Scrap collecting device for wafer processing of semiconductor device
By using a combination of chip drain and fan in the wafer processing device of semiconductor devices, the debris residue problem is solved, rapid cleaning and efficient processing table cleanliness are achieved, and processing efficiency is improved.
Patent Information
- Application Number
- CN202421056926.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-15
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-15
AI Technical Summary
During the wafer processing of semiconductor devices, debris produced by drilling remain on the processing table, affecting the processing quality and tabletop cleanliness, and inconvenient cleaning.
A debris collection device including a chip drain and a fan is designed to blow debris into the chip drain using exhaust ducts and outlets, and to achieve rapid collection through an inclined design and adjustable exhaust duct, combining electric cylinders and The use of hole punching equipment ensures effective cleaning of debris.
It achieves rapid and effective debris collection and improvement of the cleanliness of the processing table, avoids debris residues, and improves the efficiency and convenience of wafer processing.
Smart Images
Figure CN222245487U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing, in particular to a debris collection device for wafer processing of semiconductor devices. Background Art
[0002] A wafer refers to a silicon chip used in the manufacture of silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. In the manufacture of semiconductor chips, after multiple chip areas are formed on the surface of the wafer, it is necessary to first draw lanes at the intervals, and then split the entire wafer into multiple separate chips. The wafer needs to be drilled during processing, and the debris generated by the drilling remains on the processing table, which not only affects the processing of the wafer, but also affects the cleanliness of the processing table, making it inconvenient to clean up later. Utility Model Content
[0003] The utility model aims to provide a chip collecting device for wafer processing of semiconductor devices, which has the advantage of being able to clean and collect the chip.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip collection device for wafer processing of semiconductor devices, comprising a support seat, a processing table is fixedly installed on the top of the support seat, and a chip discharge groove is opened on the outer ring of the processing table and located at the top of the support seat, and a chip collection box is provided below the support seat and corresponding to the position of the chip discharge groove, and a processing cover is fixedly installed on the outer ring of the top of the support seat, a slide rail is fixedly installed on the top of the inner cavity of the processing cover, a slider is slidably installed on the bottom of the slide rail, a punching device is fixedly installed on the bottom of the slider through an electric telescopic rod, an electric cylinder is fixedly installed on the right side of the slider, a bellows is fixedly installed on the top of the processing cover, and a fan is connected to the right side of the bellows, the air outlet pipe of the fan extends through the processing cover and is connected to an exhaust pipe, and the inner side of the exhaust pipe is connected to an air outlet head.
[0005] As a preferred solution, guide frames are fixedly mounted on both sides of the bottom of the support seat, a sliding block is slidably connected inside the guide frame, and the inner side of the sliding block is fixedly mounted to the side of the debris collection box.
[0006] As a preferred solution, positioning sleeves are sleeved on both sides of the rear end of the exhaust pipe, and the back side of the positioning sleeves is connected to the front side of the processing cover.
[0007] As a preferred solution, the exhaust duct is arranged in a U-shape inside the processing cover and corresponds to the top of the chip discharge groove, and the air outlet head is designed to be tilted downward.
[0008] As a preferred solution, the chip removal groove is designed to penetrate the interior of the support seat, and the chip removal groove is connected to the interior of the debris collection box below.
[0009] As a preferred solution, the bellows is connected to the top of the processing cover via a mounting groove, and a positioning assembly is installed at the connection between the back of the bellows and the top of the processing cover.
[0010] As a preferred solution, support legs are fixedly installed on both sides of the bottom of the support seat and outside the guide frame.
[0011] Compared with the prior art, the beneficial effects of the utility model are as follows:
[0012] 1. The utility model adds a chip groove around the processing table. After the processing is completed, the exhaust duct and the air outlet head can be used to quickly blow the chips remaining on the processing table to the chip groove and collect them. The inclined design of the air outlet head can better blow the wind to the table surface, and the overall inclination angle of the exhaust duct can be adjusted. In addition, the chips above the support seat can be cleaned separately without residue, and can be collected quickly without affecting the next processing efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a first-view structural stereogram of the utility model;
[0014] Figure 2 This is a structural stereogram of the utility model from a second viewing angle;
[0015] Figure 3 It is a partial structural sectional view of the utility model;
[0016] Figure 4 It is the front view of the structure of the utility model.
[0017] In the figure: 1. support base; 2. processing table; 3. chip groove; 4. guide frame; 5. chip collection box; 6. sliding block; 7. processing cover; 8. slide rail; 9. slide block; 10. punching equipment; 11. electric cylinder; 12. bellows; 13. fan; 14. exhaust duct; 15. air outlet; 16. positioning sleeve. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0019] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.
[0020] Embodiment 1:
[0021] See also Figure 1 As shown, the utility model provides a chip collection device for wafer processing of semiconductor devices, comprising a support seat 1, a processing table 2 is fixedly installed on the top of the support seat 1, a chip removal groove 3 is opened on the outer ring of the processing table 2 and located on the top of the support seat 1, a chip collection box 5 is arranged below the support seat 1 and at a position corresponding to the chip removal groove 3, a processing cover 7 is fixedly installed on the outer ring of the top of the support seat 1, a slide rail 8 is fixedly installed on the top of the inner cavity of the processing cover 7, a slider 9 is slidably installed on the bottom of the slide rail 8, a punching device 10 is fixedly installed on the bottom of the slider 9 through an electric telescopic rod, an electric cylinder 11 is fixedly installed on the right side of the slider 9, a bellows 12 is fixedly installed on the top of the processing cover 7, a fan 13 is connected to the right side of the bellows 12, an air outlet pipe of the fan 13 extends through and extends to the inside of the processing cover 7 and is connected to an exhaust pipe 14, and the inner side of the exhaust pipe 14 is connected to an air outlet head 15.
[0022] The present technical solution is provided with a fan 13 and an exhaust duct 14, which can clean up the debris generated during processing. In addition, the exhaust duct 14 is arranged in a U-shape to increase the exhaust cleaning area, thereby preventing the debris from remaining on the processing table 2.
[0023] Embodiment 2:
[0024] On the basis of embodiment 1, the utility model is as follows Figure 4 As shown, it is disclosed that guide frames 4 are fixedly installed on both sides of the bottom of the support seat 1, and the inside of the guide frame 4 is slidably connected with a sliding block 6, and the inner side of the sliding block 6 is fixedly installed with the side of the debris collection box 5.
[0025] Use Figure 1 In the technical solution shown, the guide frame 4 can accommodate the end of the sliding block 6 and ensure the balance of the debris collection box 5 when it is pulled longitudinally at the bottom of the support base 1.
[0026] Secondly, in the technical solution, positioning sleeves 16 are sleeved on both sides of the rear end of the exhaust duct 14, and the back of the positioning sleeves 16 is connected to the front of the processing cover 7; the exhaust duct 14 is U-shaped inside the processing cover 7, and corresponds to the top of the chip groove 3, and the air outlet 15 is designed to be tilted downward.
[0027] Its use is as Figure 1In the technical solution shown, the positioning sleeve 16 can fix the rear end of the exhaust pipe 14 without affecting the processing of the wafer, and the inclined air outlet 15 can blow the wind onto the processing table 2, thereby improving the cleaning efficiency.
[0028] Embodiment three:
[0029] The utility model Figure 1-Figure 4 As shown, a chip groove 3 is disclosed that is designed to penetrate the interior of the support seat 1, and the chip groove 3 is connected to the interior of the debris collection box 5 below; the bellows 12 is connected to the top of the processing cover 7 through a mounting groove, and a positioning assembly is installed at the connection between the back of the bellows 12 and the top of the processing cover 7; support legs are fixedly installed on both sides of the bottom of the support seat 1 and on the outside of the guide frame 4.
[0030] The above technical solution is adopted mainly to reinforce the side of the bellows 12 by using the positioning assembly, so as to increase the firmness after installation and placement above the processing cover 7, and facilitate removal at a later stage.
[0031] The working principle of the utility model is as follows: when processing the wafer, the electric cylinder 11 is used to move the slider 9, and the electric telescopic rod connected to the top of the punching device 10 can drive it to move downward to complete the processing operation. After processing, a large amount of debris is generated and remains on the processing table 2 and the support seat 1. The fan 13 is started to blow the wind to the exhaust pipe 14 and the air outlet 15, and the debris on the processing table 2 is blown to the chip discharge groove 3 for collection, and some of the debris remaining on the support seat 1 can be cleaned manually, and the chip discharge groove 3 can discharge the debris to the inside of the debris collection box 5 below, and complete the centralized collection, thereby improving the cleanliness of the surface of the processing table 2 without affecting the next processing.
[0032] Importantly, it should be noted that the construction and arrangement of the present application shown in a plurality of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and ratio of various elements, and parameter values (e.g., temperature, pressure, etc.), installation arrangements, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, the element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature or number or position of the discrete element can be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present utility model. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also equivalent structure. Without departing from the scope of the present invention, other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the present invention is not limited to a specific embodiment, but extends to various modifications that still fall within the scope of the appended claims.
[0033] Additionally, in order to provide a concise description of example embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.
[0034] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.
Claims
1. A chip collection device for semiconductor device wafer processing, comprising a support base (1), characterized in that: A processing table (2) is fixedly mounted on the top of the support seat (1); a chip removal groove (3) is provided on the outer ring of the processing table (2) and is located on the top of the support seat (1); a chip collection box (5) is provided below the support seat (1) and at a position corresponding to the chip removal groove (3); a processing cover (7) is fixedly mounted on the outer ring of the top of the support seat (1); a slide rail (8) is fixedly mounted on the top of the inner cavity of the processing cover (7); a slider (9) is slidably mounted on the bottom of the slide rail (8) A punching device (10) is fixedly installed at the bottom of the slider (9) via an electric telescopic rod, an electric cylinder (11) is fixedly installed on the right side of the slider (9), a bellows (12) is fixedly installed on the top of the processing cover (7), the right side of the bellows (12) is connected to a fan (13), the air outlet pipe of the fan (13) extends through the interior of the processing cover (7) and is connected to an exhaust pipe (14), and the inner side of the exhaust pipe (14) is connected to an air outlet head (15).
2. The chip collection device for semiconductor device wafer processing according to claim 1, characterized in that: Guide frames (4) are fixedly mounted on both sides of the bottom of the support seat (1), and a sliding block (6) is slidably connected inside the guide frame (4), and the inner side of the sliding block (6) is fixedly mounted on the side of the debris collection box (5).
3. The chip collection device for semiconductor device wafer processing according to claim 1, characterized in that: Positioning sleeves (16) are sleeved on both sides of the rear end of the exhaust pipe (14), and the back side of the positioning sleeve (16) is connected to the front side of the processing cover (7).
4. The chip collection device for semiconductor device wafer processing according to claim 1, characterized in that: The exhaust pipe (14) is arranged in a U-shape inside the processing cover (7) and corresponds to the top of the chip discharge groove (3), and the air outlet head (15) is designed to be inclined downward.
5. The chip collection device for semiconductor device wafer processing according to claim 1, characterized in that: The chip removal groove (3) is designed to penetrate the interior of the support seat (1), and the chip removal groove (3) is connected to the interior of the debris collection box (5) below.
6. The chip collection device for semiconductor device wafer processing according to claim 1, characterized in that: The bellows (12) is connected to the top of the processing cover (7) via a mounting groove, and a positioning component is installed at the connection position between the back side of the bellows (12) and the top of the processing cover (7).
7. The chip collection device for semiconductor device wafer processing according to claim 1, characterized in that: Support legs are fixedly installed on both sides of the bottom of the support seat (1) and outside the guide frame (4).