Water jet scalpel cleaning equipment for semiconductor products

By setting up a water separation plate and uniformly arranged water holes in the water blade cleaning equipment, the problem of uneven cleaning pressure of the water blade is solved, and the uniform cleaning and efficient cleaning effect of semiconductor products is achieved, and the product yield is improved.

CN222241555UActive Publication Date: 2024-12-27KUNSHAN GUANGCHENG MASCH EQUIP CO LTD
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Patent Information

Application Number
CN202323668617.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-29
Publication Date
2024-12-27
Estimated Expiration
2033-12-29

AI Technical Summary

Technical Problem

During the immersion cleaning process of semiconductor products and PCB products, the cleaning pressure of ordinary water jets is uneven, resulting in poor cleaning effect and affecting product yield and cost.

Method used

A semiconductor product water drilling equipment is designed. The water drilling plate arranged in the cleaning water drill is divided into two parts, and the water flows through multiple evenly arranged water holes to ensure uniform water pressure. This achieves uniform cleaning of semiconductor products.

Benefits of technology

Through uniform water pressure, the semiconductor product is thoroughly cleaned, which improves the product yield and cleaning effect.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222241555U_ABST
Patent Text Reader

Abstract

The utility model discloses semiconductor product water jet scalpel cleaning equipment which comprises a machine body, a cleaning tank is arranged in the machine body, a water pump and a filter are arranged outside the machine body, the water pump is communicated with the filter through a pipeline, a cleaning water jet scalpel is arranged in the cleaning tank, one side of the cleaning water jet scalpel is provided with a water inlet, and the water inlet is communicated with the filter through a pipeline. A plurality of water inlets are formed in one side of the cleaning water jet cutter, a plurality of water outlets are formed in the other side of the cleaning water jet cutter, a water diversion plate is arranged in the cleaning water jet cutter and divides the cleaning water jet cutter into two parts, one part of the cleaning water jet cutter comprises the water inlet, the other part of the cleaning water jet cutter comprises the water outlet, and a plurality of water passing holes are formed in the water diversion plate. One end of the water passing hole is communicated with the part, with the water inlet, of the cleaning water jet cutter, and the other end of the water passing hole is communicated with the part, with the water outlet, of the cleaning water jet cutter. The water jet cleaning equipment for the semiconductor products is used for cleaning the semiconductor products and the PCB products, is uniform in cleaning pressure, thorough in cleaning and good in cleaning effect, and is beneficial to guaranteeing the product yield.
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Description

Technical Field

[0001] The utility model relates to water jet cleaning equipment for semiconductor products, belonging to the technical field of semiconductor product cleaning devices. Background Art

[0002] The production process of semiconductor products and PCB products often involves a cleaning process, which includes an immersion cleaning process for cleaning semiconductor products and PCB products. In the immersion cleaning process, a cleaning water jet is often used to clean the product workpiece in the immersion tank. The pressure of ordinary water jet cleaning is uneven, resulting in incomplete cleaning of the product, poor cleaning effect, low product yield and high cost.

[0003] The patent with the authorization announcement number CN 205436425 U discloses a swing-type PCB board water jet cleaning device, including a frame, a water tank, a conveying roller, a motor, a first connecting rod, a second connecting rod, a support frame, a guide rod, and a water jet assembly. When the swing-type PCB board water jet cleaning device is working, the PCB board enters the conveying roller through the material port and moves continuously, and high-pressure water is pumped into the water jet box through the water inlet pipe. The high-pressure water is evenly distributed through the flow equalizing plate and then sprayed out through the spray knife plate to form a uniform water curtain. At the same time, the motor rotates, and the motor drives the water jet assembly to swing back and forth on the guide rod through the first connecting rod and the second connecting rod to clean the PCB board. The device has a simple structure, and the swing-type cleaning action allows the PCB board to be washed with high-pressure water, and the cleaning is uniform without dead corners, and the cleaning effect is good. However, this structure is not suitable for the cleaning of semiconductor products with high cleanliness requirements, and lacks a filtering mechanism, which affects product quality and yield. Utility Model Content

[0004] The main technical problem solved by the utility model is to provide a semiconductor product water jet cleaning device, which is used for cleaning semiconductor products and PCB products, has uniform cleaning pressure, thorough cleaning, good cleaning effect, and is conducive to ensuring product yield.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: to provide a water jet cleaning device for semiconductor products, including a body, a cleaning tank is arranged in the body, a water pump and a filter are arranged outside the body, the water pump is connected to the filter through a pipeline, a cleaning water jet is arranged in the cleaning tank, a water inlet is arranged on one side of the cleaning water jet, the water inlet is connected to the filter through a pipeline, a plurality of water outlets are arranged on the other side of the cleaning water jet, a water dividing plate is arranged in the cleaning water jet, the water dividing plate divides the cleaning water jet into two parts, one part of the cleaning water jet includes a water inlet, the other part of the cleaning water jet includes a water outlet, a plurality of water holes are arranged on the water dividing plate, one end of the water hole is connected to a part of the cleaning water jet including the water inlet, and the other end of the water hole is connected to a part of the cleaning water jet including the water outlet.

[0006] Preferably, a movable pipe joint is provided on the pipeline.

[0007] Preferably, two water jet mounting frames are provided in the cleaning tank, and two ends of the cleaning water jet are respectively mounted on the two water jet mounting frames.

[0008] Preferably, the water jet mounting frame is provided with two rotatable movable adjustment blocks, and the two ends of the water dividing plate are respectively mounted on the two movable adjustment blocks.

[0009] Preferably, the multiple water outlets are evenly arranged on the cleaning water jet.

[0010] Preferably, the plurality of water holes are evenly arranged on the water distribution plate.

[0011] The beneficial effect of the utility model is that the semiconductor product water jet cleaning equipment of the utility model is used for cleaning semiconductor products and PCB products. By arranging a water distribution plate in the cleaning water jet, the cleaning pressure of the water jet is made uniform, the semiconductor products are cleaned thoroughly, the cleaning effect is good, and it is beneficial to ensure the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0013] Figure 1 It is a structural schematic diagram of the semiconductor product water jet cleaning device of the utility model;

[0014] Figure 2 and Figure 3It is a schematic diagram of two sides of a cleaning water jet in a semiconductor product water jet cleaning device of the utility model;

[0015] Figure 4 The utility model is a schematic diagram of the structure of a water distribution plate in a water jet cleaning device for semiconductor products. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] See also Figures 1 to 4 The utility model embodiment includes: a semiconductor product water jet cleaning device, which includes a body 1, a cleaning tank 2 is arranged in the body 1, a water pump 3 and a filter 4 are arranged outside the body 1, the water pump 3 is connected with the filter 4 through a pipeline, the filter 4 filters the water pumped by the water pump 3 to ensure the cleanliness of the water to avoid contamination of the surface of the semiconductor product, a cleaning water jet 5 is arranged in the cleaning tank 2, a water inlet 6 is arranged on one side of the cleaning water jet 5, the water inlet 6 is connected with the filter 4 through a pipeline 7, and a plurality of outlets are arranged on the other side of the cleaning water jet 5. Water inlet 8, a water dividing plate 9 is arranged in the cleaning water knife 5, and the water dividing plate 9 divides the cleaning water knife 5 into two parts, one part of the cleaning water knife 5 includes a water inlet 6, and the other part of the cleaning water knife 5 includes a water outlet 8. A plurality of water holes 10 are arranged on the water dividing plate 9, one end of the water hole 10 is connected with a part of the cleaning water knife 5 including the water inlet 6, and the other end of the water hole 10 is connected with a part of the cleaning water knife 5 including the water outlet 8, that is, one end of the water hole 10 is connected with the water inlet 6, and the other end of the water hole 10 is connected with the water outlet 8.

[0018] Preferably, a movable pipe joint 11 is provided on the pipeline 7 , and the cleaning water jet 5 can be taken out of the cleaning tank 2 by removing the movable pipe joint 11 .

[0019] Preferably, two water jet mounting frames 12 are provided in the cleaning tank 2 , and two ends of the cleaning water jet 5 are respectively mounted on the two water jet mounting frames 12 .

[0020] Preferably, two movable adjustment blocks 13 are provided on the water jet mounting frame 12, and the two ends of the water splitting plate 9 are respectively mounted on the two movable adjustment blocks 13. The movable adjustment blocks 13 are rotated to adjust the direction of the water holes 10 of the water splitting plate 9. The water splitting plate 9 can be disassembled to facilitate the cleaning and maintenance of the water jet 5.

[0021] Preferably, the plurality of water outlets 8 are evenly arranged on the cleaning water jet 5 , and the plurality of water holes 10 are evenly arranged on the water dividing plate 9 .

[0022] When the semiconductor product water jet cleaning device of the utility model is used, the water pump 3 works to pump the cleaning water to the filter 4, which is filtered by the filter 4, reaches the water inlet 6 through the pipe 7, and enters the multiple water holes 10 on the water distribution plate 9 through the water inlet 6. The cleaning water passes through the multiple water holes 10 to the multiple water outlets 8 of the cleaning water jet 5, and the cleaning water is sprayed from the multiple water outlets 8 to clean the semiconductor products placed in the cleaning tank 2. If the cleaning water directly enters from the water inlet 6 and is sprayed from the water outlet 8, the water pressure near the water inlet 6 is relatively large, and the water pressure sprayed from the water outlet 8 is relatively large, while the water pressure far from the water inlet 6 is relatively small. The water pressure sprayed from the water outlet 8 is also relatively small, which makes the cleaning of the semiconductor products uneven, affecting the product quality. After the water dividing plate 9 is set, the cleaning water entering from the water inlet 6 passes through the water holes 10 on the water dividing plate 9 and then enters the water outlet 8. Since the multiple water holes 10 are evenly distributed on the water dividing plate 9, the water pressure of the cleaning water is uniform after coming out of the multiple water holes 1 and then entering the water outlet 8. The water pressure of the cleaning water sprayed from the water outlet 8 is uniform, which can achieve uniform cleaning of semiconductor products, thorough cleaning of semiconductor products, good cleaning effect, and is conducive to ensuring product yield.

Claims

1. A water jet cleaning device for semiconductor products, comprising a body, a cleaning tank is arranged inside the body, a water pump and a filter are arranged outside the body, the water pump and the filter are connected through a pipeline, characterized in that: A cleaning water jet is arranged in the cleaning tank, a water inlet is arranged on one side of the cleaning water jet, the water inlet is connected to the filter through a pipe, a plurality of water outlets are arranged on the other side of the cleaning water jet, a water dividing plate is arranged in the cleaning water jet, the water dividing plate divides the cleaning water jet into two parts, one part of the cleaning water jet includes the water inlet, the other part of the cleaning water jet includes the water outlet, a plurality of water holes are arranged on the water dividing plate, one end of the water hole is connected to a part of the cleaning water jet including the water inlet, and the other end of the water hole is connected to a part of the cleaning water jet including the water outlet.

2. The semiconductor product water jet cleaning equipment according to claim 1, characterized in that: The pipeline is provided with a movable pipe joint.

3. The semiconductor product water jet cleaning equipment according to claim 2, characterized in that: Two water jet mounting frames are arranged in the cleaning tank, and two ends of the cleaning water jet are respectively mounted on the two water jet mounting frames.

4. The semiconductor product water jet cleaning equipment according to claim 3, characterized in that: The water jet mounting frame is provided with two rotatable movable adjustment blocks, and the two ends of the water dividing plate are respectively mounted on the two movable adjustment blocks.

5. The semiconductor product water jet cleaning equipment according to claim 4, characterized in that: The multiple water outlets are evenly arranged on the cleaning water jet.

6. The semiconductor product water jet cleaning equipment according to claim 5, characterized in that: The multiple water holes are evenly arranged on the water distribution plate.