Glue pouring shell, circuit board glue pouring structure and diaphragm booster pump

Abstract

The utility model relates to a glue pouring shell, a circuit board glue pouring structure and a diaphragm booster pump comprising the circuit board glue pouring structure. A glue pouring shell is used for adapting to a circuit board and carrying out glue pouring, and comprises a shell bottom surface; the shell side wall is formed on the shell bottom surface; and the positioning part is formed on the shell bottom surface and / or the shell side wall and is used for placing the circuit board so as to form a glue pouring cavity between the circuit board and the shell bottom surface. In the glue filling process, the sealant is filled into the glue filling cavity, so that the glue filling uniformity can be ensured, the problem of non-uniform glue filling caused by the absence of a fixed glue filling space in the prior art can be avoided, and the requirements on the glue filling operation of workers in the glue filling process can be reduced, so that the working efficiency is improved. Besides, after the sealant is solidified, the sealant pouring shell and the circuit board form an integrated structure, the bottom surface of the circuit board is better protected through the sealant pouring shell, the sealant is prevented from being damaged and falling off due to collision, the safety of the circuit board can be further improved, and the service life of the circuit board can be further prolonged.

Description

Technical Field

[0001] The utility model relates to a glue-filling shell, a circuit board glue-filling structure and a diaphragm booster pump comprising the circuit board glue-filling structure. Background Art

[0002] In the prior art, most circuit boards are welded manually. In order to improve the waterproof effect of the product, the welded circuit boards are manually glued. Since the sealant has a certain fluidity in the molten state, uneven gluing is prone to occur during the gluing process, which places high requirements on the workers and reduces work efficiency. Utility Model Content

[0003] The purpose of the utility model is to provide a glue-filling shell to solve the above-mentioned problems, thereby avoiding the phenomenon of uneven glue filling as much as possible and improving work efficiency.

[0004] The utility model also provides a circuit board glue filling structure, which ensures that the circuit board is glued evenly and improves work efficiency.

[0005] The utility model also provides a diaphragm booster pump including the circuit board glue-filling structure.

[0006] In order to achieve the above object, the utility model is implemented through the following technical solutions:

[0007] In one aspect of the utility model, a glue-filling shell is used to adapt to a circuit board and perform glue filling, comprising:

[0008] Shell bottom surface;

[0009] a shell sidewall formed on the shell bottom surface;

[0010] The positioning portion is formed on the bottom surface of the shell and / or the side wall of the shell, and is used to place the circuit board so as to form a glue-filling cavity between the circuit board and the bottom surface of the shell.

[0011] The utility model provides a glue-filling shell for adapting a circuit board and conveniently filling the circuit board with glue. The glue-filling shell is provided with a positioning portion for placing the circuit board. When the circuit board is placed in the positioning portion, a glue-filling cavity is formed between the circuit board and the bottom surface of the shell. During the glue-filling process, simply pouring sealant into the glue-filling cavity can ensure uniform glue filling, which can not only avoid the problem of uneven glue filling due to the absence of a fixed glue-filling space in the prior art, but also reduce the requirements for workers' glue-filling operations during the glue-filling process, thereby improving work efficiency. In addition, after the sealant solidifies, the glue-filling shell and the circuit board form an integrated structure, and the bottom surface of the circuit board is better protected by the glue-filling shell to avoid damage and falling off of the sealant due to collision, which can further improve the safety and service life of the circuit board.

[0012] Preferably, when the circuit board is placed on the positioning portion, the plane of the end of the shell side wall away from the shell bottom surface is slightly higher than the pins of the electronic components on the circuit board. In this way, during the glue filling process, the sealant will overflow from the top of the shell side wall only after it flows over the pins of the electronic components on the circuit board, which can ensure that after the sealant solidifies, the pins of all electronic components on the circuit board will be wrapped by the sealant, avoiding the risk of short circuit, for example, preventing carbon powder and other conductive impurities from adhering to the circuit board and causing a short circuit in the circuit board.

[0013] Preferably, a glue overflow port is provided on the side wall of the shell, and the plane where the glue overflow port is located is slightly higher than the pins of the electronic components on the circuit board. In this way, during the glue filling process, the sealant will overflow from the glue overflow port only after it overflows the pins of the electronic components on the circuit board, which can ensure that after the sealant solidifies, the pins of all electronic components on the circuit board will be wrapped by the sealant, avoiding the risk of short circuit, for example, preventing carbon powder and other conductive impurities from adhering to the circuit board and causing a short circuit in the circuit board.

[0014] Preferably, the plastic-filled shell further includes a wire outlet and a winding post arranged near the wire outlet. The power line on the circuit board is wound around the winding post and then passes through the wire outlet. Even if the power line is subjected to a certain tension, the tension will act on the winding post instead of directly acting on the soldering point between the power line and the circuit board, thereby reducing the possibility of disconnection / desoldering of the power line and the circuit board due to the force.

[0015] Another aspect of the utility model is a circuit board glue filling structure, comprising:

[0016] The glue-filled shell comprises a shell bottom surface, a shell side wall formed on the shell bottom surface, and a positioning portion formed on the shell bottom surface and / or the shell side wall;

[0017] A circuit board is positioned on the positioning portion;

[0018] A glue-filled cavity is formed between the circuit board and the bottom surface of the shell, and sealant is filled in the glue-filled cavity so that the glue-filled shell and the circuit board form an integrated structure.

[0019] The utility model forms a glue-filling cavity (with a fixed space) between the circuit board and the bottom surface of the shell for filling with sealant. Simply pouring sealant into the glue-filling cavity can ensure uniform glue filling, which can not only avoid the problem of uneven glue filling due to the absence of a fixed glue-filling space in the prior art, but also reduce the requirements for workers' glue filling operation during the glue filling process, thereby improving work efficiency. In addition, after the sealant solidifies, the glue-filling shell and the circuit board form an integrated structure, and the glue-filling shell provides better protection for the bottom surface of the circuit board, avoiding damage and falling off of the sealant due to collision, which can further improve the safety and service life of the circuit board.

[0020] Preferably, the plane of the end of the shell side wall away from the shell bottom surface is slightly higher than the pins of the electronic components on the circuit board; the circuit board is filled with sealant covering the pins of the electronic components. During the glue filling process, the sealant will overflow from the top of the shell side wall only after it flows over the pins of the electronic components on the circuit board, which can ensure that after the sealant solidifies, the pins of all electronic components on the circuit board will be wrapped by the sealant to avoid the risk of short circuit, such as preventing carbon powder and other conductive impurities from adhering to the circuit board and causing a short circuit in the circuit board.

[0021] Preferably, a glue overflow port is provided on the side wall of the shell, and the plane where the glue overflow port is located is slightly higher than the pins of the electronic components on the circuit board; and a sealant covering the pins of the electronic components is poured on the top of the circuit board. During the glue pouring process, the sealant will overflow from the glue overflow port only after it overflows the pins of the electronic components on the circuit board, which can ensure that after the sealant solidifies, the pins of all electronic components on the circuit board will be wrapped by the sealant, avoiding the risk of short circuit, for example, preventing carbon powder and other conductive impurities from adhering to the circuit board and causing a short circuit in the circuit board.

[0022] Preferably, the plastic-filled shell further includes a wire outlet and a winding post arranged near the wire outlet. The power line on the circuit board is wound around the winding post and then passes through the wire outlet. Even if the power line is subjected to a certain tension, the tension will act on the winding post instead of directly acting on the soldering point between the power line and the circuit board, thereby reducing the possibility of disconnection / desoldering of the power line and the circuit board due to the force.

[0023] Preferably, the circuit board glue filling structure further includes a back cover, and the glue filling shell is detachably mounted on the back cover.

[0024] Preferably, a threading hole is provided on the back cover at a position corresponding to the wire outlet of the glue-filling shell; a step is formed on the glue-filling shell toward the back cover, and a positioning step is formed on the back cover to cooperate with the step to achieve positioning of the glue-filling shell and the back cover.

[0025] Preferably, the thickness of the portion where the plastic-filled shell contacts the back cover is 1-10 mm, which can prevent high-voltage breakdown and increase creepage distance.

[0026] Preferably, a notch is provided on the circuit board at a position corresponding to the wire outlet, so that the power cord can enter and exit conveniently.

[0027] In another aspect of the utility model, a diaphragm booster pump comprises the circuit board glue filling structure.

[0028] The beneficial effects of the utility model are:

[0029] 1. The utility model provides a glue potting shell for adapting to a circuit board and conveniently potting glue on the circuit board. The glue potting shell is provided with a positioning portion for placing the circuit board. When the circuit board is placed on the positioning portion, a glue potting cavity is formed between the circuit board and the bottom surface of the shell. During the glue potting process, simply pouring sealant into the glue potting cavity can ensure uniform glue potting, which can not only avoid the problem of uneven glue potting caused by the absence of a fixed glue potting space in the prior art, but also reduce the requirements for workers' glue potting operations during the glue potting process, thereby improving work efficiency.

[0030] 2. After the sealant solidifies, the sealant shell and the circuit board form an integrated structure. The sealant shell provides better protection for the bottom surface of the circuit board to avoid damage and falling off of the sealant due to collision, which can further improve the safety and service life of the circuit board.

[0031] 3. The plane of the end of the shell side wall away from the shell bottom is slightly higher than the pins of the electronic components on the circuit board. In this way, during the glue filling process, the sealant will overflow from the top of the shell side wall after it flows over the pins of the electronic components on the circuit board, which can ensure that after the sealant solidifies, all the pins of the electronic components on the circuit board will be wrapped by the sealant to avoid short circuit risks, such as preventing carbon powder and other conductive impurities from adhering to the circuit board and causing a short circuit. In addition, it can also ensure that the glue is applied evenly.

[0032] 4. There is a glue overflow port on the side wall of the shell, and the plane where the glue overflow port is located is slightly higher than the pins of the electronic components on the circuit board. In this way, during the glue filling process, the sealant will overflow from the glue overflow port only after it overflows the pins of the electronic components on the circuit board. This can ensure that after the sealant solidifies, the pins of all electronic components on the circuit board will be wrapped by the sealant to avoid short circuit risks, such as preventing carbon powder and other conductive impurities from adhering to the circuit board and causing a short circuit. In addition, it can also ensure uniform glue application.

[0033] 5. The potting shell also includes a wire outlet and a winding post arranged near the wire outlet. The power cord on the circuit board is wound around the winding post and then passes through the wire outlet. Even if the power cord is subjected to a certain tension, the tension will act on the winding post instead of directly on the solder joint between the power cord and the circuit board, reducing the possibility of disconnection / desoldering of the power cord and the circuit board due to the force. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a structural schematic diagram of the glue-filled shell of the utility model.

[0035] Figure 2 This is a structural schematic diagram of the circuit board glue filling structure of the utility model.

[0036] Figure 3 It is a structural schematic diagram of the circuit board of the utility model.

[0037] Figure 4 It is a structural schematic diagram of the rear cover of the utility model.

[0038] Figure 5 It is a structural schematic diagram of the diaphragm booster pump of the utility model.

[0039] Figure numbers: glue-filled shell 1; shell bottom 101; shell side wall 102; first annular side wall 1021; second annular side wall 1022; positioning portion 103; first annular positioning boss 1031; second annular positioning boss 1032; glue overflow port 104; wire outlet 105; winding post 106; circuit board positioning hole 107; rear cover positioning hole 108; circuit board 2; grounding copper sheet 201; glue-filled cavity 3; rear cover 4; threading port 401; positioning step 402; fluid chamber 5, diaphragm chamber 6, diaphragm 7, piston rack 8; eccentric wheel 9; shell 10; magnetic tile 11; rotor 12. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the following will be described clearly and completely in combination with the technical solution in the embodiments of the utility model. Obviously, the described embodiments are partial embodiments of the utility model, not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the protection scope of the utility model.

[0041] like Figure 1 A glue potting shell is shown, which is used to adapt to a circuit board and perform glue potting, and includes:

[0042] Shell bottom surface 101; in this embodiment, since the glue-filled shell is used for diaphragm booster pump products, the shell bottom surface 101 is basically annular; in other practical applications, the shell bottom surface 101 can also be basically disc-shaped or basically rectangular, and its actual shape can be adjusted according to the application scenario of the product and is not limited to the aforementioned shapes;

[0043] The shell side wall 102 is formed on the shell bottom surface 101; in this embodiment, since the shell bottom surface 101 is substantially annular, the shell side wall 102 includes a first annular side wall 1021 formed on the outer circle of the shell bottom surface 101, and a second annular side wall 1022 formed on the inner circle of the shell bottom surface 101; in other practical applications, the actual shape and structure of the shell side wall 102 can be adjusted according to the specific shape and structure of the shell bottom surface 101;

[0044] The positioning portion 103 is formed on the shell bottom surface 101 and / or the shell side wall 102, and is used to place the circuit board so as to form a glue-filling cavity between the circuit board and the shell bottom surface 101; in the present embodiment, the positioning portion 103 may be a first annular positioning boss 1031 formed on the outer ring of the shell bottom surface 101 or the first annular side wall 1021, or may be a second annular positioning boss 1032 formed on the inner ring of the shell bottom surface 101 or the second annular side wall 1022, and may also include the first annular positioning boss 1031 formed on the outer ring of the shell bottom surface 101 or the first annular side wall 1021, and the second annular positioning boss 1032 formed on the inner ring of the shell bottom surface 101 or the second annular side wall 1022; in other practical applications, the actual shape and structure of the positioning portion 103 may be adjusted according to the specific shape and structure of the shell bottom surface 101 and the shell side wall 102.

[0045] In addition, the circuit board is positioned by the positioning portion 103, which can effectively ensure that the circuit board is installed flat. In some practical applications, at least two circuit board positioning holes 107 are provided on the potting shell, and the circuit board is fixed to the positioning portion 103 by tightening the screws with the circuit board positioning holes 107, ensuring that the circuit board will not shake in the potting shell.

[0046] The present embodiment provides a glue potting shell for adapting to a circuit board and facilitating glue potting of the circuit board. When the circuit board is placed in the positioning portion 103, a glue potting cavity is formed between the circuit board 103 and the bottom surface 101 of the shell. During the glue potting process, simply pouring sealant into the glue potting cavity can ensure uniform glue potting, which can not only avoid the problem of uneven glue potting due to the absence of a fixed glue potting space in the prior art, but also reduce the requirements for workers' glue potting operations during the glue potting process, thereby improving work efficiency. In addition, after the sealant solidifies, the glue potting shell and the circuit board form an integrated structure, and the glue potting shell provides better protection for the bottom surface of the circuit board to avoid damage and falling off of the sealant due to collision, which can further improve the safety and service life of the circuit board.

[0047] As a preferred implementation of this embodiment, when the circuit board is placed on the positioning portion 103, the plane where one end of the shell side wall 102 away from the shell bottom surface 101 is located is slightly higher than the pins of the electronic components on the circuit board. In this way, during the glue filling process, the sealant will overflow from the top of the shell side wall 102 only after it overflows the pins of the electronic components on the circuit board, which can ensure that after the sealant solidifies, the pins of all electronic components on the circuit board will be wrapped by the sealant to avoid the risk of short circuit, such as preventing carbon powder and other conductive impurities from adhering to the circuit board and causing the circuit board to short circuit. In some practical applications, the plane where one end of the shell side wall 102 away from the shell bottom surface 101 is located is slightly higher than the pins of the electronic components on the circuit board, specifically: the height difference between the plane where one end of the shell side wall 102 away from the shell bottom surface 101 is located and the plane where the pins of the electronic components on the circuit board are located is 0.5-10mm. During the glue pouring process, the sealant first fills the glue pouring cavity, then gradually covers and overflows the upper surface of the circuit board. When it exceeds the top of the shell side wall 102, the excess part will overflow and cover the pins of the electronic components to ensure uniform glue application. After the glue is completely solidified, the circuit board and the glue pouring shell become an integrated structure, which not only reduces the risk of short circuit of the circuit board but also increases the service life of the circuit board.

[0048] As another preferred implementation of this embodiment, a glue overflow port 104 is provided on the shell side wall 102, and the plane where the glue overflow port is located is slightly higher than the pins of the electronic components on the circuit board. In this way, during the glue filling process, the sealant will overflow from the glue overflow port 104 only after it overflows the pins of the electronic components on the circuit board, which can ensure that after the sealant solidifies, the pins of all electronic components on the circuit board will be wrapped by the sealant to avoid the risk of short circuit, such as preventing carbon powder and other conductive impurities from adhering to the circuit board and causing the circuit board to short circuit. In some practical applications, the plane where the glue overflow port 104 is located is slightly higher than the pins of the electronic components on the circuit board, specifically, the height difference between the plane where the glue overflow port 104 is located and the plane where the pins of the electronic components on the circuit board are located is 0.5-10mm. During the glue pouring process, the sealant first fills the glue pouring cavity, and then gradually covers and overflows the upper surface of the circuit board. When it exceeds the overflow port 104, the excess part will overflow from the overflow port 104 and cover the pins of the electronic components to ensure uniform glue application. After the glue is completely solidified, the circuit board and the glue pouring shell become an integrated structure, which not only reduces the risk of short circuit of the circuit board but also increases the service life of the circuit board.

[0049] As another preferred implementation of this embodiment, the plastic-filled shell also includes a wire outlet 105 and a winding post 106 arranged near the wire outlet 105. The power cord on the circuit board is wound on the winding post 106 and then passes through the wire outlet 105. Even if the power cord is subjected to a certain tension, the tension will act on the winding post 106, and will not directly act on the soldering point between the power cord and the circuit board, thereby reducing the possibility of disconnection / desoldering of the welding between the power cord and the circuit board due to the force. In some practical applications, the wire outlet 105 is designed to be U-shaped for easy wire outlet.

[0050] like Figure 2 A circuit board glue filling structure is shown, comprising:

[0051] The plastic-filled shell 1 comprises a shell bottom surface 101, a shell side wall 102 formed on the shell bottom surface 101, and a positioning portion 103 formed on the shell bottom surface 101 and / or the shell side wall 102; the specific structure is as described above and will not be repeated here;

[0052] The circuit board 2 is positioned on the positioning portion 103; the specific structure is as described above and will not be repeated here;

[0053] A glue pouring cavity 3 is formed between the circuit board 2 and the shell bottom surface 101, and sealant is poured into the glue pouring cavity so that the glue pouring shell 1 and the circuit board 2 form an integral structure. A glue pouring cavity 3 (with a fixed space) is formed between the circuit board 2 and the shell bottom surface 101 for filling with sealant. Simply pouring sealant into the glue pouring cavity 3 can ensure uniform glue pouring, which can not only avoid the problem of uneven glue pouring due to the absence of a fixed glue pouring space in the prior art, but also reduce the requirements for workers' glue pouring operations during the glue pouring process, thereby improving work efficiency. In addition, after the sealant solidifies, the glue pouring shell 1 and the circuit board 2 form an integral structure, and the glue pouring shell 1 provides better protection for the bottom surface of the circuit board 2 to avoid damage and falling off of the sealant due to collision, which can further improve the safety and service life of the circuit board 2.

[0054] The plane of the end of the shell side wall 102 away from the shell bottom surface 101 is slightly higher than the pins of the electronic components on the circuit board 2; the circuit board 2 is filled with sealant covering the pins of the electronic components; the specific structure is as described above and will not be repeated here. During the glue filling process, the sealant first fills the glue filling cavity 3, and then gradually covers and overflows the upper surface of the circuit board 2. When it exceeds the top of the shell side wall 102, the excess part will overflow and cover the pins of the electronic components to ensure uniform glue application. After the glue is completely solidified, the circuit board 2 and the glue filling shell 1 become an integrated structure, which not only reduces the risk of short circuit of the circuit board 2 but also increases the service life of the circuit board 2.

[0055] The shell side wall 102 is provided with a glue overflow port 104, and the plane where the glue overflow port is located is slightly higher than the pins of the electronic components on the circuit board; the circuit board 2 is filled with sealant covering the pins of the electronic components; the specific structure is as described above and will not be repeated here. During the glue filling process, the sealant first fills the glue filling cavity 3, and then gradually covers and overflows the upper surface of the circuit board 2. When it exceeds the glue overflow port 104, the excess part will overflow from the glue overflow port 104 and can cover the pins of the electronic components to ensure uniform glue application. After the glue is completely solidified, the circuit board 2 and the glue filling shell 1 form an integrated structure, which not only reduces the risk of short circuit of the circuit board 2 but also increases the service life of the circuit board 2.

[0056] The plastic-filled shell 1 also includes a wire outlet 105 and a winding post 106 arranged near the wire outlet 105. The specific structure is as described above and will not be repeated here. A notch is provided on the circuit board 2 at a position corresponding to the wire outlet 105 to facilitate the entry and exit of the power cord.

[0057] like Figure 4 As shown, the circuit board glue filling structure also includes a back cover 4, and the glue filling shell 1 can be detachably installed on the back cover 4; in some practical applications, at least two back cover positioning holes 108 are provided on the glue filling shell 1, and the back cover 4 is connected to the glue filling shell 1 by tightening the screws with the back cover positioning holes 108. In order to improve the waterproof performance of the product, a rubber wire sleeve is provided on the back cover 4, and the power cord passes through the rubber wire sleeve to achieve a waterproof sealing effect. In other practical applications, a threading port 401 is provided on the back cover 4 at a position corresponding to the outlet port 105 of the glue filling shell 1, and the power cord can be directly output to the outside through the outlet port 105 and the threading port 401, without redundant internal wiring, which can save space and materials and simplify the internal structure. In some other practical applications, a step is formed on the glue filling shell 1, facing the side of the back cover 4, and a positioning step 402 is formed on the back cover 4 to cooperate with the step to realize the positioning of the glue filling shell 1 and the back cover 4; when the circuit board glue filling structure of this embodiment is used for a diaphragm booster pump (such as Figure 5 As shown), by using the step on the plastic-filled shell 1 to cooperate with the positioning step 402 on the back cover 4, the verticality of the carbon brush on the circuit board 2 and the commutator on the rotor 12 can be ensured, thereby ensuring full contact between the carbon brush and the commutator and reducing motor sparks.

[0058] The thickness of the portion where the plastic-filled shell 1 contacts the back cover 4 is 1-10 mm, which can prevent high-voltage breakdown and increase the creepage distance; the wire outlet 105 is directly opposite to the wire inlet on the back cover 4, which is convenient for installation and eliminates electromagnetic interference. In addition, the power cord is directly sent to the outside through the wire outlet 105 and the wire inlet on the back cover 4, without redundant internal wiring, which can save space and materials and simplify the internal structure.

[0059] like Figure 3As shown, the circuit board 2 is electrically connected to a grounding copper sheet 201. After the screw passes through the grounding copper sheet 201, it is tightened with the rear cover positioning hole 108 to connect the rear cover 4 with the glue-filled shell 1. At the same time, the screw connects the grounding copper sheet 201 with the rear cover 4 (metal conductive material) to form grounding.

[0060] In the actual production process, the circuit board 2 is first fixed to the positioning part 103 by tightening the screws and the circuit board positioning holes 107; then the power cord of the circuit board is wound on the winding pole 106 and then passed through the outlet 105; then glue is poured. Specifically, glue pouring holes and overflow holes are provided on the circuit board 2, and glue is poured into the glue pouring cavity 3 through the glue pouring holes. The sealant first fills the glue pouring cavity 3. After it is filled, the sealant overflows from the overflow hole, and then gradually covers and overflows the upper surface of the circuit board 2. When it exceeds the overflow port 104 or the top of the shell side wall 102, the excess part will overflow from the overflow port 104 or the top of the shell side wall 102, and can cover the pins of the electronic components, ensuring uniform glue application. After the glue is completely solidified, the circuit board 2 and the glue pouring shell 1 become an integrated structure; finally, the back cover 4 is connected to the glue pouring shell 1 by tightening the screws and the back cover positioning holes 108, and the process is completed.

[0061] like Figure 5 As shown, the present embodiment is a diaphragm booster pump, including the circuit board glue filling structure. Specifically, the diaphragm booster pump includes a pump head assembly, and a driving assembly for driving the pump head assembly to work, and the driving assembly drives the pump head assembly to work, so that the water entering the pump head assembly is pressurized and then discharged from the drain port. The pump head assembly includes a fluid chamber 5, a diaphragm chamber 6, a diaphragm 7, a piston rack 8 and an eccentric wheel 9, which are common existing structures and are not described in detail. The driving assembly includes a housing 10, a magnetic tile 11 and a rotor 12 located in the housing 10, and the aforementioned circuit board glue filling structure; wherein the rotor 12 passes through the circuit board 2 and the through hole in the center of the glue filling shell 1 and is connected to the rear cover 4 through a bearing, and the rear cover 4 is assembled with the housing 10.

[0062] In the above description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed above.

[0063] In the description of the present utility model, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present utility model.

Claims

1. A glue-filling shell, used to adapt to a circuit board and perform glue filling, characterized in that include: Shell bottom surface (101); A shell side wall (102) formed on the shell bottom surface (101); The positioning portion (103) is formed on the shell bottom surface (101) and / or the shell side wall (102) and is used to place a circuit board so as to form a glue-filled cavity between the circuit board and the shell bottom surface (101).

2. The plastic-filled shell according to claim 1, characterized in that: When the circuit board is placed on the positioning portion (103), the plane where the end of the shell side wall (102) away from the shell bottom surface (101) is located is slightly higher than the pins of the electronic components on the circuit board.

3. The plastic-filled shell according to claim 1, characterized in that: The shell side wall (102) is provided with a glue overflow opening (104), and the plane where the glue overflow opening is located is slightly higher than the pins of the electronic components on the circuit board.

4. The plastic-filled shell according to claim 1, characterized in that: The plastic-filled shell further comprises a wire outlet (105) and a winding post (106) arranged close to the wire outlet (105).

5. A circuit board glue filling structure, characterized in that include: A plastic-filled shell (1) comprises a shell bottom surface (101), a shell side wall (102) formed on the shell bottom surface (101), and a positioning portion (103) formed on the shell bottom surface (101) and / or the shell side wall (102); A circuit board (2) is positioned on the positioning portion (103); A glue-filled cavity (3) is formed between the circuit board (2) and the shell bottom surface (101), and sealant is filled in the glue-filled cavity so that the glue-filled shell (1) and the circuit board (2) form an integrated structure.

6. The circuit board glue filling structure according to claim 5, characterized in that: The plane at the end of the shell side wall (102) away from the shell bottom surface (101) is slightly higher than the pins of the electronic components on the circuit board (2); and a sealant covering the pins of the electronic components is poured above the circuit board (2).

7. The circuit board glue filling structure according to claim 5, characterized in that: The shell side wall (102) is provided with a glue overflow port (104), the plane where the glue overflow port is located is slightly higher than the pins of the electronic components on the circuit board; the circuit board (2) is filled with sealing glue covering the pins of the electronic components.

8. The circuit board glue filling structure according to claim 5, characterized in that: The plastic-filled shell (1) further comprises a wire outlet (105) and a winding post (106) arranged close to the wire outlet (105).

9. The circuit board glue filling structure according to claim 5, characterized in that: The circuit board glue filling structure also includes a back cover (4), and the glue filling shell (1) is detachably mounted on the back cover (4).

10. The circuit board glue filling structure according to claim 9, characterized in that: A threading opening (401) is provided on the rear cover (4) at a position corresponding to the wire outlet (105) of the plastic-filled shell (1); a step is formed on the plastic-filled shell (1) on the side facing the rear cover (4); and a positioning step (402) is formed on the rear cover (4) for cooperating with the step to realize the positioning of the plastic-filled shell (1) and the rear cover (4).

11. The circuit board glue potting structure according to claim 9, characterized in that: The thickness of the portion where the plastic-filled shell (1) contacts the back cover (4) is 1-10 mm.

12. The circuit board glue potting structure according to claim 8, characterized in that: A notch is provided on the circuit board (2) at a position corresponding to the wire outlet (105).

13. A diaphragm booster pump, characterized in that: The invention comprises the circuit board glue filling structure as claimed in any one of claims 5 to 11.

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