Silicon wafer polishing solution recycling and regenerating device

Abstract

The utility model discloses a silicon wafer polishing solution recycling and regenerating device, which belongs to the technical field of silicon wafer polishing solution recycling and comprises a recycling box, a mounting groove is arranged on the inner side of the recycling box, and a waste solution recycling and discharging mechanism is mounted on the inner side of the mounting groove. The waste liquid recycling and discharging mechanism is used for recycling and taking out the silicon wafer polishing liquid and preventing the silicon wafer polishing liquid from remaining at the bottom of the recycling box, and the waste liquid recycling and discharging mechanism comprises a lead screw. When the device is used, silicon wafer polishing liquid in the recycling box is scraped through the waste liquid recycling and discharging mechanism, the silicon wafer polishing liquid is prevented from remaining in the recycling box, the discharging time is shortened through the lifting mechanism, and the problems that in the prior art, the silicon wafer polishing liquid is separated from the device by manually lifting and inclining the device, the automation level is low, and the efficiency is high are solved. And in addition, the workload is reduced, and the practicability is high.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer polishing liquid recovery, in particular to a silicon wafer polishing liquid recovery and regeneration device. Background Art

[0002] The silicon element, which contains 25.8% of the earth's crust, provides an inexhaustible source for the production of monocrystalline silicon. Since silicon is one of the most abundant elements in the earth's crust, the advantage of reserves is also one of the reasons why silicon has become the main material for photovoltaics, such as solar cells, which are destined to enter the large-scale market. Microelectronics technology is quietly entering aviation, aerospace, industry, agriculture and national defense, and is also quietly entering every family. The huge "magic" of a small silicon wafer is something our predecessors could not imagine. When silicon wafers are produced, the surface needs to be polished, and polishing liquid needs to be added during the polishing process to achieve a better polishing effect. Most of the existing silicon wafer polishing liquid is directly discharged after use, which causes waste and pollutes the surrounding environment. Therefore, it is necessary to recycle the silicon wafer polishing liquid during use to avoid waste of silicon wafer polishing liquid.

[0003] In the prior art, a recovery device for silicon wafer polishing liquid with application number 202120153574.8 relates to the semiconductor field. The recovery device for silicon wafer polishing liquid comprises a box body, a drainage hole connected to the inside of the box body is opened on the left side of the box body, a support ring is fixedly connected to the inner wall of the box body, a support rod is fixedly connected between the inner walls on the left and right sides of the support ring, a silicone ring is overlapped on the upper surface of the support ring, and the outer surface of the silicone ring overlaps the inner wall of the box body, and a sponge pad is fixedly connected to the inner wall of the silicone ring. The recovery device for silicon wafer polishing liquid can recycle the used polishing liquid through the mutual cooperation between the support ring, the support rod, the silicone ring, the baffle, the opening, the pull rope, the flexible mesh plate and the sponge pad, and filter the polishing liquid at the same time, so that the polishing liquid can be reused, which solves the problem that most of the existing silicon wafer polishing liquid is directly discharged after use, causing waste and polluting the surrounding environment.

[0004] The applicant has studied and found that the above-mentioned scheme has certain shortcomings. When the device is in use, it is necessary to discharge the polishing liquid inside the box for storage. The staff manually lifts the right side of the box to tilt the box so that the polishing liquid flows out from the drainage hole. Therefore, the device requires the staff to manually lift the box, the automation level is low, the operation is time-consuming and labor-intensive, the work efficiency is low, and it is inconvenient to use. In addition, the polishing liquid is easy to remain in the box, causing waste. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a silicon wafer polishing liquid recovery and regeneration device, which aims to improve the problem that when the device is in use, when the polishing liquid inside the box needs to be discharged for storage, the staff manually lifts the right side of the box upwards to tilt the box so that the polishing liquid flows out from the drainage hole. Therefore, the device requires the staff to manually lift the box upwards, has a low level of automation, is time-consuming and labor-intensive to operate, has low work efficiency, is inconvenient to use, and the polishing liquid is easily retained in the box, causing waste.

[0006] The utility model is implemented as follows: a silicon wafer polishing liquid recovery and regeneration device includes a recovery box, an installation groove is arranged on the inner side of the recovery box, a waste liquid recovery and discharge mechanism is installed on the inner side of the installation groove, and the waste liquid recovery and discharge mechanism is used to recover and remove the silicon wafer polishing liquid and avoid the silicon wafer polishing liquid from remaining at the bottom of the recovery box.

[0007] In the preferred technical solution of the present utility model, the waste liquid recovery and discharge mechanism includes a screw rod, which is rotatably installed on the inner side of the installation groove, and a sleeve plate is threadedly installed on the screw rod, and a scraper is fixedly installed on one side of the sleeve plate. The bottom end of the scraper and the bottom end of the recovery box are slidably fitted, and a connecting pipe is installed on one side of the recovery box. The rotation of the screw rod causes the sleeve plate to drive the scraper to move, scraping the recovered silicon wafer polishing liquid to prevent the silicon wafer polishing liquid from remaining at the bottom of the recovery box, and storing it after being discharged through the connecting pipe.

[0008] In the preferred technical solution of the utility model, a motor is installed on one side of the recovery box, and the screw rod is driven by the motor.

[0009] In the preferred technical solution of the utility model, a recovery groove is provided at the bottom of the recovery box, a guide plate is obliquely installed on the inner side of the recovery groove, and the connecting pipe is provided on the side of the recovery groove. The silicon wafer polishing liquid scraped by the scraper enters the recovery groove, passes through the inclined guide plate, and is discharged by the connecting pipe.

[0010] In the preferred technical solution of the utility model, a second mounting groove is provided on the inner side of the recovery box, a guide rod is fixedly installed on the inner wall of the second mounting groove, a connecting guide plate is slidably penetrated on the outside of the guide rod, and one side of the connecting guide plate is connected to the scraper to enhance the stability of the scraper when moving.

[0011] In a preferred technical solution of the present utility model, the connecting pipe is provided with a solenoid valve.

[0012] In the preferred technical solution of the utility model, a filter plate is installed on the inner wall of the top end of the recovery box, and the silicon wafer polishing liquid is filtered through the filter plate.

[0013] In the preferred technical solution of the present utility model, a lifting mechanism is installed at the bottom end of the recycling box, and the lifting mechanism includes a base plate, and a support rod and a cylinder are installed at the upper end of the base plate. The top end of the support rod is rotatably connected to the bottom end of the recycling box, and the output end of the cylinder is rotatably connected to the bottom end of the recycling box, so that the silicon wafer polishing liquid inside the recycling box is easier to discharge.

[0014] The beneficial effects of the utility model are as follows: the utility model is a silicon wafer polishing liquid recycling and regeneration device obtained by the above design. When in use, the device is placed below the polishing part, and the silicon wafer polishing liquid is filtered by the filter plate and enters the inner bottom end of the recovery box. When the polishing is finished, the waste liquid recovery and discharge mechanism drives the screw rod, and the screw rod rotates so that the sleeve plate drives the scraper to move, so that the scraper scrapes the silicon wafer polishing liquid at the bottom end of the recovery box, so that the silicon wafer polishing liquid enters the recovery tank, and reaches one side of the connecting pipe through the guide plate, and finally leaves the recovery box through the connecting pipe to be stored, completing the recycling and regeneration, and drives one side of the recovery box to rise through the cylinder, increasing the inclination of the recovery box, so that the time for the silicon wafer polishing liquid to leave the recovery box is shortened. When the device is in use, the waste liquid recovery and discharge mechanism scrapes the silicon wafer polishing liquid in the recovery box to avoid the silicon wafer polishing liquid remaining in the recovery box, and the lifting mechanism shortens the discharge time, which solves the problem that the prior art needs to lift and tilt the device by manpower to make the silicon wafer polishing liquid leave the device, the automation level is low, and the work efficiency is low, and the workload is reduced, and the practicality is strong. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 This is a schematic diagram of the structure of a silicon wafer polishing liquid recovery and regeneration device provided by the embodiment of the utility model;

[0017] Figure 2 Another structural schematic diagram provided for an embodiment of the utility model;

[0018] Figure 3 A schematic diagram of the internal structure provided for an embodiment of the utility model;

[0019] Figure 4 for Figure 3 Enlarged view of position A in the middle.

[0020] In the figure: 100-recovery box; 101-installation slot; 102-second installation slot; 103-recovery slot; 200-waste liquid recovery and discharge mechanism; 210-screw rod; 220-sleeve plate; 230-scraper; 240-connecting guide plate; 250-guide rod; 260-guide plate; 270-motor; 280-connecting pipe; 290-filter plate; 300-lifting mechanism; 310-bottom plate; 320-cylinder; 330-support rod. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the implementation of the utility model clearer, the technical solution in the implementation of the utility model will be clearly and completely described below in conjunction with the drawings in the implementation of the utility model. Obviously, the described implementation is a part of the implementation of the utility model, not all of the implementations. Based on the implementation of the utility model, all other implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-Figure 4 The utility model provides a technical solution: a silicon wafer polishing liquid recovery and regeneration device, including a recovery box 100, an installation groove 101 is arranged inside the recovery box 100, and a waste liquid recovery and discharge mechanism 200 is installed inside the installation groove 101. The waste liquid recovery and discharge mechanism 200 is used to recover and remove the silicon wafer polishing liquid and prevent the silicon wafer polishing liquid from remaining at the bottom of the recovery box 100.

[0023] In some specific implementation schemes, the waste liquid recovery and discharge mechanism 200 includes a screw rod 210, which is rotatably installed on the inner side of the installation groove 101. The screw rod 210 is threadedly installed with a sleeve plate 220, and a scraper 230 is fixedly installed on one side of the sleeve plate 220. The bottom end of the scraper 230 slides and fits with the bottom end of the recovery box 100. A connecting pipe 280 is installed on one side of the recovery box 100. The rotation of the screw rod 210 causes the sleeve plate 220 to drive the scraper 230 to move, scraping the recovered silicon wafer polishing liquid to prevent the silicon wafer polishing liquid from remaining at the bottom of the recovery box 100, and the polishing liquid is discharged through the connecting pipe 280 for storage.

[0024] In some specific implementation schemes, a motor 270 is installed on one side of the recovery box 100 , and the screw rod 210 is driven by the motor 270 .

[0025] In some specific implementation schemes, a recovery tank 103 is provided at the bottom of the recovery box 100, a guide plate 260 is obliquely installed on the inner side of the recovery tank 103, and a connecting pipe 280 is provided on the side of the recovery tank 103. The silicon wafer polishing liquid scraped by the scraper 230 enters the recovery tank 103, passes through the inclined guide plate 260, and is discharged by the connecting pipe 280.

[0026] In some specific embodiments, a second mounting groove 102 is provided on the inner side of the recycling box 100, and a guide rod 250 is fixedly installed on the inner wall of the second mounting groove 102. A connecting guide plate 240 is slidably penetrated on the outside of the guide rod 250, and one side of the connecting guide plate 240 is connected to the scraper 230 to enhance the stability of the scraper 230 when moving.

[0027] In some specific embodiments, the connecting pipe 280 is provided with a solenoid valve.

[0028] In some specific implementation schemes, a filter plate 290 is installed on the inner wall of the top of the recovery box 100, and the silicon wafer polishing liquid is filtered through the filter plate 290.

[0029] In some specific embodiments, a lifting mechanism 300 is installed at the bottom of the recycling box 100, and the lifting mechanism 300 includes a base plate 310. A support rod 330 and a cylinder 320 are installed at the upper end of the base plate 310. The top end of the support rod 330 is rotatably connected to the bottom end of the recycling box 100, and the output end of the cylinder 320 is rotatably connected to the bottom end of the recycling box 100, so that the silicon wafer polishing liquid inside the recycling box 100 is easier to discharge.

[0030] Working principle: When in use, the device is placed under the polishing part, and the silicon wafer polishing liquid is filtered by the filter plate 290 and enters the inner bottom end of the recovery box 100. When the polishing is completed, the waste liquid recovery and discharge mechanism 200 drives the screw rod 210, and the screw rod 210 rotates to make the sleeve plate 220 drive the scraper 230 to move, so that the scraper 230 scrapes the silicon wafer polishing liquid at the bottom end of the recovery box 100, so that the silicon wafer polishing liquid enters the recovery tank 103, and reaches one side of the connecting pipe 280 through the guide plate 260, and finally leaves the recovery box 100 through the connecting pipe 280 to be stored, completing the recycling and regeneration, and drives one side of the recovery box 100 to rise through the cylinder 320, increasing the inclination of the recovery box 100, so that the time for the silicon wafer polishing liquid to leave the recovery box 100 is shortened.

[0031] The above description is only the preferred implementation of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A silicon wafer polishing liquid recovery and regeneration device, characterized in that: It includes a recovery box, an installation groove is provided on the inner side of the recovery box, a waste liquid recovery and discharge mechanism is installed on the inner side of the installation groove, the waste liquid recovery and discharge mechanism is used to recover and remove the silicon wafer polishing liquid and prevent the silicon wafer polishing liquid from remaining at the bottom of the recovery box, the waste liquid recovery and discharge mechanism includes a screw rod, the screw rod is rotatably installed on the inner side of the installation groove, the screw rod is threadedly installed with a sleeve plate, a scraper is fixedly installed on one side of the sleeve plate, the bottom end of the scraper is slidably fitted with the bottom end of the recovery box, and a connecting pipe is installed on one side of the recovery box.

2. A silicon wafer polishing liquid recovery and regeneration device according to claim 1, characterized in that: A motor is installed on one side of the recovery box, and the screw rod is driven by the motor.

3. A silicon wafer polishing liquid recovery and regeneration device according to claim 1, characterized in that: A recovery groove is arranged at the bottom of the recovery box, a guide plate is obliquely installed on the inner side of the recovery groove, and the connecting pipe is arranged on the side of the recovery groove.

4. A silicon wafer polishing liquid recovery and regeneration device according to claim 1, characterized in that: A second mounting groove is arranged inside the recovery box, a guide rod is fixedly mounted on the inner wall of the second mounting groove, a connecting guide plate is slidably penetrated outside the guide rod, and one side of the connecting guide plate is connected to the scraper.

5. The silicon wafer polishing liquid recovery and regeneration device according to claim 1, characterized in that: The connecting pipe is provided with a solenoid valve.

6. The silicon wafer polishing liquid recovery and regeneration device according to claim 1, characterized in that: A filter plate is installed on the inner wall of the top end of the recovery box.

7. The silicon wafer polishing liquid recovery and regeneration device according to claim 1, characterized in that: The bottom end of the recycling box is equipped with a lifting mechanism, which includes a bottom plate. A support rod and a cylinder are installed at the upper end, and the top end of the support rod is rotatably connected to the bottom end of the recovery box. The cylinder output end is rotatably connected to the bottom end of the recovery box.

Images