Probe cleaning device

Abstract

The utility model provides a cleaning device for a probe. The cleaning device comprises a chuck, a base, a hinge, a lifting mechanism and a tilting mechanism, the chuck is placed on the base; one end of the hinge is connected with the chuck, and the other end is connected with the base; the base is connected with the lifting mechanism; the chuck is connected with the tilting mechanism. According to the probe cleaning device, the chuck is adjusted to a proper angle through the inclination mechanism, then the lifting mechanism drives the base, the chuck and the probe cleaning wafer to move up and down together for probe cleaning, the unexpected effect is that metal filings on cleaning dead corners of a probe can make more sufficient contact with polymers on the probe cleaning wafer, and the cleaning effect is better. In the probe cleaning process, the inclination angle of the chuck can be adjusted according to the contact condition of the metal chips and the polymer, so that the metal chips on the cleaning dead angles of the probe can be further removed; as the metal filings on the probe are cleaned more cleanly, the probe can be used for a longer time, and the cost for sending the probe to an original factory to chemically clean the probe and replacing the probe card is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer testing equipment, in particular to a cleaning device for a probe. Background Art

[0002] WAT (Wafer Accept Test) requires the use of a probe machine, which uses the probes of the built-in probe card to pierce the pads on the wafer cutting path, thereby providing different electrical test conditions for the wafer. Different types of probe cards have slightly different piercing actions, such as Figure 1 and Figure 2 As shown, the hollow arrow in the figure indicates the moving direction of the first chuck 1 (chuck) and other components. When the probe card of model FormFactor is used for needle insertion, the first chuck 1 moves upward, and the first probe 3 moves upward from position ① to position ②. During the movement of the first chuck 1, the first probe 3 is deformed and slides in the X-axis direction relative to the wafer 2 to form a needle mark, which easily generates first metal chips 5 on the front side of the first probe 3. Under high voltage and high current test conditions and high frequency needle insertion, heat will be generated. The first metal chips 5 will melt and bond to the front side of the first probe 3 due to absorbing heat. The first metal chips 5 bonded to the first probe 3 increase the contact area between the first probe 3 and the pad 4. If the test is continued, the test data will be abnormal.

[0003] like Figure 2 As shown, currently the factory usually adopts a periodic maintenance method to clean the first probe 3, and the cleaning method is as follows: a first cleaning wafer 6 is placed on the first chuck 1, and the upper surface of the first cleaning wafer 6 is covered with a polymer with a certain roughness, such as metal silicide, and then the same needle-piercing action as during the test is performed multiple times, so that the first metal chips 5 and the polymer rub against each other and fall off the first probe 3.

[0004] However, since the needle tip will hinder the first metal chips 5 from fully contacting the polymer, a cleaning dead corner will exist on the first probe 3. The poor cleaning effect on the cleaning dead corner will cause serious accumulation of the first metal chips 5 on the first probe 3 and it can no longer be used for electrical testing. The probe card needs to be returned to the factory for chemical cleaning or the entire probe card needs to be replaced, resulting in increased production costs. Utility Model Content

[0005] The utility model provides a cleaning device for a probe, so as to solve the technical problem of poor cleaning effect on a cleaning dead corner of the probe.

[0006] In order to solve the above technical problems, the utility model provides a probe cleaning device, comprising a chuck, a base, a hinge, a lifting mechanism and a tilting mechanism; the chuck is placed on the base; one end of the hinge is connected to the chuck, and the other end is connected to the base; the base is connected to the lifting mechanism; the chuck is connected to the tilting mechanism.

[0007] Optionally, the tilting mechanism includes a motor, a lead screw and a sleeve; the motor is mounted on the base, one end of the lead screw is meshed and connected with the rotating shaft of the motor, the sleeve is threadedly sleeved on the lead screw, and the sleeve is connected to the chuck.

[0008] Optionally, a line between the other end of the lead screw and the hinge is arranged on a longitudinal bisector of the chuck.

[0009] Optionally, the motor is mounted on a side of the base, and the sleeve is mounted on a side of the chuck.

[0010] Optionally, the tilting mechanism includes a cylinder, the cylinder includes a telescopic rod, and the cylinder is installed on the base; one end of the telescopic rod is located inside the cylinder, and the other end of the telescopic rod is connected to the chuck.

[0011] Optionally, a line between the other end of the telescopic rod and the hinge is arranged on a longitudinal bisector of the chuck.

[0012] Optionally, the cylinder is mounted on a side surface of the base, and the other end of the telescopic rod is connected to a side surface of the chuck via a connecting piece.

[0013] Optionally, the chuck and the base are both disc-shaped.

[0014] Optionally, the device further comprises a needle cleaning wafer, and a plurality of protruding structures are arranged on the upper surface of the needle cleaning wafer.

[0015] Optionally, a plurality of the protruding structures are evenly arranged on the upper surface of the needle cleaning wafer.

[0016] The utility model provides a probe cleaning device, which can adjust the chuck to a suitable angle through a tilting mechanism, and then drive the base, the chuck and the cleaning wafer to move up and down together through a lifting mechanism to perform a cleaning action. An unexpected effect is that the metal chips on the cleaning dead corners of the probe can be more fully contacted with the polymer on the cleaning wafer, and the cleaning effect is better; during the cleaning process, the tilting angle of the chuck can be adjusted according to the contact between the metal chips and the polymer, so as to further remove the metal chips on the cleaning dead corners of the probe; because the metal chips on the probe are cleaned more cleanly, the probe can be used for a longer time, reducing the cost of sending the probe to the original factory for chemical cleaning and replacing the probe card. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of a probe clamp needle action in the prior art.

[0018] Figure 2 It is a schematic diagram of a needle clearing action in the prior art.

[0019] Figure 3 It is a structural schematic diagram of a probe cleaning device provided in one embodiment of the utility model.

[0020] Figure 4 It is a structural schematic diagram of a probe cleaning device provided by another embodiment of the utility model.

[0021] Figure 5 It is a schematic diagram of a needle clearing action provided by an embodiment of the utility model.

[0022] Figure 6 It is a schematic structural diagram of a cleaned probe provided by an embodiment of the utility model.

[0023] Cleaning of the probe [Explanation of reference numerals as follows]:

[0024] The first chuck-1, wafer-2, the first probe-3, pad-4, the first metal shavings-5, the first cleaning wafer-6;

[0025] Chuck-11, base-12, hinge-13, lifting mechanism-14, tilting mechanism-15, metal chips-16, needle cleaning wafer-17, probe-18;

[0026] Motor-151, screw-152. DETAILED DESCRIPTION

[0027] In order to make the purpose, advantages and features of the utility model clearer, a probe cleaning device proposed by the utility model is further described in detail below in conjunction with the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model.

[0028] In the description of the present invention, the terms "first", "second", etc. are added for the convenience of description and reference, and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined by the terms "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0029] like Figure 3 , Figure 5 and Figure 6As shown, this embodiment provides a cleaning device for a probe 18, comprising a chuck 11, a base 12, a hinge 13, a lifting mechanism 14 and a tilting mechanism 15; the chuck 11 is placed on the base 12; one end of the hinge 13 is connected to the chuck 11, and the other end is connected to the base 12; the base 12 is connected to the lifting mechanism 14; the chuck 11 is connected to the tilting mechanism 15. The lifting mechanism 14 is used to drive the base 12 to move up and down, and the tilting mechanism 15 is used to drive the chuck 11 to tilt relative to the base 12.

[0030] The cleaning device of the probe 18 provided in this embodiment can adjust the chuck 11 to a suitable angle through the tilting mechanism 15, and then drive the base 12, the chuck 11 and the cleaning wafer 17 to move up and down together through the lifting mechanism 14 to perform the cleaning action. The unexpected effect is that the metal chips 16 on the cleaning dead corner of the probe 18 can be more fully contacted with the polymer on the cleaning wafer 17, and the cleaning effect is better (the cleaning effect can be referred to Figure 6 As shown, Figure 6 Metal shavings in 16 Figure 2 The first metal chips 5 in the probe 18 are obviously less); during the needle cleaning process, the tilt angle of the chuck 11 can be adjusted according to the contact between the metal chips 16 and the polymer, so as to further remove the metal chips 16 on the cleaning dead corners of the probe 18; because the metal chips 16 on the probe 18 are cleaned more thoroughly, the probe 18 can be used for a longer time, reducing the cost of sending the probe 18 to the original factory for chemical cleaning and replacing the probe card.

[0031] like Figure 3 As shown, the tilting mechanism 15 includes a motor 151, a lead screw 152 and a sleeve; the motor 151 is mounted on the base 12, one end of the lead screw 152 is meshed and connected with the rotating shaft of the motor 151, the sleeve is threadedly sleeved on the lead screw 152, and the sleeve is connected to the chuck 11. The motor 151 can drive the lead screw 152 to rotate, the rotation of the lead screw 152 can drive the sleeve to move up and down, and the up and down movement of the sleeve can drive the chuck 11 to tilt at an angle. The motor 151 can be a stepping motor, which has better precision than conventional motors and can better adjust the tilt angle of the chuck 11.

[0032] like Figure 3 and Figure 5 As shown, the line between the other end of the lead screw 152 and the hinge 13 is set on the longitudinal bisector of the chuck 11. The line between the other end of the lead screw 152 and the hinge 13 refers to the line between the center of the other end of the lead screw 152 and the center of the hinge 13. The intersection line between the longitudinal bisector of the chuck 11 and the upper surface of the chuck 11 is the X-axis direction (the X-axis direction refers to Figure 5In the process of driving the cleaning wafer 17 to rise and fall, the lifting mechanism 14 drives the probe 18 to slide on the cleaning wafer 17 along the X-axis direction, and the connecting line is on the longitudinal bisector of the chuck 11, so that the metal chips 16 on the probe 18 can be fully contacted with the polymer, thereby improving the cleaning effect. In other embodiments, the connecting line between the other end of the lead screw 152 and the hinge 13 can be slightly offset from the longitudinal bisector of the chuck 11.

[0033] like Figure 3 As shown, the motor 151 is mounted on the side of the base 12, and the sleeve is mounted on the side of the chuck 11. The motor 151 and the sleeve are both arranged on the side, which can facilitate the installation of the motor 151 and the sleeve. In other embodiments, a groove can be machined on the upper surface of the base 12, and the motor 151 can be installed in the groove.

[0034] like Figure 4 As shown, in another embodiment, the tilting mechanism 15 includes a cylinder, the cylinder includes a telescopic rod, and the cylinder is installed on the base 12; one end of the telescopic rod is located inside the cylinder, and the other end of the telescopic rod is connected to the chuck 11. The chuck 11 can be driven to tilt at an angle by the cylinder.

[0035] like Figure 4 and Figure 5 As shown, the line between the other end of the telescopic rod and the hinge 13 is set on the longitudinal bisector of the chuck 11. When the lifting mechanism 14 drives the cleaning wafer 17 to lift, the probe 18 slides on the cleaning wafer 17 along the X-axis direction. The line is on the longitudinal bisector of the chuck 11, which can make the metal chips 16 on the probe 18 fully contact with the polymer, thereby improving the cleaning effect.

[0036] like Figure 4 As shown, the cylinder is mounted on the side of the base 12, and the other end of the telescopic rod is connected to the side of the chuck 11 through an adapter. The cylinder is arranged on the side of the base 12, which can facilitate the installation of the cylinder and its pipeline.

[0037] refer to Figure 3 As shown, the shape of the chuck 11 and the base 12 are both disc-shaped. The shape of the chuck 11 and the base 12 are both disc-shaped, which can facilitate the processing of the chuck 11 and the base 12. In other embodiments, the shape of the chuck 11 and the base 12 can be elliptical or other shapes.

[0038] refer to Figure 5As shown, the device also includes a needle cleaning wafer 17, and a plurality of protrusion structures are arranged on the upper surface of the needle cleaning wafer 17. The protrusion structure can be a spherical convex point or a long strip prism structure, and the protrusion structure can prevent the polymer used for needle cleaning on the upper surface of the needle cleaning wafer 17 from sliding off.

[0039] refer to Figure 5 As shown, a plurality of the protruding structures are evenly arranged on the upper surface of the needle cleaning wafer 17. The evenly arranged protruding structures can make the polymer used for needle cleaning more evenly dispersed, thereby improving the needle cleaning effect.

[0040] refer to Figure 3 As shown, the lifting mechanism 14 includes a motor or a cylinder. The motor or the cylinder can drive the base 12 to move up and down to complete the needle clearing action.

[0041] To sum up, the utility model provides a cleaning device for a probe 18, which can adjust the chuck 11 to a suitable angle through the tilting mechanism 15, and then drive the base 12, the chuck 11 and the cleaning needle wafer 17 to move up and down together through the lifting mechanism 14 to perform the cleaning action. The unexpected effect is that the metal chips 16 on the cleaning dead corners of the probe 18 can be more fully contacted with the polymer on the cleaning needle wafer 17, and the cleaning effect is better; during the cleaning process, the tilting angle of the chuck 11 can be adjusted according to the contact between the metal chips 16 and the polymer, so as to further remove the metal chips 16 on the cleaning dead corners of the probe 18; because the metal chips 16 on the probe 18 are cleaned more thoroughly, the probe 18 can be used for a longer time, reducing the cost of sending the probe 18 to the original factory for chemical cleaning and replacing the probe card.

[0042] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation to the scope of the utility model. Any changes and modifications made by ordinary technicians in this field based on the above disclosure are within the protection scope of the utility model.

Claims

1. A probe cleaning device, characterized in that: It comprises a chuck, a base, a hinge, a lifting mechanism and a tilting mechanism; the chuck is placed on the base; one end of the hinge is connected to the chuck, and the other end is connected to the base; the base is connected to the lifting mechanism; and the chuck is connected to the tilting mechanism.

2. A probe cleaning device as claimed in claim 1, characterized in that: The tilting mechanism comprises a motor, a lead screw and a sleeve; the motor is mounted on the base, one end of the lead screw is meshedly connected with the rotating shaft of the motor, the sleeve is threadedly sleeved on the lead screw, and the sleeve is connected to the chuck.

3. A probe cleaning device as claimed in claim 2, characterized in that: The connecting line between the other end of the lead screw and the hinge is arranged on the longitudinal bisector of the chuck.

4. A probe cleaning device as claimed in claim 3, characterized in that: The motor is mounted on a side surface of the base, and the sleeve is mounted on a side surface of the chuck.

5. A probe cleaning device as claimed in claim 1, characterized in that: The tilting mechanism comprises a cylinder, which comprises a telescopic rod, and the cylinder is mounted on the base; one end of the telescopic rod is located inside the cylinder, and the other end of the telescopic rod is connected to the chuck.

6. A probe cleaning device as claimed in claim 5, characterized in that: The connecting line between the other end of the telescopic rod and the hinge is arranged on the longitudinal bisector of the chuck.

7. A probe cleaning device as claimed in claim 5, characterized in that: The cylinder is installed on the side of the base, and the other end of the telescopic rod is connected to the side of the chuck through a connecting piece.

8. A probe cleaning device as claimed in claim 1, characterized in that: The chuck and the base are both in the shape of a disc.

9. A probe cleaning device as claimed in claim 1, characterized in that: The device also includes a needle-cleaning wafer, and a plurality of protruding structures are arranged on the upper surface of the needle-cleaning wafer.

10. A probe cleaning device as claimed in claim 9, characterized in that: A plurality of the protruding structures are evenly arranged on the upper surface of the needle cleaning wafer.

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