Wafer heat preservation diffusion device

Abstract

The utility model provides a wafer heat preservation diffusion device which comprises a diffusion furnace body and is characterized in that a flow equalizing device is arranged in the diffusion furnace body, an air inlet main pipe and an air outlet pipe are respectively arranged on the outer walls of the two sides of the diffusion furnace body, an air inlet auxiliary pipe is arranged between the air inlet main pipe and the flow equalizing device, and a furnace door is arranged at the bottom of the diffusion furnace body. According to the utility model, the flow equalizing device is designed on the wafer heat preservation diffusion device, when the flow equalizing device is used, the motor connected with the driving shaft is started to drive the main air guide plate to rotate, and the linkage plate is arranged between the main air guide plate and the auxiliary air guide plate, so that when the main air guide plate rotates, the auxiliary air guide plate is driven to rotate along with the main air guide plate; therefore, the gas conveying direction of the gas inlet auxiliary pipe is adjusted, the gas is uniformly diffused in the diffusion furnace body, the gas is prevented from being accumulated in the furnace, the process reaction is more perfect, the gas flow disorder phenomenon can be reduced, and the process stability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of diffusion devices, in particular to a wafer heat preservation diffusion device. Background Art

[0002] In the process of semiconductor vertical furnace, diffusion furnace is used for diffusion, oxidation, annealing, alloying and sintering in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices and optical fibers. The main purpose of the diffusion process is to dope semiconductor wafers under high temperature conditions, that is, to diffuse elements phosphorus and boron into the wafer, thereby changing and controlling the type, concentration and distribution of impurities in the semiconductor, so as to establish different electrical characteristic areas.

[0003] At present, the air intake method adopted by horizontal furnaces in the industry is mostly front-end air intake and rear-end air exhaust. The existing vertical diffusion furnaces need to improve the air intake method to increase the uniformity of the gas in the chamber, so that the gas entering the diffusion furnace is more uniform and the process reaction is more perfect. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer heat preservation and diffusion device to solve the problems raised by the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer insulation diffusion device, including a diffusion furnace body, a flow equalizing device is arranged inside the diffusion furnace body, an air inlet pipe and an air outlet pipe are respectively arranged on the outer walls on both sides of the diffusion furnace body, an air inlet auxiliary pipe is arranged between the air inlet pipe and the flow equalizing device, and a furnace door is arranged at the bottom of the diffusion furnace body.

[0006] As a further description of the utility model: the flow equalizing device includes an air collecting hood, the air collecting hood has a trapezoidal cross-section that is narrow at the top and wide at the bottom, and one end of the air intake auxiliary pipe away from the air intake main pipe passes through the diffusion furnace body and is fixedly connected to the air collecting hood.

[0007] As a further description of the utility model: a fixed frame is fixedly installed at the bottom of the air collecting hood, and the fixed frame is fixedly installed inside the diffusion furnace body. A main air guide plate is arranged inside the fixed frame, and a driving shaft passes through the main air guide plate. The driving shaft is rotatably connected to the fixed frame, and the driving shaft passes through the diffusion furnace body and is connected to an external motor.

[0008] As a further description of the utility model: multiple groups of auxiliary air guide plates are rotatably connected inside the fixed frame, the auxiliary air guide plates are located on both sides of the main air guide plate, and linkage plates are provided on the front and back side walls of the lower ends of the main air guide plate and the auxiliary air guide plates. A rotating shaft is rotatably connected between the linkage plate and the main air guide plate and the auxiliary air guide plate.

[0009] As a further description of the utility model: a seal is fixedly installed on the upper surface of the furnace door, the cross-sectional size of the seal is the same as the cross-sectional size of the inner cavity of the diffusion furnace body, a support frame is fixedly installed on the upper surface of the seal, and a plurality of groups of insulation layers equidistantly distributed up and down are fixedly installed on the support frame.

[0010] As a further description of the utility model: flange rings are fixedly installed at one end of the air inlet main pipe and the air outlet pipe away from the diffusion furnace body.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] The utility model designs a flow equalizing device on the wafer insulation diffusion device. When in use, the motor connected to the driving shaft is started to drive the main air guide plate to rotate. Because a linkage plate is installed between the main air guide plate and the auxiliary air guide plate, when the main air guide plate rotates, the auxiliary air guide plate can be driven to rotate accordingly, thereby adjusting the direction of gas transported by the auxiliary air intake pipe to make it evenly diffused inside the diffusion furnace body, avoiding gas accumulation in the furnace, making the process reaction more perfect, reducing air flow turbulence, and increasing process stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the internal structure of the diffusion furnace body of the utility model;

[0015] Figure 3 This is a schematic diagram of the structure of the gas collecting hood of the utility model;

[0016] Figure 4 It is a schematic diagram of the structure of the current balancing device of the utility model.

[0017] In the figure: 1. diffusion furnace body; 2. flow equalizing device; 201. air collecting hood; 202. fixing frame; 203. main air guide plate; 204. auxiliary air guide plate; 205. driving shaft; 206. linkage plate; 207. rotating shaft; 3. air inlet main pipe; 4. auxiliary air inlet pipe; 5. air outlet pipe; 6. furnace door; 7. sealing member; 8. support frame; 9. thermal insulation layer. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-Figure 4 The utility model provides a technical solution: a wafer insulation diffusion device, including a diffusion furnace body 1, a flow equalizing device 2 is arranged inside the diffusion furnace body 1, an air inlet main pipe 3 and an air outlet pipe 5 are respectively arranged on the outer walls of both sides of the diffusion furnace body 1, an air inlet auxiliary pipe 4 is arranged between the air inlet main pipe 3 and the flow equalizing device 2, and a furnace door 6 is arranged at the bottom of the diffusion furnace body 1.

[0020] In this embodiment: the flow equalizing device 2 includes an air collecting hood 201, the air collecting hood 201 is a trapezoidal cross-section with a narrow upper part and a wide lower part, the end of the air intake sub-pipe 4 away from the air intake main pipe 3 passes through the diffusion furnace body 1 and is fixedly connected to the air collecting hood 201; a fixed frame 202 is fixedly installed at the bottom of the air collecting hood 201, the fixed frame 202 is fixedly installed inside the diffusion furnace body 1, a main air guide plate 203 is arranged inside the fixed frame 202, a driving shaft 205 passes through the main air guide plate 203, the driving shaft 205 is rotatably connected to the fixed frame 202, and the driving shaft 205 passes through the diffusion furnace body 1 and is connected to an external motor.

[0021] During specific use: the gas transported by the air intake sub-pipe 4 is transported downward by the air collecting hood 201, and during the transportation process, the motor connected to the drive shaft 205 can be started to drive the main air guide plate 203 to rotate. Since a linkage plate 206 is installed between the main air guide plate 203 and the sub-air guide plate 204, when the main air guide plate 203 rotates, the sub-air guide plate 204 can be driven to rotate accordingly, thereby adjusting the direction of the gas transported by the air intake sub-pipe 4 to make it evenly diffused inside the diffusion furnace body 1.

[0022] In this embodiment: a plurality of groups of auxiliary air guide plates 204 are rotatably connected inside the fixed frame 202, the auxiliary air guide plates 204 are located on both sides of the main air guide plate 203, and linkage plates 206 are provided on the front and back side walls of the lower ends of the main air guide plate 203 and the auxiliary air guide plates 204, and a rotating shaft 207 is rotatably connected between the linkage plate 206 and the main air guide plate 203 and the auxiliary air guide plate 204.

[0023] During specific use: since a linkage plate 206 is installed between the main air guide plate 203 and the auxiliary air guide plate 204, when the main air guide plate 203 rotates, the auxiliary air guide plate 204 can be driven to rotate accordingly.

[0024] In this embodiment: a seal 7 is fixedly installed on the upper surface of the furnace door 6, and the cross-sectional size of the seal 7 is the same as the cross-sectional size of the inner cavity of the diffusion furnace body 1. A support frame 8 is fixedly installed on the upper surface of the seal 7, and a plurality of groups of insulation layers 9 equidistantly distributed up and down are fixedly installed on the support frame 8.

[0025] During specific use: a wafer boat for placing wafers is also installed on the top of the support frame 8, and the furnace door 6 and the sealing member 7 can diffuse the furnace body 1 of the diffusion furnace, so that the furnace body 1 of the diffusion furnace forms a closed process reaction space.

[0026] In this embodiment, flange rings are fixedly mounted on the ends of the air inlet main pipe 3 and the air outlet pipe 5 away from the diffusion furnace body 1 .

[0027] When used specifically: the flange ring facilitates the installation and disassembly of the external gas pipeline and the air inlet pipe 3 and the air outlet pipe 5.

[0028] Working principle: When in use, external gas is introduced into the diffusion furnace body 1 through the air intake main pipe 3 and the air intake sub-pipe 4, wherein the gas transported by the air intake sub-pipe 4 is transported downward by the gas collecting hood 201, and during the transportation process, the motor connected to the drive shaft 205 can be started to drive the main air guide plate 203 to rotate. Since a linkage plate 206 is installed between the main air guide plate 203 and the sub-air guide plate 204, when the main air guide plate 203 rotates, the sub-air guide plate 204 can be driven to rotate accordingly, thereby adjusting the direction of gas transported by the air intake sub-pipe 4, so that it is evenly diffused inside the diffusion furnace body 1, avoiding gas accumulation in the furnace, making the process reaction more perfect, reducing air flow turbulence, and increasing process stability.

[0029] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in the field. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for technical personnel in the field to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer heat preservation diffusion device, comprising a diffusion furnace body (1), characterized in that: A flow equalizing device (2) is arranged inside the diffusion furnace body (1), an air intake main pipe (3) and an air outlet pipe (5) are arranged on the outer walls of both sides of the diffusion furnace body (1), an air intake auxiliary pipe (4) is arranged between the air intake main pipe (3) and the flow equalizing device (2), and a furnace door (6) is arranged at the bottom of the diffusion furnace body (1).

2. The wafer heat preservation and diffusion device according to claim 1, characterized in that: The flow equalizing device (2) comprises an air collecting hood (201), the air collecting hood (201) having a trapezoidal cross section that is narrow at the top and wide at the bottom, and an end of the air intake auxiliary pipe (4) away from the air intake main pipe (3) passes through the diffusion furnace body (1) and is fixedly connected to the air collecting hood (201).

3. The wafer heat preservation and diffusion device according to claim 2, characterized in that: A fixing frame (202) is fixedly installed at the bottom of the gas collecting hood (201), and the fixing frame (202) is fixedly installed inside the diffusion furnace body (1). A main air guide plate (203) is arranged inside the fixing frame (202), and a driving shaft (205) passes through the main air guide plate (203). The driving shaft (205) is rotatably connected to the fixing frame (202), and the driving shaft (205) passes through the diffusion furnace body (1) to be connected to an external motor.

4. The wafer heat preservation and diffusion device according to claim 3, characterized in that: A plurality of groups of auxiliary air guide plates (204) are rotatably connected inside the fixed frame (202), the auxiliary air guide plates (204) are located on both sides of the main air guide plate (203), and linkage plates (206) are provided on the front and back side walls of the lower ends of the main air guide plate (203) and the auxiliary air guide plates (204), and a rotation shaft (207) is rotatably connected between the linkage plate (206) and the main air guide plate (203) and the auxiliary air guide plate (204).

5. The wafer heat preservation and diffusion device according to claim 1, characterized in that: A sealing member (7) is fixedly mounted on the upper surface of the furnace door (6), the cross-sectional dimensions of the sealing member (7) being the same as the cross-sectional dimensions of the inner cavity of the diffusion furnace body (1), and a support frame (8) is fixedly mounted on the upper surface of the sealing member (7), and a plurality of groups of thermal insulation layers (9) equidistantly distributed vertically are fixedly mounted on the support frame (8).

6. The wafer heat preservation and diffusion device according to claim 1, characterized in that: The ends of the air inlet main pipe (3) and the air outlet pipe (5) away from the diffusion furnace body (1) are both fixedly mounted with flange rings.

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