating layer can reduce the ability of the heat from the heat dissipation base 301 to diffuse to the driving board 2 , thereby preventing the driving board 2 from being thermally damaged at a position corresponding to the heat dissipation base 301 .

[0086] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A switching power supply for a servo motor, characterized in that: include: The housing (1) is provided with a plurality of heat dissipation holes; A driving board (2) is fixedly arranged in the housing (1), provided with a connection port for an external power supply and an output voltage, a transformer (201) and an integrated chip (202); A heat dissipation component (3) is fixedly arranged on the driving board (2); A heat conduction component (4) is respectively in contact with the heat dissipation component (3), the transformer (201) and the chip (202), and is used for conducting heat dissipated by the transformer (201) and the chip (202) to the heat dissipation component (3).

2. The switching power supply according to claim 1, characterized in that: The heat conducting component (4) comprises: A first heat absorbing element (401) is fixedly disposed on the driving board (2) and is disposed corresponding to the chip (202); A second heat absorbing member (402) is fixedly disposed on the driving board (2) and disposed between the driving board (2) and the transformer (201); A first heat conducting member (403), two ends of which are respectively connected to the first heat absorbing member (401) and the heat dissipating assembly (3); The second heat conducting member (404) has two ends respectively connected to the second heat absorbing member (402) and the heat dissipating component (3).

3. The switching power supply according to claim 2, characterized in that: The heat conducting component (4) further comprises: A third heat absorbing member (405) is fixedly disposed on a side of the chip (202) away from the driving board (2); The third heat conducting member (406) has two ends respectively connected to the third heat absorbing member (405) and the heat dissipating assembly (3).

4. The switching power supply according to claim 2, characterized in that: The first heat absorbing member (401) is arranged in a ring shape, and the chip (202) is located inside the first heat absorbing member (401).

5. The switching power supply according to claim 4, characterized in that: The driving plate (2) is provided with a groove adapted to the first heat absorbing member (401), and the first heat absorbing member (401) is arranged in the groove.

6. The switching power supply according to claim 4, characterized in that: The first heat absorbing component (401) is hollow and sealed, and is filled with cooling liquid.

7. The switching power supply according to claim 1, characterized in that: The heat dissipation component (3) comprises: A heat dissipation base (301) is fixedly disposed on the driving board (2) and connected to the heat conducting component (4); A plurality of heat sinks (302) are evenly arranged on a side of the heat dissipation base (301) away from the driving board (2).

8. The switching power supply according to claim 7, characterized in that: The heat dissipation bases (301) are symmetrically arranged in two with respect to the transformer (201), a plurality of heat sinks (302) are respectively arranged on the two heat dissipation bases (301), and the heat conduction components (4) are respectively connected to the two heat dissipation bases (301).

9. The switching power supply according to claim 7, characterized in that: A heat insulation layer is provided between the heat dissipation base (301) and the driving board (2).

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