Pin reflow soldering device

Abstract

The utility model discloses a contact pin reflow soldering device. Comprising a pin positioning cover plate (100), four support columns (10) and 288 pin positioning holes (1), wherein the four support columns (10) and the 288 pin positioning holes (1) are arranged on the pin positioning cover plate (100); the four supporting columns (10) are arranged at the four corners of the pin positioning cover plate (100) and correspond to positioning grooves of the base (200). The supporting column (10) is used for rigidly supporting the contact pin positioning cover plate; the screw (2) is used for fixing the supporting column; the contact pin positioning hole (1) is used for positioning and fixing a contact pin; and the base (200) is used for positioning the PCB and the pin positioning cover plate. The device has the characteristics of high processing efficiency, good precision control and stable and reliable quality.

Description

Technical Field

[0001] The present invention relates to the technical field of aviation airborne electrical equipment, and specifically to a device for pin reflow soldering. Background Art

[0002] Multilayer plywood PCB has become an indispensable component of aviation electronic products due to its advantages such as high integration, smaller size and more stable signal transmission. As the demand for multilayer plywood PCB increases, the complexity of the welding process also increases. According to the traditional processing method, the use of manual welding process and single-point pin fixing of multilayer PCB will lead to increased labor costs and low processing efficiency, which cannot meet normal production and assembly requirements. Utility Model Content

[0003] The purpose of the utility model is to provide a device for pin reflow soldering. The utility model has the characteristics of high processing efficiency, good precision control, stable and reliable quality.

[0004] The technical solution of the utility model is: a pin reflow soldering device, comprising:

[0005] A pin positioning cover plate, and four support columns and 288 pin positioning holes arranged on the pin positioning cover plate;

[0006] Four support columns are set at the four corners of the pin positioning cover, corresponding to the positioning grooves of the base;

[0007] A support column, used for rigidly supporting the pin positioning cover plate;

[0008] Screws, used to fix the support column;

[0009] Pin positioning hole, used for positioning and fixing the pin;

[0010] The base is used to position the PCB and the pin positioning cover.

[0011] In the aforementioned pin reflow soldering device, the pin positioning cover plate includes:

[0012] Pin positioning holes, support columns and screws;

[0013] The support column and the pin positioning cover are fixed by screws and matched with the cover positioning groove of the base.

[0014] In the aforementioned pin reflow soldering device, the diameter of the pin positioning hole is L=0.6 mm, the processing accuracy is 0.1 mm, and each of the 288 positioning holes has a unique coordinate.

[0015] In the aforementioned pin reflow soldering device, the base is provided with a cover plate positioning groove and a PCB positioning groove.

[0016] In the aforementioned pin reflow soldering device, the pin positioning cover plate is made of synthetic stone material.

[0017] In the aforementioned pin reflow soldering device, the support column and the base are made of synthetic stone material.

[0018] The advantages of the utility model are:

[0019] The utility model has high processing efficiency, good precision control, stable and reliable quality, and can realize pin reflow soldering to meet the needs of batch production and processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of a device capable of realizing pin reflow soldering;

[0021] Figure 2 A three-dimensional outline diagram of a device capable of realizing pin reflow soldering;

[0022] Figure 3 A schematic diagram of the pin positioning cover;

[0023] Figure 4 A schematic diagram of the base.

[0024] Among them: 1. Pin positioning hole, 2. Screw, 3. Cover positioning slot, 4. PCB positioning slot, 10. Support column, 100. Pin positioning cover, 200. Base. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0026] The features and illustrative embodiments of various aspects of the utility model will be described in detail below. In the detailed description below, many specific details are proposed in order to provide a comprehensive understanding of the utility model. However, it is obvious to those skilled in the art that the utility model can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the utility model by illustrating examples of the utility model. The utility model is by no means limited to any specific settings and methods proposed below, but covers any improvements, replacements and modifications of structures, methods, devices without departing from the spirit of the utility model. In the accompanying drawings and the following description, known structures and technologies are not shown to avoid unnecessary ambiguity in the utility model.

[0027] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other, and the embodiments can be referenced and cited to each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0028] Embodiment 1. A device for pin reflow soldering, see Figure 1-4 , the device comprises:

[0029] Pin positioning cover 100, and

[0030] 4 support columns 10 and 288 pin positioning holes 1 are provided on the pin positioning cover plate 100;

[0031] Four support columns 10 are arranged at the four corners of the pin positioning cover plate 100, corresponding to the positioning grooves of the base 200;

[0032] Support column 10, used for rigidly supporting the pin positioning cover plate;

[0033] Screw 2, used to fix the support column

[0034] Pin positioning hole 1, used for positioning and fixing the pin;

[0035] The base 200 is used to position the PCB and the pin positioning cover.

[0036] In the second aspect, the utility model proposes a processing method for replacing manual welding with a reflow soldering process based on a composite plate fixing device, and the processing method includes the following steps:

[0037] The first layer of PCB is fixed by the PCB positioning groove provided in the base 200 of the device, and the frame in the composite structure is placed on the corresponding position of the first layer of PCB. Then the pin positioning cover plate 100 is placed on the base and supported by the support column 10 and the cover plate positioning groove provided in the base 200. The pin is passed through the pin positioning hole 1, and the frame, PCB and device are placed in the reflow furnace for soldering.

[0038] The above-mentioned embodiments of the invention have high processing efficiency, good precision control, stable and reliable quality, and can solve the problems of low efficiency, unstable precision and quality of traditional manual welding and single-point pin insertion.

[0039] Example 2. The multi-layer plywood structure PCB has a high degree of integration and a high complexity of welding process. According to the traditional processing method, the manual welding process and the single-point pin fixing method of the multi-layer PCB are used, which has high labor costs and low processing efficiency and cannot meet the normal production and assembly requirements.

[0040] The first layer of PCB is fixed by the PCB positioning groove provided in the base 200 of the device, and the frame in the composite structure is placed on the corresponding position of the first layer of PCB. Then the pin positioning cover plate 100 is placed on the base and supported by the support column 10 and the cover plate positioning groove provided in the base 200. The pin is passed through the pin positioning hole 1, and the frame, PCB and device are placed in the reflow furnace for soldering.

[0041] Compared with the prior art, the beneficial effect of the present invention is that the pin reflow soldering device can realize the reflow soldering process to replace manual soldering, and can meet the needs of mass production and processing.

Claims

1. A pin reflow soldering device, characterized in that: include: a pin positioning cover plate (100), and Four support columns (10) and 288 pin positioning holes (1) arranged on a pin positioning cover plate (100); Four support columns (10) are arranged at four corners of the pin positioning cover plate (100) and correspond to the positioning grooves of the base (200); A support column (10) is used to rigidly support the pin positioning cover plate; Screws (2) for fixing the support column; A pin positioning hole (1) for positioning and fixing the pin; The base (200) is used to position the PCB and the pin positioning cover plate.

2. The pin reflow soldering device according to claim 1, characterized in that: The pin positioning cover plate (100) comprises: Pin positioning hole (1), support column (10) and screw (2); The support column (10) and the pin positioning cover plate (100) are fixed by means of screws (2) and are adapted to the cover plate positioning groove of the base (200).

3. The pin reflow soldering device according to claim 2, characterized in that: The diameter L of the pin positioning hole (1) is 0.6 mm, the processing accuracy is 0.1 mm, and each of the 288 positioning holes (1) has a unique coordinate.

4. The pin reflow soldering device according to claim 2, characterized in that: The base (200) is provided with a cover plate positioning groove and a PCB positioning groove.

5. The pin reflow soldering device according to claim 1, characterized in that: The pin positioning cover plate (100) is made of synthetic stone material.

6. The pin reflow soldering device according to claim 1, characterized in that: The support column (10) and the base (200) are made of synthetic stone material.

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