Chip pin shaping machine

Abstract

The utility model provides a chip pin shaping machine. The chip pin shaping machine comprises a camera module, a display module, a shaping module, a pressing module and a chip positioning module, the camera module comprises a camera and a first adjusting unit for driving the camera to move, and the camera is connected with the display module; the shaping module comprises a shaping comb and a second adjusting unit for driving the shaping comb to move up and down; the pressing module comprises a pressing plate and a third adjusting unit connected with the pressing plate. And the chip positioning module comprises a chip reference seat for bearing a chip substrate and a fourth adjusting unit for adjusting the position of the chip reference seat. According to the chip pin shaping machine provided by the embodiment of the invention, through the improved structural design, a plurality of pins on the single side of the chip can be shaped and repaired simultaneously, and the repairing condition can be clearly and accurately mastered through the display module in the shaping operation process, so that the phenomena of missing detection and neglected shaping easily caused by manual visual inspection are avoided, and the working efficiency is improved. And the shaping and repairing efficiency and quality can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic component manufacturing equipment, and in particular to a chip pin shaping machine. Background Art

[0002] After the chips are manufactured, they are prone to various deformations such as tilting, warping, and twisting of the chip pins due to collision, falling, improper picking, etc., which affects the flatness and coplanarity of the chip pins, resulting in the chip being scrapped due to the inability to perform normal patch welding, causing huge economic losses. To make up for such defects, the pins need to be shaped and repaired to a flatness and coplanarity that meets industry welding standards. Traditional shaping methods generally use manual tweezers to shape the pins one by one, or use simple multiple sets of tooling equipment to shape them. The shaping process relies entirely on manual visual observation to observe the shaping and repair situation. These methods are not only inefficient, but also prone to human errors (such as failure to observe the deformation of some pins), which may lead to the omission of the shaping of some pins. With the increase in chip packaging density and the reduction in pin spacing, manual methods or simple tooling methods can no longer meet the requirements of high-precision and high-reliability shaping.

[0003] Therefore, it is necessary to propose a new chip pin shaping machine to solve the above problems. Summary of the invention

[0004] In view of the shortcomings of the prior art mentioned above, the purpose of the present application is to provide a chip pin shaping machine, which is used to solve the problems of low efficiency and / or easy omissions in the existing process of shaping chip pins one by one with manual tweezers, or shaping with the help of simple multiple sets of tooling equipment, and completely relying on manual visual observation of the shaping and repair situation during the shaping process.

[0005] To achieve the above-mentioned purpose and other related purposes, the present application provides a chip pin shaping machine, including: a camera module, a display module, a shaping module, a clamping module and a chip positioning module; the camera module includes a camera and a first adjustment unit for driving the camera to move, the camera is connected to the display module, and the first adjustment unit can move the camera above the pins of the chip; the shaping module includes a shaping comb and a second adjustment unit for driving the shaping comb to move up and down; the clamping module includes a pressing plate and a third adjustment unit connected to the pressing plate, and the third adjustment unit can drive the pressing plate to move to the substrate surface of the chip; the chip positioning module includes a chip reference seat for supporting the chip substrate and a fourth adjustment unit for adjusting the position of the chip reference seat, and the fourth adjustment unit can drive the chip to move to the shaping comb.

[0006] Optionally, the second adjustment unit includes a base for fixing the shaping comb and an adjustment mechanism for adjusting the position of the base, and the adjustment mechanism includes a micrometer.

[0007] Optionally, the camera module further includes a light source located below the lens.

[0008] Optionally, the chip pin shaping machine further comprises a base plate, and the camera module, display module, shaping module, pressing module and chip positioning module are all fixed on the base plate.

[0009] Optionally, the base plate is an alloy plate, and a plurality of supporting legs are arranged at intervals on the bottom surface of the base plate.

[0010] Optionally, the first adjustment unit includes a support rod and a bracket, the camera is fixed on the bracket, and the bracket is rotatably connected to the support rod.

[0011] Optionally, a limit block is further provided on the support rod, and the limit block is located below the camera.

[0012] Optionally, the camera module further includes a range extender disposed on the camera.

[0013] As described above, the chip pin shaping machine provided in this embodiment has an improved structural design, and can simultaneously shape and repair multiple pins on a single side of the chip. During the shaping operation, the repair status can be clearly and accurately grasped through the display module, avoiding the phenomenon of missed inspections and missed repairs that are easily caused by manual visual inspection, which helps to improve the efficiency and quality of shaping and repair. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 Shown is an exemplary front view of the chip pin shaping machine provided by the present application.

[0015] Figure 2 and Figure 3 Display as Figure 1 The chip lead shaping machine is shown in side views from different directions.

[0016] Figure 4 Shown is an exemplary structural schematic diagram of a shaping module and a chip positioning module of a chip pin shaping machine provided in the present application. DETAILED DESCRIPTION

[0017] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. For example, when describing the embodiments of the present application in detail, for ease of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the present application. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0018] For ease of description, spatially relative terms such as "under", "below", "below", "below", "above", "on", etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

[0019] In the context of the present application, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0020] See also Figures 1 to 4 It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present application in a schematic manner, and therefore the illustrations only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the form, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0021] like Figures 1 to 4As shown, the present application provides a chip pin shaping machine, including: a camera module 1, a display module 2, a shaping module 3, a pressing module 4 and a chip positioning module 5. The camera module 1 includes a camera 11 and a first adjustment unit for driving the camera 11 to move. The first adjustment unit can move the camera 11 above the pin of the chip to observe the pin of the chip through the camera 11, so as to more clearly grasp the deformation of the pin, and then perform the shaping operation more targeted. The camera 11 is connected to the display module 2, so the result of the camera 11 can be displayed in time through the display module 2, and the relevant modules are adjusted according to the display result until they are adjusted to a state that meets the required requirements. The shaping module 3 includes a shaping comb 31 and a second adjustment unit for driving the shaping comb 31 to move up and down. The shaping comb 31 is a structure including a plurality of parallel and spaced comb teeth, but the specific structure of the shaping comb, such as the number of comb teeth, the spacing between the comb teeth, the material of the comb teeth, etc., can be determined according to the chip to be shaped. For example, the material of the shaping comb can be the same as the material of the chip pin to be shaped, such as copper, but it is not limited to this. The shaping comb 31 is detachably connected to the second adjusting unit. For example, the shaping comb can be connected to the base 321 of the second adjusting unit by a fixing member such as a screw, and a manual lifting device can be set on the second adjusting unit to adjust the position of the base 321 up and down, or automatically adjust it by a mechanical device such as an upgraded cylinder, thereby adjusting the upper and lower positions of the shaping comb. In addition, a driving mechanism for rotating the shaping comb can be set as required. The pressing module 4 includes a pressing plate 41 and a third adjusting unit 42 connected to the pressing plate 41, and the third adjusting unit 42 can drive the pressing plate 41 to move to the substrate surface of the chip. The pressing plate 41 can be a fixed size, or it can be adjusted according to the size of the chip to be shaped. The third adjusting unit 42 can adopt a manual manual adjustment device, such as a pressing mechanism with a spring for adjustment, or it can also be automatically adjusted by a device with a lifting cylinder. The chip positioning module 5 includes a chip reference seat 51 for carrying a chip substrate and a fourth adjusting unit 52 for adjusting the position of the chip reference seat 51, and the fourth adjusting unit 52 can drive the chip to move to the second adjustment unit. The fourth adjustment unit 52 may be a manual adjustment device or an electric adjustment device. In this embodiment, in order to simplify the device structure and reduce the device cost, each adjustment unit is preferably a manual adjustment device.

[0022] An exemplary method of using the chip pin shaping machine provided in this embodiment is to first place the chip positioning module 5 at a preset position, and then place the chip to be shaped on the chip reference seat 51, wherein only the substrate portion of the chip is placed on the chip reference seat 51, and the chip pins are in an unsupported free state. Next, the pressing plate 41 of the clamping module 4 is pressed on the chip substrate, the camera 11 is adjusted to the top of the chip pin, and the chip pin condition is observed through the display module 2. Then, the second adjustment unit adapted to the chip (the selection of the shaping comb mainly considers parameters such as chip width, number of pins, pin width, and pin spacing) is moved to the bottom of the pin, and the comb teeth are adjusted by the second adjustment unit so that they are located directly below the chip pin one by one (this process can be observed by the camera 11 The upper and lower positions of the comb teeth and the pins), and then the second adjustment unit is repeatedly raised and lowered, so that the comb teeth touch and squeeze the ends of the corresponding pins one by one to restore the ends of the chip pins to their original appearance and achieve good coplanarity, and then the second adjustment unit is horizontally moved so that the comb teeth of the second adjustment unit are located directly below the gap of the chip pins one by one, and then the second adjustment unit is repeatedly raised and lowered, and the comb teeth move up and down in the gap between two adjacent pins, thereby adjusting the pin spacing to the required level and completing the shaping operation. During and after the shaping operation, the shaping result is observed in time through the display. After the pin shaping and repair on one side of the chip is completed, the pressing plate 41 and the shaping comb can be removed, and the chip side can be changed manually using a vacuum suction pen, or the chip side can be changed by rotating the chip reference seat 51, and then the pressing plate and the shaping comb are adjusted to the shaping position to shape and repair the pins on the other side of the chip until all the pins of the chip are shaped and repaired.

[0023] Of course, the shaping operation varies depending on the shape of the chip pins. For example, if the pins of some chips are straight, coplanar shaping is not required.

[0024] The chip pin shaping machine provided in this embodiment has an improved structural design, and can simultaneously shape and repair multiple pins on a single side of the chip. During the shaping operation, the display module 2 can be used to clearly and accurately grasp the repair status, avoiding the phenomenon of missed inspections and missed repairs that are easily caused by manual visual inspection, which helps to improve the efficiency and quality of shaping and repair.

[0025] In some examples, the second adjustment unit includes a base 321 for fixing the shaping comb 31 and an adjustment mechanism 322 for adjusting the position of the base 321, wherein the adjustment mechanism 322 includes a micrometer 323. Figure 4As shown, the second adjustment unit includes a plurality of sheet metal parts connected to the base 321 and an X-axis micrometer 323, a Y-axis micrometer 323 and a Z-axis micrometer 323 connected to the sheet metal parts. By adjusting the micrometers in the corresponding axial directions, the base 321 can be fine-tuned in the corresponding direction, thereby achieving precise adjustment of the position of the second adjustment unit. In a further example, the base 321 includes an upper limit block 123 and a lower limit block 123, and the upper limit block 123 and the lower limit block 123 are provided with upper and lower corresponding grooves. The grooves of the two limit blocks 123 constitute a space that can accommodate the second adjustment unit, and the height of the space can be adjusted by moving the upper limit block 123 and / or the lower limit block 123. For example, in this embodiment, the second adjustment unit can be movably arranged on the upper limit block 123 up and down, the chip can be moved to the bottom of the second adjustment unit and located in the groove, and the distance of the lower limit block 123 is adjusted according to the height of the chip pin, so that the bottom surface of the undeformed pin end of the chip contacts the lower limit block 123, and then the second adjustment unit is moved up and down to perform plastic surgery on the chip pin.

[0026] In some examples, the first adjustment unit includes a support rod 121 and a bracket 122, the camera 11 is fixed on the bracket 122, and the bracket 122 is rotatably connected to the support rod 121. Figure 2 As shown, the support rod 121 is a cylindrical rod, and the bracket 122 includes two annular portions (not marked) and a horizontal extension portion (not marked) connected between the two annular portions. The camera 11 is fixed in one of the annular portions, and the other annular portion is wound around the support rod 121 and fastened by fasteners such as screws. The position of the camera 11 can be adjusted by manually removing the screws and rotating and / or moving the support rod 121 up and down and then re-tightening it. In some examples, a limit block 123 is also provided on the support rod 121, and the limit block 123 is located below the camera 11 to prevent the bracket 122 from causing a malfunction of the camera 11 due to an unexpected sudden drop.

[0027] In some other examples, the bracket connected to the camera can be wrapped around the support rod through an annular slider, and the annular slider is connected to the piston rod of the cylinder. Through the lifting and lowering of the cylinder piston rod, the camera is driven up and down to adjust the shooting effect.

[0028] In some examples, the camera module 1 further includes a teleconverter disposed on the camera 11. If the width of the chip to be shaped is greater than 25 mm, the teleconverter (teleconverter) is installed so that the camera 11 can fully capture the chip and display the complete chip through the display module 2. If the chip width is less than 25 mm, the teleconverter can be removed. Since the specific use of the teleconverter is well known to those skilled in the art, it will not be elaborated in detail.

[0029] In some examples, the camera module 1 further includes a light source 13 located below the lens, and the light source 13 is, for example, a ring light source 13, and its power supply 8 can be arranged on one side of the camera 11. The light source 13 can be arranged below the camera 11 through a support member (for example, a support member also connected to the support rod 121 is arranged below the camera 11), and can be arranged below the camera 11 through a connecting member. Starting the light source 13 as needed helps to achieve clearer imaging.

[0030] Each module can be independently set as needed. In other examples, the chip pin shaping machine also includes a base plate 6, and the camera module 1, display module 2, shaping module 3, clamping module 4 and chip positioning module 5 are all fixed on the base plate 6, for example, fixed by fasteners such as screws. Such a design makes the overall structure of the chip pin shaping machine more compact and facilitates the movement of the equipment. In a further example, the base plate 6 is an alloy plate, such as a stainless steel plate, and a plurality of support feet 7 are arranged at intervals on the bottom surface of the base plate 6, which facilitates the transportation of the equipment. The bottom of the support feet 7 can be treated with anti-slip.

[0031] In some examples, the display module 2 includes a liquid crystal screen, which can be erected on the bottom plate 6 through a support rod 121, and the liquid crystal screen can be rotated and / or raised and lowered to meet different needs. The camera 11 can be connected to the liquid crystal screen by wire and / or wirelessly to achieve real-time transmission of shooting results.

[0032] In some examples, such as Figure 4 As shown, the fourth adjustment unit 52 includes an adjustment base and an adjustment mechanism for adjusting the position of the adjustment base, and the adjustment mechanism is, for example, also a structure including a micrometer. The chip reference seat is an inverted T-shaped structure, which is vertically arranged on the adjustment base. In some other examples, the bearing surface of the chip reference seat is composed of a central part and an edge portion arranged around the central part, and the edge portion is detachably connected to the central part, or the edge portion is foldable (for example, connected to the central part by a hinge), so the size of the bearing surface can be adjusted as needed to perform pin shaping and repair on chips of different sizes.

[0033] In summary, the present application provides a chip pin shaping machine, including: a camera module, a display module, a shaping module, a pressing module and a chip positioning module; the camera module includes a camera and a first adjustment unit for driving the camera to move, the camera is connected to the display module, and the first adjustment unit can move the camera above the pin of the chip; the shaping module includes a shaping comb and a second adjustment unit for driving the shaping comb to move up and down; the pressing module includes a pressing plate and a third adjustment unit connected to the pressing plate, and the third adjustment unit can drive the pressing plate to move to the substrate surface of the chip; the chip positioning module includes a chip reference seat for carrying the chip substrate and a fourth adjustment unit for adjusting the position of the chip reference seat, and the fourth adjustment unit can drive the chip to move to the shaping comb. The chip pin shaping machine provided in this embodiment has an improved structural design, which can simultaneously shape and repair multiple pins on a single side of the chip, and the display module can be used to clearly and accurately grasp the repair status during the shaping operation, avoiding the phenomenon of missed inspection and missed repair caused by manual visual inspection, which helps to improve the efficiency and quality of shaping and repair.

[0034] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A chip pin shaping machine, characterized in that: include: A camera module, a display module, a shaping module, a pressing module and a chip positioning module; the camera module includes a camera and a first adjusting unit for driving the camera to move, the camera is connected to the display module, and the first adjusting unit can move the camera above the pins of the chip; the shaping module includes a shaping comb and a second adjusting unit for driving the shaping comb to move up and down; the pressing module includes a pressing plate and a third adjusting unit connected to the pressing plate, and the third adjusting unit can drive the pressing plate to move to the substrate surface of the chip; The chip positioning module comprises a chip reference seat for carrying a chip substrate and a fourth adjusting unit for adjusting the position of the chip reference seat, and the fourth adjusting unit can drive the chip to move to the shaping comb.

2. The chip pin shaping machine according to claim 1, characterized in that: The second adjusting unit comprises a base for fixing the shaping comb and an adjusting mechanism for adjusting the position of the base, wherein the adjusting mechanism comprises a micrometer.

3. The chip pin shaping machine according to claim 1, characterized in that: The camera module also includes a light source located below the lens.

4. The chip pin shaping machine according to claim 1, characterized in that: The chip pin shaping machine also includes a bottom plate, and the camera module, display module, shaping module, pressing module and chip positioning module are all fixed on the bottom plate.

5. The chip pin shaping machine according to claim 4, characterized in that: The bottom plate is an alloy plate, and a plurality of supporting legs are arranged at intervals on the bottom surface of the bottom plate.

6. The chip pin shaping machine according to claim 1, characterized in that: The first adjustment unit includes a support rod and a bracket, the camera is fixed on the bracket, and the bracket is rotatably connected to the support rod.

7. The chip pin shaping machine according to claim 6, characterized in that: A limit block is also arranged on the support rod, and the limit block is located below the camera.

8. The chip pin shaping machine according to claim 1, characterized in that: The camera module also includes a range extender disposed on the camera.

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